EP1073888A1 - Microcalorimetre - Google Patents

Microcalorimetre

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Publication number
EP1073888A1
EP1073888A1 EP99915762A EP99915762A EP1073888A1 EP 1073888 A1 EP1073888 A1 EP 1073888A1 EP 99915762 A EP99915762 A EP 99915762A EP 99915762 A EP99915762 A EP 99915762A EP 1073888 A1 EP1073888 A1 EP 1073888A1
Authority
EP
European Patent Office
Prior art keywords
thermometer
microcalorimeter
heating
cooling device
absorber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99915762A
Other languages
German (de)
English (en)
Inventor
Franz Von Feilitzsch
Jens HÖHNE
Josef Jochum
Johann Schnagl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CSP Cryogenic Spectrometers GmbH
Original Assignee
CSP Cryogenic Spectrometers GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CSP Cryogenic Spectrometers GmbH filed Critical CSP Cryogenic Spectrometers GmbH
Publication of EP1073888A1 publication Critical patent/EP1073888A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G01K17/006—Microcalorimeters, e.g. using silicon microstructures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
    • F25B9/145—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle pulse-tube cycle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/14—Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1406—Pulse-tube cycles with pulse tube in co-axial or concentric geometrical arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/14—Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1408—Pulse-tube cycles with pulse tube having U-turn or L-turn type geometrical arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/14—Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1418—Pulse-tube cycles with valves in gas supply and return lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/14—Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1418—Pulse-tube cycles with valves in gas supply and return lines
    • F25B2309/14181—Pulse-tube cycles with valves in gas supply and return lines the valves being of the rotary type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/14—Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1424—Pulse tubes with basic schematic including an orifice and a reservoir
    • F25B2309/14241—Pulse tubes with basic schematic including an orifice reservoir multiple inlet pulse tube
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/10—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point with several cooling stages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a microcalorimeter according to claim 1, a group of microcalorimeters according to claim 23 and a device for measuring particles and radiation according to claim 26.
  • microcalorimeters have a wide range of applications. They are used, for example, in material analysis or quality assurance by means of X-ray fluorescence analysis, preferably in the semiconductor industry, but they are also suitable for the determination of molecules in biotechnology.
  • Microcalorimeter structure, principle
  • detectors represent the so-called microcalorimeters. As can be seen in FIG. 1, they essentially consist of the components: sorber 2, thermometer 1 and a coupling 5 to a heat sink or cold bath together.
  • the thermometer 1 is a so-called phase transition thermometer with a superconducting material that changes from the normally conductive to the superconducting phase at a critical temperature, the transition temperature T c .
  • the transition from the normally conductive to the superconducting region does not occur abruptly due to material inhomogeneities, but rather over a region ⁇ T transition of a few mK, as shown in FIG. 2.
  • the electrical resistance R of the superconducting material shows a strong temperature dependency, which makes it suitable for a very sensitive temperature measurement.
  • the point of greatest slope with respect to the quotient from resistance change ⁇ R to temperature change ⁇ T in the transition region is selected as the working point or working temperature point of the superconducting material in order to achieve maximum sensitivity for temperature changes ⁇ T.
  • the principle of operation of the microcalorimeter is that a particle or radiation strikes the absorber 2 and interacts with it.
  • the locally deposited energy .DELTA.E then spreads in the absorber, it thermalizes, and finally reaches the thermometer 1 connected to the heat sink. There, it causes a temperature increase .DELTA.T and leads to a change in resistance .DELTA.R, which is read out by readout electronics 40, such as it is shown in Figure 3 can be detected.
  • the readout electronics 40 shown in greatly simplified form in FIG. 3 have a readout circuit 44 with two branches connected in parallel, namely a branch having a shunt resistor R s and a branch magnetic readout coil L and resistance R ⁇ connected in series, which is formed by the thermometer, having branch.
  • the readout circuit 44 is fed by a constant current I 0 . If a particle or radiation deposits energy in the microcalorimeter, this leads to a change in resistance in the thermometer R ⁇ , which causes a change in the current I ⁇ . This change in current in turn leads to a change in the magnetic field in the coil L, which is finally detected by an SQÜID 42 ("Superconducting Quantum Interference Device", a superconducting quantum interference device). The measurement signal obtained in this way is directly proportional to the incident energy ⁇ E.
  • thermometer As shown in FIG. 4a, the temperature of the heat sink T s is kept below the step temperature T c of the superconductor or the thermometer.
