EP0983713A1

EP0983713A1 - Electrical component arrangement on a circuit card

Info

Publication number: EP0983713A1
Application number: EP99915500A
Authority: EP
Inventors: Felix Franck
Original assignee: Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Current assignee: Osram GmbH
Priority date: 1998-03-18
Filing date: 1999-03-04
Publication date: 2000-03-08
Also published as: TW412914B; DE19811733A1; JP2002503399A; WO1999048345A1

Abstract

The invention relates to the spatial arrangement of radially and axially cabled components on a circuit card (4). According to the invention, at least one axially cabled component, e.g. a diode (2), and optionally an axial SMD component, are arranged beneath at least one radially cabled component, e.g. an encased capacitor (1) and directly adjacent to the leads thereof (7, 8). In another embodiment, the body of the axially cabled component (2) is partly surrounded by at least one lead (7) of the radially cabled component (1), thus optimally utilizing the space beneath said component (1).

Description

Arrangement of electrical components on a circuit board

Technical field

The invention relates to the arrangement of electrical components on a circuit board according to the preamble of claim 1.

It is in particular the arrangement of electrical components for circuit arrangements for operating electrical lamps, e.g. Discharge lamps, in particular fluorescent lamps and high pressure lamps as well as for operating incandescent lamps, e.g. Low voltage halogen light bulbs. Circuit arrangements for the operation of discharge lamps are generally referred to as electronic ballasts (EVG), while the term electronic transformer or electronic converter is common for the operation of low-voltage halogen incandescent lamps. Both types of circuit arrangements are summarized under the term "electronic operating devices".

In the following, the term "component" refers to the component body including connections. Furthermore, for the sake of clarity, the components are divided into two groups. The first group comprises radially wired components, ie component bodies with connecting wires, which are arranged exclusively on one side of the component body are, in particular, film capacitors and large discrete semiconductor components, for example transistors, thyristors, power diodes, diacs, triacs, etc. The second group comprises axial components, ie elongated - 2 -

che component body with two connections, one of the two connections being arranged on each of the two end faces of the component body, in particular also diodes. The second group includes both wired axial components and axial SMD (Surface Mounted Device) components.

State of the art

In conventional arrangements of electrical components on circuit boards, the components of the two groups are arranged at a mutual distance from one another. It is known (see FIG. 1) not to insert components of the first group into the circuit board as far as their body, but to leave the connecting wires long and bend them in such a way that the body of this component (1) is directly above and in contact is arranged with the body of a component (2) of the second group. However, the space directly below the components of the first group is not optimally used, since the bodies of the components are arranged one above the other on the circuit board (3). This is disadvantageous because generally more compact and in particular flatter electrical assemblies are sought.

Presentation of the invention

It is an object of the present invention to provide an arrangement of electrical components on a circuit board according to the preamble of claim 1 with a reduced space requirement.

This object is achieved by the characterizing features of claim 1. Particularly advantageous configurations can be found in the dependent claims. - 3 -

The basic idea of the invention is to arrange at least one component of the second group under at least one component of the first group and directly next to its connecting wires. In this way, the space under a component of the first group is optimally used.

It is particularly advantageous with regard to the reduction in the height of an electrical assembly to additionally bend the connecting wires of the components of the first group in such a way that one or more of these connecting wires partially encompass the body of a component of the second group. The bending takes place in such a way that in the final state the projection of the connecting wires of the component of the first group onto the circuit board is essentially perpendicular to the longitudinal axis of the corresponding component of the second group. During the bending, the body of the component of the second group serves as a bending gauge. This effectively prevents the connecting wires from kinking and significantly reduces the risk of breakage. In addition, the positional tolerances of the bent components of the first group are smaller. The corresponding bending of the connecting wires of the components of the first group can also take place separately in a preparation step.

It is particularly advantageous for the wiring if at least one of the connections of the component of the first group and the respectively closest connection of the component of the second group have the same electrical potential. In this case, the connections of the same potential are positioned and contacted in close proximity to one another. As a result, the body of the component of the second group can even be selected to be shorter than would actually be required for isolation from all connections of the component of the first group. This again saves space on the circuit board. A further reduction in the overall height can be achieved if the connecting wires are bent over in such a way that the body of the component of the first group is arranged directly next to the body of the component of the second group and also essentially on the circuit board. This bending of the connecting wires of the components of the first group can also take place either after assembly or in a preparation step.

If the circuit board is only provided with conductor tracks on its soldering side, only those component types from the second group are suitable whose connections consist of connecting wires. Is the circuit board on both sides, i.e. Also provided with conductor tracks on the component side, the components from the second group that are implemented using SMD (Surface Mounted Device) technology are also suitable. In this case, the connection surfaces of the SMD component serve as connections.

Description of the drawings

The invention will be explained in more detail below with the aid of a few exemplary embodiments. Show it:

FIG. 1a shows an arrangement according to the invention of a cup capacitor and two diodes in a side view,

Figure lb like figure la, but in plan view,

FIG. 2 shows an arrangement of a component from the first and one from the second group according to the prior art,

FIG. 3 shows an arrangement according to the invention of a transistor and a diode in side view, - 5 -

4a shows a further arrangement according to the invention of a transistor and a diode in side view,

FIG. 4b like FIG. 4a, but in a top view,

FIG. 5 shows a variant of FIG. 4b,

6a shows a further arrangement according to the invention of a transistor and a diode in side view,

Figure 6b like Figure 6a, but in plan view.

