EP0916463A1 - Method for recycling an abrasive suspension - Google Patents
Method for recycling an abrasive suspension Download PDFInfo
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- EP0916463A1 EP0916463A1 EP98118106A EP98118106A EP0916463A1 EP 0916463 A1 EP0916463 A1 EP 0916463A1 EP 98118106 A EP98118106 A EP 98118106A EP 98118106 A EP98118106 A EP 98118106A EP 0916463 A1 EP0916463 A1 EP 0916463A1
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- Prior art keywords
- cutting
- silicon
- abrasion
- quartz
- grain
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Classifications
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M175/00—Working-up used lubricants to recover useful products ; Cleaning
- C10M175/04—Working-up used lubricants to recover useful products ; Cleaning aqueous emulsion based
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/025—Use, recovery or regeneration of abrasive mediums
Definitions
- the invention relates to a method for reprocessing a used in mechanical processing of silicon, Quartz or ceramic abrasive suspension used from a cutting fluid in which a cutting grain and abrasion from the processed material is dispersed.
- a batch of such a suspension is in a storage tank (for one or more wire saws), from which during the sawing process a defined amount of suspension per Time unit is removed and sprayed onto the wire frame.
- a storage tank for one or more wire saws
- Below the wire gate is a kind of collecting basin, in which the suspension, the resulting from the process Abrasion contains, collected and from there continuously in the Storage tank is returned. Enriched by this return the process-related abrasion in the storage tank until the grinding suspension due to insufficient cutting performance can no longer be used.
- the cutting grain contained in the grinding suspension becomes quartz using machining tools, for example Band or wire saws or lapping disks, transported to the site and pressed, where it unfolds its cutting effect should.
- machining tools for example Band or wire saws or lapping disks
- the task is solved by a process for reprocessing a used, in the mechanical processing grinding suspension of silicon, quartz or ceramic, consisting of a cutting fluid in which a Cutting grain and abrasion are dispersed, which is characterized is that in a first step Grinding suspension gently into a drying step Solid and a liquid component is separated and in one second step the solid component by known Classification process separated into cutting grain and abrasion becomes.
- drying step in the method according to the invention are, for example Belt drying processes, spray drying processes, or vacuum drying process.
- Vacuum drying processes are preferred, in particular here vacuum thin film evaporation.
- Dry classification methods are preferably used as the classification method such as screening or visual processes used.
- a vision method e.g. Air sighting by means of Air classifier or air cyclone used.
- the service life during which the grinding suspension is still useful for mechanical processing of silicon, quartz or the use of ceramics depends on the extent to which Abrasion gets into the grinding suspension.
- the abrasion comes from it for the most part from silicon, quartz or from Ceramics, but also from abrasive grain and wire.
- the cutting fluid used will also damp out the air absorbs.
- Store with increasing service life more and more particles from the abrasion adhere to the cutting grain and form agglomerates with it. Because these agglomerates in contrast to the free cutting grain no longer as material-removing Component of the grinding suspension, it makes sense to exchange used grinding suspension as soon as one certain amount of abrasion gets into the grinding suspension is.
- the method according to the invention succeeds in cutting grain from a grinding suspension used to process silicon Quartz or ceramic can no longer be used to advantage can largely recover.
- the abrasive is preferably at temperatures of 120-150 ° C heated at about 10 mbar absolute pressure.
- the aim of this first step is to fix and separate the liquid part of the grinding suspension.
- the liquid portion can directly with careful process control used again to prepare a new grinding suspension become.
- the fixed portion is divided into different using a classification process Grain sizes separated, the grain size that the Corresponds to the grain size of the cutting grain originally used, directly or slightly mixed with new SiC again for mechanical processing of silicon, quartz or ceramic (e.g. a wire sawing process) can.
- the SiC obtained by means of the classification process Fraction in fresh or from the drying step Cutting liquid redispersed with vigorous stirring.
- the fine part separated during classification consisting of the Abrasion, for example, can be used for metallurgical purposes become. This usually falls with the invention Process no hazardous waste.
- the method according to the invention can be applied to all known Grinding suspensions for the mechanical processing of silicon Use quartz or ceramic in which the cutting grain is in one Cutting fluid is dispersed.
