EP0923122A3 - A method of manufacturing an integrated circuit using chemical mechanical polishing and a chemical mechanical polishing system - Google Patents

A method of manufacturing an integrated circuit using chemical mechanical polishing and a chemical mechanical polishing system Download PDF

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Publication number
EP0923122A3
EP0923122A3 EP98309597A EP98309597A EP0923122A3 EP 0923122 A3 EP0923122 A3 EP 0923122A3 EP 98309597 A EP98309597 A EP 98309597A EP 98309597 A EP98309597 A EP 98309597A EP 0923122 A3 EP0923122 A3 EP 0923122A3
Authority
EP
European Patent Office
Prior art keywords
mechanical polishing
chemical mechanical
substrate
manufacturing
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98309597A
Other languages
German (de)
French (fr)
Other versions
EP0923122B1 (en
EP0923122A2 (en
Inventor
Annette Margaret Crevasse
William Graham Easter
John Albert Maze (Iii)
John Thomas Sowell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/982,109 external-priority patent/US5967885A/en
Priority claimed from US08/980,943 external-priority patent/US5951382A/en
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of EP0923122A2 publication Critical patent/EP0923122A2/en
Publication of EP0923122A3 publication Critical patent/EP0923122A3/en
Application granted granted Critical
Publication of EP0923122B1 publication Critical patent/EP0923122B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A method of manufacturing integrated circuits using a carrier fixture. The carrier fixture does not include transport channels or openings for directing a slurry to a substrate being polished and, as a result, damage to the substrate is reduced because the edges adjacent to the substrate are eliminated. The present invention further provides a carrier fixture having an inner support (e.g., 130) coupled to a ring member (e.g., 120) that contacts a substrate (e.g., 200) during the CMP process. The present invention also provides a carrier fixture having inner (e.g., 130) and outer supports (e.g., 125) coupled to a ring member (e.g., 120).
EP98309597A 1997-12-01 1998-11-24 Method of manufacturing an integrated circuit using chemical mechanical polishing and fixture for chemical mechanical polishing Expired - Lifetime EP0923122B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US980943 1992-11-24
US08/982,109 US5967885A (en) 1997-12-01 1997-12-01 Method of manufacturing an integrated circuit using chemical mechanical polishing
US982109 1997-12-01
US08/980,943 US5951382A (en) 1997-12-01 1997-12-01 Chemical mechanical polishing carrier fixture and system

Publications (3)

Publication Number Publication Date
EP0923122A2 EP0923122A2 (en) 1999-06-16
EP0923122A3 true EP0923122A3 (en) 1999-12-29
EP0923122B1 EP0923122B1 (en) 2011-09-07

Family

ID=27130610

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98309597A Expired - Lifetime EP0923122B1 (en) 1997-12-01 1998-11-24 Method of manufacturing an integrated circuit using chemical mechanical polishing and fixture for chemical mechanical polishing

Country Status (3)

Country Link
EP (1) EP0923122B1 (en)
JP (1) JPH11239965A (en)
KR (1) KR100495717B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
DE60138343D1 (en) * 2000-07-31 2009-05-28 Ebara Corp Substrate holder and polishing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283859A (en) * 1987-05-13 1988-11-21 Hitachi Ltd Wafer polishing jig
GB2312181A (en) * 1996-04-19 1997-10-22 Speedfam Corp Retainer apparatus for use in polishing a workpiece

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283859A (en) * 1987-05-13 1988-11-21 Hitachi Ltd Wafer polishing jig
GB2312181A (en) * 1996-04-19 1997-10-22 Speedfam Corp Retainer apparatus for use in polishing a workpiece

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 090 (M - 803) 2 March 1989 (1989-03-02) *

Also Published As

Publication number Publication date
JPH11239965A (en) 1999-09-07
EP0923122B1 (en) 2011-09-07
EP0923122A2 (en) 1999-06-16
KR100495717B1 (en) 2005-09-30
KR19990062593A (en) 1999-07-26

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