EP0939410A2 - Verfahren zur Herstellung einer Kaltleiteranordnung sowie Verwendung der Kaltleiteranordnung als Strombegrenzer - Google Patents
Verfahren zur Herstellung einer Kaltleiteranordnung sowie Verwendung der Kaltleiteranordnung als Strombegrenzer Download PDFInfo
- Publication number
- EP0939410A2 EP0939410A2 EP99810105A EP99810105A EP0939410A2 EP 0939410 A2 EP0939410 A2 EP 0939410A2 EP 99810105 A EP99810105 A EP 99810105A EP 99810105 A EP99810105 A EP 99810105A EP 0939410 A2 EP0939410 A2 EP 0939410A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal layer
- solder
- ptc thermistor
- layer
- meandering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
Definitions
- the invention relates to a method for producing a PTC thermistor arrangement with at least one metal layer, the electrical resistance of which is positive Has temperature coefficient and for electrical insulation on both sides of their two opposite main surfaces each provide a ceramic plate, as well as with at least one cooling element, which with a ceramic plate in thermal Contact is there. It also describes how a PTC thermistor arrangement is used to limit the current can be used.
- PTC thermistor arrangements of the type mentioned above are known per se Way preferably used in electrical circuits to be current sensitive Protect components from short-circuit currents.
- EP 0 642 199 A1 describes a protective circuit for a circuit with a Capacitor circuit, which has a reversible short-circuit current limiter provides a PTC thermistor in series with a capacitor bank and connected in parallel to a varistor and / or an ohmic resistor is.
- a similar current limiting circuit is known from EP 0 713 228 A1 which also describes non-blocking thermistor structures based on metal.
- the PTC thermistor structure has at least one, preferably made of Cr / Ni layer existing resistance track, which is thermally coupled to a cooling element. For electrical insulation of the resistance track are electrically insulating and thermally conductive insulation layers are provided.
- a disadvantage of the known PTC thermistor arrangements, which have a mechanical Pressing device is their large and sometimes very heavy structure that not least due to the device itself which causes the contact pressure.
- the invention is based on the object of a method for producing a PTC thermistor arrangement and to specify a PTC thermistor arrangement produced therewith on the one hand, avoiding clamping devices, a compact and lightweight Has structure and moreover improved thermal conductivity for efficient Provides cooling of the PTC thermistor element.
- it aims to use a varistor and ohmic resistance to limit the current can.
- the PTC thermistor required for the current limitation be introduced with as little movement as possible within the PTC thermistor arrangement can, even when the highest current peaks occur, across the interconnects to resist occurring forces.
- claims 1, 5, 6, and 12 The object on which the invention is based is achieved in claims 1, 5, 6, and 12.
- the claim 1 is directed to a method of manufacture a PTC thermistor arrangement
- claims 5 and 6 relate to the invention trained PTC thermistor assemblies
- claim 12 is directed to a Current limiting device according to the invention, which consists of an inventive PTC thermistor assembly is composed.
- the inventive idea advantageous advanced features are the subject of the dependent claims.
- PTC thermistor assemblies is a method of manufacture a PTC thermistor arrangement, the at least one metal layer, the electrical Resistance has a positive temperature coefficient and their a ceramic plate is provided for two opposite main surfaces are, and has at least one cooling element which with a ceramic plate in is thermal contact, indicated such that the metal layer at its two Main surfaces each with the ceramic plates using a solder or adhesive layer with each other.
- solders or adhesive layers must be used that over have particularly good thermal conductivity properties.
- the PTC thermistor arrangement used as a current limiter so in cases of overcurrents cold-conductive metal layer warms up, causing its electrical resistance to skyrocket increases.
- current flowing through is limited until the cold-conducting material reaches its initial temperature reached after a certain cooling time. Because the occurrence of overcurrents On the one hand, the response time must take place within a few microseconds the PTC thermistor arrangement, i.e.
- those between the cooling element and to optimize the heat transfer provided by the cold-conducting metal layer are, as well as the connection layer with which the cooling element on at least one ceramic plate adjacent.