- Liquids are preferably used as cutting fluids Question that arises under the above Distill conditions without decomposing to let.
- Hard material particles are preferably used as the cutting grain made of aluminum oxide, silicon or boron carbide, their average grain diameter preferably. in the area from 5 to 30 ⁇ m.
- the described process for the recovery of cutting grain is feasible with particularly good results if the weight ratio from cutting fluid to cutting grain in the unused Abrasives 2: 1 to 1: 2, preferably 1: 1 to Is 1: 1.5.
- An abrasive suspension was first prepared by adding 20 kg Silicon carbide grains with an average grain diameter of 14 ⁇ m in 20 kg of a polyvalent used as cutting fluid Alcohol were dispersed.
- the used grinding suspension was then separated into a solid and a liquid phase using a vacuum thin-film evaporator with a heating surface of 0.5 m 2 at a rotor speed of 800 rpm, a temperature of 225 ° C. and a pressure of approx. 25 mbar.
- the degree of drying of the powdery solid was 99.5 %.
- the solid was classified in an air classifier at a rotor speed of 4500 rpm, the yield of regenerated The target product was 65%.
- the silicon carbide abrasive grain recovered in this way was removed in approx. 15 kg of fresh cutting fluid dispersed with stirring and then for lapping additional silicon wafers used.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mining & Mineral Resources (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zur Wiederaufarbeitung einer gebrauchten, bei der mechanischen Bearbeitung von Silicium, Quarz oder Keramik verwendeten Schleifsuspension, bestehend aus einer Schneidflüssigkeit, in der ein Schneidkorn und Abrieb dispergiert sind, welches dadurch gekennzeichnet ist, daß in einem ersten Verfahrensschritt die Schleifsuspension über einen Trocknungsschritt schonend in eine Fest- und eine Flüssigkomponente getrennt wird und in einem zweiten Verfahrensschritt die Festkomponente durch an sich bekannte Klassierverfahren in Schneidkorn und Abrieb getrennt wird.The invention relates to a process for reprocessing a used grinding suspension used in the mechanical processing of silicon, quartz or ceramic, consisting of a cutting fluid in which a cutting grain and abrasion are dispersed, which is characterized in that the grinding suspension is applied in a first process step a drying step is gently separated into a solid and a liquid component and in a second process step the solid component is separated into cutting grain and abrasion by means of known classification methods.
Description
Die Erfindung betrifft ein Verfahren zum Wiederaufarbeiten einer gebrauchten, bei der mechanischen Bearbeitung von Silicium, Quarz oder Keramik verwendeten Schleifsuspension, bestehend aus einer Schneidflüssigkeit, in der ein Schneidkorn und vom bearbeiteten Material stammender Abrieb dispergiert sind.The invention relates to a method for reprocessing a used in mechanical processing of silicon, Quartz or ceramic abrasive suspension used from a cutting fluid in which a cutting grain and abrasion from the processed material is dispersed.
Für das Herstellen von dünnen Scheiben aus Silicium (Elektronik- und Solaranwendung) und Quarz aus Einkristallstäben oder Gießblöcken hat sich das Trennläppen ("Präzisionsdrahtsägen") bestens bewährt. Dabei wird ein viele Kilometer langer Draht über ein Spulensystem so geführt, daß ein Drahtgatter mit bis zu ca. 450 nebeneinanderliegenden Drähten entsteht. Damit lassen sich in einem Arbeitsgang aus einem entsprechend langen Block oder Stab bis zu 450 dünne Scheiben gleichzeitig herstellen. Als Schleifsuspension werden Schneidkörnungen, bevorzugt SiC grün oder dunkel in unterschiedlichen Korngrößen verwendet, die in einer Schneidflüssigkeit suspendiert werden.For the production of thin slices from silicon (electronics and solar application) and quartz from single crystal rods or Casting blocks has become lapping ("precision wire sawing") well proven. In doing so, there is a many kilometers long wire over a coil system so that a wire frame with up to about 450 wires lying next to each other. Leave with it yourself from a correspondingly long one step Make block or rod up to 450 thin slices at the same time. Cutting grains are preferred as the grinding suspension SiC green or dark used in different grain sizes, which are suspended in a cutting fluid.