Figures la and lb schematically show an inventive arrangement of a cup capacitor 1 - as a representative of the first group - and two diodes 2, 3 - as a representative of the second group - on a circuit board 4 (detail) in side view and plan view. The body 5 or 6 of each of the two diodes 2, 3 is arranged directly next to each of the two connecting wires 7, 8 of the cup capacitor 1. The two connecting wires 7, 8 are bent over in such a way that they each partially enclose a body 5 or 6 of the two diodes 2, 3. Due to the bend, the connecting wires 7, 8 of the cup capacitor 1 are each oriented in a plan view (FIG. 1b) essentially perpendicular to the longitudinal axis of the corresponding diode 2, 3. During the bending, the bodies 5, 6 of the two diodes 2, 3 serve as bending guides. The body 9 of the cup capacitor 1 is arranged in a horizontal orientation directly next to the bodies 5, 6 of the two diodes 2, 3 and on the component side of the printed circuit board 4. For this purpose, the lengths of the connecting wires 7, 8 of the cup capacitor 1 are suitably dimensioned. Compared to the prior art (see FIG. 1), the overall height of the arrangement is lower. Furthermore, the space between the connection side of the cup capacitor 1 and its bent connection wires 7, 8 on the one hand and the circuit board 4 on the other hand is optimally used by the two diodes 2, 3. - 6 -

FIG. 3 shows schematically a side view of an arrangement according to the invention of a power transistor 10 with a cooling vane 11 - as a representative of the first group - and a diode 12 - as a representative of the second group - on a circuit board 4 (detail). The transistor 10 is arranged vertically on the circuit board 4. Directly next to the three connecting wires 13a-13c (only one of the three connecting wires can be seen in the side view) and, as it were, under the body 14 of the transistor 10, the body 15 of the diode 12 is arranged. The lengths of the three connecting wires 13a-13c are sufficiently dimensioned for this. The cooling vane 11 of the transistor 10 is connected to a right-angled cooling plate 16, which is fastened on the circuit board 4. This arrangement is particularly suitable when there is sufficient overall height, but little space for the circuit board.

FIGS. 4a and 4b schematically show a further arrangement according to the invention of the power transistor 10 and the diode 12 from FIG. 3 in a side view and a top view. Here, the connecting wires 13a-13c of the transistor 10 are bent over in such a way that the body 14 with the cooling vane 11 and the cooling plate 17 are arranged essentially parallel to the circuit board 4 (the cooling plate is not shown in FIG. 4b). The connecting wires 13a-13c of the transistor 10 partially surround the body 15 of the diode 12. The cooling plate 17 can optionally also be formed by a wall of a metallic housing (not shown). This arrangement is characterized by its particularly flat design, i.e. low overall height. However, the area required on the circuit board 4 is greater in this arrangement than in the arrangement shown in FIG. 3.

Figure 5 shows a variant of the arrangement shown in Figure 4b. Here, a connecting wire 18 of the diode 19 is connected to a connection 13c of the transistor 10, ie they are at the same electrical potential. The diode 19 is advantageously with a shorter body 20 than ever. - 7 -

ner of the diode 12 in Figure 4b selected. This is possible because the body 20 does not have to insulate the connecting wire 18 of the diode 19 from the connecting wire 13c of the transistor 10 here, but only from the two remaining connections 13a, 13b.

Figures 6a, 6b show a further variant of the arrangement shown in Figures 4a, 4b. Similar to the arrangement shown in FIGS. 1a, 1b, the three connecting wires 13a-13b of the transistor 10 are bent here in such a way that the body 14 of the transistor 10 and the body 15 of the diode 12 are arranged directly next to one another on the component side of the printed circuit board 4 . The body 15 of the diode 12 is partially surrounded by the connecting wires 13a-13c of the transistor 10. The cooling vane 11 of the transistor 10 is arranged directly on the component side of the circuit board. This variant is characterized by its particularly low overall height.

Claims

claims

1. Arrangement of electrical components on a scarf tuiigsplatine with electrical components of a first group and a second group, wherein

• the first group comprises radially wired components (1; 10), i.e. Component body (9; 14) with connecting wires. (7, 8; 13a-13c), which connecting wires (7, 8; 13a-13c) are arranged exclusively on one side of the component body (9; 14),

• the second group comprises axially wired components (2; 3; 12; 19), i.e. elongate component body (5; 6; 15; 20) with two connections, which elongate component body defines a longitudinal axis of the component, one of the two connections being arranged on each of the two end faces of the component body, characterized in that under at least one component (1 ; 10) the first group at least one component (2, 3; 12; 19) of the second group directly next to the connecting wires (7, 8; 13a-13c) of the at least one component (2, 3; 12; 19) of the first group is arranged.

2. Arrangement according to claim 1, wherein one or more connecting wires (7, 8; 13a-13c) of the at least one component (1; 10) of the first group the body (5; 6; 15; 20) of the at least one component (2;

3; 12; 19) of the second group partially include such that the projection of the connecting wires (7, 8; 13a-13c) of the at least one component (1; 10) of the first group onto the circuit board (4) is substantially perpendicular to the longitudinal axis of the at least one Components (2; 3; 12; 19) of the second group are oriented.

3. Arrangement according to claim 1 or 2, wherein - if at least one of the connections (13c) of the component (10) of the first group and the respectively closest connection (18) of the component (19) of the second group have the same electrical potential - the connections (13c; 18) of the same potential are positioned in close proximity to one another.

4. Arrangement according to claim 2 or 3, wherein the body (9; 14) of the at least one component (1; 10) of the first group next to the body (5, 6; 15) of the at least one component (2, 3; 12) the second group and is essentially arranged on the circuit board (4).

5. Arrangement according to one of claims 1 to 4, wherein the connections of the at least one component of the second group are connecting wires.

6. Arrangement according to one of claims 1 to 4, wherein the at least one component of the second group realized in SMD (Surface Mounted Device) technology and the connections are connection surfaces of the SMD component.