EP0976848A4 - Composition metallique contenant de l'acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique - Google Patents
Composition metallique contenant de l'acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metalliqueInfo
- Publication number
- EP0976848A4 EP0976848A4 EP98953055A EP98953055A EP0976848A4 EP 0976848 A4 EP0976848 A4 EP 0976848A4 EP 98953055 A EP98953055 A EP 98953055A EP 98953055 A EP98953055 A EP 98953055A EP 0976848 A4 EP0976848 A4 EP 0976848A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- metallic coating
- acetilide
- blank
- forming
- composition containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36380397A JP3491021B2 (ja) | 1997-11-26 | 1997-11-26 | 金属アセチリド化合物を含有した金属組成物、これを用いて金属膜を形成した素材及びその金属膜形成方法 |
JP36380397 | 1997-11-26 | ||
PCT/JP1998/005139 WO1999027159A1 (fr) | 1997-11-26 | 1998-11-13 | Composition metallique contenant de l'acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0976848A1 EP0976848A1 (fr) | 2000-02-02 |
EP0976848A4 true EP0976848A4 (fr) | 2005-02-23 |
EP0976848B1 EP0976848B1 (fr) | 2009-02-11 |
Family
ID=18480237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98953055A Expired - Lifetime EP0976848B1 (fr) | 1997-11-26 | 1998-11-13 | Composition metallique contenant un acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0976848B1 (fr) |
JP (1) | JP3491021B2 (fr) |
KR (1) | KR20000069225A (fr) |
DE (1) | DE69840542D1 (fr) |
TW (1) | TW561140B (fr) |
WO (1) | WO1999027159A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007009250A (ja) * | 2005-06-29 | 2007-01-18 | Daiken Kagaku Kogyo Kk | 電子部品の結線方法及び電子部品 |
JP2008106058A (ja) * | 2006-09-28 | 2008-05-08 | Daiken Kagaku Kogyo Kk | 金属化合物、その製造方法及び導体用ペースト |
JPWO2010119787A1 (ja) * | 2009-04-14 | 2012-10-22 | 旭化成イーマテリアルズ株式会社 | 導体層形成用組成物及び導体基板、並びに導体基板の製造方法 |
JP5448628B2 (ja) * | 2009-08-03 | 2014-03-19 | 大研化学工業株式会社 | 塩基性酢酸白金塩の製造方法、塩基性酢酸白金塩及び白金アセチリド化合物の製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2606807A (en) * | 1948-12-03 | 1952-08-12 | Rca Corp | Electric marking |
US3316088A (en) * | 1963-02-11 | 1967-04-25 | Ibm | Process of electrophotography based on electrophotolytic reactions and element therefor |
US3800030A (en) * | 1972-05-02 | 1974-03-26 | Polaroid Corp | Process for purifying silver compounds |
US4098807A (en) * | 1974-12-09 | 1978-07-04 | Air Products And Chemicals, Inc. | Platinum and palladium complexes |
US5100702A (en) * | 1990-02-22 | 1992-03-31 | Nissan Chemical Industries, Ltd. | Thin platinum film-forming composition |
US5312643A (en) * | 1990-11-20 | 1994-05-17 | Matsushita Electric Industrial Co., Ltd. | Method of producing a transparent conductive film provided with supplementary metal lines |
US5464990A (en) * | 1992-09-25 | 1995-11-07 | Fuji Xerox Co., Ltd. | Voltage non-linear device and liquid crystal display device incorporating same |
US5630872A (en) * | 1994-12-09 | 1997-05-20 | Mitsubishi Materials Corporation | Formation of thin-film patterns of a metal oxide |
EP0969006A1 (fr) * | 1997-09-30 | 2000-01-05 | Daiken Chemical Co. Ltd. | Compose d'acetylure de metal et procede de production |
-
1997
- 1997-11-26 JP JP36380397A patent/JP3491021B2/ja not_active Expired - Fee Related
-
1998
- 1998-11-13 DE DE69840542T patent/DE69840542D1/de not_active Expired - Lifetime
- 1998-11-13 EP EP98953055A patent/EP0976848B1/fr not_active Expired - Lifetime
- 1998-11-13 WO PCT/JP1998/005139 patent/WO1999027159A1/fr not_active Application Discontinuation
- 1998-11-13 TW TW087118843A patent/TW561140B/zh not_active IP Right Cessation
- 1998-11-30 KR KR1019997004810A patent/KR20000069225A/ko active Search and Examination
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2606807A (en) * | 1948-12-03 | 1952-08-12 | Rca Corp | Electric marking |
US3316088A (en) * | 1963-02-11 | 1967-04-25 | Ibm | Process of electrophotography based on electrophotolytic reactions and element therefor |
US3800030A (en) * | 1972-05-02 | 1974-03-26 | Polaroid Corp | Process for purifying silver compounds |
US4098807A (en) * | 1974-12-09 | 1978-07-04 | Air Products And Chemicals, Inc. | Platinum and palladium complexes |
US5100702A (en) * | 1990-02-22 | 1992-03-31 | Nissan Chemical Industries, Ltd. | Thin platinum film-forming composition |
US5312643A (en) * | 1990-11-20 | 1994-05-17 | Matsushita Electric Industrial Co., Ltd. | Method of producing a transparent conductive film provided with supplementary metal lines |
US5464990A (en) * | 1992-09-25 | 1995-11-07 | Fuji Xerox Co., Ltd. | Voltage non-linear device and liquid crystal display device incorporating same |
US5630872A (en) * | 1994-12-09 | 1997-05-20 | Mitsubishi Materials Corporation | Formation of thin-film patterns of a metal oxide |
EP0969006A1 (fr) * | 1997-09-30 | 2000-01-05 | Daiken Chemical Co. Ltd. | Compose d'acetylure de metal et procede de production |
Non-Patent Citations (1)
Title |
---|
See also references of WO9927159A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP0976848B1 (fr) | 2009-02-11 |
EP0976848A1 (fr) | 2000-02-02 |
TW561140B (en) | 2003-11-11 |
KR20000069225A (ko) | 2000-11-25 |
WO1999027159A1 (fr) | 1999-06-03 |
DE69840542D1 (de) | 2009-03-26 |
JPH11158184A (ja) | 1999-06-15 |
JP3491021B2 (ja) | 2004-01-26 |
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