EP0976312A1 - Dispositif permettant de travailler de fa on selective sur des composants individuels d'un ensemble plat electronique - Google Patents

Dispositif permettant de travailler de fa on selective sur des composants individuels d'un ensemble plat electronique

Info

Publication number
EP0976312A1
EP0976312A1 EP98912208A EP98912208A EP0976312A1 EP 0976312 A1 EP0976312 A1 EP 0976312A1 EP 98912208 A EP98912208 A EP 98912208A EP 98912208 A EP98912208 A EP 98912208A EP 0976312 A1 EP0976312 A1 EP 0976312A1
Authority
EP
European Patent Office
Prior art keywords
assembly
opening
cover
individual components
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98912208A
Other languages
German (de)
English (en)
Inventor
Hans-Werner Lueckehe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Wincor Nixdorf International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wincor Nixdorf International GmbH filed Critical Wincor Nixdorf International GmbH
Publication of EP0976312A1 publication Critical patent/EP0976312A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the invention relates to a device for the selective processing of individual components of an electronic printed circuit board under predetermined environmental conditions.
  • the invention is based on the object of specifying a device of the type mentioned at the outset which makes it possible to produce and maintain the specified environmental conditions for the assembly with little effort and still allow access to the component to be machined.
  • a device of the type mentioned according to the invention comprises a container intended for receiving the assembly, in the top surface of which there is an opening for introducing a processing tool, the opening being formed eccentrically in a disk which is rotatably mounted in the top surface.
  • the desired environmental conditions for the assembly and for the machining process can be stored in the container. will create. Through the opening in the top surface, it is possible to insert the machining tool into the receiving space of the container, the opening being able to be adjusted in a certain area above the assembly by means of the disk, so that it lies above the component to be machined. This makes it possible to avoid having to provide a separate cover for each component to be machined, in which the opening is arranged at the appropriate point.
  • the disk is preferably mounted eccentrically in a second disk, which in turn is rotatably mounted in the top surface. This means that the opening can be adjusted not only in a circle, as in the solution mentioned above, but practically without gaps over the entire area within the circumference of the second disk.
  • the cover surface is preferably made transparent.
  • the container comprises a box-shaped lower part which can be closed by a cover forming the cover surface.
  • the container is designed as a heating cell, the machining tool being a hot air nozzle for soldering and plumbing a selected component of the assembly.
  • the adjustable arrangement according to the invention of a passage opening for a machining tool in the top surface can be used with advantage.
  • Figure 1 is a partially schematic cross section through an inventive device for input
  • FIG. 2 shows a plan view of a special embodiment of a cover that can be used in the device according to FIG. 1.
  • the device shown in Figure 1 comprises a heating cell, generally designated 10.
  • the heating cell consists of a box-shaped lower part 12 which is open at the top and has a base 14 and side walls 16, and a cover 18 which closes the lower part 12.
  • the lower part 12 and the cover 18 delimit a receiving space 20 for a flat module, generally designated 22.
  • This comprises a printed circuit board 24 on which a plurality of components 26, in particular BGA (ball grid array) components using SMD technology, are soldered.
  • the printed circuit board 24 rests on supports 28, which in turn are placed on the bottom 14 of the lower part 12 or fastened to this. In this case, there is expediently the possibility of displacing the supports 28 in order to be able to put on different flat assemblies 22.
  • the lower part 12 is double-walled with an outer shell 30 and an inner shell 32, which enclose an air circulation space 34 between them.
  • Air inlet openings 36 are formed in the bottom region of the inner shell 32.
  • Air outlet openings 38 are provided in the side wall region of the inner shell 32.
  • an opening 44 is formed through which a hot air nozzle 46 can be inserted, which is placed on the circuit board 24 so that it completely surrounds a component 26 to be soldered or to be soldered.
  • the hot air flow generating the soldering temperature thus only reaches the component 26 to be soldered or desoldered, while the other components of the printed circuit board 22 are shielded from the hot air flow.
  • the assembly 22 After the assembly 22 has been positioned in the receiving space 20 of the heating cell 10 and closed by means of the cover 18, the assembly 22 is first heated to about 90 ° C. within half an hour to an hour. This ensures that the entire printed circuit board is heated to an almost identical temperature level. Shading effects and a different mass distribution on the printed circuit board 24 no longer play an important role.
  • the component to be repaired or replaced is then unsoldered in approx. 45 seconds. Now the module is allowed to cool to room temperature over a period of about two hours.
  • the cooling phase like the heating phase, can be regulated by a suitable control of the blowers 40 and the heating element 42.
  • the component is then placed and the cover 18 is replaced. Subsequently, the assembly 22 is warmed up again for about half an hour to an hour to the desired preheating temperature of about 90 ° C. The component is soldered in and the assembly 22 is then cooled again over a period of approximately two hours.
  • This method prevents local overheating of the printed circuit board 22, which can otherwise lead to deformation of the printed circuit board.
  • the cover 18 Since the device described above is primarily intended for repair work, the cover 18 must be designed in such a way that the soldering nozzle 46 can be placed over each of the components that can be soldered in or out by this method. This would require that a correspondingly large number of different lids be available, in which the opening 44 is provided in the correct place in order to be able to position the soldering nozzle 46 correctly.
  • the effort involved is avoided by a cover as shown in FIG. 2.
  • the cover 18 shown there comprises a frame 48 and a plate 50 surrounded by it.
  • the opening 44 for inserting the soldering nozzle 46 is formed eccentrically in a first circular disk 52.
  • the circular disk 52 is also rotatably mounted eccentrically in a second larger circular disk 54.
  • the mounting takes place with a stepped flange 56 on the circumference of the circular disk 52 and retaining tabs 58 which hold the circular disk 52 in the corresponding opening of the circular disk 54.
  • the second circular disk 54 is in the same way with the help of a stepped flange 60 and retaining tabs 62 in a ner opening in the plate 50 rotatably mounted.
  • the opening 44 can be placed anywhere within the circumference of the second circular disc 54.
  • a single cover is sufficient to process all components of an assembly. In any case, it is not necessary to provide a separate cover for each component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un dispositif permettant de travailler de façon sélective sur des composants individuels d'un ensemble plat électronique dans des conditions d'environnement prédéterminées. Ce dispositif comprend un récipient conçu pour recevoir l'ensemble, dont la surface de couverture (18) comporte une ouverture (44) permettant l'introduction d'un outil de travail, cette ouverture (44) étant formée de façon excentrique dans un disque (52) qui est monté de façon à pouvoir tourner dans la surface de couverture (18).
EP98912208A 1997-04-18 1998-02-12 Dispositif permettant de travailler de fa on selective sur des composants individuels d'un ensemble plat electronique Withdrawn EP0976312A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19716392A DE19716392A1 (de) 1997-04-18 1997-04-18 Vorrichtung zum selektiven Bearbeiten einzelner Bauteile einer elektronischen Flachbaugruppe
DE19716392 1997-04-18
PCT/DE1998/000405 WO1998048606A1 (fr) 1997-04-18 1998-02-12 Dispositif permettant de travailler de façon selective sur des composants individuels d'un ensemble plat electronique

