EP1048070A1 - Dispositif de reception et de positionnement d'un substrat - Google Patents

Dispositif de reception et de positionnement d'un substrat

Info

Publication number
EP1048070A1
EP1048070A1 EP99963247A EP99963247A EP1048070A1 EP 1048070 A1 EP1048070 A1 EP 1048070A1 EP 99963247 A EP99963247 A EP 99963247A EP 99963247 A EP99963247 A EP 99963247A EP 1048070 A1 EP1048070 A1 EP 1048070A1
Authority
EP
European Patent Office
Prior art keywords
substrate
takeover
chuck
holding system
chuck arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99963247A
Other languages
German (de)
English (en)
Inventor
Ulf-Carsten Kirschstein
Stefan Risse
Christoph Damm
Thomas Peschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems CMS GmbH
KLA Tencor MIE Jena GmbH
Original Assignee
Leica Microsystems Jena GmbH
Leica Microsystems CMS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems Jena GmbH, Leica Microsystems CMS GmbH filed Critical Leica Microsystems Jena GmbH
Publication of EP1048070A1 publication Critical patent/EP1048070A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Definitions

  • the invention relates to a takeover and holding system for a substrate in a Be chichtungsstrom, which is equipped with a movable in the coordinates X, Y electrostatic chuck arrangement for holding the substrate on a support surface during the exposure
  • Holding devices for holding substrates, in particular masks and wafers, during exposure are known in the prior art in various designs.
  • the holding systems are arranged on a table which can be moved in two coordinates X, Y and have a support plane for the substrate, on which it is placed before and on which it is held, while the table is moved step by step in the direction of X and / or Y and thereby brought into the desired exposure positions one after the other.
  • the support levels are usually made up of high-level support surfaces, sometimes also by formed several punctiform support elements
  • the basic bodies, supporting plates, etc., on which support elements are arranged or support surfaces are formed, are generally mechanically fixed to the table by means of dimensional adjustment for aligning the substrate in the coordinate Z.
  • the coordinate Z corresponds to the direction of irradiation of the exposure beam path directed at right angles to the substrate surface
  • the sensitive handling of the substrate when it is transferred to the exposure device and the accuracy in the positioning of the substrate surface relative to the exposure device are essential Criteria with regard to the quality and fineness of the structure aimed at during exposure and the more important the more the efforts of the microelectronics industry go after the reduction of the structure width.
  • the direction of the exposure radiation is not inadvertently influenced by magnetic fields and / or by electrical charges in the holding system. In all of this, the costs for the manufacture of the holding systems must be kept within economically justifiable limits.
  • an electrostatic field is formed, through which the substrate is arranged on a flat, above the conductive layer
  • the magnitude of the attractive force between the chuck arrangement and the substrate depends on the applied electrical voltage, on the area size of the conductive layer (the so-called chuck electrode) and on the thickness of the insulating layer which is between the conductive layer and the substrate at located.
  • suitable measures prevent electrostatic charging at undesired points on the holding system or the exposure device, so that the exposure beam path is not influenced unintentionally.
  • One such measure is the use of non-magnetic materials. In the arrangement described in the aforementioned publication, this is achieved by using sapphire material. Sapphire is non-magnetic, but it entails very high procurement costs and also high technological costs in the manufacture of the flat contact surface for the substrate.
  • the arrangement was therefore not covered with sapphire over the entire 8-inch contact surface, but only a few 2-inch sapphire discs were placed over an intermediate layer of niobium.
  • the technologically complex manufacturing process for the multi-part contact surface is still disadvantageous.
  • the uniformity of the material on which the substrate rests is not guaranteed, which results in a non-uniformity of the holding force with respect to the entire contact surface.
  • US Pat. No. 5,600,530 also describes a receiving device for substrates, which in turn contains an electrostatic device
  • a disadvantage of the aforementioned publications is also that the holding devices do not have technical means with which the transfer of the substrate from a feed device, for example a robot arm, and its storage on the storage level can be carried out sensitively and positionally.
  • the object of the invention is to further develop hat systems of the type described above in such a way that a precise transfer from a handling system and an improvement in position and shape stability during the exposure is achieved.
  • At least one second electrostatic chuck arrangement is provided which, like the first electrostatic chuck arrangement, which serves to hold the substrate during the exposure, has a contact surface for the substrate, but the contact surface of the first and the support surface of the second chuck arrangement jointly form the support surface for the substrate, and the support surface of the second chuck arrangement in the direction of the coordinate Z, ie is arranged displaceably in the direction of incidence of the exposure beam path, relative to the support surface of the first chuck arrangement.
