EP0931357A1 - Module optoelectronique pour transfert de donnees bidirectionnel par voie optique - Google Patents

Module optoelectronique pour transfert de donnees bidirectionnel par voie optique

Info

Publication number
EP0931357A1
EP0931357A1 EP97912032A EP97912032A EP0931357A1 EP 0931357 A1 EP0931357 A1 EP 0931357A1 EP 97912032 A EP97912032 A EP 97912032A EP 97912032 A EP97912032 A EP 97912032A EP 0931357 A1 EP0931357 A1 EP 0931357A1
Authority
EP
European Patent Office
Prior art keywords
radiation
component
beam splitter
focusing means
optoelectronic module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97912032A
Other languages
German (de)
English (en)
Inventor
Werner Späth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0931357A1 publication Critical patent/EP0931357A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures

Definitions

  • the invention relates to an optoelectronic module for bidirectional optical data transmission, in which a transmission component for emitting radiation, a reception component for receiving radiation, a beam splitter device with a beam splitter layer and a radiation focusing means for focusing radiation are designed and arranged in relation to one another are that during operation of the optoelectronic module at least part of a radiation emitted by the transmission component is coupled into an optical device, in particular an optical waveguide, optically coupled to the optoelectronic module, and that at least part of a received radiation decoupled from the optical device is coupled into the receiving component.
  • Such a module is known for example from the European patent application EP 664 585.
  • a transmission and reception module for bidirectional optical message and signal transmission is described therein.
  • a laser chip is arranged on a common carrier between two carrier parts, the side surfaces of which are adjacent to the resonator surfaces of the laser chip and are provided with mirror layers and are inclined at an angle of 45 ° to the resonator surfaces. Radiation emitted by the laser chip parallel to the upper side of the common carrier is deflected by one of these side surfaces by 90 ° in the direction of a lens coupling lens attached to the carrier part and is coupled into an optical waveguide by means of the latter.
  • the device consisting of the laser chip, the photodiode, common carrier and the carrier parts is mounted in a hermetically d ichtes metal housing having a window.
  • the invention is based on the object of developing an optoelectronic module of the type mentioned at the outset which requires as little assembly effort as possible, enables the simplest possible adjustment of the individual components to one another and has low reflection losses.
  • optoelectronic module with the features of claim 1.
  • Advantageous embodiments and developments of the optoelectronic module according to the invention are the subject of subclaims 2 to 11.
  • a preferred method for the simultaneous production of a plurality of optoelectronic modules according to the invention is the subject of claim 12.
  • a shaped body is provided as the beam splitter device, which essentially consists of a material which is transparent to the emitted radiation and the received radiation and in which the beam splitter layer is embedded.
  • the inventive design of the beam splitter device as a shaped body has the particular advantage that its side surfaces can be used as reference and adjustment surfaces for all the components of the optoelectronic module mentioned at the beginning.
  • the molded body has at least a first side surface, a second side surface and a third side surface, wherein the first side surface and the second side surface are inclined to one another, in particular are perpendicular to one another.
  • the third side surface is inclined to the second side surface or he ⁇ most side surface; in particular, the included angle is 90 °.
  • the first and third Be ⁇ ten Chemistry or the second and the third side surface are opposite lateral surfaces of the mold body and are in particular parallel to one another.
  • a transmission component beam exit surface of the transmission component faces the first side surface of the beam splitter device, a reception component beam entry surface of the reception component faces the second side surface and a radiation entry and radiation exit surface of the radiation focusing means faces the third side surface.
  • the beam splitter layer is arranged such that it intersects both the beam axis of the emitted radiation and the beam axis of the received radiation.
  • the transmission component radiation exit area is to be understood as the side surface of the transmission component through which the largest part of a radiation generated in the transmission component emerges from the latter.
  • the side component of the receiving component by which radiation to be received by the receiving component is to be coupled is meant as the receiving component radiation entrance area.
  • the radiation entry and exit surface of the radiation focusing means means the side surface of the radiation focusing means through which the radiation emitted by the transmission component penetrates into the radiation focusing means and through which radiation received by the radiation focusing means from the optical device emerges from the radiation focusing means.
  • the transmission component radiation exit surface is with the first side surface, the reception component
