EP1004225A1 - Procede de chauffage de substrats par rayonnement et d'application de materiau extrude - Google Patents

Procede de chauffage de substrats par rayonnement et d'application de materiau extrude

Info

Publication number
EP1004225A1
EP1004225A1 EP97926416A EP97926416A EP1004225A1 EP 1004225 A1 EP1004225 A1 EP 1004225A1 EP 97926416 A EP97926416 A EP 97926416A EP 97926416 A EP97926416 A EP 97926416A EP 1004225 A1 EP1004225 A1 EP 1004225A1
Authority
EP
European Patent Office
Prior art keywords
substrate
energy
extrudable material
light
extrudable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97926416A
Other languages
German (de)
English (en)
Other versions
EP1004225A4 (fr
Inventor
David A. Goldberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP1004225A1 publication Critical patent/EP1004225A1/fr
Publication of EP1004225A4 publication Critical patent/EP1004225A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0042—Heating devices using lamps for industrial applications used in motor vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state

Definitions

  • This invention relates to the application of extrudable materials to substrates, which may be used for the adhesive bonding of a plurality of substrates.
  • extrudable materials to substrates to form thick protective films, penetrating films, thick films with beneficial optical, electrical, aesthetic or physical properties, or for adhesive bonding is widely used.
  • Such practices include the use of varnishes to protect wood surfaces, paints to protect and embellish wood, plastic, ceramic or metallic surfaces, and the use of hot-melt and solvent-based adhesives to bond a wide variety of substrates.
  • extrudable adhesive use include the bonding of metallic, fabric, foam, wood, leather, and plastic substrates in the assembly of such products as furniture, packaging, automotive sub-assemblies, wooden and metallic windows, trade show exhibits and point-of-purchase displays, electrical components, apparel, luggage, and more.
  • This method involves the direct fusion of dissimilar solid synthetic substrates only, and requires specific physical and optical properties for the combination of substrates that significantly limit the range of substrates that may be used.
  • U.S. Patent No. 4,644,127 to La Rocca uses a laser to assist in the bonding of metallic pieces. This method teaches the melting of the applied metal by the laser beam prior to its application to the substrate surface, and therefore the substrates are limited to metallic substrates and the applied materials are limited to gas streams containing powdered metals.
  • the prior art described above generally involves laser irradiation of the extrudable material or the substrate. While lasers excel at providing highly concentrated radiation, high-power lasers tend to be complicated and costly to operate, including YAG lasers, which are often used because of the superior quality of the wavelength of light produced. Furthermore, due to the requirement of precisely orienting and placing the laser mirrors, as well as the use of sophisticated water- cooling mechanisms for certain laser classes, including YAG lasers, which require water-purifiers, heat-exchangers, and refrigerator systems, lasers in industrial environments may require frequent maintenance. Also, many high-power lasers, including YAG lasers, output only a small fraction of the electrical-energy input, requiring large power supplies, waste heat elimination systems, and large power usage for relatively small power applications. In general, high-power lasers are expensive to purchase, operate and maintain. All of these disadvantages make high-power lasers, and the methods that employ them, unsuitable for many industrial applications.
  • the method includes the steps of generating a concentrated electromagnetic energy field, irradiating the substrate with the concentrated energy field with sufficient energy to substantially heat the substrate, but not to pyrolyze its constituents, and applying the extrudable material to the substrate at a location upon which the energy field was directed.
  • the concentrated electromagnetic energy field may be generated by a laser, which may be a carbon-dioxide laser or a linear diode array.
  • the concentrated electromagnetic energy field may also be generated by a substantially isotropic energy illumination source, which may be a high-pressure xenon arc lamp, or a coiled tungsten wire.
  • the longitudmal axis of the coiled tungsten wire may be longer than 5 mm.
  • the energy from the substantially isotropic energy illumination source may be collected using a reflecting surface. This reflecting surface may be constructed so that one of its cross-sections may contain a shape selected from the group consisting of ellipses, circles and parabolas.
  • the energy from the substantially isotropic energy illumination source may be collected using a converging optical lens.
  • the concentrated electromagnetic energy field may have at least one cross-sectional dimension greater than 3 mm when it irradiates the substrate.
  • the substrate may be treated to improve its absorption of electromagnetic energy, prior to the step of irradiating.
  • This treatment may involve the application of a highly absorbing material to the substrate.
  • the substrate may be protected from oxidation while irradiating by means of a stream of non-reactive gas which excludes oxygen-bearing atmosphere from contacting the substrate.
  • the extrudable material may be a heat-activatable polyamide.
  • the present mvention is also related to an article made in accordance with the method.
  • the article may a plurahty of substrates bonded together by the extrudable material.
  • the present invention is also related to an article made in accordance with the method, wherein at least one substrate is bonded to an object not made according to the present invention, wherein the extrudable material bonds the substrate to the object.
  • the present invention is also related to a method which includes the steps of applying the extrudable material to the substrate, generating a concentrated electromagnetic energy field, and irradiating the substrate with the concentrated energy field at a location upon which the extrudable material has previously been applied, using sufficient energy to substantially heat the substrate, but not to pyrolyze its constituents.
  • the concentrated electromagnetic energy field may be generated by a laser, which may be a linear diode array.
  • the concentrated electromagnetic energy field may also be generated by a substantially isotropic energy illumination source, which may be a high-pressure xenon arc lamp, or a coiled tungsten wire.
  • the longitudinal axis of the coiled tungsten wire may be longer than 5 mm.
  • the energy from the substantially isotropic energy illumination source may be collected using a reflecting surface. This reflecting surface may be constructed so that one of its cross-sections may contain a shape selected from the group consisting of ellipses, circles and parabolas.
  • the energy from the substantially isotropic energy illumination source may be collected using a converging optical lens.