  • Both chuck arrangements are designed with respect to their holding force so that the substrate can be held securely in position both on the support surface of the first chuck arrangement and only when it is supported on the support surface of the second chuck arrangement.
  • the arrangement according to the invention has the advantage that the contact surfaces of both chucks can be shifted in the direction of the coordinate Z, making it possible to shift the contact surface of the second chuck arrangement into a takeover position z 2 , in which a robot arm moves the substrate into the exposure system is ready.
  • the takeover position z 2 is, for example, at a distance ⁇ z from the support surface of the first chuck arrangement, which always remains in the position z 1 .
  • neck chuck is used for the first chuck arrangement and the term "handling chuck” for the second chuck arrangement, corresponding to the assigned functions.
  • the handling chuck moved out of the holding chuck in position z 2 takes over the substrate from, for example, a robot arm and, after the electrostatic holding force between the handling chuck and the substrate is effective, is pushed back at least until the supporting surfaces both chucks form a common level at position ⁇ .
  • the contact surface of the handling chuck is smaller than the substrate surface to be accommodated, so that the substrate with free surface sections protrudes beyond the contact surface of the handling chuck.
  • the handling chuck remains after the retraction in the position ⁇ , in which the substrate is in the exposure position and here partly rests on the support surface of the holding chuck, partly on the support surface of the handling chuck.
  • the handling chuck can alternatively either be fixed by means of a clamping device, or it is stopped unfixed in position z 1 .
  • the contact surface of the handling chuck can move freely in the direction of the Z coordinate and, as soon as the electrostatic holding force now also acts between the holder chuck and the substrate, can be carried out by the tension-balancing forces exerted by the substrate, provided that the two contact surfaces are not in one plane , are pulled into position z 1 in which the support surface of the neck chuck is located. In this way, it is advantageously achieved without great technical effort with regard to an exact positioning of the handling chuck in the position zi that the substrate is kept stress-free without the risk of deformation.
  • the take-over and holding system according to the invention can also be designed in a further variant such that after the substrate has been placed on the support surface of the holding chuck, the handling chuck is decoupled from the substrate and retracted to a position z 2 ', for which z 2 ' ⁇ applies z 1 ⁇ z 2 Then, during the exposure, the substrate only picks up on the support surface of the neck chuck, while there is a free space between the support chuck's surface and the substrate
  • the contact surfaces of the two chuck arrangements are aligned parallel to the direction of action of gravity, for example such that the coordinate Y lies in the direction of action of gravity, while the coordinates X, Z are perpendicular to the direction of gravity
  • the two chuck arrangements are connected to a pallet truck which can be moved in the direction of the coordinate Y, the holding chuck being fixed by means of a support plate and the handling chuck by means of a linear actuator (displaceable in Z direction) is coupled to the pallet truck
  • the pallet truck is arranged on a column aligned parallel to the coordinate Y and is slidably guided on this wall with sliding feet and / or rollers, in addition to the sliding feet and / or rollers piezoelectrically driven clamping devices for temporarily locking the pallet truck to the column are provided for
  • the pallet truck can be locked in its position in the direction of the Y coordinate during the exposure process
  • the column is connected to at least one slide that is displaceable in the X direction, whereby the substrate lying on it can be moved in the X direction at a constant distance from the exposure optics.
  • the contact surfaces of both chuck arrangements are circular and are arranged concentrically to one another, the contact surface of the handling chuck being enclosed by the contact surface of the neck chuck and having an expansion of less than 1/3, preferably less than 1/4 of the contact area of the neck chuck ensures that
  • Chuck arrangements consist of a basic body, on which an electrically conductive layer is applied at least in sections and an insulating layer is applied above it, the insulating layers facing the exposure optics and forming the support surfaces for the substrate.
  • Channels for a cooling medium can be incorporated into the insulating layers, whereby the channels open into inflows and outflows for the cooling medium and helium is preferably used as the cooling medium.
  • the support plate and the base body of the chuck arrangements are made of a glass ceramic with the same material properties, for example with the same