  • Beam entry surface with the second side surface and the beam entry and exit surface of the beam lungsfokussierffens is connected to the third side surface ⁇ ver.
  • a radiation-permeable medium such as, for. B. transparent synthetic resin that fills any gaps between the individual surfaces. It is particularly advantageous if the transmitting component beam entrance surface has a physical contact with the first side surface, that is, when the Ab ⁇ was less than or equal to one tenth of the wavelength of the emitted radiation between transmitting component beam entrance surface and the first side surface. Ideally, the transmission component beam exit surface lies on the first side surface. The same applies analogously to the receiving component beam entry area and the beam entry and exit area of the radiation focusing means.
  • An optoelectronic module according to the invention constructed in this way advantageously has very low internal reflection losses.
  • a particular advantage of the optoelectronic module according to the invention is that it takes up very little space.
  • the beam splitter device is made from at least two joined optical prisms and the beam splitter layer is arranged between the two optical prisms.
  • the beam splitter device has the shape of a cuboid, the beam splitter layer lies in a diagonal sectional area of the cuboid and has a perpendicular to the beam splitter layer
  • the radiation focusing means has a carrier part on which the beam splitter device and the transmission component are fastened.
  • the carrier part consists essentially of a material which is transparent to the emitted radiation and the received radiation, and the transmission component and the radiation focusing means are arranged on opposite sides of the carrier part.
  • a further preferred embodiment of the optoelectronic module according to the invention has a monitor diode which has a monitor diode beam entry surface facing a fourth side surface of the molded body.
  • the monitor diode radiation entry surface means the side surface of the monitor diode through which radiation to be detected by the monitor diode penetrates into it.
  • the first side surface and the fourth side surface of the molded body are arranged in such a way that, during operation of the optoelectronic module, at least part of a radiation transmitted through the beam splitter layer strikes the monitor diode radiation entry surface. They represent, for example, opposite side surfaces of the shaped body and are in particular parallel to one another.
  • the second and third side surfaces are opposite side surfaces of the molded body, which are in particular parallel to one another.
  • the monitor diode is also on the Carrier part attached and any gap between the monitor diode beam entry surface and the fourth side surface of the molded body filled with a transparent material.
  • the shaped body has the shape of a cuboid
  • the beam splitter layer lies in a diagonal sectional area of the cuboid
  • a sectional area of the cuboid lying perpendicular to the beam splitter layer has the shape of a rectangle, in particular a square
  • the second and third side surfaces are opposite side surfaces of the shaped body, so that the radiation focusing means and the receiving component are arranged on opposite sides of the shaped body, has the features that the beam axis of the emitted radiation and the beam axis of the received radiation form an angle of 90 °
  • the beam splitter layer is designed and arranged such that it largely reflects the emitted radiation, so that the beam axis of the reflected radiation is parallel to the beam axis of the received one Radiation extends and that it transmits at least part of the received radiation, so that it strikes the receiving component beam entry surface.
  • the shaped body has the shape of a cuboid
  • the beam splitter layer lies in a diagonal sectional area of the cuboid
  • a sectional surface of the cuboid lying perpendicular to the beam splitter layer has the shape of a rectangle, in particular a square
  • the first and the third side surface are opposite side surfaces of the shaped body, so that the radiation focusing means and the transmission component are arranged on opposite sides of the shaped body, has the features that the beam axis of the emitted Radiation and the beam axis of the received radiation run essentially parallel to one another in such a way that the beam splitter layer is designed and arranged in such a way that it passes a part of the emitted radiation to be coupled into the optical device and largely reflects the received radiation and deflects it towards the receiving component.
  • a blocking filter is arranged between the receiving component and the second side surface of the molded body, said filter being largely opaque to the wavelength of the emitted radiation.
  • This can in particular crosstalk, d. H. a direct transmission of signals from the transmitting component to the receiving component can be prevented.