- NiZrTi alloys which should preferably be composed of the following mixture ratios: Ni 22 Zr 63 Ti 15 alloy.
- Pure zirconium or pure titanium are also suitable as soldered connections.
- an adhesive layer has proven to be particularly suitable for silicone rubber proven, which is mixed with a metallic powder, preferably aluminum or Silver.
- High-temperature plastics such as PEEk, PSU, PAI, PES can also be used for this be used.
- Preferred materials for cold-conducting metal layers are Vacon, iron or Nickel represents the latter, for example, has a specific electrical resistance from 7.3 ⁇ cm.
- a NiZrTi solder has a specific electrical Resistance of 170 ⁇ cm, so that the parallel resistance from the plumb line less than 2% of the nickel resistance, with a 0.5 mm thick nickel layer.
- solder or adhesive layer are bilateral solder or adhesive layers applied to the cold-conducting metal layer in such a way Cross-section dimensions that the ratio of the sum of the cross-sectional areas the solder or adhesive layers adjacent to the metal layer and the cross-sectional area the metal layer is ⁇ 4/5, preferably 0.12.
- solders known per se e.g. Ticusil, Ticuni, Incusil, CS1, CB4, CB10, Keramitil, which are essentially based on silver, copper or nickel are based and have an incomparably lower electrical resistance as a NiZrTi alloy, for example, these connecting layers bear due to their small cross-sectional area in a subordinate way to the due to the temperature-changing electrical conductivity of the entire PTC thermistor arrangement at.
- the cold-conducting metal layer which is in the manner of a Sandwich structure is inserted between two ceramic plates, a meandering shape which has areas in which the metal layer assumes a curved shape, which are each followed by straight-line sections.
- the meandering structure is dimensioned as small as possible Metal layer, which have very small arc radii on the meander curves, tried the current flowing through the metal layer on the inside of the radius to concentrate, resulting in overheating or destruction of the meandering structure can lead.
- the curved regions of the metal layer and / or the solder or adhesive layers adjacent to these areas must at least partially have a lower electrical resistance, than those who are straight. So on the one hand it is necessary to carry the current To enlarge and / or cross-section within the meander curves Increase conductivity.
- the PTC thermistor arrangement consists of two congruent, thermally conductive metal layers formed by a ceramic layer separated from one another, each of which is in turn enclosed on both sides by ceramic plates.
- a cooling element designed as an aluminum cooler or AlSiC cooler is soldered to the ceramic plate, which preferably consists of aluminum nitrite, by means of a preferably soft solder connection.
- the cooling element is previously nickel-plated and the aluminum nitride ceramic plate is metallized. The solder is introduced at around 250 ° C between the two elements for a firm connection.
- the entire PTC thermistor arrangement and in particular the metal meander tracks can be dimensioned in such a way that their electrical properties in terms of capacitance, inductance and electrical resistance correspond entirely to a current limiter circuit which, in a manner known per se, consists of a cooled non-linear PTC resistor and in parallel a varistor and a linear one Resistance.
- a current limiter circuit which, in a manner known per se, consists of a cooled non-linear PTC resistor and in parallel a varistor and a linear one Resistance.
- FIG. 1 shows a cross-sectional view through a PTC thermistor arrangement according to the invention, the core of which has a 5-layer structure, consisting of three ceramic plates 1, which preferably consist of aluminum nitrite (AIN) or aluminum oxide (Al 2 O 3 ) and in each case a cold-conducting metal layer Provide 2, which is made of pure nickel in the example shown.
- the metal layers 2 have a meandering structure perpendicular to the plane of the drawing, which will be discussed further below.
- the shape and size of the metal layers 2 are designed such that when used as a current limiter, they can absorb the entire capacitor energy that occurs in the event of a short circuit, as a result of which the space-consuming varistor and parallel resistor, as they result from the known current limiter circuits, are no longer necessary.
- the metal layers 2 between the ceramic plates 1 are bonded to the ceramic plates 2 on both sides by means of a solder layer 3.
