EP1157441A1 - Housing for an electronic apparatus in microwave technology - Google Patents
Housing for an electronic apparatus in microwave technologyInfo
- Publication number
- EP1157441A1 EP1157441A1 EP00904819A EP00904819A EP1157441A1 EP 1157441 A1 EP1157441 A1 EP 1157441A1 EP 00904819 A EP00904819 A EP 00904819A EP 00904819 A EP00904819 A EP 00904819A EP 1157441 A1 EP1157441 A1 EP 1157441A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- housing
- housing according
- circuit board
- chambers
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005516 engineering process Methods 0.000 title claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 14
- 229920003023 plastic Polymers 0.000 claims abstract description 14
- 230000003287 optical effect Effects 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 7
- 230000008719 thickening Effects 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
- H01Q1/3283—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle side-mounted antennas, e.g. bumper-mounted, door-mounted
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
- G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
- G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
- G01S7/032—Constructional details for solid-state radar subsystems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
- H01Q19/062—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens for focusing
-
- B60W2420/408—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
- B60Y2400/00—Special features of vehicle units
- B60Y2400/30—Sensors
- B60Y2400/301—Sensors for position or displacement
- B60Y2400/3017—Radars
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
- G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
- G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
- G01S2013/9327—Sensor installation details
- G01S2013/93275—Sensor installation details in the bumper area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a housing for an electronic device in microwave technology, in particular for a radar sensor, according to the preamble of the main claim.
- a radar sensor with a holder can be screwed onto the outside of a vehicle, for example for determining the distance to a vehicle traveling in front.
- This radar sensor has an oscillator, a mixer, an amplifier and an antenna system for generating and receiving the radar beams as well as a receiver with evaluation electronics.
- the above-mentioned components are installed in one or more housings, each of which is usually sealed very tightly and then fastened to the vehicle using suitable brackets.
- the circuitry structure of the evaluation electronics it is known to use, for example, multi-layer boards which may be mounted in the housing with an additional evaluation board attached. This arrangement is then fastened in the holder, for example in the bumper of the motor vehicle.
- the essential size of the arrangement is formed by the antennas separate for sending and receiving, which radiate through the bumper into the area of interest.
- the components are generally applied on the upper side between the antennas, but these can, however, generate undesired leakage radiation.
- Complex shielding, for example with foam absorbers, is therefore necessary and the large number of parts results in high production costs.
- a housing of the type mentioned at the outset for use in microwave technology is advantageous in the further development according to the invention with the characterizing features of claim 1 in that the housing is composed of three tightly connected parts which can be produced from the cheapest material and in terms of the design can be optimally designed for the components to be arranged in detail.
- the invention enables a compact radar sensor to be constructed, the integration of antenna structures to reduce the space requirement being able to be advantageously carried out.
- the radar sensors required here Ren operate in a frequency band at about 24 GHz, they offer the advantage of small antennas and are relatively inexpensive to manufacture.
- the housing according to the invention is advantageously formed in the middle part from a metal plate on which at least one circuit board can be attached. Furthermore, there are recesses which, with the at least one circuit board, form chambers into which components of the electronic circuit can protrude.
- the lower, injection-molded part made of plastic has an externally contactable connector arrangement.
- the upper part is the plastic injection-molded cover, with which chambers for electronic and / or microwave technology components can also be formed with the at least one circuit board. With the chamber of the components according to the invention, suppression of undesired emissions of microwave radiation is advantageously achieved.
- the middle part is preferably provided with centering marks which engage in corresponding marks on the lower part and on the cover during assembly, the middle part also being able to be constructed symmetrically to simplify production.
- both one and two circuit boards for example an upper and a lower one, can be provided.
- the circuit details with the antenna structures have to sit on the upper circuit board because of the radiation of the microwaves.
- multilayer circuit boards made of composite materials can be fitted on one or both sides or multi-layer ceramics are used, the connections of which have to be contacted, for example by bonding, before the bottom connector part is attached to the bottom.
- the upper circuit board can be bonded, whereby no large strokes are required due to a favorable arrangement of contacts lying in a row.
- the lower plug part of the housing has the required number of plug contacts and a plug shape adapted to the respective application, the plug contacts being injected using injection molding technology and being able to be glued to the middle part with the metal plate during assembly.
- the lower part of the housing consisting of the middle part and the lower plug part, can thus be closed in a watertight manner, with additional clips making it possible to achieve an adjustment and secure it against displacement before gluing.
- the cover of the housing according to the invention is designed for chambering the individual assemblies, such as antennas, oscillators, mixers, evaluation electronics, etc.
- the individual assemblies such as antennas, oscillators, mixers, evaluation electronics, etc.
- materials are present as so-called optical windows for promoting the transmission of microwaves and in the other areas there are materials for absorbing microwaves.
- a first advantageous embodiment for forming these optical windows can be realized by clipping metal structures inside into the corresponding chamber on the cover.
- a flat ceramic plate can also be attached between the wall of the cover and the clipped-on metal structures.
- the optical windows are formed by injected metal grid structures.
- the optical windows can in principle be formed by an injected ceramic plate that is metallized on one or both sides, the outer or the outer and the inner side of the ceramic plate being injected into the cover. The metallizations on the ceramic plate can be connected to the ground of the circuit board via a metal spring.
- the distances and the material thicknesses can be selected in multiples of a quarter of the wavelength of the microwave radiation, for example at a frequency of 24 GHz.
- the plastic coating which can be applied on one or both sides, also serves as a matching structure here due to its dielectric constant.
- the distance in air must be chosen in the size of ⁇ / 2 of the microwave length, while the ceramic plate ⁇ / 4 must be thick.
- the antennas are formed from a plurality of patches, for example 2, 3, 4 or 6, wherein above these patches there can be dielectric horns projecting inwards in the optical windows as a focusing device. It is also advantageously possible for the op- table windows inwardly and / or outwardly projecting dielectric lenses are present as a focusing device.
- the plastic of the lid is microwave-permeable, as is the case, for example, with polyetherimide or comparable plastics.
- the lid is thus also glued onto the composite of the lower plug part and the middle metal part and is thus also sealed watertight.
- a holder is attached to at least one of the three parts, which is formed from an extension, possibly with a thickening, with screwable or clipable elements.
- An extension and thickening of the middle part offers the advantage of better heat dissipation; In contrast, the mounting of the holder on the lower plastic part is less expensive to manufacture
- the pressure equalization in the interior of the housing can be carried out using conventionally known pressure equalization elements, wherein pressure equalization inside the plug and via the copper wires of the inserted counterpart is also possible.
- the proposed housing according to the invention is not only suitable for the construction of a radar sensor but is also suitable for the construction of communication devices and other sensors which use microwaves in a frequency range up to 140 GHz. There are only the geometries of the housing in relation to to adapt the component requirements and the wavelengths used.