Ein Ansatz einer derartigen Suspension wird in einem Vorratstank (für eine oder mehrere Drahtsägen) gepuffert, aus dem während des Sägeprozesses eine definierte Menge Suspension pro Zeiteinheit entnommen und auf das Drahtgatter gesprüht wird. Unterhalb des Drahtgatters befindet sich eine Art Sammelbecken, in dem die Suspension, die den beim Prozeß anfallenden Abrieb enthält, gesammelt und von da aus kontinuierlich in den Vorratstank zurückgeführt wird. Durch diese Rückführung reichert sich im Vorratstank der prozeßbedingte Abrieb solange an, bis die Schleifsuspension durch unzureichende Schneidleistung nicht mehr verwendet werden kann.A batch of such a suspension is in a storage tank (for one or more wire saws), from which during the sawing process a defined amount of suspension per Time unit is removed and sprayed onto the wire frame. Below the wire gate is a kind of collecting basin, in which the suspension, the resulting from the process Abrasion contains, collected and from there continuously in the Storage tank is returned. Enriched by this return the process-related abrasion in the storage tank until the grinding suspension due to insufficient cutting performance can no longer be used.
Während der mechanischen Bearbeitung des Siliciums oder des Quarzes wird das in der Schleifsuspension enthaltene Schneidkorn mit Hilfe von Bearbeitungswerkzeugen, beispielsweise Band- oder Drahtsägen oder Läppscheiben, an den Ort transportiert und gedrückt, an dem es seine zerspanende Wirkung entfalten soll. During the machining of silicon or The cutting grain contained in the grinding suspension becomes quartz using machining tools, for example Band or wire saws or lapping disks, transported to the site and pressed, where it unfolds its cutting effect should.
Mit zunehmender Gebrauchsdauer nimmt die Wirksamkeit der Schleifsuspension ab, so daß sie schließlich ausgetauscht werden muß, weil das gestellte Bearbeitungsziel mit der gebrauchten Schleifsuspension nicht mehr zu erreichen ist.With increasing service life, the effectiveness of the Abrasive suspension, so that they are eventually replaced must, because the set processing goal with the used Grinding suspension can no longer be reached.
In der Praxis sind verschiedene Möglichkeiten bekannt, die Einsatzdauer (= Anzahl der möglichen Schnitte) zu verlängern, z.B. Ersatz einer Teilmenge der gebrauchten Schleifsuspension durch frische Schleifsuspension nach jedem Schnitt, oder Entfernen eines Teils des Abriebes durch Dekantieren.In practice, various options are known that Extend the duration of use (= number of possible cuts), e.g. Replacement of a subset of the used grinding suspension with fresh grinding suspension after each cut or removal part of the abrasion by decanting.
Allen Verfahren ist gemeinsam, daß die gebrauchte Schleifsuspension nach einer mehr oder weniger großen Zahl von Schnitten entsorgt werden muß, was normalerweise über Lagerung als Sondermüll oder Verbrennung mit anschließender Lagerung als Sondermüll (je nach Trägerflüssigkeit) erfolgt.All processes have in common that the used grinding suspension after a more or less large number of cuts must be disposed of, which is normally about storage as hazardous waste or incineration with subsequent storage as special waste (depending on the carrier liquid).
Da die Kosten für das Schneidkorn einen großen Teil der Gesamtkosten der mechanischen Bearbeitung von Silicium, Quarz oder Keramik bilden, ist die verbreitete Praxis, gebrauchte Schleifsuspension als Abfall zu entsorgen, sobald ihre Wirksamkeit unter eine bestimmte Zielvorgabe abgesunken ist, unwirtschaftlich.Because the cost of the cutting grain a large part of the total cost mechanical processing of silicon, quartz or forming ceramics is common practice, used Dispose of grinding suspension as waste as soon as it becomes effective has dropped below a certain target, uneconomical.