  • thermometer due to an incident particle or radiation the thermometer warms, this has an increase in resistance or temperature increase ⁇ T + and thus an instantaneous reduction ⁇ T.
  • the heating output corresponding to the temperature in the thermometer, which brings the temperature back to the working point. This directly counteracts the heating, which leads to a shortening of the signal length, ie an acceleration.
  • thermometer A disadvantage of the detector arises when measuring higher-energy radiation due to the limited dynamic range.
  • the temperature of the heat sink T s is below the transition temperature T c or below the working temperature point, so that the thermometer must be heated to its working temperature point by a heating current flowing through the thermometer.
  • this in turn is limited because it must not exceed the critical current specific to the superconducting material of the thermometer. If, however, particles or radiation are to be measured that deposit a lot of energy, the temperature of the heat sink T s must first be set very low in order to ensure a large difference from the working temperature point and thus a large heating output.
  • thermometer also serves as a heating device in the detector used here, the heating current is limited by the critical current and therefore the dynamic range. However, if the largest possible dynamic range is to be set, a large heating output or energy dissipation in the thermometer is required.
  • FIG. 5 shows a diagram of the electrical wiring of such a low-temperature calorimeter.
  • the readout circuit 44 already explained in FIG. 3 is shown here with the shunt resistance R s in one branch and the thermometer resistance R ⁇ and the coil L in the other branch. Furthermore, there is a heating resistor R H , which is thermally coupled to the thermometer R ⁇ and via a control element 43 with a root extractor 43 and a conventional SQUID system 42 to the coil L for adjustment of the heating power is shown. If the thermometer is heated by an incident particle or incident radiation, the heating power at the resistor R H is reduced by the just mentioned feedback in order to return the thermometer to the working temperature point. The signal is accelerated here by the feedback of the heating resistor R H to the readout circuit 44.
  • thermometer By separating the thermometer and the heating device, the above-mentioned disadvantages of the detector from the American patent US-A-5,641,961 can be overcome.
  • thermometer is heated and cooled via a bond wire, which is both coupled to a heat sink and connected to a heating current source, the following disadvantages arise.
  • the bonding wire used as a heating device has a high thermal capacity in comparison to the thermometer and, due to the quasi punctiform or local coupling, a low thermal conductivity. This leads to a slower return of the thermometer to the working temperature point and thus to a deteriorated signal acceleration (see explanations on FIG. 4c).
  • the heating power is reduced because, depending on the coupling, about half of the heating power is given off to the heat sink. In other words, in order to obtain a certain dynamic range, approximately twice the heating power must be applied.
  • the inadvertent heating of the heat sink or the cold bath leads to an overuse of the cold bath and thus to a reduction in the service life. Presentation of the invention
  • the microcalorimeter according to the present invention comprises a sensor component consisting of a thermometer with a superconducting material and an absorber thermally coupled to the thermometer, a cooling device, a heating device and a reading device. Because the cooling device and the heating device are separate devices which are thermally coupled separately from one another to the sensor component, the heating device can be arranged in such a way that the heat emitted by it flows through the thermometer into the cooling device. This leads to a minimization of the heating power or to a minimization of the cooling power to be applied by the cooling device, since heating power is not given directly and unused to the cooling device.
  • the cooling device is thermally coupled to the sensor component
  • the cooling of the sensor component by the cooling device takes place uniformly, which in turn leads to a signal acceleration.
  • This is additionally promoted by a flat thermal coupling of the heating device to the sensor component.
  • Flat thermal Coupling here means that the coupling takes place over an extensive contact area and not only in a quasi-punctiform manner as with bond wires.
  • the heating device or cooling device can be optimized separately from one another with regard to thermal capacity, thermal conductivity or geometry. For example, the areal heat coupling between the thermometer and the heating device can be brought to a suitable value in order to obtain an optimal signal amplitude.
  • thermometer It is advantageous to set a poorer thermal conductivity in comparison to the thermometer, which results in a slower energy dissipation into the heat sink in comparison with the reduction in the heating power and thus a large signal amplitude or pulse height. This ensures a good energy resolution.
  • the areal coupling offers the decisive advantage of uniform cooling of the thermometer, as a result of which temperature gradients within the thermometer are avoided and, in turn, the signals are accelerated and the energy resolution increased.