  • glass ceramics Another important advantage of glass ceramics is that conventional optics processing technologies can be used in the manufacture of the parts mentioned, by means of which the highest degree of machining accuracy can be achieved effectively. This relates above all to the production of flat surfaces with the highest flatness requirements, but also to compliance with parallelism and angles on the parts in question. This makes it possible to maintain manufacturing tolerances in the micrometer range and in the range of arc seconds. Due to the brittleness of the glass ceramic used, plastic deformations on the flat surfaces, in particular on the support surfaces for the substrate, are excluded, as a result of which permanent deformations which are caused by mechanical forces cannot be transferred to the substrate.
  • the sliding feet and / or castors for guiding the pallet truck and the column are made of a high-strength ceramic with a modulus of elasticity in the range of approximately 300 to 400 GPa. This enables the pallet truck to be guided precisely on the column.
  • electrically driven clamping devices are provided for temporarily locking the lift truck in the positions in which the substrate surface is exposed.
  • Chuck arrangements are provided to apply an electrical potential of up to 5000 volts to the conductive layers on the one hand and to the substrate on the other hand.
  • two mirrored surfaces are worked on the support plate, one of which points in the direction of the coordinate X and the other in the direction of the coordinate Y and which both serve as a reference mirror of a metrology system, in which the position of the support plate or the substrate is determined by interferometric measurements.
  • the mirrored surfaces can be formed by an aluminum coating provided with an oxide protective layer, preferably SiO 2 .
  • the support plate can have material recesses which serve to reduce weight, which advantageously results in lower drive power and more favorable acceleration behavior during the movement of the lifting truck.
  • the basic body of the first chuck arrangement is either placed directly on the lifting truck or, alternatively, via a Carrier plate is connected to the pallet truck
  • FIG. 1 shows the schematic diagram of the arrangement according to the invention
  • FIG. 2 shows a section from FIG. 1
  • Fig. 4 neck and handling chuck with substrate in the guard position
  • a take-over and holding system in which a first chuck arrangement, namely a holding chuck 1, is firmly connected to a pallet truck 3 via a support plate 2.
  • the pallet truck 3 is coupled to a column 4 via sliding feet and / or rollers 18 and slidable in the longitudinal direction of this column
  • This arrangement is aligned so that the column 4 runs in the direction of the coordinate Y, the coordinate Y corresponds to the direction of action of gravity and the support surface 5 of the neck strap 1 is aligned parallel to the plane spanned in the coordinates X, Y.
  • the direction of irradiation of the radiation beam path which is based on an exposure optics (not shown), takes place at right angles to the support surface 5 in the direction of the coordinate Z
  • the column 4 is connected to a carriage which is guided straight in the direction of the coordinate X and which runs on the ruler shown in the X direction. This ensures that the neck strap 1 with its support surface 5 can be moved in the direction of the coordinates X, Y.
  • the displacement in the direction X takes place by moving the carriage (not shown in the drawing) with which the column 4 is firmly connected, the displacement in the Y direction is carried out by moving the lifting carriage 3 along the column 4.
  • Both the carriage and the lifting carriage 3 are equipped with electromechanical drives (which are also not shown) coupled
  • a substrate 17 placed on the support surface 5, for example a wafer can be positioned relative to the exposure optics in such a way that the substrate 17 is exposed step by step to a predetermined one Structure can be made on two mutually perpendicular side surfaces of the support plate 2, mirror surfaces 19, 20 can be applied, via which the position of the support plate 2 can be measured with interferometric accuracy.
  • a second chuck arrangement namely a Handling chuck 6 is present.
  • the positioning of the two chuck arrangements 1 and 6 relative to one another can be seen from the sectional view in FIG. 2. It can first be seen here that the support surface 7 of the handling chuck 6 is aligned parallel to the support surface 5 of the holding chuck 1
  • Both contact surfaces 5, 7 are oriented perpendicular to the coordinate Z and thus to the direction of incidence of the exposure beam path.
  • the neck chuck 1 is firmly connected to the support plate 2, for example by screwing or clamping
  • the handling chuck 6 is arranged to be displaceable in the direction of the coordinate Z.
  • Neck chucks 1 and the basic body 9 of the handling chuck 6, including the support surfaces 5 and 7, are designed as circular surfaces. Both chucks 1, 6 are connected by means of (not shown in the drawing) constrained guides which restrict the degrees of freedom and thereby exact compliance with the relative position of the chucks 1, 6 to one another , especially with regard to a Ensure rotation against each other about the coordinate Z.