  • the concentrated electromagnetic energy field may have at least one cross-sectional dimension greater than 3 mm when it irradiates the substrate.
  • the substrate may be treated to improve its absorption of electromagnetic energy, prior to the step of irradiating. This treatment may involve the application of a highly absorbing material to the substrate.
  • the extrudable material may be a heat-activatable polyamide or a light-activatable cross- linkable material.
  • the present invention is also related to an article made in accordance with the method.
  • the article may a plurality of substrates bonded together by the extrudable material.
  • the present mvention is also related to an article made in accordance with the method, wherein at least one substrate is bonded to an object not made according to the present invention, wherein the extrudable material bonds the substrate to the object.
  • Fig. 1 is a cross-sectional schematic view of a sinuous deposition device according to the present invention, carried out with an arc lamp whose energy is collected with an ellipsoidal reflector, in which the substrate is heated after extrudable material application.
  • Fig. 2 is a cross-sectional view of a second embodiment of the present invention, including a linear deposition device, using a lamp containing a coiled tungsten wire whose energy is collected with a trough ellipsoidal reflector, in which the substrate is heated after extrudable material application, in which lamp and reflector are shown in an oblique view.
  • Fig. 3 is a cross-sectional view of a third embodiment of the present invention, including a linear deposition device that contains a linear diode array whose energy is collected with a trough converging lens, using a non-reactive gas to prevent oxidation of the substrate, in which the substrate is heated before extrudable material application, and in which the linear diode array and lens are shown in an oblique view.
  • Fig. 4 is a cut-away top view of a fourth embodiment of the present invention, including an areal deposition device, in which the substrate is heated prior to extrudable material application.
  • Fig. 5 is a cross-sectional schematic of the areal deposition device of Fig. 4, taken along line 5-5 of Fig. 4.
  • Fig. 6 is a cut-away top view of a fifth embodiment of the present invention, including an areal deposition device, in which the substrate is heated after extrudable material application.
  • Fig. 7 is a cross-sectional schematic of a sixth embodiment of the present invention, depicting the initiation of cross-linking in a light-activatable cross-linkable extrudable material by means of a broad spectrum lighting source that simultaneously performs light-mediation heating of the substrate.
  • Fig. 8 is a schematic cross-section of an article made using the sinuous or linear deposition method of this invention, as might be made using the devices of Fig. 1, Fig. 2, Fig. 3, or Fig. 7, in which light-mediated substrate heating is used on surfaces which are closely opposed, where the cross-section is perpendicular to the direction of movement of the substrate.
  • Fig. 9 is a schematic cross-section of an article made using the sinuous or linear deposition method of this invention, as might be made using the devices of Fig. 1, Fig. 2, Fig. 3, or Fig. 7, in which light-mediated substrate heating is used on surfaces which are separated by a more substantial gap than shown in Fig.8, where the cross-section is perpendicular to the direction of movement of the substrate.
  • Fig. 10 is a cross-sectional schematic of a seventh embodiment of the present invention, including a method for bonding two substrates in which the substrates are positioned so that the deposition on both substrate surfaces uses a single material applicator.
  • Fig. 11 is a cross-sectional schematic of an eighth embodiment of the present mvention, including a method for bonding two substrates in which the substrates are positioned so that the deposition on both substrate surfaces uses a different material applicator for each substrate.
  • Fig. 12 is a cross-sectional view of a ninth embodiment of the present invention, in which a light-absorbing substance is applied to the substrate in order to enhance substrate heating through light absorption.
  • Fig. 13 is a cross-sectional view of a tenth embodiment of the present invention, in which a
  • hot-melt adhesives In the case of hot-melt adhesives, it should be noted that most adhesives are applied at temperatures very close to their melting points in order to minimize the damage that can occur to adhesives that are maintained at highly elevated temperatures. Furthermore, an important parameter in the industrial use of most hot-melt adhesives is their closing times - that is, the time until the adhesive hardens to the point that it can be manipulated with structural integrity and without surface tackiness. Many adhesives are engineered to minimize the closing time, thereby increasing the process throughput. With adhesives engineered for fast closing times, however, even relatively small decreases in temperature can result in rapid increases in viscosity in the adhesive.
  • This invention teaches the directed heating of the substrate using an electromagnetic energy field, which will hereinafter be refered to as a light or laser beam, eventhough the field may lack sharp boundaries.
  • electromagnetic energy field which will hereinafter be refered to as a light or laser beam, eventhough the field may lack sharp boundaries.
  • wavelengths from the infrared to ultra-violet in the electromagnetic energy spectrum will be used, due to their ease of generation, transmission, reflection, and focusing.
  • electromagnetic radiation from other frequency bands, including microwaves could be profitably employed.
  • the material temperature will be relatively little affected by the absorbed light. Furthermore, these heating effects will not be concentrated at the interface between substrate and material, where the physical processes affecting bond strength are occurring. Therefore, either the light beam used for heating the substrate should be directed so that it does not pass through the extrudable material, or the material should be largely transparent to the majority of the heat energy in the light beam.
  • the substrate Once the substrate has absorbed the heat energy from the incident illumination, its temperature will rise dramatically. According to the method of this invention, it is desirable to transfer some of the heat captured by the substrate to that extrudable material that is in close contact with the substrate.
  • the extrudable material is a hot-melt adhesive
  • this local heating at the substrate-material interface permits rapid cooling of the bulk adhesive distant from the interface after it has been deposited on the substrate. This promotes the closing of the adhesive within a reasonable period of time, while still altering the adhesion properties of that extrudable material closest to the substrate.
  • the materials used in the following description are generally materials which are heat-activatable, such as hot-melt adhesives.