- the solder layer 3 consists of the considerations already mentioned above with regard to the thermal and electrical conductivity, preferably of a NiZrTi alloy, which has a specific thermal conductivity of 8 W / mK with a typical solder layer thickness of 30 ⁇ m. Furthermore, the solder has a specific electrical resistance of 170 ⁇ cm.
- the lowermost ceramic plate 1 is thermally coupled to a cooling element 4 via a further solder layer 5.
- the thermal coupling between the cooling element 4 and the ceramic plate 1 typically takes place with a soft solder layer, the cooling element 4, which preferably consists of aluminum, being nickel-plated on its surface and the ceramic plate being metallized before the soldering.
- a solder material suitable for this connection is Reifen SnPb 36 Ag 1 .
- a further cooling element can be applied to to improve the cooling effect of the entire PTC thermistor arrangement.
- the overall height is based to significantly reduce suitable dimensions for the individual metal layers, for example, to only 35 mm, compared to a construction height of 150 mm from conventional ones PTC thermistor arrangements in which the cohesion of the individual layers with the help of suitable clamping devices.
- the cold-conducting metal layers used in the PTC thermistor arrangement according to the invention 1 have and have a meandering structure in a manner known per se about a shape and layer thickness that have a desired resistance value as well the absorption capacity corresponds to a certain maximum energy.
- Outgoing of a desired dimensioning becomes an outline drawing of the meandering Metal layer, for example made in DXF format, directly from one EDM machine is readable.
- the meandering structures preferably worked out of a 250 to 500 mm thick nickel foil.
- a foil consisting of amorphous Ni 22 Zr 63 Ti 15 is used as the solder.
- such spoons with a width of 35 mm and a thickness of 30 ⁇ m can be obtained as strips.
- Usual solder layer thicknesses for the cohesive connection between the cold-conducting metal layer 2 and the corresponding ceramic plate 1 should be between 35 and 100 ⁇ m in order to allow the soldering process to take place without any voids.
- several individual layers of solder are connected to one another with adhesive, by means of spot welding or other joining methods.
- the prepared spoons are applied to both sides of the metal layer made of nickel, which are subsequently eroded in overhanging areas according to the meandering shape of the nickel layer.
- the meandering layer sequences consisting of nickel and solder are positioned between two ceramic plates and soldered accordingly.
- the soldering process takes place under high vacuum conditions at a maximum temperature of approximately 920 ° C., the layer arrangement being pressed together with a pressure of approximately 50 g / cm 2 during the soldering.
- the layer sequence assembled in this way shows a particularly high strength in thermal cycle tests in which temperature changes between -50 ° C and 150 ° C are carried out.
- Such PTC thermistor arrangements survive far more than 1900 thermal cycles without damage.
- Vacon CF25 is a new alloy from a Vacon melt with a particularly high increase in resistance at high temperatures is.
- Vacon CF 25 has a resistance stroke of 17.5 with a heating of 20 ° C to 1000 ° C, whereas nickel only has a resistance stroke of 6.5.
- a PTC thermistor arrangement can consist of any number of layer sequences be built up between ceramic plates and metal layers and in this way can be expanded modularly, without the expense of extra clamping devices to operate, which also encompass the entire layer arrangement would have to lead to an even larger design.
- the above-mentioned solder material consisting of a NiZrTi alloy, has particularly suitable electrical and thermal properties that particularly are advantageous with regard to the cold-conducting properties of the metal layer.
- Ceramic plates conventional solders, for example Ticusil, Ticuni, Incusil, CS1, CB4, CB10, Keramitil etc. is used, so make sure that the solder layer thickness in the Comparison to the metal layer thickness is only of minor dimension, so that a possible current flow in the case of current limitation through the solder layers due to their only a very small layer thickness is largely prevented.
- two layer arrangements are given, which consist of there are two ceramic plates 1 with an intermediate metal layer 2.
- the current cross section of the arrangement exposes itself about 50% of solder material 3 and the rest as cold-conducting metal 1 together.