Publications (1)

Publication Number Publication Date
EP0976312A1 true EP0976312A1 (fr) 2000-02-02

Family

ID=7827009

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98912208A Withdrawn EP0976312A1 (fr) 1997-04-18 1998-02-12 Dispositif permettant de travailler de fa on selective sur des composants individuels d'un ensemble plat electronique

Country Status (3)

Country Link
EP (1) EP0976312A1 (fr)
DE (1) DE19716392A1 (fr)
WO (1) WO1998048606A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965048A (en) * 1998-11-20 1999-10-12 General Electric Company Heated chamber including an open wall with a gas curtain
US6897410B1 (en) * 2003-11-07 2005-05-24 Delaware Capital Formation, Inc. Dual stage pre-heater

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274576A (en) * 1979-11-13 1981-06-23 International Business Machines Corporation Cryogenic chip removal technique
DE8310164U1 (de) * 1983-04-07 1984-01-12 Cooper Industries, Inc., 77210 Houston, Tex. Entlötgerät
US5594200A (en) * 1995-06-09 1997-01-14 Ramsey Electronics, Inc. Electromagnetic isolation chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9848606A1 *

Also Published As

Publication number Publication date
WO1998048606A1 (fr) 1998-10-29
DE19716392A1 (de) 1998-10-22

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