  • the heating device has one or more heating elements which are coupled to the sensor component. This makes it possible to heat either only the thermometer or only the absorber by means of a heating element or simultaneously the thermometer and the absorber with one heating element each. Furthermore, a large number of heating elements can be coupled to the sensor component in order to ensure an even supply of heat.
  • the heat capacity of a heating element is dimensioned such that it is less than or equal to the heat capacity of the system of thermometer and absorber.
  • the cooling device for coupling to the sensor component has, for example, a substrate, an electrically insulating layer or a membrane.
  • the advantages of the membrane lie in the fact that, compared to the substrate, it enables a weaker, but nevertheless uniform, thermal coupling of the thermometer to the heat sink. Furthermore, when measuring X-rays, there is the advantage that the probability of absorption below the thermometer is very minimized due to the small thickness compared to the substrate. In contrast to the substrate, there is therefore no deterioration in the energy resolution due to interfering signals.
  • thermometer To be able to register events on the thermometer, it is necessary to ensure a good coupling of the two components. This can be achieved by applying the thermometer directly to the absorber. If, on the other hand, a spatial resolution of the event occurring in the absorber is desired, the absorber is locally coupled to the thermometer via a connecting device.
  • the connecting device can be a bond wire that connects the absorber and the thermometer. However, it is also possible to arrange the absorber and thermometer next to one another in such a way that again only a local coupling is formed.
  • thermometer For an improved spatial resolution of an event occurring in the absorber, it is possible according to a further advantageous embodiment of the invention to design the thermometer with a large number of thermometer elements which are each coupled to the absorber at different points.
  • the readout electronics advantageously have a SQUID system with a single SQUID or a group of SQUIDs.
  • the thermometer can have, for example, an element superconductor, a high-temperature superconductor, an alloy, a two-layer structure composed of two superconductors, a two-layer structure composed of a superconductor and a normal conductor, or a three-layer structure composed of normal conductors and superconductors.
  • the element superconductors consist, for example, of tungsten, iridium, aluminum or tantalum, the two-layer structures from a combination of iridium / gold, iridium / silver, aluminum / silver, tantalum / silver, tantalum / gold, titanium / aluminum or titanium 11
  • the absorber and the substrate have, for example, a dielectric such as sapphire, a semiconductor such as silicon, germanium or gallium arsenide, or a metal such as gold or silver, a semimetal such as bismuth, semimetal alloys such as mercury-telluride, cadmium-telluride or mercury-cadmium-plate uride, or super conductor such as tantalum, aluminum or lead or a combination of the individual materials.
  • the heating film can be made of gold or silver or platinum.
  • the substrate is made of silicon, germanium or sapphire, for example, and the membrane is made of silicon nitride, silicon oxide or aluminum oxide.
  • a multiplicity of microcalorimeters according to the present invention are arranged next to one another to form a group of microcalorimeters.
  • three-dimensional structures can be formed, which are arranged, for example, for observation around an object.
  • two-dimensional structures are also possible, in which the large number of microcalorimeters, analogous to a CCD camera, is arranged in one plane.
  • a microcalorimeter or a group of microcalorimeters according to the invention is placed in a device for measuring particles and radiation with a first cooling device, with a second cooling device which is precooled by the first cooling device and itself an operating temperature ( T s ) and used with an inlet opening for the passage of particles and radiation as a detection device for detecting particles and radiation.
  • the microcalorimeter is thermally coupled to the second cooling device. 12
  • the first cooling device advantageously has a coupled nitrogen / helium cooler, a pulse tube cooler, a mechanical cooling device such as a helium compression cooler or an electrical cooling device such as a Peltier element.
  • the second cooling device has, for example, a demagnetization stage, a 3 He / He separation cooler, a 3 He cooler, a mechanical cooling device such as a helium compressor cooler, an electrical cooling device such as a Peltier element or a superconducting tunnel diode such as an NIS diode.
  • the device has a focusing device such as, for example, an X-ray lens, a Wolter arrangement, a Fresnel lens, focusing tube bundles, electrical focusing devices or magnetic focusing devices which point in the direction from the detection device considered the inlet opening, is arranged in front of or behind the inlet opening.
  • a focusing device such as, for example, an X-ray lens, a Wolter arrangement, a Fresnel lens, focusing tube bundles, electrical focusing devices or magnetic focusing devices which point in the direction from the detection device considered the inlet opening, is arranged in front of or behind the inlet opening.
  • FIG. 1 shows a schematic illustration of a microcalorimeter with its essential components