- the thickness of the cold-conducting metal layer 2 is considerably larger than the sum of the cross sections of both solder layers 1, which makes their contribution to the electrical Conductivity is significantly reduced even in the event of a short circuit.
- the solder layer thicknesses be reduced to 0.05 to 0.025 mm, but there is a risk that voids occur during the soldering process.
- the metal layer length of the metal layer is also the length of the metal layer by the desired electrical specifications, such as the size of the capacitor bank and select the desired maximum current appropriately. So you can Depending on the possible applications, the metal layer lengths are up to 1 m, which are reasonable Dimensions are to be integrated in a PTC thermistor arrangement.
- the meander shape shown in FIG. 3a is considered to be particularly suitable for this is.
- the cold-conducting metal layer 2, which is formed in a meandering shape, has in each case rectilinear regions 7 running in parallel and the rectilinear regions connecting curved areas 8, the so-called meandering curves.
- a typical one Dimensioning of a metal layer made of nickel has a width-thickness ratio of 5 x 0.25 mm, so that the largest possible area Heat loss in normal operation as well as the heat from the short-circuit current passage as quickly as possible via the integral solder joint in the adjacent Cooler can be removed.
- the meandering geometry shows the disadvantage that the smaller the arc radii in the meander curves 8, the more the current flowing through the metal layer tries on itself to concentrate the inside of the meander curve, causing local overheating in the Metal layer arise that lead to the destruction of the metal layer itself.
- Particularly as small as possible, particularly when miniaturizing PTC thermistor arrangements trained meander structures has been recognized according to the invention that for Avoiding thermal overheating in either the meander curves current-carrying cross-section enlarged within the curves and / or the electrical Conductivity in the curved areas must be increased.
- the meander curves can also be used a very good conductive metal, which creates the current density within the metal layer is reduced since the current flow is now to the surrounding well conductive metal layer can avoid.
- that should be additional material applied to the meander curves is not a PTC material, so that the electrical resistance in this applied material 9 with increasing temperature remains largely constant.
- FIGS. 4a and b Such an arrangement is shown in FIGS. 4a and b.
- a solder layer 3 consisting of a NiZrTi alloy, firmly bonded to the ceramic plates 1.
- solder 9 With higher electrical between metal layer 2 and ceramic plates 1 Conductivity used. Solders with such higher electrical conductivities are, for example, compounds based on copper or silver.
- solder is AgCuTi (Ticusil), which has a solder layer thickness of 100 ⁇ m has a specific resistance of 2.6 ⁇ cm. This measure would result in a 500 ⁇ m thick nickel metal layer 2 and a 100 ⁇ m thick solder the electrical resistance in the meandering curves around the Factor 2 reduced. When using a 250 micron thick nickel metal layer 2 and A solder layer of the same thickness (100 ⁇ m) can even resist can be reduced by a factor of 3.
- solders with higher electrical conductivity can be immediate pure copper or silver are sprayed onto the metal layer, whereby the sprayed-on layer must be kept so thin that another layer of solder can be introduced to the ceramic plate 1.
- Fig. 5a Fig. 5b is a top view and a cross-sectional view for this arrangement shown.
- the metal layer 2 is in the rectilinear areas 7 made of nickel, in the transition to the curved areas by a layer of solder 11 is cut off.
- the meandering curve area 8 closes for continuation the metal layer 2 to a material 10 that has a higher electrical conductivity has, as the metal layer 2 in the rectilinear area.
- the material layer 10 can have a larger cross section than in the straight line Have area to additional current compression caused by the bend to avoid.
- FIG. 6a and b Another embodiment that further miniaturization of the meandering structure enables is shown in Figs. 6a and b. So it is possible to have several Realize meandering arches on the same contact surface by the current-carrying Metal layer in the meandering curves 8 with the same cross section from the Plane of the meandering structure are twisted. 6b is a cross-sectional illustration of the vertically twisted meandering curve areas represented by the distance can be shortened between two parallel linear areas 7. Around Avoid repetitions are based on the originally introduced reference numerals to understand the material sequence in Fig. 6b.
