EP1156886A4 - Apparatus and method for applying flux to a substrate - Google Patents

Apparatus and method for applying flux to a substrate

Info

Publication number
EP1156886A4
EP1156886A4 EP00902365A EP00902365A EP1156886A4 EP 1156886 A4 EP1156886 A4 EP 1156886A4 EP 00902365 A EP00902365 A EP 00902365A EP 00902365 A EP00902365 A EP 00902365A EP 1156886 A4 EP1156886 A4 EP 1156886A4
Authority
EP
European Patent Office
Prior art keywords
substrate
applying flux
flux
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00902365A
Other languages
German (de)
French (fr)
Other versions
EP1156886A1 (en
Inventor
Vision Systems Inc Robotic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acuity CiMatrix Inc
Original Assignee
Robotic Vision Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robotic Vision Systems Inc filed Critical Robotic Vision Systems Inc
Publication of EP1156886A1 publication Critical patent/EP1156886A1/en
Publication of EP1156886A4 publication Critical patent/EP1156886A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225Screens or stencils; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203Fluxing, i.e. applying flux onto surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12Production of screen printing forms or similar printing forms, e.g. stencils

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP00902365A 1999-01-07 2000-01-07 Apparatus and method for applying flux to a substrate Withdrawn EP1156886A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22724399A 1999-01-07 1999-01-07
US227243 1999-01-07
PCT/US2000/000427 WO2000040343A1 (en) 1999-01-07 2000-01-07 Apparatus and method for applying flux to a substrate

Publications (2)

Publication Number Publication Date
EP1156886A1 EP1156886A1 (en) 2001-11-28
EP1156886A4 true EP1156886A4 (en) 2002-08-28

Family

ID=22852350

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00902365A Withdrawn EP1156886A4 (en) 1999-01-07 2000-01-07 Apparatus and method for applying flux to a substrate

Country Status (3)

Country Link
EP (1) EP1156886A4 (en)
AU (1) AU2409500A (en)
WO (1) WO2000040343A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (en) * 1969-12-03 1971-06-09 Siemens Ag Printed circuit screen printing template
US4323593A (en) * 1979-04-11 1982-04-06 Matsushita Electric Industrial Co., Ltd. Method of printing a spot pattern in a printed circuit board
JPH0313393A (en) * 1989-06-12 1991-01-22 Sony Corp Mask screen for cream solder printing and preparation thereof
JPH03256396A (en) * 1990-03-07 1991-11-15 Senju Metal Ind Co Ltd Soldering method for printed-circuit board
JPH04230095A (en) * 1990-12-27 1992-08-19 Fuji Photo Film Co Ltd Board mounting method
JPH06260748A (en) * 1993-03-03 1994-09-16 Kiyoshi Saitou Partially flux applying apparatus for printed board
US5356658A (en) * 1993-07-19 1994-10-18 Motorola, Inc. Flexible high speed liquid dispenser
US5373786A (en) * 1992-06-10 1994-12-20 Dainippon Screen Mfg. Co., Ltd. Metal mask plate for screen printing
GB2320462A (en) * 1996-12-18 1998-06-24 Micro Metallic Ltd Improved stencil and method of producing same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0244496B1 (en) * 1986-05-06 1991-01-16 Ibm Deutschland Gmbh Lithographic mask for ions, electrons or x-rays, and process for its production
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
KR0138278B1 (en) * 1995-01-24 1998-04-27 김광호 Mask for x-ray lithography and method to manufacture the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (en) * 1969-12-03 1971-06-09 Siemens Ag Printed circuit screen printing template
US4323593A (en) * 1979-04-11 1982-04-06 Matsushita Electric Industrial Co., Ltd. Method of printing a spot pattern in a printed circuit board
JPH0313393A (en) * 1989-06-12 1991-01-22 Sony Corp Mask screen for cream solder printing and preparation thereof
JPH03256396A (en) * 1990-03-07 1991-11-15 Senju Metal Ind Co Ltd Soldering method for printed-circuit board
JPH04230095A (en) * 1990-12-27 1992-08-19 Fuji Photo Film Co Ltd Board mounting method
US5373786A (en) * 1992-06-10 1994-12-20 Dainippon Screen Mfg. Co., Ltd. Metal mask plate for screen printing
JPH06260748A (en) * 1993-03-03 1994-09-16 Kiyoshi Saitou Partially flux applying apparatus for printed board
US5356658A (en) * 1993-07-19 1994-10-18 Motorola, Inc. Flexible high speed liquid dispenser
GB2320462A (en) * 1996-12-18 1998-06-24 Micro Metallic Ltd Improved stencil and method of producing same