- FIG. 1 shows a section along a longitudinal line through the basic structure of such a housing
- FIG. 2 shows a section through an exemplary embodiment which, in a modification of FIG. 1, is provided with metal clips in the optical window of the antenna system in the housing;
- FIG. 3 shows a section along a transverse line of the exemplary embodiment according to FIG. 2;
- FIG. 4 shows a section through an exemplary embodiment which, in a modification of FIG. 1, is provided with an injected metal structure in the optical window of the antenna system in the housing;
- FIG. 5 shows a section through an exemplary embodiment which, in a modification of FIG. lines in the optical window of the antenna system is provided in the housing;
- FIG. 6 shows a section along a transverse line of the exemplary embodiment according to FIG. 5;
- Figure 7 shows a section through an embodiment which is provided in addition to Figure 1 with a holder on the lower part of the housing and
- Figure 8 shows a section through an embodiment which is provided in addition to Figure 1 with a bracket on the central part of the housing.
- FIG. 1 shows a housing 1 for a radar sensor as a microwave device, which can be attached to a motor vehicle, for example on the bumper, in such a way that it can emit electromagnetic waves for determining the distance.
- the housing 1 has a central part 2, which consists of a metal plate and is provided with centering marks 3 for adjusting the other housing parts and with recesses or chambers 4 on one side and with recesses or chambers 5 on the other side.
- the chambers 4 and 5 are preferably arranged symmetrically; on the chambers 4 and 5, circuit boards 6 and 7 are arranged, which are held on the middle part 2 with brackets not shown here.
- the housing can also be assembled with only one circuit board, for example the circuit board 6.
- the circuit board 6 In the chambers 4 and 5, components of the electronic circuit, in particular, microwave-emitting components also come to rest.
- the circuit details with the antenna structures must in any case sit on the upper circuit board 6 because of the radiation from the microwaves.
- multi-layer circuit boards made of composite materials or multi-layered circuits, which are equipped on one side and on both sides, are suitable as circuit boards.
- a lower part 8 preferably an injection molded plastic part, which has a plug arrangement 9.
- This part 8 has a recess into which the markings 3 of the middle part 2 can engage and thus the position of the parts 2 and 8 is fixed and also a tight connection is possible.
- the connections on the circuit boards 6 and 7 are to be contacted here, if necessary also with plated-through holes 10 before the lower plug part 8 is attached on the underside, e.g. to bond.
- the plug contacts of the plug arrangement 9 are injected here using injection molding technology and, during assembly, with the middle part 2, i.e. glued to the metal plate.
- an upper part 11 as a cover, preferably also an injection-molded plastic part, which also has recesses into which the markings 3 of the middle part 2 can engage and thus the position of the parts 2 and 11 is fixed and sealed in the same way as when assembling parts 2 and 8.
- Chambers 12 and 13 are also formed in the upper part 11, into which individual assemblies such as antennas, oscillators, mixers and evaluation electronics can protrude.
- optical windows are present in the plastic part 11 according to FIG. 1, which contribute to favoring the radiation of the microwaves.
- the materials are arranged so that they are suitable for absorbing the microwaves.
- the optical windows can be formed, for example, by an injection-molded, flat ceramic plate 17 metallized on one or both sides, the outer or the outer and the inner side of the respective ceramic plate 17 being injected into the region 14 or 15 of the upper part 11.
- the metallizations not visible here on the ceramic plate 17 can be connected to the ground of the circuit board 6 via a metal spring 18.
- optical windows can be realized here by clipping metal structures 20 under a flat ceramic plate 21 in the left area 14 or by clipping the metal structures 20 directly onto the plastic of the upper part 11 in the right area 15.
- the position of the metal structures 20 is also shown in FIG. 3 in a section along a transverse line through the housing 1.
- the optical windows are formed by metal grid structures 22 which are injected into the plastic in the regions 14 and 15 of the upper part 11 and which have a focusing effect.
- an antenna system is constructed in such a way that the antennas, in one here not in the figures in detail recognizable manner, are formed from a plurality of patches, for example three, so according to the embodiment of Figures 5 and 6 above these patches in the optical windows of the areas 14 and / or 15 focusing devices can be attached.
- dielectric horns 23 protrude into the chamber 13 of the housing 1 as a focusing device.
- dielectric lenses 24 and / or 25 projecting inwards and / or outwards are present in the optical windows as a focusing device.
- the dielectric horn 23 from FIG. 5 can also be seen in a section along a transverse line.
- FIGS. 7 and 8 For fastening the housing 1, for example to the bumper of a motor vehicle, exemplary embodiments of a suitable holder are shown in accordance with FIGS. 7 and 8.
- a holder 26 in the form of an extension of the lower plastic part 8 of the housing 1 is proposed, which, optionally with a thickening, is either screwable at the end by means of a bore 27 or clipable with a clip element 28.
- a holder 29 by extending and thickening the middle part 2 made of metal is shown in FIG. 8, wherein the corresponding screw or clip elements 27 and / or 28 can be used as in FIG. 7.
Abstract
The invention relates to a housing for an electronic apparatus in microwave technology comprised of three parts (2, 8, 11) that are not connected to each other. A central part (2) is formed by a metal plate on which at least one circuit board (6, 7) can be mounted and having recesses that form chambers (4, 5) together with the at least one circuit board (6, 7), the components of an electronic circuit projecting into said chambers. A lower plastic part (11) with a connector array (9) and an upper plastic part (11) are provided that also form chambers (12, 13) for electronic and/or microwave technology components.
Description
Gehäuse für ein elektronisches Gerät in der MikrowellentechnikHousing for an electronic device in microwave technology
Stand der TechnikState of the art
Die Erfindung betrifft ein Gehäuse für ein elektronisches Gerät in der Mikrowellentechnik, insbesondere für einen Radarsensor, nach dem Oberbegriff des Hauptanspruchs.The invention relates to a housing for an electronic device in microwave technology, in particular for a radar sensor, according to the preamble of the main claim.
Es ist beispielsweise aus der EP 0 685 930 AI bekannt, dass ein Radarsensors mit einer Halterung außen an einem Fahrzeug, beispielsweise zur Abstandsbestimmung zu einem voraus fahrenden Fahrzeug, angeschraubt werden kann. Dieser Radarsensor weist einen Oszillator, einen Mischer, einen Verstärker und ein Antennensystem zur Erzeugung und zum Empfang der Radarstrahlen als auch einen Empfänger mit Auswerteelektronik auf. Bei dieser bekannten Anordnungen sind die oben erwähnten Komponenten in ein oder in mehrere Gehäuse eingebaut, die jeweils für sich, in der Regel sehr dicht verschlossen werden und dann mit geeigneten Halterungen am Fahrzeug befestigt werden.