  • constrained guides can be designed, for example, as balls partially immersed in V-shaped grooves, the balls being provided on one of the chucks and the grooves provided on the other.
  • the basic body 8 of the holding device 1 is perforated, and in which
  • Breakthrough of the basic body 9 of the handling chuck 6 is movably guided. Furthermore, the basic body 9 of the handling chuck 6 is connected to a pneumatic drive 11 via a gear member 10. By actuating the pneumatic drive 11, the handling chuck 6 can be displaced in the direction of the coordinate Z. As FIG. 2 also shows, the support plate 2 is connected to the lifting truck 3 in a kinematically determined manner by means of fixed-body articulation bolts 12
  • An electrically conductive layer 13 made of chrome or nickel with a thickness of ⁇ 200 nm is applied to the base body 8 of the neck chuck 1 in the direction of the exposure optics, to which an insulating layer 14 is applied.
  • the substrate 17, not shown, is designed to be raised. This applies analogously to the handling chuck 6, in which an electrically conductive layer 15 is first applied to the base body 9 and an insulating layer 16 is applied above.
  • the insulating layer 16 is designed to be raised to the substrate 17
  • a substrate 17 is to be placed on the support surface 5 of the holding device 1 for exposure, its delivery is first carried out with the aid of a robot arm (not shown) into a position z 2 In this case, the substrate 17 should be aligned approximately centrally to the support surface 5 with the aid of the robot arm.
  • the gear member 10 is controlled by the pneumatic drive 11 and the handling chuck 6 is thereby advanced, to the extent that Portions of the substrate surface 18 which face the support surface 7 come into contact with the support surface 7
  • an electrical voltage with a potential of approximately 4000 volts is applied to the electrically conductive layer 15 of the handling chuck 6 on the one hand and to the substrate 17 via electrical contacts, which are not shown in the drawing.
  • the substrate 17 is released from the engagement with the robot arm and the robot arm is pivoted out of the space between the substrate 17 and also not shown exposure optics.
  • the pneumatic drive 11 is actuated, whereby the handling chuck 6 is pulled into the holding chuck 1 until the support surface 7 Position z 1 reached.
  • the sections of the substrate surface 18, which are not covered by the support surface 7, are placed on the support surface 5 on the neck fixture 1. This completes the displacement of the handling chuck 6 or the substrate 17 the substrate 17 in the guard position
  • the handling chuck 6 is not fixed in this position, but remains freely “floating" in the Z direction.
  • the conductive layer 13 of the holding chuck 1 is now (electrical contacts not shown in the drawing) also an electrical potential of 4000 V g , whereby, in addition to the holding force between handling chuck 6 and substrate 17, an electrostatic holding force between holding device 1 and substrate 7 is effective.
  • the holding position for substrate 17 is determined solely by the position of support surface 5 on holding device 1
  • the substrate 17 continues to adhere to the support surface 7 of the handling chuck 6, but because of the “floating” mounting of the handling chuck 6 it has no defined position in relation to the exposure optics.
  • the support surface 7 of the handling chuck 6 thus only ensures the dimensional stability of the substrate 17 by supporting the substrate surface 18
  • the position of the support surface 7 in the Z direction is automatically moved into the position zi by the substrate surface 18, as a result of which an overdetermination of the substrate 17 or tensions in the substrate material due to overdeterminations are compensated for.
  • the substrate 17 is now prepared for exposure and is subsequently by controlling the carriage drive for shifting in the coordinate X and by controlling the lift truck drive for shifting in the coordinate Y into the respective viewing positions in which the structure is applied to the substrate 17.
  • the substrate 17 is removed from the exposure device in the reverse manner , by first switching off the voltage potential between the substrate 17 and the neck chuck 1, so that the substrate 17 only adheres to the handling chuck 6.
  • the handling chuck 6 with the substrate 17 is now moved in the direction of the coordinate Z until the substrate surface 18 is in the position z 2 be find in which the substrate 17 is brought back into engagement with the robot arm.
  • the conductive layer 15 is also switched potential-free, whereupon the substrate 17 is removed from the exposure device with the aid of the robot arm
  • the handling chuck 6 does not remain in the position z after the substrate 17 has been placed on the holding chuck 1, but (after the conductive layer 15 has been isolated) in a position z 2 'is moved further, so that the substrate 17 is only held by the neck chuck 1 during the exposure.
  • the basic bodies 8, 9 of the two chuck arrangements 1, 6 and the insulating layers 14, 16 of the two chuck arrangements 1, 6 made of glass ceramic " ZERODUR "and the support plate 2, the frame of the lifting truck 3 and the column 4 are made of silicon carbide. This ensures that temperature influences do not adversely affect the positional accuracy of the substrate 17 Reference number list

