EP1008103A1 - Mode de fabrication d'une carte a puce - Google Patents

Mode de fabrication d'une carte a puce

Info

Publication number
EP1008103A1
EP1008103A1 EP97952785A EP97952785A EP1008103A1 EP 1008103 A1 EP1008103 A1 EP 1008103A1 EP 97952785 A EP97952785 A EP 97952785A EP 97952785 A EP97952785 A EP 97952785A EP 1008103 A1 EP1008103 A1 EP 1008103A1
Authority
EP
European Patent Office
Prior art keywords
antenna coil
card
module
recess
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97952785A
Other languages
German (de)
English (en)
Inventor
Robert Wilm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PAV Card GmbH
Original Assignee
PAV Card GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PAV Card GmbH filed Critical PAV Card GmbH
Publication of EP1008103A1 publication Critical patent/EP1008103A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

  • the invention relates to a method for producing a chip card, a semiconductor chip located on a module being inserted in a recess in a card carrier and being contacted with an inductive signal transmission device in the form of an antenna coil.
  • the module with the semiconductor chip is preferably inserted into a recess in the card body and laminated to the card body by means of joining or the like to obtain a corresponding mechanical and electrical connection.
  • an electrical connection between the module and the card body or contacts located on the card body, which are in contact with a coil for establishing a contactless connection to the environment can result from the fact that an anisotropic conductive adhesive in the area of the connection points and / or the connection points of the respective agent for contactless data transmission and the adhesive so far at least in the area of the connection points is compressed or compressed to form an electrically conductive bridge.
  • the modules used in the production of chip cards generally fall back on a plastic carrier on which the semiconductor chip mentioned at the beginning is optionally provided with so-called contact areas.
  • the prefabricated ISO module is attached to the card carrier, which e.g. can consist of polycarbonate, connected. This connection or the insertion of the module into the card body in a, e.g. milled recess is usually made using the adhesive methods mentioned when using a hot or hot melt adhesive.
  • connection points for the induction loop i.e. for the signal transmission device.
  • these connection points are preferably raised on the surface of the module and / or on the surface or on the side surfaces of the recess within the card carrier.
  • the antenna coil connection ends of the signal transmission device which protrude into the recess in the card body are formed in a meandering or spiral shape.
  • the meandering or spiral shape of the antenna coil connection ends ensures that bending and / or torsional forces which act on the card body and thus on the contact surface in later operation can be absorbed, so that it is ensured that no undesirable changes in the contact properties occur.
  • the antenna coil connection ends are in the form of a spiral spiral spring with a winding spacing.
  • the antenna coil connection ends are designed in such a way that the meandering or spiral windings are provided with a profile which increases towards the center of the recess in relation to the card length or cross section. This measure ensures that when the recess is subsequently introduced into the card body, preferably by milling, there is a sufficiently large contact point. This contact point then forms a contact connection with the electrical connection surfaces of the module or the semiconductor chip, so that the inductive signal transmission between the environment and the chip can take place by means of an antenna.
  • the end of the antenna coil being formed with an increasing course of the meandering or spiral windings, the tolerances which are never to be avoided during milling are compensated for, so that the manufacturing technology outlay in the production of the chip card can be reduced overall.
  • the actual contacting process can then take place using a conductive adhesive or by means of soldering and / or welding connections known per se, the required thermal energy being able to be supplied to the contact connection points via the rear of the module.
  • the method according to the invention it is possible with the method according to the invention to form contact connections of sufficient long-term stability, it being possible for the antenna coil to be arranged within the card body, for example when it is cast, in a manner known per se. Due to the desired spring effects of the antenna coil connection ends, the process reliability is increased when the module with a semiconductor chip is retrofitted. Due to the advantageously increasing winding course, a safe milling of the antenna coil or the antenna coil connection ends is ensured during the production of the recess or cavity, so that the most important prerequisite for the production of the Contact connection between module and antenna is guaranteed.
  • Fig. 1 is a chip card in plan view with a recognizable recess and antenna meander and
  • FIG. 2 shows a cross section along the line A-A of the chip card according to FIG. 1.
  • the chip card 1 shown in the figures has a recess or cavity 2.
  • the recess 2 serves to receive a module, not shown, consisting of a carrier substrate and a semiconductor chip fastened thereon.
  • the carrier substrate or the module can have electrical contact surfaces which interact with the terminal when the card is inserted into the terminal.
  • the semiconductor chip is chip-contacted in a known manner on the carrier substrate and has electrical contact surfaces which are used for connection to an inductive signal transmission device, namely an antenna 3.
  • the antenna 3 (FIG. 2) is located in the material of the chip card 1 and, in a manner known per se, interacts inductively with a corresponding coil, which is arranged in a reading terminal.
  • the carrier substrate of the module has contact areas on the side of the actual chip, which are electrically connectable to the ends of the antenna coil connections.
  • the antenna coil connecting ends 4 are formed as meanders.
  • the meandering shape extends essentially over the area of the electrical connection surfaces of the module to be used.
  • the recess 2 which can be seen from the cross-sectional view according to FIG. 2, has a chip receiving area 5 and an overlying one, e.g. milled surface 6 for the carrier substrate.
  • the module formed from the chip and carrier substrate with the chip facedown is brought into the chip receiving area 5, the carrier substrate almost completely closing the corresponding milled surface 6.
  • connection surfaces On the underside of the carrier substrate, not shown, there are electrical connection surfaces which can be connected to the contact points 7 of the antenna coil connecting ends 4, for example by means of conductive adhesive, soldering, welding or the like.
  • FIG. 2 for example, with antenna coil connection ends 4 rising towards the center of the recess 2, ensures when the recess is introduced into the card body or into the chip card 1 that contact points 7 are milled with sufficient certainty, i.e. be exposed.
  • the antenna coil connecting ends 4 Due to the meandering shape of the antenna coil connecting ends 4 at least in the contact area or also by the design of the connecting ends 4 as a spiral spiral spring with a winding spacing, bending and torsional forces have no adverse effect on the quality of contact of the electrical connection points either in the manufacturing process or when the card is subsequently used .
  • the open side of the recess can be made using a cover plate or a laminating film be closed. Any remaining intermediate spaces are filled with a plastic mass.
  • a spatially coiled spiral spring is preferably used in the form of a cylindrical or truncated cone for the formation of the antenna coil connecting ends.