Aus den Patent Abstracts of Japan zu JP 1-316170 ist bekannt, gebrauchte Schleifsuspension zu zentrifugieren und die wiedergewonnenen Schleifkörner in frischer Schneidflüssigkeit zu redispergieren. Nachteiligerweise bleibt ein hoher Anteil an Abrieb sowie gebrauchte Schneidflüssigkeit in den wiedergewonnenen Schleifkörnern. Die abgetrennte gebrauchte Schneidflüssigkeit muß zudem wie gehabt entsorgt werden.From the Patent Abstracts of Japan for JP 1-316170 it is known to centrifuge used grinding suspension and the recovered Redisperse abrasive grains in fresh cutting fluid. Unfortunately, a high proportion of abrasion remains as well as used cutting fluid in the recovered Abrasive grains. The separated used cutting fluid must also be disposed of as usual.
Es bestand daher die Aufgabe, ein möglichst einfaches Verfahren zur Verfügung zu stellen, das einen verlängerten Einsatz des Schneidkorns zur mechanischen Bearbeitung von Silicium oder Quarz ermöglicht und die Nachteile des Standes der Technik vermeidet. The task was therefore to find a process that was as simple as possible to provide an extended use of the cutting grain for mechanical processing of silicon or quartz and the disadvantages of the prior art avoids.
Gelöst wird die Aufgabe durch ein Verfahren zur Wiederaufarbeitung einer gebrauchten, bei der mechanischen Bearbeitung von Silicium, Quarz oder Keramik verwendeten Schleifsuspension, bestehend aus einer Schneidflüssigkeit, in der ein Schneidkorn und Abrieb dispergiert sind, welches dadurch gekennzeichnet ist, daß in einem ersten Verfahrensschritt die Schleifsuspension über einen Trocknungsschritt schonend in eine Fest- und eine Flüssigkomponente getrennt wird und in einem zweiten Verfahrensschritt die Festkomponente durch an sich bekannte Klassierverfahren in Schneidkorn und Abrieb getrennt wird.The task is solved by a process for reprocessing a used, in the mechanical processing grinding suspension of silicon, quartz or ceramic, consisting of a cutting fluid in which a Cutting grain and abrasion are dispersed, which is characterized is that in a first step Grinding suspension gently into a drying step Solid and a liquid component is separated and in one second step the solid component by known Classification process separated into cutting grain and abrasion becomes.
Vorteilhafterweise lassen sich in der Regel alle Bestandteile der gebrauchten Schleifsuspension, die durch das erfindungsgemäße Verfahren getrennt erhalten werden, wiederverwenden, so daß kein zu entsorgender Sondermüll mehr anfällt.As a rule, all components can advantageously be used the used grinding suspension by the inventive Procedures obtained separately, reuse, so that there is no more hazardous waste to be disposed of.
Als Trocknungsschritt im erfindungsgemäßen Verfahren sind beispielsweise Bandtrocknungsverfahren, Sprühtrocknungsverfahren, oder Vakuumtrocknungsverfahren geeignet.As a drying step in the method according to the invention are, for example Belt drying processes, spray drying processes, or vacuum drying process.
Vorzugsweise sind Vakuumtrocknungsverfahren, hier insbesondere die Vakuumdünnschichtverdampfung, geeignet.Vacuum drying processes are preferred, in particular here vacuum thin film evaporation.
Als Klassierverfahren werden vorzugsweise trockene Klassierverfahren wie beispielsweise Siebverfahren oder Sichtverfahren eingesetzt.Dry classification methods are preferably used as the classification method such as screening or visual processes used.
Vorzugsweise wird ein Sichtverfahren, z.B. Windsichten mittels Windsichter oder Luftzyklon, eingesetzt.Preferably a vision method, e.g. Air sighting by means of Air classifier or air cyclone used.