Abstract

L'invention concerne un dispositif de réception et de positionnement d'un substrat (17) dans un système de sensibilisation équipé de moyens de manipulation pour l'amenée d'un substrat (17), d'un dispositif à mandrin électrostatique (1) destiné au positionnement du substrat (17) pendant la sensibilisation, ainsi que d'une optique de sensibilisation à partir de laquelle un rayonnement corpusculaire est orienté perpendiculairement, suivant la coordonnée Z, à la surface du substrat. Un dispositif de ce genre est caractérisé en ce qu'il est prévu au moins un deuxième dispositif à mandrin électrostatique (6) qui, de même que le premier dispositif (1), sert au positionnement du substrat (17) pendant la sensibilisation et présente une surface d'appui pour le substrat, la surface d'appui du deuxième dispositif (6) étant toutefois montée coulissante en direction de la coordonnée Z. Les deux dispositifs à mandrin (1, 6) sont réalisés, en ce qui concerne leur force de maintien, de telle façon que le substrat (17) soit maintenu en position, de manière sûre, aussi bien lorsqu'il est appliqué sur le premier dispositif à mandrin (1), que lorsqu'il est appliqué uniquement sur le deuxième dispositif à mandrin (6).
EP99963247A 1998-11-18 1999-11-16 Dispositif de reception et de positionnement d'un substrat Withdrawn EP1048070A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19853092 1998-11-18
DE19853092A DE19853092B4 (de) 1998-11-18 1998-11-18 Übernahme- und Haltesystem für ein Substrat
PCT/DE1999/003637 WO2000030172A2 (fr) 1998-11-18 1999-11-16 Dispositif de reception et de positionnement d'un substrat

Publications (1)

Publication Number Publication Date
EP1048070A1 true EP1048070A1 (fr) 2000-11-02

Family

ID=7888150

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99963247A Withdrawn EP1048070A1 (fr) 1998-11-18 1999-11-16 Dispositif de reception et de positionnement d'un substrat

Country Status (6)

Country Link
US (1) US6480369B1 (fr)
EP (1) EP1048070A1 (fr)
JP (1) JP2002530866A (fr)
DE (1) DE19853092B4 (fr)
TW (1) TW430751B (fr)
WO (1) WO2000030172A2 (fr)

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US20030012631A1 (en) * 2001-07-12 2003-01-16 Pencis Christopher H. High temperature substrate transfer robot
JP4323232B2 (ja) * 2002-12-04 2009-09-02 芝浦メカトロニクス株式会社 静電吸着方法、静電吸着装置及び貼り合せ装置
US7009359B2 (en) * 2003-08-08 2006-03-07 Asml Holding N.V. Foam core chuck for the scanning stage of a lithography system
US7245357B2 (en) 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007080523A1 (fr) * 2006-01-10 2007-07-19 Koninklijke Philips Electronics N.V. Appareil de positionnement d’un objet a sustentation magnetique et procede de positionnement et de stabilisation sure d’un objet
WO2018084965A1 (fr) * 2016-11-03 2018-05-11 Molecular Imprints, Inc. Système de chargement de substrat

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Also Published As

Publication number Publication date
JP2002530866A (ja) 2002-09-17
WO2000030172A2 (fr) 2000-05-25
DE19853092A1 (de) 2000-06-15
TW430751B (en) 2001-04-21
US6480369B1 (en) 2002-11-12
WO2000030172A3 (fr) 2000-11-23
DE19853092B4 (de) 2004-10-21

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