Zum schaltungstechnischen Aufbau der Auswerteelektronik ist es für sich bekannt, beispielsweise Mehrlagenplatinen zu verwenden, die ev. mit einer zusätzlichen, aufgesetzten Auswerteplatine im Gehäuse montiert werden. Diese Anordnung wird dann in der Halterung, beispielsweise in der Stoßstange des Kraftfahrzeuges, befestigt. Die wesentliche Baugröße der Anordnung wird hierbei durch die für das Senden und Empfangen getrennten Antennen gebildet , welche durch die Stoßstange in den interessierenden Bereich strahlen. Aus Platzersparnisgründen werden die Bauelemente in der Regel auf der Oberseite zwischen den Antennen aufgebracht, wodurch diese jedoch eine unerwünschte Leckstrahlung erzeugen können. Es sind daher aufwendige Abschirmungen, beispielsweise mit Schaumstoff- absorbern, notwendig und wegen der Vielzahl der Teile ergeben sich hohe Fertigungskosten.It is known, for example from EP 0 685 930 A1, that a radar sensor with a holder can be screwed onto the outside of a vehicle, for example for determining the distance to a vehicle traveling in front. This radar sensor has an oscillator, a mixer, an amplifier and an antenna system for generating and receiving the radar beams as well as a receiver with evaluation electronics. In this known arrangement, the above-mentioned components are installed in one or more housings, each of which is usually sealed very tightly and then fastened to the vehicle using suitable brackets. For the circuitry structure of the evaluation electronics, it is known to use, for example, multi-layer boards which may be mounted in the housing with an additional evaluation board attached. This arrangement is then fastened in the holder, for example in the bumper of the motor vehicle. The essential size of the arrangement is formed by the antennas separate for sending and receiving, which radiate through the bumper into the area of interest. In order to save space, the components are generally applied on the upper side between the antennas, but these can, however, generate undesired leakage radiation. Complex shielding, for example with foam absorbers, is therefore necessary and the large number of parts results in high production costs.
Vorteile der ErfindungAdvantages of the invention
Ein Gehäuse der eingangs genannten Art für die Anwendung in der Mikrowellentechnik ist in der erfindungsgemäßen Weiterbildung mit den kennzeichnenden Merkmalen des Anspruchs 1 dadurch vorteilhaft, dass das Gehäuse aus drei dicht miteinander verbundenen Teilen zusammengesetzt wird, die aus dem jeweils günstigstem Material hergestellt werden können und hinsichtlich der Bauform jeweils optimal auf die im Detail anzuordnenden Bauteile gestaltet werden können.A housing of the type mentioned at the outset for use in microwave technology is advantageous in the further development according to the invention with the characterizing features of claim 1 in that the housing is composed of three tightly connected parts which can be produced from the cheapest material and in terms of the design can be optimally designed for the components to be arranged in detail.
Insbesondere für die Erfassung der Entfernungen und Geschwindigkeiten mittels Mikrowellenradar rund um ein Kraftfahrzeug kann mit der Erfindung ein kompakter Radarsensor aufgebaut werden, wobei sich die Integration von Antennenstrukturen zur Verringerung des Raumbedarfes vorteilhaft ausführen lässt. Die hier benötigten Radarsenso-
ren arbeiten in einem Frequenzband bei ca. 24 GHz, sie bieten den Vorteil von kleinen Antennen und sind relativ kostengünstig herzustellen.In particular for the detection of the distances and speeds by means of microwave radar around a motor vehicle, the invention enables a compact radar sensor to be constructed, the integration of antenna structures to reduce the space requirement being able to be advantageously carried out. The radar sensors required here Ren operate in a frequency band at about 24 GHz, they offer the advantage of small antennas and are relatively inexpensive to manufacture.
Das erfindungsgemäße Gehäuse ist in vorteilhafter Weise im mittleren Teil aus einer Metallplatte gebildet, auf der mindestens eine Schaltungsplatine aufbringbar ist . Weiterhin sind Ausnehmungen vorhanden, die mit der mindestens einen Schaltungsplatine Kammern bildet, in die Bauteile der elektronischen Schaltung hineinragen können. Das untere, spritzgusstechnisch aus Kunststoff hergestellte Teil weist eine außen kontaktierbare Steckeranordnung auf. Das obere Teil ist der ebenfalls spritzgusstechnisch hergestellte Deckel aus Kunststoff, mit dem auch mit der mindestens einen Schaltungsplatine Kammern für elektronische und/oder mikrowellentechnische Bauteile gebildet werden können. Mit der erfindungsgemäßen Kamme- rung der Bauelemente wird in vorteilhafter Weise eine Unterdrückung von unerwünschten Aussendungen von Mikrowellenstrahlungen erreicht.The housing according to the invention is advantageously formed in the middle part from a metal plate on which at least one circuit board can be attached. Furthermore, there are recesses which, with the at least one circuit board, form chambers into which components of the electronic circuit can protrude. The lower, injection-molded part made of plastic has an externally contactable connector arrangement. The upper part is the plastic injection-molded cover, with which chambers for electronic and / or microwave technology components can also be formed with the at least one circuit board. With the chamber of the components according to the invention, suppression of undesired emissions of microwave radiation is advantageously achieved.
In bevorzugter Weise ist das mittlere Teil mit Zentriermarken versehen, die in korrespondierende Marken am unteren Teil und am Deckel bei der Montage eingreifen, wobei zur Vereinfachung der Herstellung das mittlere Teil auch symmetrisch aufgebaut sein kann.The middle part is preferably provided with centering marks which engage in corresponding marks on the lower part and on the cover during assembly, the middle part also being able to be constructed symmetrically to simplify production.
Für das Anbringen der Schaltungsplatinen auf dem mittleren Teil können auch in vorteilhafter Weise Aussparungen und Haltepunkte angebracht werden, wobei je nach Bauteilebedarf sowohl eine als auch zwei Schaltungsplatinen, beispielsweise eine obere und eine untere, vorgesehen werden können. Die Schaltungsdetails mit den Antennenstrukturen müssen dabei, wegen der Abstrahlung der Mikrowellen, auf der oberen Schaltungsplatine sitzen. Es können hierbei sowohl einseitig als auch beidseitig bestückte mehrlagige Schaltungsplatinen aus Verbundmaterialien
oder Vielschichtkeramiken eingesetzt werden, deren Anschlüsse vor dem Anbau des unteren Steckerteils auf der Unterseite zu kontaktieren, z.B. zu bonden sind. In einem weiteren Arbeitsschritt kann die obere Schaltungsplatine gebondet werden, wobei hierbei durch eine günstige Anordnung von in einer Reihe liegenden Kontakten keine großen Hübe erforderlich sind.For attaching the circuit boards to the middle part, recesses and breakpoints can also be advantageously provided, depending on the component requirements, both one and two circuit boards, for example an upper and a lower one, can be provided. The circuit details with the antenna structures have to sit on the upper circuit board because of the radiation of the microwaves. In this case, multilayer circuit boards made of composite materials can be fitted on one or both sides or multi-layer ceramics are used, the connections of which have to be contacted, for example by bonding, before the bottom connector part is attached to the bottom. In a further step, the upper circuit board can be bonded, whereby no large strokes are required due to a favorable arrangement of contacts lying in a row.