  • the method works more generally on any material deposition in which the penetration of the material is dependent on its temperature, and the temperature of the substrate. This might include, for example, the penetration of resins and curable varnishes into wood.
  • the preferred embodiments of this invention depend on whether the apparatus deposits a sinuous line of extrudable material, a linear stream of material, or an areal deposition of material. Each of these cases is covered in the following sections.
  • the position on the substrate which is heated must be very closely situated to the position where the extrudable material is deposited.
  • the substrate will be simultaneously translated and rotated around the material application position for a sinuous bead to be deposited, and if the light is applied distantly from the material application position, it cannot be guaranteed that the substrate location on which the light is trained will be the same substrate location to which the adhesive is deposited.
  • the position of light application and the position of material deposition will be closely situated, which requires that the light must be highly concentrated on the substrate.
  • Fig. 1 is a cross-sectional schematic view of a sinuous deposition device that utilizes light- mediated heating of the substrate after extrudable material deposition, carried out with an arc lamp whose energy is collected with an ellipsoidal reflector.
  • An illuminating high-pressure arc lamp 22 is placed at one focus of an ellipsoidal mirror 24, and the material deposition location is placed near the other focus of the mirror.
  • the salient property of an ellipsoidal mirror is that raypaths emanating from one focus are intercepted by the ellipsoidal mirror, and subsequently reflect off the mirror surface and collect at the other focus. This property of ellipsoidal mirrors is often utilized in optical devices, and is frequently used, for example, in lamps which illuminate fiber optic bundles.
  • the lamp 22 is not a point source of light energy, not all of the energy source can be contained within the point focus of the ellipsoidal mirror, and those parts of the arc not located precisely at the focus of the ellipsoidal mirror will not precisely intercept the point at which it is desirable for light to impinge on the substrate.
  • light sources with the smallest hght emission volume are highly desirable.
  • Arc lamps have the advantage of a very high radiance, with large amounts of their energy being emitted from a very small surface volume.
  • High-pressure xenon arc lamps often emit more than half of their energy at longer than visible wavelengths, which is of great benefit in light-mediated heating of the substrate because such wavelengths are very efficiently absorbed by a variety of substrates. Examples of suitable high-pressure arc lamps are the Cermax Xenon arc lamp series with integrated reflectors (e.g. EX990C-10F) from ILC
  • tungsten-halogen lamps which are generally very inexpensive, require unsophisticated and inexpensive power sources, are extremely efficient in their use of input electrical energy, and which emit the vast majority of their light output in infrared wavelengths.
  • low voltage tungsten-halogen bulbs have smaller filaments than those of high- voltage halogen bulbs, and many inexpensive versions of these bulbs are commercially available in the range of up to 250 watts or more. If additional power is required, multiple bulbs or reflectors can be used. Alternatively, these bulbs can be run at voltages higher than their nominal rating, which increases the light output at the expense of significantly lower bulb lifetimes.
  • the MR16 EKE 150 Watt projector lamp available from a number of suppliers including General Electric, is suitable for lower power applications, and includes an integrated ellipsoidal reflector to collect the output light.
  • an extrudable material 26 is deposited onto a substrate 32 by means of a nozzle 28, which is situated in such a manner as to interfere as little as possible with a plurality of incident hght rays 30 from the lamp.
  • the extrudable material 26 is administered in the preferred case through means of a positive displacement pump attached to the nozzle, although simpler air pressure-mediated devices are possible, such as the Polygun II hot-melt adhesive applicator from 3M Adhesive Systems of St. Paul, MN.
  • the illuminating lamp is located in such a manner as to illuminate the substrate 32 after the extrudable material 26 has been deposited on its surface. It is also possible to locate the illuminating lamp so that it heats the substrate 32 before deposition of the material 26. In such cases that application throughputs require larger energy fluxes than that available from a single lamp, it may be necessary to place a plurality of lamp assemblies (including in each case a lamp 22 and a mirror 24) in positions adjacent to the position that the material is deposited.
  • Fig. 1 there exist alternative schemes for capturing the illumination from the lamp 22 other than the use of an ellipsoidal mirror.
  • non-ellipsoidal mirrors can be used to converge the light energy to a pseudo-focus.
  • the lamp 22 can be placed at the focus of a parabolic mirror, in which case the reflected light rays would become nearly collimated.
  • collimated rays can then be focused using standard converging lens arrays.
  • the mirror can be any shape that collects light energy from the light source onto the substrate, and need not be specifically derived from a conic section such as a parabola, circle or an ellipse.
  • the mirror may be asymmetric, such that the collected light is distributed on the substrate in a linear, elliptical or other shape, rather than focused into the smallest possible area.
  • Such illumination geometries would be of particular benefit in those cases where the extrudable material is not deposited in a narrow line, or where the extrudable material is illuminated for some duration.
  • P is the illumination power density (e.g. in units of watt-cm 2 )
  • T is the time during which the light is applied to a given area of substrate (e.g. in units of seconds).
  • Fig. 2 is a cross-sectional view of a second embodiment of the present invention, including a linear deposition device that utilizes light-mediated heating of the substrate after extrudable material deposition, using a lamp containing a coiled tungsten wire whose energy is collected with a trough ellipsoidal reflector, in which lamp and reflector are shown in an oblique view.
  • a lamp containing a coiled tungsten wire whose energy is collected with a trough ellipsoidal reflector, in which lamp and reflector are shown in an oblique view.
  • like components such as the extrudable material 26, nozzle 28, and substrate 32 will be referenced with the same reference numbers.
  • An extended length lamp 34 is bounded above by a trough mirror 36, whose cross-section perpendicular to the long axis is roughly elliptical.
  • the longitudinal ends of this mirror 36 may either be open, or alternatively and more efficiently, they may be turned down to collect hght from the ends and direct it towards the substrate 32.