- the individual meandering structures are edged side by side run as shown in Fig. 7.
- the individual cold-conducting metal layers 2 are introduced into a ceramic body 1 prepared in a fan shape and connected to it via a solder layer 3. Due to the vertical arrangement of the meandering metal layer 2, the individual rectilinear Meandering paths, which are shown in cross section in Fig. 7, brought closer together become. Above all, it is conceivable, in addition to being rectangular in cross section shaped meandering tracks also meandering metal layers with circular Cross section to use.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
- Fig. 1
- Querschnittsdarstellung durch eine Kaltleiteranordnung in integrierter Version,
- Fig. 2a, b
- Querschnittsdarstellungen durch zwei Keramikplatten mit eingelöteter kaltleitenden Metallschicht mit unterschiedlichen Querschnittsflächen,
- Fig. 3 a, b
- Mäanderförmige, kaltleitende Metallschicht mit gekrümmten Mäanderkurven,
- Fig. 4a, b
- Mäanderkurvenstruktur mit angrenzender Lötschicht hoher elektrischer Leitfähigkeit,
- Fig. 5a, b, c
- Mäanderkurvenstruktur, bestehend aus Material höherer elektrischer Leitfähigkeit, sowie
- Fig. 6a, b
- Mäanderkurvenstruktur mit aus der Mäanderebene erhabenen Kurvenbögen,
- Fig. 7
- Mäanderstruktur mit hochkant verlaufenden Mäanderbahnen.
- 1
- Keramikplatte
- 2
- Kaltleitende Metallschicht
- 3
- Lötschicht
- 4
- Kühlelement
- 5
- Lötschicht
- 6
- obere Seite des Kaltleiteranordnung
- 7
- Geradlinige Bereiche
- 8
- Gekrümmte Bereiche, Mäanderkurve
- 9
- Lot mit höherer elektrischer Leitfähigkeit
- 10
- Material mit höherer elektrischer Leitfähigkeit
- 11
- Trennlotschicht
Claims (14)
- Verfahren zur Herstellung einer Kaltleiteranordnung mit wenigstens einer Metallschicht (2), deren elektrischer Widerstand einen positiven Temperaturkoeffizienten aufweist und zur elektrischen Isolation beidseitig zu ihren zwei gegenüberliegenden Hauptflächen jeweils eine Keramikplatte (1) vorsieht,
sowie mit wenigstens einem Kühlelement (4), das mit einer Keramikplatte (1) in thermischen Kontakt steht,
dadurch gekennzeichnet, daß die Metallschicht (2) an ihren zwei Hauptoberflächen jeweils mit den Keramikplatten (1) mittels einer Lot- oder Klebeschicht (3) miteinander fest verfügt wird. - Verfahren nach Anspruch 1,
dadurch gekennzeichnet, daß als Lot zur Lötverbindung eine NiZrTi-Legierung, vorzugsweise eine Ni22Zr63Ti15-Legierung, oder Zr oder Ti verwendet wird. - Verfahren nach Anspruch 1,
dadurch gekennzeichnet, daß die Klebeschicht Silikongummi aufweist, dem ein metallisches Pulver beigemengt ist, vorzugsweise Al oder Ag. - Verfahren nach einem der Ansprüche 1 bis 3,