  • FIG. 2 shows a diagram which shows a typical course of a phase transition of a thermometer in a microcalorimeter, 13
  • FIG. 3 shows a greatly simplified schematic illustration of the readout electronics of a microcalorimeter
  • thermometer 4 each show a resistance-temperature diagram, by means of which the setting of the thermometer to the working temperature point or the reaction of the thermometer to events taking place in the absorber are explained,
  • FIG. 5 shows a schematic representation of the electrical wiring of a low-temperature calorimeter in the prior art according to 0. Meier and others,
  • FIG. 6 shows a schematic illustration of a first exemplary embodiment of the invention
  • FIG. 7 shows a schematic illustration of a second exemplary embodiment of the invention
  • FIG. 8 shows a schematic illustration of a third exemplary embodiment of the invention
  • FIG. 11 shows a schematic illustration of a fifth exemplary embodiment of the invention
  • FIG. 12 shows a schematic illustration of an exemplary embodiment of a group of microcalocal 14
  • FIG. 13 shows a schematic illustration of an exemplary embodiment of a device for measuring radiation according to the invention.
  • FIG. 6 shows a schematic illustration of the arrangement of the individual components of a microcalorimeter according to a first exemplary embodiment of the present invention.
  • the same parts are designated with the same reference numerals.
  • thermometer film 1 When viewed from the bottom up, a thermometer film 1 is first applied to a substrate 30 connected to a heat sink (not shown), then an absorber 2 and a heating film 20 are applied to this thermometer film 1. All components are thermally coupled to one another. As has already been mentioned, due to the coupling of the thermometer 1 over a large area to the heat sink, uniform cooling is achieved, which causes a signal acceleration. Furthermore, the entire heating power applied by the heating film 20 is dissipated into the heat sink via the thermometer 1, so that essentially only the heating power necessary for setting the working temperature point has to be provided in order to set a certain dynamic range.
  • FIG. 7 shows a schematic representation of the arrangement of the individual components of a microcalorimeter according to a second exemplary embodiment of the present invention.
  • thermometer film 1 when viewed from bottom to top, a thermometer film 1 is first applied to a substrate 30 connected to a heat sink (not shown). An absorber 2 is then applied to this thermometer film 1 and a heating film 20 is applied to this.
  • the heating film 20 is coupled to the absorber 2 to achieve a more extensive and thus more uniform heating of the thermometer 1. This can also cause the signal to accelerate.
  • FIG. 8 shows a schematic illustration of the arrangement of the individual components of a microcalorimeter according to a third exemplary embodiment of the present invention. This embodiment represents a combination of the first two embodiments.
  • thermometer film 1 is applied to a substrate 30 connected to a heat sink (not shown), and an absorber 2 and a heating film 20 are applied to this thermometer film 1. Finally, the absorber 2 is again provided with a heating film 20. All components are thermally coupled to one another.
  • the heating films 20 on the absorber 2 and on the thermometer 1 can be connected in series, in parallel or independently with two different sources.
  • One advantage of this arrangement is that a large-area and thus uniform heating of the thermometer 1 is provided, which means that 16
  • ne good thermal conductivity can be achieved. Furthermore, depending on the heat capacity of the individual components 1, 2, 20, a more or less fast active cooling of absorber 2 and thermometer 1 can be achieved. Active cooling means the loss of heating power in the event of an event taking place in the absorber. As has already been mentioned, a low heat capacity of the absorber 2 and heating film 20 components or good thermal conductivity to the thermometer 1 are a prerequisite for rapid active cooling and thus acceleration of the signals.
  • thermometer 1 A special feature of this embodiment is the areal coupling of the absorber 2 to the thermometer 1. If there is an energy deposition of a particle in the absorber 2, the energy thermalizing in the direction of the thermometer 1 can be quickly released to the thermometer 1. This causes a rapidly increasing signal pulse with a large amplitude, whereby a good energy resolution with regard to incident particles or radiation to be observed can be achieved.
  • FIGS. 9 show a schematic representation of a real geometry of the individual components of a microcalorimeter according to the third exemplary embodiment of the invention.
  • thermometer 1 is electrically contacted via contacting surfaces made of aluminum, so-called aluminum bond pads 35, 36, and via superconducting wires 45, 46 by means of an 17
  • Gold heaters are connected as heating elements via an electrically conductive absorber 2. They are electrically contacted via aluminum bond pads 37, 38 and connected to a voltage source (not shown) via superconducting wires 47, 48. The gold heaters are coupled to thermometer 1 and the absorber via their thermal conductivity.
  • thermometer film 1 is evaporated or sputtered onto the substrate 30.
  • the thermometer 1 is then structured by means of a photolithographic process or etching and sputtering.
  • a so-called lift-off mask for the heaters 22, 23 is then created using a photolithographic process.