Das untere Steckerteil des erfindungsgemäßen Gehäuses besitzt die erforderliche Anzahl von Steckkontakten und eine an den jeweiligen Verwendungsfall angepasste Steckerform, wobei die Steckkontakte in Spritzgusstechnik eingespritzt und bei der Montage mit dem mittleren Teil mit der Metallplatte verklebt werden können. Damit ist das Unterteil des Gehäuses, bestehend aus dem mittleren Teil und dem unteren Steckerteil wasserdicht verschließbar, wobei mit zusätzlichen Clipsen eine Justage und ein Sichern vor einem Verrücken vor dem Kleben erreicht werden kann.The lower plug part of the housing according to the invention has the required number of plug contacts and a plug shape adapted to the respective application, the plug contacts being injected using injection molding technology and being able to be glued to the middle part with the metal plate during assembly. The lower part of the housing, consisting of the middle part and the lower plug part, can thus be closed in a watertight manner, with additional clips making it possible to achieve an adjustment and secure it against displacement before gluing.
In besonders vorteilhafter Weise ist der Deckel des erfindungsgemäßen Gehäuses zur Kammerung der einzelnen Baugruppen, wie Antennen, Oszillator, Mischer, Auswerteelektronik usw. ausgebildet. In den, den Antennen gegenüberliegen Bereichen sind Materialien als sog. optische Fenster zur Begünstigung der Durchstrahlung mit Mikrowellen und in den anderen Bereichen sind Materialien zur Absorbierung von Mikrowellen vorhanden. Es sind somit auf einfache Weise mehrere Funktionen im Kunststoffdeckel des Gehäuses integriert.In a particularly advantageous manner, the cover of the housing according to the invention is designed for chambering the individual assemblies, such as antennas, oscillators, mixers, evaluation electronics, etc. In the areas opposite the antennas, materials are present as so-called optical windows for promoting the transmission of microwaves and in the other areas there are materials for absorbing microwaves. Several functions are thus easily integrated in the plastic cover of the housing.
Eine erste vorteilhafte Ausführungsform zur Bildung dieser optischen Fenster kann durch Einclipsen von Metall- Strukturen innen in die entsprechende Kammer am Deckel realisiert werden. Zusätzlich kann auch zwischen die Wand des Deckels und den eingeclipsten Metallstrukturen eine plane Keramikplatte angebracht sein.
Bei einer anderen vorteilhaften Ausführungsform sind die optischen Fenster durch eingespritzte Metallgitterstrukturen gebildet . Weiterhin können die optischen Fenster grundsätzlich durch eine eingespritzte, ein- oder beid- seitig metallisierte Keramikplatte gebildet sein, wobei die äußere oder die äußere und die innere Seite der Keramikplatte in den Deckel eingespritzt ist. Die Metallisierungen auf der Keramikplatte können dabei über eine Metallfeder an die Masse der Schaltungsplatine angeschlossen werden.A first advantageous embodiment for forming these optical windows can be realized by clipping metal structures inside into the corresponding chamber on the cover. In addition, a flat ceramic plate can also be attached between the wall of the cover and the clipped-on metal structures. In another advantageous embodiment, the optical windows are formed by injected metal grid structures. Furthermore, the optical windows can in principle be formed by an injected ceramic plate that is metallized on one or both sides, the outer or the outer and the inner side of the ceramic plate being injected into the cover. The metallizations on the ceramic plate can be connected to the ground of the circuit board via a metal spring.
Für eine geeignete Dimensionierung der Teile des erfindungsgemäßen Gehäuses und der Kammern können, beispielsweise bei einer Frequenz von 24 GHz, die Abstände und die Materialdicken in Vielfachen von einem Viertel der Wellenlänge der Mikrowellenstrahlung gewählt werden. Es ergeben sich beispielsweise in Luft Abstände zwischen der Keramikplatte und der Schaltungsplatine von ca. 3mm, für die Dicke einer Dickschichtkeramikplatte 1mm und für den Kunststoff ca. 1,7mm. Der Kunststoffüberzug, der ein oder beidseitig aufgebracht werden kann, dient hier wegen seiner Dielektrizitätskonstanten zusätzlich als Anpassstruktur. Zur Nutzung von sog. Superstrate-Effekten muß der Abstand in Luft dabei in der Größe von λ/2 der Mikrowel- lenlänge gewählt werden, während die Keramikplatte λ/4 dick sein muss. Durch die Wahl einer geeigneten Metallisierung der Keramikplatte kann die gewünschte Antennencharakteristik mit nur einem Patch als Speiseelement erreicht werden, um die Baugröße gering zu halten.For a suitable dimensioning of the parts of the housing and the chambers according to the invention, the distances and the material thicknesses can be selected in multiples of a quarter of the wavelength of the microwave radiation, for example at a frequency of 24 GHz. There are, for example, air gaps between the ceramic plate and the circuit board of approx. 3 mm, for the thickness of a thick-layer ceramic plate 1 mm and for the plastic approx. 1.7 mm. The plastic coating, which can be applied on one or both sides, also serves as a matching structure here due to its dielectric constant. To use so-called superstrate effects, the distance in air must be chosen in the size of λ / 2 of the microwave length, while the ceramic plate λ / 4 must be thick. By choosing a suitable metallization of the ceramic plate, the desired antenna characteristics can be achieved with just one patch as a feed element in order to keep the size small.
Bei einer vorteilhaften Ausführungsform sind die Antennen aus einer Mehrzahl von Patches, beispielsweise 2, 3, 4 oder 6, gebildet, wobei oberhalb dieser Patches in den optischen Fenstern nach innen ragende dielektrische Hörner als Fokussiereinrichtung vorhanden sein können. Es ist auch in vorteilhafter Weise möglich, dass in den op-
tischen Fenstern nach innen und/oder nach außen ragende dielektrische Linsen als Fokussiereinrichtung vorhanden sind.In an advantageous embodiment, the antennas are formed from a plurality of patches, for example 2, 3, 4 or 6, wherein above these patches there can be dielectric horns projecting inwards in the optical windows as a focusing device. It is also advantageously possible for the op- table windows inwardly and / or outwardly projecting dielectric lenses are present as a focusing device.