  • the extended length lamp 34 is placed at the one focus of the trough mirror 36, and a large fraction of the illuminating light collects near the other focus of the elliptical trough reflector, where the collection of such foci is coincident with the linear distribution of sites on the substrate 32 on which the extrudable material 26 is deposited via the nozzle 28.
  • the elliptical reflector 36 can be replaced with a cylindrical trough reflector.
  • the lamp is placed at the center of the semi- cylinder, and light rays that are emitted away from the substrate are reflected off of the mirror, and back to the lamp, where they combine with rays generated by the lamp directed downwards to the substrate.
  • a parabolic trough reflector behind the lamp to collimate the hght rays, with a converging cylinder lens between the lamp and the substrate to collect lamp illumination.
  • the extended length lamp 34 and the semi-elliptical trough mirror 36 as a unit may be called the heating element.
  • This heating element may be placed in such a way to heat the substrate either after the application of the extrudable material, as shown in Fig. 2, or the heating element may come before the application of extrudable material.
  • the decision regarding the placement of the heating element involves application specific considerations that will generally deal with the nature of the substrate and extruded materials and the topological requirements of the apparatus. In general, the amount of heat entering the substrate prior to material deposition must overcome heat losses by means of conduction, convection and radiation prior to encountering the deposited material.
  • Heating the substrate before the application of the extrudable material has the advantage that the radiant heat will not be lost through reflection at the air/extrudable material interface, or be absorbed within the bulk of the extrudable material.
  • heat transferred to the substrate may be lost through radiation, convection and conduction before the extrudable material has touched the substrate.
  • the heat captured by the substrate may translate into temperature rises in the substrate that can either pyrolyze the substrate, or subject the substrate to oxidation in the presence of the atmosphere.
  • the amount of heat transmitted to the substrate must be regulated to limit the temperature increase below that which causes substrate degradation. Fig.
  • FIG. 3 is a cross-sectional view of a third embodiment of the present invention, including a linear deposition device that utilizes light-mediated heating of the substrate before extrudable material deposition, containing a linear diode array whose energy is collected with a trough converging lens, using a non-reactive gas to prevent oxidation of the substrate, and in which the linear diode array and lens are shown in an oblique view.
  • a laser diode array 37 optionally in conjunction with a cylinder converging lens 39, is used to heat the substrate prior to deposition of the extrudable material.
  • the converging lens 39 is used to compensate for the divergence of light energy typically found in laser diodes, and allows the laser diode array to stand back from the substrate surface.
  • a stream of a non-reactive gas 38 directed out of a gas-dispensing nozzle 40 may optionally be directed at the substrate 32 to exclude the majority of the oxygen present at the substrate surface.
  • the non-reactive gas 38 will be chosen both on the basis of its non-reactivity to the substrate, its lack of toxicity, its cost, its transparency to the light-energy emanating from the laser diode array 37, and its thermal conductivity. In general, gases with low thermal conductivity are to be preferred, as they will remove less heat from the substrate prior to the application of the extrudable material 26. Gases which will frequently meet these criteria include nitrogen and argon.
  • the placement of the nozzle 40 to be such that the stream of non-reactive gas is directed either towards the point of extrudable material deposition, or it may be placed near the nozzle with the stream of non-reactive gas directed away from the deposition point.
  • Heating after the extrudable material has been applied suffers from fewer problems related to pyrolysis, since as the substrate temperature rises, it efficiently transmits heat to the overlying material through conduction. Also, the overlying material excludes atmospheric oxygen, so oxidation of the substrate material is a less significant problem. In practice, both methods of light-mediated heating of the substrate can provide significant increases in penetration of the extrudable material into the substrate.
  • laser diodes and laser diode arrays are efficient laser power sources whose emitting surface cross- section has one relatively small dimension (on the order of a micron) and one much larger linear dimension (on the order of centimeters). Because of the long linear dimension, laser diode arrays are difficult to implement in the prior art, which requires the illumination to pass through a topologically-constrained nozzle along with the extrudable material. In the current invention, such constraints are eliminated by illuminating the substrate before or after the point of deposition.
  • An example of a suitable laser diode array is the B1-81-15C-19-30-A laser diode array from
  • a carbon dioxide laser may be beneficial.
  • Such lasers are generally inexpensive and efficient compared to many other laser light sources, and are available in very high power outputs.
  • trough deposition of extrudable material over the surface can be performed, using commercially available apparatus.
  • Light-mediation of this process can be performed by areal heating before, after, or both before and after the deposition of extrudable material.
  • the use of areal heating before the deposition of extrudable material is described in the fourth embodiment of the present invention shown in Figs. 4 and 5.
  • light energy may impinge on the substrate simultaneously on either side of the deposition apparatus ⁇ that is, the processes may run either simultaneously or sequentially.
  • FIG. 4 is a cut-away top view of an areal deposition device that utilizes light-mediated heating of the substrate prior to extrudable material deposition.
  • the substrate 32 lies across the entire deposition surface, moving in the direction indicated by the arrow at the bottom of the figure.
  • the extrudable material 26 is deposited along the width of the substrate by a trough material spreader 42.
  • Such trough material spreaders are widely used in industry, and employ a variety of mechanical means to lay a wide bead of extrudable material perpendicular to the direction of movement of substrate.
  • a lamp array 44 illuminates the substrate 32.
  • the lamp array 44 includes a plurality of extended length illumination devices oriented with their long axes perpendicular to the direction of movement of the substrate.
  • an areal reflector 46 which reflects light that is emitted by the lamp array away from the substrate, so that it is redirected toward the substrate.
  • This reflector will generally be roughly planar, although its shape may be molded in order to increase light directed at the substrate. For example, the reflector may be turned down on the edges to capture stray light.