Abstract

La présente invention concerne un mode de fabrication de carte à puce (1), consistant à placer dans la cavité (2) d'un châssis de carte une microplaquette de semiconducteur placé sur un module, laquelle se met en contact avec un dispositif de transmission de signaux par induction se présentant sous forme de bobine-antenne (3). La bobine-antenne - ou ses extrémités (4)-, telle qu'elle est conçue selon l'invention, du moins dans la zone des surfaces de connexion électrique du module ou de la microplaquette de semiconducteur, à l'intérieur de la cavité, a la forme d'une méandre ou d'une spirale pour absorber les forces de flexion et de torsion.
EP97952785A 1996-11-19 1997-11-19 Mode de fabrication d'une carte a puce Withdrawn EP1008103A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1996147846 DE19647846C1 (de) 1996-11-19 1996-11-19 Verfahren zum Herstellen einer Chipkarte
DE19647846 1996-11-19
PCT/EP1997/006469 WO1998022906A1 (fr) 1996-11-19 1997-11-19 Mode de fabrication d'une carte a puce

Publications (1)

Publication Number Publication Date
EP1008103A1 true EP1008103A1 (fr) 2000-06-14

Family

ID=7812130

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97952785A Withdrawn EP1008103A1 (fr) 1996-11-19 1997-11-19 Mode de fabrication d'une carte a puce

Country Status (4)

Country Link
EP (1) EP1008103A1 (fr)
AU (1) AU5654198A (fr)
DE (1) DE19647846C1 (fr)
WO (1) WO1998022906A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19831565C1 (de) * 1998-07-14 1999-10-28 Muehlbauer Ag Verfahren zum Freilegen von Antennenanschlußflächen einer Chipkarte
DE10109030C2 (de) * 2001-02-24 2003-11-13 Cubit Electronics Gmbh Kontaktloser Transponder
DE10212014B4 (de) * 2002-03-18 2006-08-17 Sagem Orga Gmbh Verfahren zur Herstellung eines Chipkartenkörpers
DE10228373B4 (de) * 2002-06-25 2010-06-17 Sagem Orga Gmbh Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer Chipkarte
DE102004010013B4 (de) * 2003-03-05 2006-10-12 Pav Card Gmbh Verfahren zum Kontaktieren eines Chipmoduls
EP3159832B1 (fr) 2015-10-23 2020-08-05 Nxp B.V. Jeton d'authentification

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9822906A1 *

Also Published As

Publication number Publication date
WO1998022906A1 (fr) 1998-05-28
DE19647846C1 (de) 1998-03-12
AU5654198A (en) 1998-06-10

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