Die Gebrauchsdauer, während der die Schleifsuspension noch nutzbringend zur mechanischen Bearbeitung von Silicium, Quarz oder Keramik einzusetzen ist, hängt davon ab, in welchem Maß Abrieb in die Schleifsuspension gelangt. Der Abrieb stammt dabei zum überwiegenden Teil vom Silicium, Quarz oder von der Keramik, aber auch vom Schleifkorn und vom Draht. Je nach verwendeter Schneidflüssigkeit wird außerdem Feuchtigkeit aus der Luft absorbiert. Mit zunehmender Gebrauchsdauer lagern sich immer mehr Teilchen aus dem Abrieb an das Schneidkorn an und bilden mit diesem Agglomerate. Da sich diese Agglomerate im Gegensatz zum freien Schneidkorn nicht mehr als materialabtragende Komponente der Schleifsuspension eignen, ist es sinnvoll, gebrauchte Schleifsuspension auszutauschen, sobald eine bestimmte Menge an Abrieb in die Schleifsuspension gelangt ist.The service life during which the grinding suspension is still useful for mechanical processing of silicon, quartz or the use of ceramics depends on the extent to which Abrasion gets into the grinding suspension. The abrasion comes from it for the most part from silicon, quartz or from Ceramics, but also from abrasive grain and wire. Depending on The cutting fluid used will also damp out the air absorbs. Store with increasing service life more and more particles from the abrasion adhere to the cutting grain and form agglomerates with it. Because these agglomerates in contrast to the free cutting grain no longer as material-removing Component of the grinding suspension, it makes sense to exchange used grinding suspension as soon as one certain amount of abrasion gets into the grinding suspension is.
Durch das erfindungsgemäße Verfahren gelingt es, Schneidkorn aus einer Schleifsuspension, die zur Bearbeitung von Silicium Quarz oder Keramik nicht mehr nutzbringend verwendet werden kann, größtenteils zurückzugewinnen.The method according to the invention succeeds in cutting grain from a grinding suspension used to process silicon Quartz or ceramic can no longer be used to advantage can largely recover.
Zur Wiederaufbereitung der gebrauchten Schleifsuspension, welche im Gegensatz zu ungebrauchter Schleifsuspension eine bestimmte Menge an Abrieb enthält, wird diese zunächst vorzugsweise mittels Vakuumdünnschichtverdampfung auf Temperaturen vorzugsweise oberhalb der Siedetemperatur der verwendeten Schneidflüssigkeit bei dem jeweils gewählten Druck (vorzugweise Unterdruck) erhitzt und die verdampfte Schneidflüssigkeit anschließend kondensiert.For reprocessing the used grinding suspension, which in contrast to unused grinding suspension a certain one Contains amount of abrasion, this is preferred first by means of vacuum thin film evaporation to temperatures preferably above the boiling point of the used Cutting fluid at the selected pressure (preferably Vacuum) and the evaporated cutting fluid then condensed.
Das Schleifmittel wird vorzugsweise auf Temperaturen von 120-150°C bei ca. 10 mbar Absolutdruck erhitzt.The abrasive is preferably at temperatures of 120-150 ° C heated at about 10 mbar absolute pressure.
Ziel dieses ersten Verfahrensschrittes ist es, festen und flüssigen Anteil der Schleifsuspension zu trennen.The aim of this first step is to fix and separate the liquid part of the grinding suspension.
Der flüssige Anteil kann bei sorgfältiger Prozessführung direkt wieder zum Ansetzen einer neuen Schleifsuspension verwendet werden.The liquid portion can directly with careful process control used again to prepare a new grinding suspension become.
Der feste Anteil wird mittels eines Klassierverfahrens in verschiedene Korngrößen aufgetrennt, wobei die Korngröße, die der Korngröße des ursprünglich eingesetzten Schneidkorns entspricht, direkt oder ggf. geringfügig mit neuem SiC vermischt wieder für die mechanische Bearbeitung von Silicium, Quarz oder Keramik (z.B. einen Drahtsägeprozeß) eingesetzt werden kann.The fixed portion is divided into different using a classification process Grain sizes separated, the grain size that the Corresponds to the grain size of the cutting grain originally used, directly or slightly mixed with new SiC again for mechanical processing of silicon, quartz or ceramic (e.g. a wire sawing process) can.
Dazu wird die mittels des Klassierverfahrens erhaltene SiC Fraktion in frischer oder aus dem Trocknungsschritt stammender Schneidflüssigkeit unter starkem Rühren redispergiert.For this purpose, the SiC obtained by means of the classification process Fraction in fresh or from the drying step Cutting liquid redispersed with vigorous stirring.
Der beim Klassieren abgetrennte Feinteil, bestehend aus dem Abrieb, kann beispielsweise für metallurgische Zwecke verwendet werden. Damit fällt im Regelfall beim erfindungsgemäßen Verfahren keinerlei Sondermüll an.The fine part separated during classification, consisting of the Abrasion, for example, can be used for metallurgical purposes become. This usually falls with the invention Process no hazardous waste.