  • the orientation of the lamp array 44 may be different from that shown in Fig. 4 and Fig. 5, with the long axis of the lamps oriented along the axis of substrate movement.
  • this invention teaches that the lamp array 44 may be placed over the substrate 32 after the deposition of the extrudable material, according to the same principles enunciated above with reference to the linear stream of extrudable material.
  • Fig. 6 is a schematic top view of a fifth embodiment of the present invention, including an areal deposition device that utilizes light- mediated heating of the substrate after deposition of the extrudable material.
  • lamps could be placed both before and after the deposition point.
  • the substrate illumination occurs subsequent to the extrudable material deposition, it is beneficial to reduce the amount of light absorbed by or reflected at the surface of the extrudable material.
  • the material should be largely transparent to the incident illumination. This generally precludes the use of certain dyes or additives with high absorption in the infrared, or large particles which scatter the light.
  • hot-melt adhesives will be used as the extrudable material.
  • the strength of the adhesive can be improved using catalyzed cross-linking.
  • One frequently used method to initiate such cross-linking involves the use of light initiation, particularly with short wavelength ultra-violet light. Given the presence of intense light provided by the illumination source of this invention, it would be useful to utilize some fraction of this hght for initiation of the cross-linking catalysis, especially in those cases where broad spectrum sources such as a tungsten-halogen lamp or a halogen arc lamp are used.
  • Fig. 7 is a cross-sectional schematic of a sixth embodiment of the present invention, depicting the initiation of cross-linking in a light-activatable cross-linkable extrudable material by means of a broad spectrum lighting source that simultaneously performs light-mediation heating of the substrate.
  • the light collecting apparatus is not shown.
  • a broad spectrum lamp 50 which could, for example, be an arc lamp or an incandescent lamp such as a tungsten-halogen bulb, is positioned above a Ught-activatable, cross-linkable extrudable material 52 which has been deposited by the nozzle 28 onto the substrate 32.
  • UV-cured material is activated by shorter wavelength light, generally UV light, due to the higher energy of the UV photons.
  • Two light rays are depicted emanating from the lamp 50.
  • a short wavelength UV ray 54 is absorbed by the UV-cured material 52, initiating a cross-linking reaction within the material 52.
  • Light curable extrudable material 52 should be chosen so that the UV Ught rays can penetrate significantly into the material, so as to initiate the cross-Unking throughout the thickness of the material.
  • a long- wavelength visible or infrared Ught ray 56 passes through the UV-cured extrudable material 52, which is largely transparent to Ught rays of these wavelengths, and impinges on the substrate 32, where it is absorbed and its energy is converted into heat.
  • the broad spectrum lamp may be substituted with Ught sources that emit a limited number of discrete wavelengths, given that some of these wavelengths are suitable to initiate cross-linking reactions, and others are longer wavelengths more suitable for heating the substrate.
  • This mode of deposition using the light used in heating the substrate to additionally initiate cross-Unking or other catalyzed processes within the extrudable material can function whenever the light is positioned to illuminate the substrate at a point after deposition of the extrudable material.
  • the devices of Fig. 2 and Fig. 6, used respectively in linear and areal deposition using Ught-mediated heating of the substrate could also utiUze the Ught to initiate a reaction within the extrudable substrate.
  • Such catalyzed reactions can be used in conjunction with conventional UV-initiated cross- Unking of high-viscosity adhesives, such as the high-viscosity, UV-curable 60-7016 urethane acrylate adhesive from Epoxies, Etc. of Greenville, RI. These could also be used in conjunction with surface treatments on an areal basis, in which the cross-Unking can occur after the extrudable material has penetrated into the substrate surface.
  • high-viscosity adhesives such as the high-viscosity, UV-curable 60-7016 urethane acrylate adhesive from Epoxies, Etc. of Greenville, RI.
  • FIG. 1 U providing a film on the surface of a substrate.
  • Fig. 1, Fig. 2 and Fig. 3 depict the deposition of a film on a substrate surface in a linear or sinuous bead, such as might be used in decorative purposes, or positioning electrical or optical lines on a substrate surface.
  • the method of the present invention When the method of the present invention is applied to a plurality of surfaces, using an adhesive as the extrudable material, it can be used to bond like or dissimilar materials together.
  • the present invention teaches a variety of topologies relating the substrates and the bonding adhesive.
  • Fig. 8 is a schematic cross-section of an article made using sinuous or linear deposition methods, as might be made using the first, second, third or sixth embodiments of the present invention, where the cross-section is perpendicular to the direction of movement of the substrate, in which Ught-mediated substrate heating is used on surfaces in close opposition.
  • a plurality of the substrates 32 are placed in close opposition, and the surfaces most exposed are bonded using light-mediated substrate heating, with a resulting adhesive bead 58.
  • the substrates are held together due to the structural integrity of the adhesive bead, which resists forces, largely shear in nature, when the substrates are pulled apart.
  • the substrates bonded by this method may be of similar or dissimilar composition.
  • Fig. 9 is a schematic cross-section of an article made using sinuous or linear deposition methods, as might be made using the first, second, third or sixth embodiments of the present invention, where the cross-section is perpendicular to the direction of movement of the substrate, in which Ught-mediated substrate heating is used on surfaces which are separated by a more substantial gap than shown in Fig. 8.
  • a plurality of the substrates 32 are placed in wide opposition, containing a gap 60, into which the adhesive 58 is deposited using Ught- mediated substrate heating.
  • the substrates are held together due to the structural integrity of the adhesive, which resists tensile or cleavage forces when the substrates are pulled apart.
  • Articles can be made by a combination of the bonds described in Fig.
  • Bonds of the types depicted in Fig. 8 and Fig. 9 may be combined or configured in a variety of different manners, other than the "butt" bonds shown.
  • one substrate may be placed on top of another, and the edge of the upper substrate may then be bonded to the lower substrate using material deposition at the boundary region. Light-mediation of this bond can be accomplished using illumination that straddles the boundary, heating both upper and lower substrates.