Durch die Nutzung der zuvor erwähnten fokussierenden Elementen lassen sich in vorteilhafter Weise wesentlich kleinere Schaltungsplatinen einsetzen, als dies bei einer Anordnung mit nur einem Patch möglich ist. Voraussetzung ist dabei lediglich, dass der Kunststoff des Deckels mikrowellendurchlässig ist, wie dies beispielsweise bei Polyetherimid oder vergleichbaren Kunststoffen der Fall ist .By using the focusing elements mentioned above, it is advantageously possible to use circuit boards that are much smaller than is possible with an arrangement with only one patch. The only requirement is that the plastic of the lid is microwave-permeable, as is the case, for example, with polyetherimide or comparable plastics.
Nach der vollständigen Bestückung der einzelnen Teile des Gehäuses wird somit auch der Deckel auf den Verbund aus dem unteren Steckerteil und dem mittleren Metallteil aufgeklebt und ist damit auch wasserdicht verschlossen. Um das Gehäuse zu befestigen, beispielsweise an der Stoßstange eines Kraftfahrzeuges, ist an mindestens einem der drei Teile eine Halterung angebracht, die aus einer Verlängerung, gegebenenfalls mit einer Verdickung, mit schraub- oder clipsbaren Elementen gebildet ist. Eine Verlängerung und Verdickung des mittleren Teils bietet den Vorteil der besseren Wärmeableitung; kostengünstiger in der Fertigung ist dagegen die Anbringung der Halterung am unteren KunststoffteilAfter the complete assembly of the individual parts of the housing, the lid is thus also glued onto the composite of the lower plug part and the middle metal part and is thus also sealed watertight. In order to fasten the housing, for example to the bumper of a motor vehicle, a holder is attached to at least one of the three parts, which is formed from an extension, possibly with a thickening, with screwable or clipable elements. An extension and thickening of the middle part offers the advantage of better heat dissipation; In contrast, the mounting of the holder on the lower plastic part is less expensive to manufacture
Der Druckausgleich im Inneren des Gehäuses kann mit herkömmlich bekannten Druckausgleichselementen vorgenommen werden, wobei auch ein Druckausgleich im Inneren der Steckers und über die Kupferadern des eingesteckten Gegenstücks möglich ist. Das vorgeschlagene erfindungsgemäße Gehäuse eignet sich nicht nur für den Aufbau eines Radarsensors sondern ist auch zum Aufbau von Kommunikationsgeräten und anderer Sensoren geeignet, die Mikrowellen in einem Frequenzbereich bis 140 GHz verwenden. Es sind dabei lediglich die Geometrien des Gehäuses in Bezug auf
den Bauelementebedarf und die verwendeten Wellenlängen anzupassen.The pressure equalization in the interior of the housing can be carried out using conventionally known pressure equalization elements, wherein pressure equalization inside the plug and via the copper wires of the inserted counterpart is also possible. The proposed housing according to the invention is not only suitable for the construction of a radar sensor but is also suitable for the construction of communication devices and other sensors which use microwaves in a frequency range up to 140 GHz. There are only the geometries of the housing in relation to to adapt the component requirements and the wavelengths used.
Diese und weitere Merkmale von bevorzugten Weiterbildungen der Erfindung gehen außer aus den Ansprüchen auch aus der Beschreibung und den Zeichnungen hervor, wobei die einzelnen Merkmale jeweils für sich allein oder zu mehreren in Form von Unterkombinationen bei der Ausführungs- form der Erfindung und auf anderen Gebieten verwirklicht sein und vorteilhafte sowie für sich schutzfähige Ausführungen darstellen können, für die hier Schutz beansprucht wird.These and other features of preferred developments of the invention are evident from the claims and also from the description and the drawings, the individual features being realized individually or in groups in the form of subcombinations in the embodiment of the invention and in other fields be and can represent advantageous and protectable designs for which protection is claimed here.
Zeichnungdrawing
Ausführungsbeispiele eines erfindungsgemäßen Gehäuses für eine elektronisches Gerät der Mikrowellentechnik werden anhand der Zeichnung erläutert. Es zeigen:Exemplary embodiments of a housing according to the invention for an electronic device in microwave technology are explained with reference to the drawing. Show it:
Figur 1 einen Schnitt entlang einer Längslinie durch den prinzipiellen Aufbau eines solchen Gehäuses ;1 shows a section along a longitudinal line through the basic structure of such a housing;
Figur 2 einen Schnitt durch ein Ausführungsbeispiel , das in Abwandlung der Figur 1 mit Metallclipsen im optischen Fenster des Antennensystems im Gehäuse versehen ist;FIG. 2 shows a section through an exemplary embodiment which, in a modification of FIG. 1, is provided with metal clips in the optical window of the antenna system in the housing;
Figur 3 einen Schnitt entlang einer Querlinie des Ausführungsbeispiels nach der Figur 2;FIG. 3 shows a section along a transverse line of the exemplary embodiment according to FIG. 2;
Figur 4 einen Schnitt durch ein Ausführungsbeispiel, das in Abwandlung der Figur 1 mit einer eingespritzten Metallstruktur im optischen Fenster des Antennensystems im Gehäuse versehen ist;FIG. 4 shows a section through an exemplary embodiment which, in a modification of FIG. 1, is provided with an injected metal structure in the optical window of the antenna system in the housing;
Figur 5 einen Schnitt durch ein Ausführungsbeispiel, das in Abwandlung der Figur 1 mit Fokussiereinrich-
tungen im optischen Fenster des Antennensystems im Gehäuse versehen ist;5 shows a section through an exemplary embodiment which, in a modification of FIG. lines in the optical window of the antenna system is provided in the housing;
Figur 6 einen Schnitt entlang einer Querlinie des Ausführungsbeispiels nach der Figur 5 ;FIG. 6 shows a section along a transverse line of the exemplary embodiment according to FIG. 5;
Figur 7 einen Schnitt durch ein Ausführungsbeispiel, das in Ergänzung der Figur 1 mit einer Halterung am unteren Teil des Gehäuses versehen ist undFigure 7 shows a section through an embodiment which is provided in addition to Figure 1 with a holder on the lower part of the housing and
Figur 8 einen Schnitt durch ein Ausführungsbeispiel, das in Ergänzung der Figur 1 mit einer Halterung am mittleren Teil des Gehäuses versehen ist.Figure 8 shows a section through an embodiment which is provided in addition to Figure 1 with a bracket on the central part of the housing.