dadurch gekennzeichnet, daß die Lot- oder Klebeschicht (3) einen größeren spezifischen elektrischen Widerstand aufweist, als die Metallschicht (2). - Kaltleiteranordnung mit wenigstens einer Metallschicht (2), deren elektrischer Widerstand einen positiven Temperaturkoeffizienten aufweist und zur elektrischen Isolation beidseitig zu ihren zwei gegenüberliegenden Hauptflächen jeweils eine Keramikplatte (1) vorsieht,
sowie mit wenigstens einem Kühlelement (4), das mit einer Keramikplatte (1) in thermischen Kontakt steht,
dadurch gekennzeichnet, daß zwischen den Hauptoberflächen der Metallschicht (2) und den Keramikplatten (1) jeweils eine Lot- oder Klebeschicht (3) vorgesehen ist, und daß das Verhältnis aus der Summe der Querschnittsflächen der an der Metallschicht (2) angrenzenden Lot- oder Klebeschichten (3) und der Querschnittsfläche der Metallschicht kleiner 4/5, vorzugsweise 0,12 ist. - Kaltleiteranordnung nach Anspruch 5
oder dem Oberbegriff des Anspruchs 5, wobei die Metallschicht (2) in Mäanderfrom ausgebildet ist und Bereiche (8) aufweist, in denen die Metallschicht (2) gekrümmt ist und an diese anschließende Bereiche (7) aufweist, die weitgehend geradlinig verlaufen,
dadurch gekennzeichnet, daß die gekrümmten Bereiche (8) der Metallschicht (2) und/oder der an diesen Bereichen angrenzenden Lotschichten wenigstens teilweise einen geringeren elektrischen Widerstand aufweisen gegenüber denjenigen, die geradlinig verlaufen. - Kaltleiteranordnung nach Anspruch 6,
dadurch gekennzeichnet, daß die mäanderförmige Metallschicht (2) in den gekrümmten Bereichen (8) einen Krümmungsradius r aufweist, der wenigstens 0,8 mal größer ist als die Breite d der geradlinig verlaufenden Metallschicht. - Kaltleiteranordnung nach Anspruch 6 oder 7,
dadurch gekennzeichnet, daß die Breite h der Metallschicht im Scheitelpunkt der gekrümmten Bereiche wenigstens 1,5 mal größer ist als die Breite d. - Kaltleiteranordnung nach einem der Ansprüche 6 bis 8,
dadurch gekennzeichnet, daß in den gekrümmten Bereichen (8) ein Lot für die Lötverbindung zwischen Keramikplatte (1) und Metallschicht (2) verwendet wird, das über eine höhere elektrische Leitfähigkeit, bspw. AgCu- oder AgCuTi-Lot, verfügt, als das Lot in den geradlinigen Bereichen. - Kaltleiteranordnung nach einem der Ansprüche 6 bis 8,
dadurch gekennzeichnet, daß unmittelbar auf den gekrümmten Bereichen (8) der Metallschicht (2) eine dünne, gut elektrisch leitende Schicht, vorzugsweise Cu oder Ag, aufgebracht ist. - Kaltleiteranordnung nach einem der Ansprüche 6 bis 10,
dadurch gekennzeichnet, daß der gekrümmte Bereich (8) der Metallschicht (2) mit gleichbleibender Querschnittsfläche aus der Ebene der Mäanderstruktur verdreht ist. - Vorrichtung zur Strombegrenzung in elektrischen Schaltkreisen zum Schutz von elektrischen Bauelementen vor auftretenden Kurzschlußströmen unter ausschließlicher Verwendung einer Kaltleiteranordnung nach einem der Ansprüche 1 bis 11.