Das erfindungsgemäße Verfahren läßt sich auf alle bekannten Schleifsuspensionen zur mechanischen Bearbeitung von Silicium Quarz oder Keramik anwenden, in denen das Schneidkorn in einer Schneidflüssigkeit dispergiert vorliegt.The method according to the invention can be applied to all known Grinding suspensions for the mechanical processing of silicon Use quartz or ceramic in which the cutting grain is in one Cutting fluid is dispersed.
Als Schneidflüssigkeiten kommen vorzugsweise Flüssigkeiten in Frage, die sich unter o.g. Bedingungen unzersetzt destillieren lassen.Liquids are preferably used as cutting fluids Question that arises under the above Distill conditions without decomposing to let.
Als Schneidkorn werden vorzugsweise Hartstoff-Partikel, beispielsweise aus Aluminiumoxid, Silicium- oder Borcarbid verwendet, deren mittlere Korndurchmesser vorzugsweise. im Bereich von 5 bis 30 µm liegen.Hard material particles, for example, are preferably used as the cutting grain made of aluminum oxide, silicon or boron carbide, their average grain diameter preferably. in the area from 5 to 30 µm.
Das beschriebene Verfahren zur Rückgewinnung von Schneidkorn ist mit besonders gutem Ergebnis durchführbar, wenn das Gewichtsverhältnis von Schneidflüssigkeit zu Schneidkorn im ungebrauchten Schleifmittel 2:1 bis 1:2, vorzugsweise 1:1 bis 1:1,5 beträgt.The described process for the recovery of cutting grain is feasible with particularly good results if the weight ratio from cutting fluid to cutting grain in the unused Abrasives 2: 1 to 1: 2, preferably 1: 1 to Is 1: 1.5.
Obwohl die Rückgewinnung von Schneidkorn aus einer gebrauchten Schleifsuspension am Beispiel von Schleifsuspensionen zur mechanischen Bearbeitung von Silicium oder Quarz beschrieben wurde, ist dieses Verfahren auch auf Schleifsuspensionen anwendbar, die zur mechanischen Bearbeitung von anderem sprödharten Material, beispielsweise Glas oder Keramik, verwendet werden.Although the recovery of cutting grain from a used Grinding suspension using the example of grinding suspensions for mechanical Processing of silicon or quartz described this procedure is also applicable to grinding suspensions applicable to the mechanical processing of other brittle hard Material, such as glass or ceramic, is used become.
Nachfolgend wird das erfindungsgemäße Verfahren an einem Beispiel dargestellt.The method according to the invention is illustrated below using an example shown.
Es wurde zunächst eine Schleifsuspension bereitet, indem 20 kg Siliciumcarbid-Körner mit einem mittleren Korndurchmesser von 14 µm in 20 kg eines als Schneidflüssigkeit verwendeten mehrwertigen Alkohols dispergiert wurden.An abrasive suspension was first prepared by adding 20 kg Silicon carbide grains with an average grain diameter of 14 µm in 20 kg of a polyvalent used as cutting fluid Alcohol were dispersed.
Unter Verwendung dieser Schleifsuspension konnten anschließend ca. 400 Scheiben mit einem Durchmesser von 200 mm von einem monokristallinen Siliciumkristall durch Trennläppen abgetrennt werden. Bis zu diesem Zeitpunkt hatte sich in der gebrauchten Schleifsuspension ein Siliciumabrieb von 1 kg (bezogen auf 10 kg abriebfreie Schleifsuspension) angereichert.Using this grinding suspension, we could then approx. 400 disks with a diameter of 200 mm from one monocrystalline silicon crystal separated by lapping become. By that time it had been used Grinding suspension a silicon abrasion of 1 kg (based on 10 kg of abrasion-free grinding suspension).
Die gebrauchte Schleifsuspension wurde daraufhin mit einem Vakuumdünnschichtverdampfer mit einer Heizfläche von 0,5 m2 bei einer Rotordrehzahl von 800 Upm, einer Temperatur von 225°C und einem Druck von ca. 25 mbar in Feststoff und flüssige Phase getrennt.The used grinding suspension was then separated into a solid and a liquid phase using a vacuum thin-film evaporator with a heating surface of 0.5 m 2 at a rotor speed of 800 rpm, a temperature of 225 ° C. and a pressure of approx. 25 mbar.