Beschreibung der AusführungsbeispieleDescription of the embodiments
Figur 1 zeigt ein Gehäuse 1 für einen Radarsensor als mikrowellentechnisches Gerät, das an einem Kraftfahrzeug, beispielsweise an der Stoßstange, derart befestigt werden kann, dass es elektromagnetische Wellen zur Abstandsbestimmung absenden kann. Das Gehäuse 1 weist ein mittleres Teil 2 auf, das aus einer Metallplatte besteht und mit Zentriermarken 3 zur Justierung der andern Gehäuseteile und mit Ausnehmungen bzw. Kammern 4 auf der einen Seite und mit Ausnehmungen bzw. Kammern 5 auf der anderen Seite versehen ist. Die Kammern 4 und 5 sind vorzugsweise symmetrisch angeordnet; auf den Kammern 4 und 5 werden Schaltungsplatinen 6 und 7 angeordnet, die mit hier nicht ersichtlichen Halterungen auf dem mittleren Teil 2 gehalten sind.FIG. 1 shows a housing 1 for a radar sensor as a microwave device, which can be attached to a motor vehicle, for example on the bumper, in such a way that it can emit electromagnetic waves for determining the distance. The housing 1 has a central part 2, which consists of a metal plate and is provided with centering marks 3 for adjusting the other housing parts and with recesses or chambers 4 on one side and with recesses or chambers 5 on the other side. The chambers 4 and 5 are preferably arranged symmetrically; on the chambers 4 and 5, circuit boards 6 and 7 are arranged, which are held on the middle part 2 with brackets not shown here.
In Abwandlung der in der Figur 1 gezeigten Darstellung ist das Gehäuse auch mit nur einer Schaltungsplatine, z.B. der Schaltungsplatine 6, aufbaubar. In den Kammern 4 und 5 können Bauelemente der elektronischen Schaltung,
insbesondere auch mikrowellenabstrahlende Bauelemente zu liegen kommen. Die Schaltungsdetails mit den Antennenstrukturen müssen dabei, wegen der Abstrahlung der Mikrowellen, auf jeden Fall auf der oberen Schaltungsplatine 6 sitzen. Als Schaltungsplatinen kommen hierbei sowohl einseitig als auch beidseitig bestückte mehrlagige Schaltungsplatinen aus Verbundmaterialien oder Vielschichtke- ra iken in Betracht .In a modification of the illustration shown in FIG. 1, the housing can also be assembled with only one circuit board, for example the circuit board 6. In the chambers 4 and 5, components of the electronic circuit, in particular, microwave-emitting components also come to rest. The circuit details with the antenna structures must in any case sit on the upper circuit board 6 because of the radiation from the microwaves. In this case, multi-layer circuit boards made of composite materials or multi-layered circuits, which are equipped on one side and on both sides, are suitable as circuit boards.
Es ist weiterhin ein unteres Teil 8, vorzugsweise ein spritzgusstechnisch hergestelltes Kunststoffteil, vorhanden, das eine Steckeranordnung 9 aufweist. Dieses Teil 8 weist Ausnehmung auf, in die die Markierungen 3 des mittleren Teils 2 eingreifen können und somit die Lage der Teile 2 und 8 fixiert ist und außerdem ein dichtes Aneinanderfügen möglich ist. Die Anschlüsse an den Schaltungs- platinen 6 und 7 sind hierbei, gegebenenfalls auch mit Durchkontaktierungen 10 vor dem Anbau des unteren Stekkerteils 8 auf der Unterseite zu kontaktieren, z.B. zu bonden. Die Steckkontakte der Steckeranordnung 9 werden hier in Spritzgusstechnik eingespritzt und bei der Montage mit dem mittleren Teil 2, d.h. mit der Metallplatte, verklebt .There is also a lower part 8, preferably an injection molded plastic part, which has a plug arrangement 9. This part 8 has a recess into which the markings 3 of the middle part 2 can engage and thus the position of the parts 2 and 8 is fixed and also a tight connection is possible. The connections on the circuit boards 6 and 7 are to be contacted here, if necessary also with plated-through holes 10 before the lower plug part 8 is attached on the underside, e.g. to bond. The plug contacts of the plug arrangement 9 are injected here using injection molding technology and, during assembly, with the middle part 2, i.e. glued to the metal plate.
Es ist weiterhin beim Ausführungsbeispiel nach der Figur 1 eine oberes Teil 11 als Deckel, vorzugsweise auch ein spritzgusstechnisch hergestelltes Kunststoffteil, vorhanden, das ebenfalls Ausnehmungen aufweist, in die die Markierungen 3 des mittleren Teils 2 eingreifen können und somit die Lage der Teile 2 und 11 in gleicher Weise wie beim Zusammenbau der Teile 2 und 8 fixiert und abgedichtet ist. Auch im oberen Teil 11 sind Kammern 12 und 13 ausgebildet, in die einzelne Baugruppen, wie Antennen, Oszillator, Mischer, Auswerteelektronik hineinragen können.
In den, den Antennen gegenüberliegen Bereichen 14 und 15 sind im Kunststoff-Teil 11 nach der Figur 1 sog. optische Fenster vorhanden, die zur Begünstigung der Durchstrahlung der Mikrowellen beitragen. In den anderen Bereichen des Teils 11 sind die Materialien so angeordnet, dass sie zur Absorbierung der Mikrowellen geeignet sind. Die optischen Fenster können beispielsweise durch eine eingespritzte, ein- oder beidseitig metallisierte plane Keramikplatte 17 gebildet sein, wobei die äußere oder die äußere und die innere Seite der jeweiligen Keramikplatte 17 in den Bereich 14 oder 15 des oberen Teils 11 eingespritzt ist. Die hier nicht sichtbaren Metallisierungen auf der Keramikplatte 17 können dabei über eine Metallfeder 18 an die Masse der Schaltungsplatine 6 angeschlossenen werden.In the exemplary embodiment according to FIG. 1, there is also an upper part 11 as a cover, preferably also an injection-molded plastic part, which also has recesses into which the markings 3 of the middle part 2 can engage and thus the position of the parts 2 and 11 is fixed and sealed in the same way as when assembling parts 2 and 8. Chambers 12 and 13 are also formed in the upper part 11, into which individual assemblies such as antennas, oscillators, mixers and evaluation electronics can protrude. In the areas 14 and 15 opposite the antennas, so-called optical windows are present in the plastic part 11 according to FIG. 1, which contribute to favoring the radiation of the microwaves. In the other areas of part 11, the materials are arranged so that they are suitable for absorbing the microwaves. The optical windows can be formed, for example, by an injection-molded, flat ceramic plate 17 metallized on one or both sides, the outer or the outer and the inner side of the respective ceramic plate 17 being injected into the region 14 or 15 of the upper part 11. The metallizations not visible here on the ceramic plate 17 can be connected to the ground of the circuit board 6 via a metal spring 18.