  • the substrates bonded through light-mediation may be of different compositions.
  • fabric can be bonded to wood, in which both substrates are treated with light-mediation of the material appUcation.
  • the method wiU also have beneficial effects when only one of the substrates utilizes light-mediation.
  • Fig. 10 is a cross-sectional schematic of a seventh embodiment of the present invention, showing a method for bonding two substrates where the two substrates are positioned so that the deposition on both substrate surfaces uses a single material applicator.
  • a plurality of unbonded substrates 62 are brought into close approximation in the presence of an adhesive applicator 64, which may be a trough or nozzle adhesive applicator.
  • the applicator deposits the adhesive 58 into the space between the substrates, and the unbonded substrate 62 is continuously fed into position adjacent to the applicator 64 under the influence of a plurality of rollers 68, which both feed in new unbonded substrate 68, as well as maintain the proper gap between bonded substrates.
  • the rollers 68 could apply pressure against the substrates 32, in order to improve bond strength.
  • a plurality of lamps 70 extending the width of the substrate to be bonded, and in conjunction with a plurality of elliptical or circular trough reflectors 72, illuminate and heat the substrate at light application points 74, prior to its contact with the adhesive 58. If the width of adhesive bead 58 is small, the lamps and reflectors may be similar to those used in applying linear or sinuous beads as depicted in Fig. 1, 2, and 3.
  • Ught- mediated heating of the substrate may be used to independently allow penetration of the adhesive to a plurality of substrates, which may subsequently be brought together for the remaining surface adhesives to join.
  • Fig. 11 is a cross-sectional schematic of an eighth embodiment of the present mvention, showing a method for bonding two substrates in which the substrates are positioned so that the deposition on both substrate surfaces uses a different material applicator for each substrate.
  • the substrates 32 may be of similar or dissimilar composition.
  • Two trough applicators 64 are used to spread the adhesive 58 separately on each substrate. After adhesive application, both substrates are heated using illumination from the extended lamp 70, some of whose rays are reflected onto the substrate 32 using the trough reflector 72. The joined substrates are pressed together and transported via the rollers 68, bringing fresh unbonded substrate 62 under the trough adhesive applicators 64. It is understood that this same effect can be achieved using alternative methods.
  • a plurality of lamps can replace the single lamp 70 of Fig. 11, each lamp to be used to heat a separate substrate.
  • a plurality of lamps could be used to heat the substrate prior to the application of the adhesive.
  • the substrate In order to derive the largest efficiencies from the light sources used in Ught-mediated heating of the substrate, it is useful for the substrate to have a high absorption of the Ught energies emitted by the illumination device. Certain substrates, however, may be either transparent to the majority of the Ught energy impinging on the substrate surface, or may be highly reflective. In both circumstances, the efficacy of light-mediated substrate heating will be reduced.
  • the extrudable material application apparatus may contain a module for altering the light-absorbing properties of the substrate.
  • Fig. 12 is a cross- sectional view of a ninth embodiment of the present invention, showing a linear deposition device in which light-mediated heating of the substrate is performed prior to the deposition of the extrudable material 26, and in which a light-absorbing substance is applied to the substrate in order to enhance substrate heating through light absorption.
  • the extrudable material 26 is deposited through the nozzle 28 onto a transparent or reflective substrate 76.
  • the substrate 76 differs from typical substrate 32 of the previous figures, in that this substrate 76 is either somewhat transparent to or relatively reflective of a substantial fraction of a plurality of collimated Ught rays 77 emanating from the Ught source, in this case a carbon dioxide laser 78.
  • a low reflection, high light-absorption composition 80 is deposited on the substrate 76 through a spray nozzle 82.
  • the composition 80 may contain carbon black as the Ught absorptive agent.
  • the nozzle 82 could be replaced with a roUer for spreading the composition 80, possibly with a reservoir in contact with the roUer for the purpose of maintaining a surface of the composition 80 on the surface of the roUer. It is also within the teachings of the invention that coating the transparent or reflective substrate 76 with the composition 80 may occur well before the deposition of the extrudable material 26, and possibly as two processes carried out on different apparatuses. It is also within the teachings of this invention that the coating of the transparent or reflective substrate 76 with the composition 80 may be of benefit when the light-mediated heating of the substrate occurs prior to or after the deposition of the extrudable material 26.
  • the carbon dioxide laser 78 could be replaced with any light source of a suitable energy density.
  • a highly light-absorbent compound other means of altering the surface properties can have similar effects. For example, roughening the surface with an abrasive surface can serve either to increase the absorbency of a highly reflective surface, or alternatively, may remove a surface treatment or layer on the substrate, revealing a more Ught- absorbent underlying substrate composition.
  • a lamp which operates at a lower temperature. Since most lamps produce a large fraction of their light through black body radiation, a lower operating temperature, usually regulated through the amount of electrical energy input to an arc or filament source, will generate a larger fraction of the energy in longer wavelengths. This control over wavelength is usually compromised by the need to generate large radiances at the illumination source, so as to keep the illumination source small, allowing more efficient capture of the generated light energy.
  • Fig. 13 is a cross- sectional view of a tenth embodiment of the present invention, including a depositional device in which a cold mirror is used to remove unwanted radiation.
  • the arc lamp 22 produces wide spectrum Ught energy consisting of long wavelength light rays 56 and short wavelength visible and
  • UV rays 54 which are concentrated by the ellipsoidal mirror 24 and projected at the substrate 32, on which lies the extrudable material 26 which has been deposited with the nozzle 28.
  • a cold mirror 84 lies between the illumination source and the substrate, and which reflects the short wavelength rays 54 away from the substrate, but which allows the longer wavelength rays 56 to pass through unimpeded.
  • the rays 54 that are reflected by the cold mirror 84 are coUected on absorbing heat sink 86, where the heat is removed with a passive radiating fin structure, possibly in conjunction with forced air cooling or with a water-cooling apparatus.