Der Trocknungsgrad des pulverförmigen Feststoffes betrug 99,5 %. Das Klassieren des Feststoffes erfolgte in einem Windsichter bei einer Rotordrehzahl von 4500 Upm, die Ausbeute an regeneriertem Zielprodukt lag bei 65 %.The degree of drying of the powdery solid was 99.5 %. The solid was classified in an air classifier at a rotor speed of 4500 rpm, the yield of regenerated The target product was 65%.
Das so wiedergewonnene Siliciumcarbid-Schleifkorn wurde in ca. 15 kg frischer Schneidflüssigkeit unter Rühren dispergiert und anschließend zum Trennläppen weiterer Siliciumscheiben verwendet. The silicon carbide abrasive grain recovered in this way was removed in approx. 15 kg of fresh cutting fluid dispersed with stirring and then for lapping additional silicon wafers used.
Mit gleichen Einstellparametern wie beim Einsatz ungebrauchten siliciumcarbides wurden ca. 320 Si-Scheiben mit identischen Ergebnissen in Bezug auf Produktivität und Qualität hergestellt.With the same setting parameters as when unused silicon carbides were about 320 Si wafers with identical Productivity and quality results manufactured.
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19743721 | 1997-10-02 | ||
| DE19743721A DE19743721A1 (en) | 1997-10-02 | 1997-10-02 | Spent grinding suspension, used for machining silicon, quartz or ceramic, is reprocessed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0916463A1 true EP0916463A1 (en) | 1999-05-19 |
Family
ID=7844492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98118106A Withdrawn EP0916463A1 (en) | 1997-10-02 | 1998-09-24 | Method for recycling an abrasive suspension |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6010010A (en) |
| EP (1) | EP0916463A1 (en) |
| JP (1) | JPH11172236A (en) |
| KR (1) | KR19990036687A (en) |
| DE (1) | DE19743721A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19960380A1 (en) * | 1999-12-14 | 2001-07-05 | Fraunhofer Ges Forschung | Process for fractionating a machining suspension |
| DE10338520A1 (en) * | 2003-08-21 | 2005-03-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for separating material splitting suspension of cooling lubricant, containing cutting grain and dispersed worked material abraded particles, with suspension treated with gas |
| US7591376B2 (en) | 2004-06-16 | 2009-09-22 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Methods for fractionating a machining suspension using destabilization and separation steps |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3426149B2 (en) * | 1998-12-25 | 2003-07-14 | 富士通株式会社 | Method and apparatus for recycling polishing waste liquid in semiconductor manufacturing |
| DE10353863B4 (en) | 2003-11-18 | 2022-10-06 | Cronimet Envirotec GmbH | Process for large-scale separation of industrial waste sludge |
| DE102008022237A1 (en) | 2008-05-06 | 2009-11-19 | Scholz Recycling Gmbh Nl Erfurt | Slurry preparation involves adding water into non-conducting slurry in container at room temperature for acquiring electrical conductivity, where cationic flocculating agent is also mixed together |
| CN101684028B (en) * | 2008-09-28 | 2012-07-18 | 张伟民 | Method and device for disposing cutting waste of silicon crystal board |
| US8277768B2 (en) * | 2008-11-14 | 2012-10-02 | Texas Instruments Incorporated | System and method for production of high purity silicon solids and solids therefrom |
| CN101565649B (en) * | 2009-05-18 | 2012-10-10 | 白瑜皎 | Method for reclaiming silicon chip cutting fluid |
| CN101805661B (en) * | 2010-03-29 | 2013-02-13 | 倪进国 | PEG recovery and regeneration method for slicer |
| CN102229792B (en) * | 2010-09-16 | 2013-10-09 | 蒙特集团（香港）有限公司 | Solar silicon wafer cutting mortar |
| CN102329687A (en) * | 2011-07-15 | 2012-01-25 | 山西天能科技股份有限公司 | Method for recycling single crystal silicon linear cutting waste mortar |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01316170A (en) * | 1988-06-13 | 1989-12-21 | Osaka Titanium Co Ltd | Cutting work method and abrasive liquid reutilizing device |