Anhand Figur 2 wird ein weiteres Ausführungsbeispiel zur Bildung des zuvor erwähnten optischen Fensters in den Bereichen 14 und 15 des oberen Teils 11 erläutert; die unveränderten Bauteile sind hier mit den gleichen Bezugszeichen wie bei der Figur 1 versehen. Durch Einclipsen von Metallstrukturen 20 unter eine plane Keramikplatte 21 im linken Bereich 14 bzw. durch Einclipsen der Metall- Strukturen 20 direkt an den Kunststoff des oberen Teils 11 im rechten Bereich 15 können hier die optischen Fenster realisiert werden. In Figur 3 ist die Lage der Metallstrukturen 20 auch in einem Schnitt entlang einer Querlinie durch das Gehäuse 1 gezeigt.Another exemplary embodiment for forming the aforementioned optical window in the regions 14 and 15 of the upper part 11 is explained with reference to FIG. 2; the unchanged components are provided with the same reference numerals as in FIG. 1. The optical windows can be realized here by clipping metal structures 20 under a flat ceramic plate 21 in the left area 14 or by clipping the metal structures 20 directly onto the plastic of the upper part 11 in the right area 15. The position of the metal structures 20 is also shown in FIG. 3 in a section along a transverse line through the housing 1.
Bei einem Ausführungsbeispiel nach Figur 4 sind die optischen Fenster durch in den Kunststoff in den Bereichen 14 und 15 des oberen Teils 11 eingespritzte Metallgitterstrukturen 22 gebildet, die eine fokussierende Wirkung haben .In an exemplary embodiment according to FIG. 4, the optical windows are formed by metal grid structures 22 which are injected into the plastic in the regions 14 and 15 of the upper part 11 and which have a focusing effect.
Wenn ein Antennensystem derart aufgebaut wird, dass die Antennen, in einer hier nicht in den Figuren im Detail
erkennbaren Weise, aus einer Mehrzahl von Patches, beispielsweise drei, gebildet sind, so können nach dem Ausführungsbeispiel gemäß Figur 5 und 6 oberhalb dieser Patches in den optischen Fenstern der Bereiche 14 und/oder 15 Fokussiereinrichtungen angebracht werden. Im rechten Bereich 15 ragen hier sog. dielektrische Hörner 23 als Fokussiereinrichtung in die Kammer 13 des Gehäuses 1 hinein. Im linken Bereich 14 nach der Figur 5 sind in den optischen Fenstern nach innen und/oder nach außen ragende dielektrische Linsen 24 und/oder 25 als Fokussiereinrichtung vorhanden. In der Figur 6 ist in einem Schnitt entlang einer Querlinie ebenfalls das dielektrische Hörn 23 aus der Figur 5 erkennbar.If an antenna system is constructed in such a way that the antennas, in one here not in the figures in detail recognizable manner, are formed from a plurality of patches, for example three, so according to the embodiment of Figures 5 and 6 above these patches in the optical windows of the areas 14 and / or 15 focusing devices can be attached. In the area 15 on the right, so-called dielectric horns 23 protrude into the chamber 13 of the housing 1 as a focusing device. In the left area 14 according to FIG. 5, dielectric lenses 24 and / or 25 projecting inwards and / or outwards are present in the optical windows as a focusing device. In FIG. 6, the dielectric horn 23 from FIG. 5 can also be seen in a section along a transverse line.
Zur Befestigung des Gehäuses 1, beispielsweise an der Stoßstange eines Kraftfahrzeuges, sind gemäß Figur 7 und 8 Ausführungsbeispiele einer geeigneten Halterung dargestellt. Nach der Figur 7 ist eine Halterung 26 in Form einer Verlängerung des unteren Kunststoff-Teils 8 des Gehäuses 1 vorgeschlagen, die, gegebenenfalls mit einer Verdickung, am Ende entweder schraubbar mittels einer Bohrung 27 oder clipsbar mit einem Clipselement 28 ist. Eine Halterung 29 durch Verlängerung und Verdickung des mittleren Teils 2 aus Metall ist in der Figur 8 gezeigt, wobei hier die entsprechenden Schraub- oder Clipselemente 27 und/oder 28 wie bei der Figur 7 angewendet werden können.
For fastening the housing 1, for example to the bumper of a motor vehicle, exemplary embodiments of a suitable holder are shown in accordance with FIGS. 7 and 8. According to FIG. 7, a holder 26 in the form of an extension of the lower plastic part 8 of the housing 1 is proposed, which, optionally with a thickening, is either screwable at the end by means of a bore 27 or clipable with a clip element 28. A holder 29 by extending and thickening the middle part 2 made of metal is shown in FIG. 8, wherein the corresponding screw or clip elements 27 and / or 28 can be used as in FIG. 7.
Claims
Patentansprücheclaims
1) Gehäuse für ein elektronisches Gerät in der Mikrowellentechnik mit mindestens einem ersten und einem zweiten Gehäuseteil (2,8,11), die dicht miteinander verbindbar sind und im Inneren des Gehäuses (1) sind eine elektronische Schaltung und mikrowellentechnische Bauteile, insbesondere Antennen zum Senden und Empfangen der Mikrowellen, vorhanden, dadurch gekennzeichnet, dass das Gehäuse (1) aus drei dicht miteinander verbundenen Teilen (2,8,11) zusammengesetzt ist, wobei ein mittleres Teil (2) aus einer Metallplatte gebildet ist, auf der mindestens eine Schaltungsplatine (6,7) aufbringbar ist und Ausnehmungen vorhanden sind, die mit der mindestens einen Schaltungsplatine (6,7) Kammern (4,5) bilden, in die Bauteile der elektronischen Schaltung hineinragen und ein unteres Teil (8) vorhanden ist, das eine außen kon- taktierbare Steckeranordnung (9) aufweist sowie
ein oberes Teil (11) als Deckel angebracht ist, mit dem ebenfalls mit der mindestens einen Schaltungsplatine (6) Kammern (12,13) für elektronische und/oder mikrowellentechnische Bauteile ausgebildet sind.1) Housing for an electronic device in microwave technology with at least a first and a second housing part (2,8,11), which can be connected tightly to one another and inside the housing (1) are an electronic circuit and microwave technology components, in particular antennas for Transmitting and receiving the microwaves, characterized in that the housing (1) is composed of three tightly connected parts (2, 8, 11), a central part (2) being formed from a metal plate on which at least one Circuit board (6,7) can be applied and there are recesses which form chambers (4, 5) with the at least one circuit board (6, 7), protrude into the components of the electronic circuit and a lower part (8) is present, which has an externally contactable plug arrangement (9) and an upper part (11) is attached as a cover, with which chambers (12, 13) for electronic and / or microwave technology components are also formed with the at least one circuit board (6).
2) Gehäuse nach Anspruch 1, dadurch gekennzeichnet, dass das mittlere Teil (2) mit Zentriermarken (3) versehen ist, die in korrespondierende Marken am unteren Teil (8) und am oberen Teil (11) bei der Montage eingreifen.2) Housing according to claim 1, characterized in that the middle part (2) is provided with centering marks (3) which engage in corresponding marks on the lower part (8) and on the upper part (11) during assembly.