  • a preferred method for the simultaneous production of at least two optoelectronic modules in utility mounting in which the radiation focusing means each have a carrier part on which the beam splitter device and the transmission component are fastened, in which the carrier part essentially consists of one for the emitted radiation and the received one Radiation-permeable material and in which the transmission component and the radiation focusing means are arranged on opposite sides of the carrier part, has the following method steps: a) producing a disc, consisting of a material which is permeable to the emitted radiation and the received radiation, b) forming or Applying at least two radiation focusing means to a main surface of the disk, such that there is a space between each two radiation focusing means, c) applying a prismatic bar into which along its length a beam splitter layer lying on one of its diagonal planes is embedded on the disk, in such a way that the beam splitter layer comes to lie over the radiation focusing means, d) applying at least two transmission components to the pane, in such a way that the transmission component beam
  • panel assembly For the sake of completeness, it should be mentioned at this point that in semiconductor technology the simultaneous manufacture of a plurality of similar components in the pane assembly is referred to as panel assembly.
  • FIG. 1 shows a schematic sectional view of a first exemplary embodiment of the optoelectronic module according to the invention
  • FIG. 2 shows a schematic sectional view of a second exemplary embodiment of an optoelectronic module according to the invention
  • Figure 3 is a schematic sectional view through a third embodiment of an optoelectronic module according to the invention
  • FIG. 4 shows a schematic illustration to explain a process sequence for the simultaneous production of a plurality of optoelectronic modules according to the exemplary embodiment from FIG. 1.
  • the prism cube 14 consists of two assembled optical prisms 15, 16, between which the beam splitter layer 10 is arranged.
  • the beam splitter layer 10 lies on a diagonal plane of the prism cube 14.
  • this exemplary embodiment is not exclusively limited to the use of a prism cube 14.
  • the prism cube it is also possible, for example, to use a prism cuboid with a square or rectangular cut surface perpendicular to the beam splitter layer 10.
  • a transmission component 2 for example a Fabry-Perot or a DFB laser, that is to say an edge emitter, is fastened on the first main surface 30 of the carrier part 1 adjacent to a first side surface 5 of the prism cube 14 such that a transmission component radiation exit surface 11 of the transmission component ment ⁇ 2 parallel to the first side surface 5 of the prism cube 14 lies.
  • a connecting means 33 between the Sendebauele ⁇ element 2 and the support part 1 is for example a solder or an adhesive is used.
  • a connecting means 33 between the Sendebauele ⁇ element 2 and the support part 1 is for example a solder or an adhesive is used.
  • the transmission component 2 can lie directly with its electrical connections on the metallization layers 42 and can be connected to them in an electrically conductive manner, for example by means of a solder.
  • the transmission component radiation exit surface 11 can optionally lie directly on the first side surface 5 of the prism cube or can also be arranged at a distance from it.
  • the space between the radiation exit surface 11 and the first side surface 5 of the prism cube 14, as shown in FIG. 1 can be filled with a radiation-permeable coupling medium 24, the refractive index of which is higher than that of air.
  • the transmission component beam exit surface 11 has physical contact with the first side surface 5.
  • a receiving component 3 e.g. B. a photodiode attached on a second side surface 6 of the prism cube 14 lying perpendicular to the first side surface 5 and parallel to the first main surface 30 of the carrier part 1, a receiving component 3, e.g. B. a photodiode attached.
  • the receiving component beam entry surface 12 of the receiving component 3 faces the second side surface 6.
  • the receiving component beam exit surface 12 again has physical contact with the second side surface 6.
  • the prism cube 14 is arranged in such a way that the beam splitter layer 10 lies in a plane which lies between the sensor debauelement 2 and the receiving device 3 is disposed and including the machines with the first major surface 30 of the support part 1 ei ⁇ angle of 45 °.
  • a monitor diode 21 On the opposite side of the transmitting component 2 of the prism cube 14 is also in the recess 31 of the support member 1 by means of a connecting means 34, for. B. a metallic solder or an adhesive, a monitor diode 21 attached.
  • This monitor diode 21 essentially serves to check the wavelength of the radiation 7 emitted by the transmission component 2.
  • the beam splitter layer 10 is designed such that it allows part of the radiation 7 emitted to pass through.
  • the monitor diode 21 is arranged such that a monitor diode beam entry surface 23 faces a fourth side surface 22 of the prism cube 14 opposite the first side surface 5.
  • a space between the fourth side surface 22 of the prism cube 14 and the monitor diode beam entry surface 23 is by means of a transparent coupling medium 26, for. B. a transparent epoxy resin filled.
  • a side surface 44 of the monitor diode 21 opposite the monitor diode beam entry surface 23 is chamfered in such a way that it reflects at least part of the radiation penetrating into the monitor diode 21 towards a radiation-detecting pn junction 45 of the monitor diode 21. It forms an angle with a side surface 46 of the monitor diode closest to the pn junction 45, which angle is less than 90 °.
  • it can be provided with a reflection-enhancing layer, for example.
