IL147092A0 - Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning - Google Patents
Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioningInfo
- Publication number
- IL147092A0 IL147092A0 IL14709200A IL14709200A IL147092A0 IL 147092 A0 IL147092 A0 IL 147092A0 IL 14709200 A IL14709200 A IL 14709200A IL 14709200 A IL14709200 A IL 14709200A IL 147092 A0 IL147092 A0 IL 147092A0
- Authority
- IL
- Israel
- Prior art keywords
- electrical circuitry
- shield structure
- conductive shield
- common conductive
- energy conditioning
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13918299P | 1999-06-15 | 1999-06-15 | |
US14698799P | 1999-08-03 | 1999-08-03 | |
US16503599P | 1999-11-12 | 1999-11-12 | |
US09/460,218 US6331926B1 (en) | 1997-04-08 | 1999-12-13 | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US18010100P | 2000-02-03 | 2000-02-03 | |
US18532000P | 2000-02-28 | 2000-02-28 | |
US19119600P | 2000-03-22 | 2000-03-22 | |
US20032700P | 2000-04-28 | 2000-04-28 | |
US20386300P | 2000-05-12 | 2000-05-12 | |
US09/579,606 US6373673B1 (en) | 1997-04-08 | 2000-05-26 | Multi-functional energy conditioner |
PCT/US2000/016518 WO2000077907A1 (en) | 1999-06-15 | 2000-06-15 | Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
Publications (1)
Publication Number | Publication Date |
---|---|
IL147092A0 true IL147092A0 (en) | 2002-08-14 |
Family
ID=27581056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14709200A IL147092A0 (en) | 1999-06-15 | 2000-06-15 | Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1222725B8 (de) |
JP (1) | JP2003502991A (de) |
CN (1) | CN1373922A (de) |
AU (1) | AU6051300A (de) |
DE (1) | DE60039245D1 (de) |
IL (1) | IL147092A0 (de) |
WO (1) | WO2000077907A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7356050B2 (en) | 2003-12-17 | 2008-04-08 | Siemens Aktiengesellschaft | System for transmission of data on a bus |
GB2439862A (en) | 2005-03-01 | 2008-01-09 | X2Y Attenuators Llc | Conditioner with coplanar conductors |
US10775856B1 (en) | 2019-12-02 | 2020-09-15 | Management Services Group, Inc. | Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2725439B2 (ja) * | 1990-05-17 | 1998-03-11 | 株式会社 村田製作所 | 電子部品の周波数調整方法 |
JP2606044B2 (ja) * | 1991-04-24 | 1997-04-30 | 松下電器産業株式会社 | 誘電体フィルタ |
-
2000
- 2000-06-15 WO PCT/US2000/016518 patent/WO2000077907A1/en active IP Right Grant
- 2000-06-15 EP EP00946814A patent/EP1222725B8/de not_active Expired - Lifetime
- 2000-06-15 CN CN00811701.2A patent/CN1373922A/zh active Pending
- 2000-06-15 DE DE60039245T patent/DE60039245D1/de not_active Expired - Fee Related
- 2000-06-15 JP JP2001504057A patent/JP2003502991A/ja active Pending
- 2000-06-15 AU AU60513/00A patent/AU6051300A/en not_active Abandoned
- 2000-06-15 IL IL14709200A patent/IL147092A0/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP1222725A1 (de) | 2002-07-17 |
WO2000077907A9 (en) | 2004-10-07 |
WO2000077907A1 (en) | 2000-12-21 |
EP1222725B8 (de) | 2008-11-26 |
AU6051300A (en) | 2001-01-02 |
EP1222725A4 (de) | 2004-07-21 |
JP2003502991A (ja) | 2003-01-21 |
DE60039245D1 (de) | 2008-07-31 |
CN1373922A (zh) | 2002-10-09 |
EP1222725B1 (de) | 2008-06-18 |
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