| EP0502461A1 (en) * | 1991-03-04 | 1992-09-09 | FORACON MASCHINEN- UND ANLAGEN GmbH | Method and apparatus for the recovery of abrasive material in a water-jet cutting operation |
| EP0742079A1 (en) * | 1995-04-03 | 1996-11-13 | ecotop Gesellschaft für innovative Abfallwirtschaft mbH | Method and apparatus for the treatment of residues containing abrasives for cutting |
| EP0767035A1 (en) * | 1995-10-04 | 1997-04-09 | Nippei Toyama Corporation | Slurry managing system and slurry managing method for wire saws |
| US5647989A (en) * | 1994-10-14 | 1997-07-15 | Kurita Water Industries Ltd. | Method for recovering abrasive particles |
| EP0786317A2 (en) * | 1996-01-26 | 1997-07-30 | Shin-Etsu Handotai Co., Ltd | System for reusing oily slurry waste fluid |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3865629A (en) * | 1972-11-07 | 1975-02-11 | Joseph Daniel Dankoff | Reclamation of components from grinding swarf |
| US4190422A (en) * | 1977-05-24 | 1980-02-26 | Bethlehem Steel Corporation | Metallic abrasive produced from a steel mill waste material |
| SU1555051A1 (en) * | 1986-10-24 | 1990-04-07 | Ю.И. Тамбовцев и И.П. Габриелов | Method of producing steel powder from grinding waste |
| US5470466A (en) * | 1993-03-17 | 1995-11-28 | Schaaf; William R. | Method and apparatus for removing ferrous particles from coolant fluid during machining |
| US5520288A (en) * | 1994-03-21 | 1996-05-28 | Pct, Inc. | Abrasive grit material recovery system |
-
1997
- 1997-10-02 DE DE19743721A patent/DE19743721A1/en not_active Withdrawn
-
1998
- 1998-09-24 EP EP98118106A patent/EP0916463A1/en not_active Withdrawn
- 1998-09-26 KR KR1019980040113A patent/KR19990036687A/en not_active Application Discontinuation
- 1998-10-01 JP JP10280062A patent/JPH11172236A/en active Pending
- 1998-10-01 US US09/164,903 patent/US6010010A/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01316170A (en) * | 1988-06-13 | 1989-12-21 | Osaka Titanium Co Ltd | Cutting work method and abrasive liquid reutilizing device |
| EP0502461A1 (en) * | 1991-03-04 | 1992-09-09 | FORACON MASCHINEN- UND ANLAGEN GmbH | Method and apparatus for the recovery of abrasive material in a water-jet cutting operation |
| US5647989A (en) * | 1994-10-14 | 1997-07-15 | Kurita Water Industries Ltd. | Method for recovering abrasive particles |
| EP0742079A1 (en) * | 1995-04-03 | 1996-11-13 | ecotop Gesellschaft für innovative Abfallwirtschaft mbH | Method and apparatus for the treatment of residues containing abrasives for cutting |
| EP0767035A1 (en) * | 1995-10-04 | 1997-04-09 | Nippei Toyama Corporation | Slurry managing system and slurry managing method for wire saws |
| EP0786317A2 (en) * | 1996-01-26 | 1997-07-30 | Shin-Etsu Handotai Co., Ltd | System for reusing oily slurry waste fluid |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 14, no. 119 (M - 945) 6 March 1990 (1990-03-06) * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19960380A1 (en) * | 1999-12-14 | 2001-07-05 | Fraunhofer Ges Forschung | Process for fractionating a machining suspension |
| DE19960380C2 (en) * | 1999-12-14 | 2002-05-29 | Fraunhofer Ges Forschung | Process for fractionating a cutting suspension |
| DE10338520A1 (en) * | 2003-08-21 | 2005-03-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for separating material splitting suspension of cooling lubricant, containing cutting grain and dispersed worked material abraded particles, with suspension treated with gas |
| US7591376B2 (en) | 2004-06-16 | 2009-09-22 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Methods for fractionating a machining suspension using destabilization and separation steps |
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990036687A (en) | 1999-05-25 |
| US6010010A (en) | 2000-01-04 |
| JPH11172236A (en) | 1999-06-29 |
| DE19743721A1 (en) | 1999-04-08 |
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