  • the transmitting component 2, the receiving component 3, the prism cube 14, and the radiation focusing means 8 are designed and arranged with respect to one another such that during operation of the optical at least part of a radiation 7 emitted by the transmission component 2 after passing through the radiation focusing means 8 into an optical device 9 arranged downstream of the radiation focusing means 8, and that at least part of a radiation emitted by the optical device 9 after passing through the radiation focusing means 8 decoupled, received radiation 13 after passing through the radiation focusing means 8 and through the prism cube 14 into the receiving component 3.
  • the prism cube 14 is made of a material which is permeable to the emitted radiation 7 and the received radiation 13 (for example quartz, borosilicate glass, sapphire or semiconductor material (for example, compare the semiconductor materials specified below for the carrier part)).
  • the beam splitter layer 10 is designed such that it largely reflects the emitted radiation 7 and transmits the received radiation 13 as far as possible.
  • Such beam splitter layers 10 are known in optical technology, e.g. B. 3dB divider or WDM (wavelength division multiplex) filter, and are therefore not explained in more detail at this point.
  • An anti-reflective coating 48 (shown in dashed lines) is optionally applied to the side surfaces 5, 6, 17, 22 of the prism cube.
  • the beam axis 19 of the emitted radiation 7 and the beam axis 20 of the received radiation 13 are perpendicular to one another in this exemplary embodiment.
  • the emitted radiation 7 and the received radiation 13 advantageously have different wavelengths ⁇ .
  • the optical device 9 is, for example, as indicated in Fi gur ⁇ 1, an optical waveguide, a lens arrangement or a further optoelectronic module, etc ..
  • the carrier part 1, including the radiation focusing means 8, is made of a material which is also transparent to both the emitted radiation 7 and the received radiation 13.
  • Glass, plastic, sapphire, diamond or a semiconductor material that is transparent to the emitted radiation 7 and to the received radiation 13 is, for example, suitable for this.
  • SiC can be used for wavelengths ⁇ > 400 nm, GaP for ⁇ > 550 nm, GaAs for ⁇ > 900 nm and silicon for ⁇ > 1100 nm.
  • the radiation focusing means 8 can, for example, be a converging lens with a spherical or aspherical surface, which is produced by means of etching or grinding.
  • a diffractive optical element, a holographic optical element or a Fresnel lens, which is produced by means of etching, grinding or milling, can likewise be used as the radiation focusing means 8.
  • the recess 31 is produced, for example, by means of etching or milling.
  • the recess 31 can alternatively also be realized by means of two separately produced molded parts which are fastened on the carrier part 1 at a distance from one another.
  • the radiation focusing means 8 as an alternative to that described above, can also be produced separately and attached to the carrier part 1, e.g. B. be fixed by means of a radiation-permeable solder or adhesive. If the carrier part 1 consists, for example, of silicon and the radiation focusing means 8 of glass, these two components can also be connected to one another by means of anodic bonding.
  • the active components of the optoelectronic module ie the transmitter component 2, the receiver component 3, and the monitor diode 21 from environmental influences
  • an encapsulation 35 consisting essentially of plastic or another encapsulation material, for example an epoxy resin or another suitable plastic , be shed.
  • the optoelectronic module according to the invention can have a hermetically sealed metal housing with an optical window.
  • the exemplary embodiment of the optoelectronic module according to the invention shown in FIG. 2 differs from the exemplary embodiment according to FIG. 1 in particular in that the radiation focusing means 8 is arranged on the side of the prismatic throw 14 opposite the transmission component 2 and in that the beam splitter layer 10 is designed such that it emitted radiation 7 for the most part and that it largely reflects the received radiation 13.
  • the beam axis 19 of the emitted radiation 7 and the beam axis 20 of the received radiation 13 run parallel to one another, in particular lie on one another.
  • the beam axis 43 of the part of the received radiation 13 reflected on the beam splitter layer 10 is perpendicular to the beam axis 19 of the received radiation 13.
  • the transmission component 2, the prism cube 14 and the radiation focusing means 8 are attached, for example by means of gluing or soldering, to a common carrier element 36, for example consisting essentially of silicon.
  • the carrier element 36 has a step 40 which separates a first mounting surface 37 and a second mounting surface 38 lying parallel to this.
  • the prism cube 14 is fastened on the first mounting surface 37 adjacent to a heel surface 41 of the step 40 that is perpendicular to the mounting surfaces 37, 38.
  • the connecting means 29 used for this does not have to be transparent to radiation.
  • the radiation focusing means 8 is fixed in such a way that its radiation entry and exit surface 18 is parallel to the third side surface 17 of the prism cube 14 and faces it.