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 124 (M - 1097) 26 March 1991 (1991-03-26) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 059 (E - 1166) 14 February 1992 (1992-02-14) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 579 (E - 1299) 18 December 1992 (1992-12-18) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 661 (E - 1644) 14 December 1994 (1994-12-14) *
See also references of WO0040343A1 *

Also Published As

Publication number Publication date
EP1156886A1 (en) 2001-11-28
AU2409500A (en) 2000-07-24
WO2000040343A1 (en) 2000-07-13

Similar Documents

Publication Publication Date Title
SG90780A1 (en) Method and apparatus for dechucking a substrate
AU2003286547A8 (en) Method and apparatus for applying designs to a substrate
EP1044494A4 (en) Method and apparatus for clamping a substrate
GB9914484D0 (en) Polishing apparatus and method for polishing a substrate
GB9801655D0 (en) Method and apparatus for treating a substrate
AU7591800A (en) Method and apparatus for single-point-delegation of a task to multiple web-basedservices
AU2001284937A1 (en) Method and apparatus for applying a curved component to a moving web
GB9908359D0 (en) Apparatus and method for aligning tubulars
EP1456467A4 (en) Method and apparatus for applying a material to a web
GB9718543D0 (en) Method and apparatus for aligning tubulars
GB9701758D0 (en) Apparatus and method for aligning tubulars
GB0029943D0 (en) Method and apparatus for completing a wellbore
GB9801359D0 (en) Methods and apparatus for treating a substrate
EP1246951A4 (en) Method and apparatus for coating a substrate in a vacuum
GB2356786B (en) Method and apparatus for aligning a crystalline substrate
AU5593700A (en) Apparatus and method for applying labels
GB2355992B (en) Method and apparatus for forming a film on a substrate
GB2368595B (en) Apparatus and method for coating substrates
AU2001273651A1 (en) Method and apparatus for applying a protective over-coating to a ball-grid-array(bga) structure
EP1208010A4 (en) Method and apparatus for applying chemical watermarks on substrate
AU2002316468A1 (en) Apparatus and method for applying an elongate member to a substrate
GB9925141D0 (en) Article aligning apparatus and method therefor
EP1156886A4 (en) Apparatus and method for applying flux to a substrate
GB2365117B (en) Method of and apparatus for heating a substrate
GB0015145D0 (en) Method and apparatus for attaching a covering to a substrate

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20010807

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

Kind code of ref document: A1

Designated state(s): DE FR GB IT

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ROBOTIC VISION SYSTEMS INC.

RIN1 Information on inventor provided before grant (corrected)

Inventor name: ROBOTIC VISION SYSTEMS INC.

RIC1 Information provided on ipc code assigned before grant

Free format text: 7B 05C 17/06 A, 7B 05D 1/32 B, 7B 23K 37/06 B, 7G 03F 7/22 B, 7B 23K 20/00 B, 7H 01L 21/60 B, 7B 41N 1/24 B, 7B 41C 1/14 B

A4 Supplementary search report drawn up and despatched

Effective date: 20020711

AK Designated contracting states

Kind code of ref document: A4

Designated state(s): DE FR GB IT

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB IT

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20040803