  • light filters and or protective glas ⁇ es or goggles may be interposed between the substrate, where considerable reflection of the incident light frequently occurs, and the operator's eyes.
  • Such filters may be neutral density filters, or may be also designed to absorb UV wavelengths, which are particularly damaging to eye health.
  • the EKE projector lamp includes an integrated elUpsoidal mirror, and the lamp was placed so that the substrate was at the approximate second focus of the ellipsoidal mirror.
  • the dichroic coating of the lamp reflector (designed to pass infrared light through the reflector) was over-coated with pure evaporated aluminum in the inside surface so as to include the infrared energy in the focused Ught.
  • a 5 mm-by-5 mm aperture was made with a metal casing to limit the area of light output, and in general, the lamp was placed so that the amount of Ught projected onto the fabric was contained within an approximately square- shaped spot approximately 7 mm on a side.
  • This test device was used to bond together, in the manner of Fig. 8, pieces of fabric or wood which had been cut to provide complimentary linear edges, and the efficacy of the Ught-mediated application of the extrudable material was measured by the static strength of the resulting bond between the pieces of cut substrate. In certain cases, a small gap was maintained between the substrate pieces so that the adhesive and Ught energy were able to penetrate between the substrate pieces, in the manner of Fig. 9.
  • the resulting strength of bonds made with and without Ught are compared for various materials.
  • the illuminating lamp was placed so that the substrate was heated approximately 1 cm after the deposition of the adhesive.
  • the iUuminating lamp was placed so that the substrate was heated 0.5-1.0 centimeter before the deposition of the adhesive.
  • Neoprene Wetsuit with 0.21 17.6 37.4 210%
  • Birch Plywood (1/16" 0.95 9.5 81.4 860% thick)
  • Birch Plywood (1/16" 0.95 9.5 72.6 760% thick)
  • the bond strength varied considerably between different samples generated without Ught, but was much less variable in cases where light-mediated heating of the substrate was employed. Tests were also performed which varied the length of time between the illumination of the substrate and the deposition of the hot-melt adhesive. It was noticed that when the illumination preceded adhesive deposition, there was a relatively rapid decrease in the strength of the bond with increasing time between the two steps. After approximately 17 seconds between the illumination and the deposition, approximately 60% of maximal bond strength remained.
  • the method exhibits large benefits on a wide variety of substrates. • The method utilizes inexpensive components. For comparison purposes, the illumination experiments described above were carried out using a lamp with a retail price of $18, and with an inexpensive rheostat control, whereas a YAG laser, used in the prior art, may cost weU in excess of $20,000 including its power supplies, water circulators, water purifiers, and laser optics. • The method exhibits benefits over a wide range of operating conditions. The treatment may be carried out before or after the deposition of the extrudable material. Furthermore, the Ught energy may be provided with a short duration intense illumination, or with a less intense illumination of longer duration.
  • This operating parameter flexibiUty indicates the ease with which the method can be applied to a variety of manufacturing environments.
  • the method utiUzes equipment that requires little and inexpensive maintenance.
  • the system used in the experiments required minimal calibration and maintenance, and can be compared with the intense and expensive maintenance required, for example, for an industrial YAG laser, where water, optics and illumination system components require frequent replacement with expensive components, as well as lengthy calibration.
  • the method is energy efficient.
  • the system used in the experiments was over 12% efficient at converting input electrical energy into light energy at the substrate, and the method described above for areal surfaces should be well over 50% efficient.
  • YAG laser-based systems are generally less than 3% efficient, and often less.
  • the energy-efficiency of the method increases the operational cost effectiveness of the method.
  • the method can be applied when the material deposition apparatus utiUzes small apertures. Because of this, lower energy density illumination sources, which are generaUy inexpensive to purchase and operate, can be used.
  • the method can be used with extrudable materials which are largely opaque to the incident illumination, by iUuminating the substrate prior to material deposition. This increases the number of materials in which light mediation of material application can be practiced.
  • the method can be used in areal applications. With laser-based light mediation that uses small irradiation apertures, the material deposition apparatus must be passed many times over the substrate to assure even coverage, or a multitude of deposition points must be used. With the present method, wide array illumination of moderate power density can be used, allowing the use of appropriate wide-array material deposition apparatuses.
  • the intense Ught sources used for light-mediation may serve a second purpose in initiating cross-Unking of Ught-activatable cross-linkable extrudable materials. This reduces the cost of using the method since a focused, high-power UV source may not need to be separately provided.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention a trait à un procédé permettant d'appliquer un matériau extrudable (26) à l'aide d'une tuyère (28) sur un substrat (32), au titre duquel un faisceau lumineux concentré (30) provenant d'une lampe (22) est dirigé sur le substrat avant ou après l'application du matériau extrudable. L'énergie du faisceau est concentrée au moyen d'un miroir (24) sur la surface du substrat. Cette énergie est ensuite transférée vers le matériau extrudable déposé, élevant, de ce fait, la température et réduisant la viscosité du matériau tout proche, ce qui facilite sa pénétration dans le substrat. Ce procédé permet de faire appel à un éclairage de densité énergétique modeste et à longueurs d'ondes non absorbées par ledit matériau. Lorsque le matériau extrudable est un adhésif, qu'il est appliqué sur plusieurs substrats dont un, au moins, a été traité au moyen du faisceau lumineux selon cette invention, et que lesdits matériaux extrudables adhérant aux substrats sont mis en contact, cette réunion de matériaux extrudables permet de constituer un liaisonnement solide entre lesdits substrats. Cette invention concerne également des articles réalisés en mettant en oeuvre ce procédé.
EP97926416A 1996-05-06 1997-05-06 Procede de chauffage de substrats par rayonnement et d'application de materiau extrude Withdrawn EP1004225A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1690596P 1996-05-06 1996-05-06
US16905P 1996-05-06
PCT/US1997/007773 WO1997042793A1 (fr) 1996-05-06 1997-05-06 Procede de chauffage de substrats par rayonnement et d'application de materiau extrude