  • the radiation focus zwi ⁇ chen i ⁇ t ⁇ sierstoff 8 and the prism cube 14 a gap exists, the, for example with a transparent coupling medium 26th B. synthetic resin is filled.
  • the radiation focusing means 8 can of course also have physical contact with the prism cube 14, in particular in direct contact with it.
  • the transmitter component 2 is fastened on the second mounting surface 38 in such a way that its beam exit surface 11 faces the prism cube 14 and rests directly on its first side surface 5. Between the transmitter component 2 and the prism cube 14, as in the exemplary embodiment of FIG. 1, there can of course be a gap which is used to reduce reflection with a transparent coupling medium 24, for. B. synthetic resin is filled, or there is physical contact.
  • Metallization layers 42 are applied to the second mounting surface 38. These are connected to electrical contacts of the transmission component 2 in an electrically conductive manner.
  • the transmission component 2 and the metallization layers 42 are designed such that electrical contacts of the transmission component 2 and the metallization layers 42 lie one on top of the other and are connected to one another, for example, by means of a metallic solder or by means of an electrically conductive adhesive.
  • the metallization layers 42 simultaneously serve as external electrical connections for the transmission component 2, which are connected, for example, to a leadframe by means of bonding wires.
  • electrical contacts of the transmission component 2 can of course also be connected to the metallization layers 42 by means of bonding wires or directly to a leadframe. The same applies to the execution Example of FIG. 1. Corresponding metallization layers 42 can also be provided there on the carrier part 1.
  • a blocking filter 27 is arranged between the receiving component 3 arranged on the prism cube 14 and the prism cube 14, said blocking filter being largely opaque to the wavelength of the emitted radiation 7. This enables the crosstalk attenuation of the optoelectronic module to be reduced.
  • Crosstalk means a direct transmission of the signals emitted by the transmission component 2 to the reception component 3.
  • the blocking filter 27 can optionally be applied to the reception component radiation entry surface 12 or to the second side surface 6 of the prism cube 14.
  • a converging lens must be arranged between the receiving component radiation entry surface 12 and the prism cube 14.
  • a laser diode is used as the transmission component 2, this can be with the active side up (up-side up) or with the active zone down (up-side down), i. H. towards the support element 36, mounted ⁇ ein.
  • the thickness of the laser diode substrate must be very precisely adapted to the position of the beam splitter layer 10. This is associated with a high assembly and adjustment effort.
  • the thickness of the epitaxial layer of the laser diode and the thickness of any electrical connection metallization layers 42 that may be present on the carrier element 36 are considered. Manufacturing tolerances can be kept very easily in the micrometer range and below. The adjustment is thereby significantly simplified. Analogously, of course, the same also applies to the exemplary embodiment of FIG. 1 described above.
  • a monitor diode 2l_ is provided. As in the exemplary embodiment of FIG. 3, this can be seen from the prism cube 14 behind the Transmitting component 2 can be arranged on the second mounting surface 38. Part of the radiation generated in the transmission component 2 must then of course be coupled out to the rear, which is associated with a deterioration in the laser parameters when using a laser diode as the transmission component 2, since the rear resonator mirror must also be partially transparent.
  • the embodiment of FIG. 1 does not have this disadvantage; here the rear mirror of a laser diode used as a transmission component 2 can be designed for high reflection.
  • FIG. 3 which differs from the embodiment of FIG. 1 in particular in that the monitor diode 21 is located behind the transmitter component 2 as seen from the prism cube 14, the carrier part 1 with the individual parts fastened thereon is connected by means of a connecting means 47 (eg solder or adhesive) attached to a carrier plate 34 such that the second main surface 32 of the carrier part 1 faces the carrier plate 34.
  • a connecting means 47 eg solder or adhesive
  • the carrier plate 34 is, for example, a mounting plate of a Cu lead frame and has a bore 62, above or in which the radiation focusing means 8 is arranged.
  • an optical waveguide connecting device 41 Arranged on the side of the carrier plate 34 opposite the carrier part 1 is an optical waveguide connecting device 41 with an optical waveguide as an optical device 9, which is fastened to the carrier plate 34, for example by means of welding, soldering or adhesive bonding.
  • the optical waveguide is so arranged above the bore 62 that the emitted
  • Radiation 7 is focused by the radiation focusing means 8 essentially onto the end face of the optical waveguide.
  • the optoelectronic module To the active components of the optoelectronic module, i.e. To protect the transmit component 2, the receive component 3, and the monitor diode 21 from environmental influences is the die ⁇ e all three components and the prism cube is 14 alswei ⁇ sending functional unit having a Vergußumhüllung 35 beispiel ⁇ wei ⁇ e au ⁇ we ⁇ entlichen in epoxy resin or other suitable Kun ⁇ tstoff shed.