  • the heaters 22, 23 are vapor-deposited or sputtered and the lift-off mask is removed.
  • a lift-off mask for the absorber 2 is then created using a photolithographic process.
  • the absorber 2 is evaporated or sputtered and the lift-off mask is removed.
  • a lift-off mask for the aluminum bond pads 35, 36, 37, 38 is then created using a photolithographic process.
  • the aluminum bond pads 35, 36, 37, 38 are sputtered on and the lift-off mask is removed.
  • FIG. 10 shows a schematic representation of a real geometry of the individual components of a microcalorimeter according to the fourth exemplary embodiment of the invention.
  • the structure of the microcalorimeter of this embodiment corresponds essentially to that of the third two 18th
  • thermometer 1 is arranged on a membrane 32.
  • This membrane 32 is applied to the substrate 30 during manufacture, the substrate 30 below the thermometer 1 then being removed, for example by etching.
  • this arrangement improves the energy resolution, particularly when measuring X-ray radiation, since the probability of disruptive signals resulting from events below the thermometer 1 is minimized.
  • Typical dimensions for the components used in microcalorimeters according to the present invention are 1 mm ⁇ 1 mm ⁇ 0.1 ⁇ m for the thermometer, 250 ⁇ m ⁇ 250 ⁇ m ⁇ 1 ⁇ m for the absorber 2, 1.5 mm ⁇ 1.5 mm ⁇ 0.4 for the membrane 32 ⁇ m and for the substrate 30 1.5mm x 1.5mm x lmm.
  • FIG. 11 shows a schematic illustration of the arrangement of the individual components of a microcalorimeter according to a fifth exemplary embodiment of the present invention.
  • the structure of the microcalorimeter of this embodiment essentially corresponds to that of the third exemplary embodiment, with the difference that the thermometer 1 is coupled to the absorber 2 via a bonding wire 5, the absorber 2 not being provided with a heating element.
  • this small-area or local coupling of the two components 1, 2 results in poorer thermal conductivity than the large-area coupling in accordance with the third embodiment and thus a poorer energy resolution, a spatially resolved detection of events taking place in the absorber 2 is possible. 19
  • FIG. 12 shows a schematic illustration of an exemplary embodiment of a group of microcalorimeters in a planar arrangement according to the invention.
  • FIG. 13 shows a schematic illustration of an exemplary embodiment of a device for measuring radiation according to the invention. 20th
  • a detection device 100 for particles and radiation is thermally coupled to a demagnetization stage 110, which represents a heat sink with a temperature of approximately 50 to 100 mK .
  • This arrangement is surrounded by a container 112 filled with liquid helium, which provides approximately a temperature of 4K.
  • a helium-cooled shield 114 follows, which, separated by a further vacuum 102, is surrounded by a container 116 filled with liquid nitrogen, which provides a temperature of approximately 77K.
  • the entire inner arrangement is surrounded by an outer jacket 120. Entry windows 118 are provided so that radiation can strike the detection device 100.
  • Such a device is suitable, for example, for examining surface contaminants by means of X-ray fluorescence analysis, the basic measurement principle being able to be represented as follows.
  • X-ray source X-rays are radiated onto the surface to be examined, whereby the atoms on the surface are excited. During their relaxation or de-excitation, these surface atoms emit the so-called X-ray fluorescence radiation, which has a characteristic wavelength or frequency for each element.
  • the detection of the X-ray fluorescence radiation takes place with the device described above, it being possible to use the measured frequency distribution to infer the frequency of the surface contaminations and their exact composition.
  • a device has the advantage that, due to the large, adjustable dynamic range, a wide energy spectrum of radiation can be detected. Furthermore, due to the good energy resolution, an exact differentiation of different elements is possible, even if their X-ray lines are close together. In addition, large surfaces can be examined because, on the one hand, due to the signal acceleration, little measurement time is required and, on the other hand, due to the minimized heating power, the second cooling device, such as the demagnetization stage, can be kept at its temperature for a long time.
  • a microcalorimeter or a group of microcalorimeters which have a sensor component consisting of a thermometer with a superconducting material and an absorber thermally coupled to the thermometer, a cooling device, a heating device and a readout device, the cooling device and the heating device being separate from one another are thermally coupled to the sensor component and at least the cooling device is thermally coupled flat to the sensor component.
  • This arrangement allows a large dynamic range to be set with minimal heating power, but it is also possible to optimize the cooling device and the heating device separately, as a result of which an improved energy resolution or signal acceleration is achieved.
  • Microcalorimeters of this type are used, for example, in material analysis or quality assurance by means of X-ray fluorescence analysis, preferably in the semiconductor industry, but are also suitable for determining molecules in biotechnology. 22
  • thermometer 32 membrane 3 355,. 3 366 aluminum bond pads on the thermometer
  • thermometer T temperature R ⁇ electrical resistance of the thermometer T temperature