Publications (2)

Publication Number Publication Date
EP1004225A1 true EP1004225A1 (fr) 2000-05-31
EP1004225A4 EP1004225A4 (fr) 2000-10-11

Family

ID=21779652

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97926416A Withdrawn EP1004225A4 (fr) 1996-05-06 1997-05-06 Procede de chauffage de substrats par rayonnement et d'application de materiau extrude

Country Status (3)

Country Link
EP (1) EP1004225A4 (fr)
AU (1) AU3118797A (fr)
WO (1) WO1997042793A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6819783B2 (en) 1996-09-04 2004-11-16 Centerframe, Llc Obtaining person-specific images in a public venue
AU4279600A (en) * 1999-04-30 2000-11-17 Powerlasers Limited Welding of carpet to panels
WO2006091869A2 (fr) 2005-02-25 2006-08-31 Youfinder Intellectual Property Licensing Limited Liability Company Indexage automatise destine a la distribution de photographies d'evenement
US8392268B2 (en) 2009-09-02 2013-03-05 Image Holdings Method and system of displaying, managing and selling images in an event photography environment
EP3655219A4 (fr) * 2017-07-17 2021-06-30 Oceaneering International, Inc. Appareil à adhésif thermofusible et procédé d'utilisation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2944586A (en) * 1956-04-20 1960-07-12 Lowe Paper Co Extrusion coating apparatus
EP0644032A2 (fr) * 1993-09-21 1995-03-22 Sumitomo Chemical Company, Limited Film multicouches et procédé pour sa fabrication

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2852407A (en) * 1956-02-27 1958-09-16 Millville Mfg Company Method and apparatus for forming a textile material with an adhesive type selvage
US3281259A (en) * 1963-08-19 1966-10-25 Haveg Industries Inc Process of rendering surface of polyethylene foam sheet printable
US3570748A (en) * 1966-06-29 1971-03-16 Standard Packaging Corp Composite film and method
US3551199A (en) * 1967-11-20 1970-12-29 Exxon Research Engineering Co Wire coating composition and microwave heating curing process
US3911173A (en) * 1973-02-05 1975-10-07 Usm Corp Adhesive process
US3944453A (en) * 1974-07-05 1976-03-16 Imperial-Eastman Corporation Hose construction
GB1489635A (en) * 1975-03-03 1977-10-26 Toyo Seikan Kaisha Ltd Packaging materials
SE415006B (sv) * 1978-03-07 1980-09-01 Asea Ab Sett att anbringaen isolering av tverbunden polymer pa en kabelledare
US4390387A (en) * 1981-06-16 1983-06-28 Mahn John E Flocked material having first thermosetting adhesive layer and second thermoplastic adhesive layer
US4484971A (en) * 1982-06-24 1984-11-27 General Binding Corporation Method and apparatus for making improved laminating film
JPS5979753A (ja) * 1982-10-29 1984-05-09 呉羽化学工業株式会社 熱収縮性複合フイルム及びその製造方法
JPS59136253A (ja) * 1983-01-26 1984-08-04 東洋製罐株式会社 多層プラスチツク積層構造物
US4559095A (en) * 1984-06-07 1985-12-17 The B. F. Goodrich Company Vulcanization of hose composites protected with thermoplastic jackets
US4902378A (en) * 1988-04-27 1990-02-20 Minnesota Mining And Manufacturing Company Polymer with reduced internal migration
GB2218668A (en) * 1988-05-17 1989-11-22 Courtaulds Films & Packaging L Multilayer polymeric films
US4936938A (en) * 1988-07-27 1990-06-26 Mineral Fiber Manufacturing Corporation Process of making roofing material
US5213900A (en) * 1990-03-23 1993-05-25 W. R. Grace & Co.-Conn. Cook-in film with improved seal strength
US5549943A (en) * 1992-09-23 1996-08-27 Viskase Corporation Heat shrinkable nylon food casing with a polyolefin core layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2944586A (en) * 1956-04-20 1960-07-12 Lowe Paper Co Extrusion coating apparatus
EP0644032A2 (fr) * 1993-09-21 1995-03-22 Sumitomo Chemical Company, Limited Film multicouches et procédé pour sa fabrication

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9742793A1 *

Also Published As

Publication number Publication date
AU3118797A (en) 1997-11-26
WO1997042793A1 (fr) 1997-11-13
EP1004225A4 (fr) 2000-10-11

Similar Documents

Publication Publication Date Title
US6217695B1 (en) Method and apparatus for radiation heating substrates and applying extruded material
CA2222163C (fr) Procede de solidarisation
AU680875B2 (en) Method and apparatus for applying a heatable composition
EP1685911B1 (fr) Procédé et appareil de revêtement par double laser
RU2763435C2 (ru) Способ и устройство для активации клея
JP3682620B2 (ja) 溶接方法
EP1893908B1 (fr) Sources lumineuses solides pour durcissement et modification de surface
US8945333B2 (en) Method for applying edge strips onto narrow surfaces of in particular plate-shaped work pieces and work pieces obtained in said manner
EP1004225A1 (fr) Procede de chauffage de substrats par rayonnement et d'application de materiau extrude
US7006763B2 (en) Method and apparatus for infrared welding of thermoplastic parts
US6940081B1 (en) Infrared irradiation
CN105848855B (zh) 用于将覆层施加到工件上的方法和用于对工件覆层的设备
KR20180105654A (ko) 분할된 uv 반사 미러들을 구비하는 uv 경화 장치
US8076606B2 (en) Equipment and method for fusing together laminar bands
CN111223393A (zh) 使用面辐射器来接合两个接合件的方法及接合装置
JP2543418B2 (ja) 光ビ―ム加熱機
EP3699103B1 (fr) Procédé, appareil et système pour fixer une étiquette sur un produit
EP2952948B1 (fr) Dispositif de chauffage thermique utilisant la lumière pour l'activation de liant et son intégration dans un dispositif de préformage
CN111629884B (zh) 用于构造材料加热的方法和设备
CA2457743C (fr) Methode et appareil de soudage infrarouge de pieces thermoplastiques
IL110363A (en) Method and apparatus for applying a heated composition to a substrate
RU2127176C1 (ru) Устройство для светолучевой пайки и сварки металлов и неметаллов
JPH05185009A (ja) 乾燥炉
Hoult Diode laser conversion of adhesives using semiconductor diode lasers
JPH05185008A (ja) 乾燥炉

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19990303

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB

A4 Supplementary search report drawn up and despatched

Effective date: 20000825

AK Designated contracting states

Kind code of ref document: A4

Designated state(s): DE FR GB

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20021101