  • Such an optoelectronic module represents a very simple embodiment of a bidirectional transmission and reception module for optical message transmission by means of a single optical waveguide.
  • an hermetically sealed metal housing with an optical window can be used as an alternative to the encapsulation casing 35 .
  • the housing consisting of the encapsulation 35 and the carrier plate 34 can advantageously be designed in a simple manner as an SMD component by means of suitable shaping of electrical connecting pins, which are also partially enclosed by the encapsulation 35. This enables a very simple standard surface mounting of the optoelectronic module according to the invention on a circuit board. If necessary, additional electronic components can be contained in the housing, such as, for. B. a preamplifier for the photodiode, laser driver, etc.
  • the respective functional unit can be attached to a carrier plate and provided with a potting sheath 35.
  • a number of rectangular grooves 54 running parallel to one another at a distance from one another are produced on a first main surface 30.
  • the section of disk 50 shown in FIG. 4 has four functional units, the two front sections being shown in section.
  • a number of Strahlung ⁇ foku ⁇ sierstoffn 8 is formed at one of the first major surface 51 opposite Erasmusen second major surface 61 of the disc 50 at one of the first major surface 51 opposite Erasmusen second major surface 61 of the disc 50 in accordance with a pre- ⁇ passed grid. In this case, these are e.g. B. spherical or aspherical lenses produced by etching or grinding.
  • the radiation focusing means 8 are arranged in rows which run parallel to the grooves 54 and lie perpendicularly opposite them.
  • the pane 50 consists of a material which is transparent to the emitted radiation 7 and the received radiation 13. Compare the description of FIG. 1.
  • a prism bar 52 with a square cross section is fastened in each groove 54 adjacent to a first groove side surface 55.
  • the first groove side surface 55 can serve as a reference surface for a first side surface 5 of the prism bar 52.
  • Each prism bar 52 has a beam splitter layer 10 which lies on a diagonal cut surface of the prism bar 52 which is parallel to its longitudinal center axis. The angle ⁇ between the beam splitter layer 10 and the first main surface 51 of the pane 50 is thus 45 °.
  • anodic bonding 29 can be used to fix the prism bar 52 on the pane 50 instead of the above-mentioned connection.
  • the surfaces to be connected are placed on top of one another, for example heated to approximately 450 ° C., and a voltage of approximately -1000 V is applied between glass and silicon.
  • the pane 50 also consists of glass or some other material and has an ⁇ -silicon layer at the connection point to the prism bar 52. It is only necessary for one glass and one ⁇ -silicon layer to lie on top of one another.
  • first major surface 51 of disk 50 is adjacent to the first side surface 5, a plurality of Sendebauele ⁇ elements 2 mounted such that electrical contacts of the Sen ⁇ debauium 2 layers on the provided on the first major surface 51 of the disc 50 applied Metalli ⁇ réelles- 42 come to rest and are connected to them in an electrically conductive manner.
  • the side surface 5 can serve as an adjustment reference surface for the transmission components 2.
  • the transmission components 2 are arranged such that each has a radiation focusing means 8 assigned to it.
  • the transmitter components 2 are installed between the metallization layers 42 a separation groove is formed, for example etched.
  • a plurality of receiving components 3 with electrical contacts 56 are each attached to the second side surfaces 6 of the prism bar 52. These are also arranged such that each has a radiation focusing means 8.
  • a plurality of monitor diodes 21 with electrical contacts 56 are fastened adjacent to a fourth side surface 22 opposite the first side surface 5.
  • laser diodes When using laser diodes as the transmission components 2, these can be connected in series on the first main surface 51 of the disk 50 by means of metallization tracks 57 (shown in broken lines in FIG. 4), so that only the two outer ones are used for the so-called burn-in of the laser diodes. at the two ends of individual laser diode lines 58 arranged ⁇ contact surfaces 42 must be contacted. The burn-in for the same laser diode row 58 assigned Can laser diodes thus be made equal ⁇ time a particularly simple manner.
  • the individual transmission components 2 and reception components 3 can also be measured for their electro-optical parameters by contacting the associated metallization layers 42, 56 and connecting them to a suitable wafer prober in the wafer assembly, that is to say in use. The same naturally also applies to the monitor diodes 21.
  • the disk 50 and the prism bars 52 are then along first dividing lines 59, which run perpendicular to the grooves 54 between the individual transmission components 2, and the disk 50 along second dividing lines 60, each running between two grooves 54 , severed.
  • the individual devices each manufactured in this way, have a transmitting component 2, a receiving component 3, a monitor diode 21, a prism block 14 and a radiation focusing means 8 with a carrier part 1, and are subsequently further processed, depending on the intended area of use.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Communication System (AREA)