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  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Measurement Of Radiation (AREA)

Abstract

L'invention concerne un microcalorimètre ou un groupe de microcalorimètres comprenant un composant détecteur (1, 2) composé d'un thermomètre (1) avec un matériau supraconducteur et d'un absorbeur (2) thermiquement couplé au thermomètre, un dispositif de refroidissement (30), un dispositif de chauffage (20) et un dispositif de lecture. Le dispositif de refroidissement et le dispositif de chauffage sont thermiquement couplés, indépendamment l'un de l'autre, au composant détecteur et au moins le dispositif de refroidissement est thermiquement couplé de façon surfacique avec le composant détecteur. Cette conception permet non seulement de régler une grande zone dynamique pour une puissance de chauffage minimum mais peut aussi d'entraîner une optimisation séparée du dispositif de refroidissement et du dispositif de chauffage, ce qui permet d'obtenir une résolution d'énergie améliorée ou une accélération des signaux. De tels microcalorimètres sont utilisés, par exemple, dans l'analyse de matériaux ou l'assurance qualité par une analyse par fluorescence X, de préférence, dans l'industrie des semi-conducteurs. Ils sont également adaptés pour déterminer des molécules en biotechnologie.
EP99915762A 1998-04-21 1999-04-16 Microcalorimetre Withdrawn EP1073888A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1998117786 DE19817786A1 (de) 1998-04-21 1998-04-21 Mikrokalorimeter
DE19817786 1998-04-21
PCT/EP1999/002588 WO1999054696A1 (fr) 1998-04-21 1999-04-16 Microcalorimetre

Publications (1)

Publication Number Publication Date
EP1073888A1 true EP1073888A1 (fr) 2001-02-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP99915762A Withdrawn EP1073888A1 (fr) 1998-04-21 1999-04-16 Microcalorimetre

Country Status (4)

Country Link
EP (1) EP1073888A1 (fr)
AU (1) AU3421799A (fr)
DE (2) DE19817786A1 (fr)
WO (1) WO1999054696A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19909048A1 (de) * 1999-03-02 2000-09-14 Csp Cryogenic Spectrometers Gm Detektor mit Isolationsschicht
DE202007016275U1 (de) * 2007-11-20 2009-05-20 Consarctic Entwicklungs Und Handels Gmbh Wärmetauscher
US20240003751A1 (en) * 2022-07-01 2024-01-04 International Business Machines Corporation Adjustable transition edge thermometer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5641961A (en) * 1995-12-28 1997-06-24 Stanford University Application of electrothermal feedback for high resolution cryogenic particle detection using a transition edge sensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9954696A1 *

Also Published As

Publication number Publication date
DE19817786A1 (de) 1999-11-04
AU3421799A (en) 1999-11-08
WO1999054696A1 (fr) 1999-10-28
DE29823004U1 (de) 1999-08-12

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