3) Gehäuse nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das mittlere Teil (2) symmetrisch aufgebaut ist.3) Housing according to claim 1 or 2, characterized in that the central part (2) is constructed symmetrically.
4) Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das obere Teil (11) derart ausgebildet ist, dass in den, den Antennen gegenüberliegen Bereichen (14,15) Materialien als optische Fenster zur Begünstigung der Durchstrahlung mit Mikrowellen und in den anderen Bereichen Materialien zur Absorbierung von Mikrowellen vorhanden sind.4) Housing according to one of the preceding claims, characterized in that the upper part (11) is designed such that in the areas (14, 15) opposite the antennas, materials as optical windows to favor the transmission of microwaves and in the others Areas of microwave absorption materials are present.
5) Gehäuse nach Anspruch 4, dadurch gekennzeichnet, dass die optischen Fenster durch eine eingespritzte, ein- oder beidseitig metallisierte Keramikplatte (17) gebildet sind, wobei die äußere oder die äußere und die innere Seite der Keramikplatte (17) eingespritzt ist.5) Housing according to claim 4, characterized in that the optical windows are formed by an injected, on one or both sides metallized ceramic plate (17), wherein the outer or the outer and the inner side of the ceramic plate (17) is injected.
6) Gehäuse nach Anspruch 5, dadurch gekennzeichnet, dass
die Metallisierungen auf der Keramikplatte (17) über eine Metallfeder (18) an die Masse der Schaltungsplatine (6) angeschlossen sind.6) Housing according to claim 5, characterized in that the metallizations on the ceramic plate (17) are connected to the ground of the circuit board (6) via a metal spring (18).
7) Gehäuse nach Anspruch 4, dadurch gekennzeichnet, dass die optischen Fenster durch Einclipsen von Metallstrukturen (20) gebildet sind.7) Housing according to claim 4, characterized in that the optical windows are formed by clipping metal structures (20).
8) Gehäuse nach Anspruch 7, dadurch gekennzeichnet, dass zwischen die Wand des oberen Teils (11) und den ein- geclipsten Metallstrukturen (20) eine plane Keramikplatte (21) angebracht ist.8) Housing according to claim 7, characterized in that a flat ceramic plate (21) is attached between the wall of the upper part (11) and the clipped-on metal structures (20).
9) Gehäuse nach Anspruch 4, dadurch gekennzeichnet, dass in den optischen Fenstern durch eingespritzte Metallgitterstrukturen (22) eine fokussierende Wirkung erzielt wird.9) Housing according to claim 4, characterized in that a focusing effect is achieved in the optical windows by injected metal grating structures (22).
10) Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Antennen aus einer Mehrzahl von Patches gebildet sind und dass oberhalb dieser Patches in den Kammern (12,13) nach innen ragende dielektrische Hörner (23) als Fokus - siereinrichtung vorhanden sind.10) Housing according to one of the preceding claims, characterized in that the antennas are formed from a plurality of patches and that above these patches in the chambers (12, 13) there are inwardly projecting dielectric horns (23) as a focusing device.
11) Gehäuse nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die Antennen aus einer Mehrzahl von Patches gebildet sind und dass oberhalb dieser Patches in den Kammern (23) nach
innen und/oder nach, außen ragende dielektrische Linsen (24,25) als Fokussiereinrichtung vorhanden sind.11) Housing according to one of claims 1 to 9, characterized in that the antennas are formed from a plurality of patches and that above these patches in the chambers (23) on the inside and / or on the outside, dielectric lenses (24, 25) are present as a focusing device.
12) Gehäuse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass12) Housing according to one of the preceding claims, characterized in that
das Gehäuse (1) an mindestens einem der drei Teile (2,8,11) eine Halterung (26,-29) aufweist, die aus einer Verlängerung und gegebenenfalls mit einer Verdickung mit schraub- oder clipsbaren Elementen (27; 28) gebildet ist.the housing (1) has a holder (26, -29) on at least one of the three parts (2, 8, 11), which is formed from an extension and optionally with a thickening with screwable or clipable elements (27; 28) .
13) Gehäuse nach Anspruch 12, dadurch gekennzeichnet, dass die Halterung (26) durch eine entsprechende Formung des unteren Teils (8) aus Kunststoff gebildet ist.13) Housing according to claim 12, characterized in that the holder (26) is formed by a corresponding shaping of the lower part (8) made of plastic.
14) Gehäuse nach Anspruch 12, dadurch gekennzeichnet, dass die Halterung (29) durch eine entsprechende Formung des mittleren Teils (2) aus Metall gebildet ist.
14) Housing according to claim 12, characterized in that the holder (29) is formed by a corresponding shaping of the central part (2) made of metal.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19904303A DE19904303A1 (en) | 1999-01-28 | 1999-01-28 | Housing for an electronic device in microwave technology |
DE19904303 | 1999-01-28 | ||
PCT/DE2000/000022 WO2000045462A1 (en) | 1999-01-28 | 2000-01-04 | Housing for an electronic apparatus in microwave technology |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1157441A1 true EP1157441A1 (en) | 2001-11-28 |
Family
ID=7896274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00904819A Withdrawn EP1157441A1 (en) | 1999-01-28 | 2000-01-04 | Housing for an electronic apparatus in microwave technology |
Country Status (6)
Country | Link |
---|---|
US (1) | US6600103B1 (en) |
EP (1) | EP1157441A1 (en) |
JP (1) | JP2002539600A (en) |
KR (1) | KR20010101704A (en) |
DE (1) | DE19904303A1 (en) |
WO (1) | WO2000045462A1 (en) |
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RU2777833C2 (en) * | 2019-12-27 | 2022-08-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования «Саратовский государственный технический университет имени Гагарина Ю.А.» | Method for obtaining a stabilized dispersion of submicrosized powders of solid solutions in alcohols |
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- 2000-01-04 JP JP2000596623A patent/JP2002539600A/en active Pending
- 2000-01-04 WO PCT/DE2000/000022 patent/WO2000045462A1/en not_active Application Discontinuation
- 2000-01-04 EP EP00904819A patent/EP1157441A1/en not_active Withdrawn
- 2000-01-04 US US09/890,368 patent/US6600103B1/en not_active Expired - Fee Related
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RU2777833C2 (en) * | 2019-12-27 | 2022-08-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования «Саратовский государственный технический университет имени Гагарина Ю.А.» | Method for obtaining a stabilized dispersion of submicrosized powders of solid solutions in alcohols |
Also Published As
Publication number | Publication date |
---|---|
DE19904303A1 (en) | 2000-08-24 |
US6600103B1 (en) | 2003-07-29 |
WO2000045462A1 (en) | 2000-08-03 |
JP2002539600A (en) | 2002-11-19 |
KR20010101704A (en) | 2001-11-14 |
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