Abstract

L'invention concerne un module optoélectronique pour transfert de données bidirectionnel par voie optique, comportant un corps moulé (14) servant de séparateur de faisceaux (4), constitué essentiellement d'un matériau perméable au faisceau émis (7) et au faisceau reçu (13), et dans lequel est incorporée une couche séparatrice de faisceaux (10). Un composant d'émission (2), un composant de réception (3) et un élément de focalisation de faisceau (8) sont de façon avantageuse raccordés directement au corps moulé (14).
EP97912032A 1996-09-30 1997-09-26 Module optoelectronique pour transfert de donnees bidirectionnel par voie optique Withdrawn EP0931357A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19640421A DE19640421A1 (de) 1996-09-30 1996-09-30 Optoelektronisches Modul zur bidirektionalen optischen Datenübertragung
DE19640421 1996-09-30
PCT/DE1997/002224 WO1998015017A1 (fr) 1996-09-30 1997-09-26 Module optoelectronique pour transfert de donnees bidirectionnel par voie optique

Publications (1)

Publication Number Publication Date
EP0931357A1 true EP0931357A1 (fr) 1999-07-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP97912032A Withdrawn EP0931357A1 (fr) 1996-09-30 1997-09-26 Module optoelectronique pour transfert de donnees bidirectionnel par voie optique

Country Status (7)

Country Link
US (1) USRE38280E1 (fr)
EP (1) EP0931357A1 (fr)
JP (1) JP2001501378A (fr)
CN (1) CN1238858A (fr)
DE (1) DE19640421A1 (fr)
TW (1) TW357493B (fr)
WO (2) WO1998015017A1 (fr)

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TW357493B (en) 1999-05-01
WO1998015017A1 (fr) 1998-04-09
WO1998015015A1 (fr) 1998-04-09
USRE38280E1 (en) 2003-10-21
CN1238858A (zh) 1999-12-15
JP2001501378A (ja) 2001-01-30
DE19640421A1 (de) 1998-04-23

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