- Vorrichtung nach Anspruch 12,
dadurch gekennzeichnet, daß die Kaltleiteranordnung eine 5-fach Schichtstruktur aufweist, mit drei Keramikplatten zwischen denen zwei Metallschichten, jeweils in abwechselnder Reihenfolge, angeordnet sind. - Vorrichtung nach Anspruch 13,
dadurch gekennzeichnet, daß die Metallschichten jeweils eine Mäanderstruktur aufweisen und derart zwischen den Keramikschichten angeordnet sind, daß sich ihre Mäanderbahnen untereinander in Deckung befinden und derart miteinander elektrisch verschaltet sind, daß sie jeweils in entgegengesetzter Richtung von elektrischen Strom durchflossen werden.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19808025 | 1998-02-26 | ||
DE1998108025 DE19808025A1 (de) | 1998-02-26 | 1998-02-26 | Verfahren zur Herstellung einer Kaltleiteranordnung sowie Verwendung der Kaltleiteranordnung als Strombegrenzer |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0939410A2 true EP0939410A2 (de) | 1999-09-01 |
EP0939410A3 EP0939410A3 (de) | 2000-07-26 |
Family
ID=7858942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99810105A Withdrawn EP0939410A3 (de) | 1998-02-26 | 1999-02-09 | Verfahren zur Herstellung einer Kaltleiteranordnung sowie Verwendung der Kaltleiteranordnung als Strombegrenzer |
Country Status (2)
Country | Link |
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EP (1) | EP0939410A3 (de) |
DE (1) | DE19808025A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103680779A (zh) * | 2013-11-04 | 2014-03-26 | 西安电子工程研究所 | 一种耐高压大功率固态限流电阻 |
TWI461386B (zh) * | 2011-06-10 | 2014-11-21 | High strength alumina and stainless steel metal bonding method |
Citations (6)
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---|---|---|---|---|
DE2510322A1 (de) * | 1975-02-11 | 1976-08-19 | Bbc Brown Boveri & Cie | Kaltleiter-bauelement |
US4901051A (en) * | 1987-09-04 | 1990-02-13 | Murata Manufacturing Co., Ltd. | Platinum temperature sensor |
DE4130772A1 (de) * | 1991-09-16 | 1993-04-29 | Siemens Matsushita Components | Kaltleiter-kontaktmetallisierung |
DE4343149A1 (de) * | 1993-12-17 | 1995-06-22 | Abb Patent Gmbh | Leistungswiderstand für den Einbau in einen Spannverband mit Flüssigkeitskühldosen und Halbleiterzellen |
EP0713228A1 (de) * | 1994-11-19 | 1996-05-22 | ABB Management AG | Vorrichtung zur Strombegrenzung |
EP0773562A2 (de) * | 1995-11-11 | 1997-05-14 | Abb Research Ltd. | Strombegrenzer |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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SE413727B (sv) * | 1977-05-17 | 1980-06-16 | Transmicro Scandinavia Ab | For anvendning sasom strombegrensande komponent i en elektrisk stromkrets avsett pct-motstand |
DE3121025A1 (de) * | 1981-05-27 | 1982-12-23 | Gustav Wahler Gmbh U. Co, 7300 Esslingen | Elektrische heizvorrichtung fuer saugrohre von brennkraftmaschinen |
JPS6048201U (ja) * | 1983-09-09 | 1985-04-04 | ティーディーケイ株式会社 | 正特性サ−ミスタ装置 |
-
1998
- 1998-02-26 DE DE1998108025 patent/DE19808025A1/de not_active Withdrawn
-
1999
- 1999-02-09 EP EP99810105A patent/EP0939410A3/de not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2510322A1 (de) * | 1975-02-11 | 1976-08-19 | Bbc Brown Boveri & Cie | Kaltleiter-bauelement |
US4901051A (en) * | 1987-09-04 | 1990-02-13 | Murata Manufacturing Co., Ltd. | Platinum temperature sensor |
DE4130772A1 (de) * | 1991-09-16 | 1993-04-29 | Siemens Matsushita Components | Kaltleiter-kontaktmetallisierung |
DE4343149A1 (de) * | 1993-12-17 | 1995-06-22 | Abb Patent Gmbh | Leistungswiderstand für den Einbau in einen Spannverband mit Flüssigkeitskühldosen und Halbleiterzellen |
EP0713228A1 (de) * | 1994-11-19 | 1996-05-22 | ABB Management AG | Vorrichtung zur Strombegrenzung |
EP0773562A2 (de) * | 1995-11-11 | 1997-05-14 | Abb Research Ltd. | Strombegrenzer |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI461386B (zh) * | 2011-06-10 | 2014-11-21 | High strength alumina and stainless steel metal bonding method | |
CN103680779A (zh) * | 2013-11-04 | 2014-03-26 | 西安电子工程研究所 | 一种耐高压大功率固态限流电阻 |
CN103680779B (zh) * | 2013-11-04 | 2016-04-06 | 西安电子工程研究所 | 一种耐高压大功率固态限流电阻 |
Also Published As
Publication number | Publication date |
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DE19808025A1 (de) | 1999-09-02 |
EP0939410A3 (de) | 2000-07-26 |
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