EP0880753A1 - Contactless integrated circuit card, and method and equipment for making same - Google Patents

Contactless integrated circuit card, and method and equipment for making same

Info

Publication number
EP0880753A1
EP0880753A1 EP97903425A EP97903425A EP0880753A1 EP 0880753 A1 EP0880753 A1 EP 0880753A1 EP 97903425 A EP97903425 A EP 97903425A EP 97903425 A EP97903425 A EP 97903425A EP 0880753 A1 EP0880753 A1 EP 0880753A1
Authority
EP
European Patent Office
Prior art keywords
integrated circuit
punch
face
card body
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97903425A
Other languages
German (de)
French (fr)
Inventor
Michel Gaumet
Alain Larchevesque
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Publication of EP0880753A1 publication Critical patent/EP0880753A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the present invention relates to a contactless integrated circuit card and a method and tool for the manufacture of such a card.
  • An integrated circuit card usually includes a plastic card body and an integrated circuit mounted in the card body.
  • contact cards in which the integrated circuit is connected to contact pads extending over the surface of the card and so-called contactless cards in which the integrated circuit is embedded in the card body and includes a contactless communication device which is also embedded in the card body and which forms an antenna capable of receiving and transmitting signals.
  • This communication member is generally produced in the form of a winding carried by the integrated circuit.
  • Document WO 94/22111 discloses contactless integrated circuit cards comprising a card body made up of several layers of plastic material between which the integrated circuit is disposed, then the layers are simultaneously subjected to a high temperature and pressure. So that the integrated circuit is embedded in the material constituting the card body it is necessary to heat the whole of the card body and then allow it to cool. The manufacture of cards according to this process is therefore long and therefore expensive.
  • thermoplastic material constituting the card body in an implanted area of the integrated circuit and press the integrated circuit using a heating punch having an active surface larger than the upper face of the integrated circuit implanted so that the ther ⁇ noplastic material pushed back by the integrated circuit during its implantation does not form an annular bead around the integrated circuit.
  • One and the same heating punch is used to soften the thermoplastic material, push in the integrated circuit and exert hot pressure on the implanted integrated circuit.
  • the upper face of the integrated circuit is flush with the corresponding face of the card body and is therefore accessible from the outside. Therefore, this process is therefore exclusively used for the manufacture of contact cards.
  • An object of the invention is to provide a contactless card, the manufacture of which is simpler and less costly, in comparison with cards with multilayer bodies.
  • a contactless card comprising a card body and at least one integrated circuit embedded in the card body, in which the card body has, on at least one of its faces, a relief located to the right of the integrated circuit.
  • a contactless card comprising the steps of:
  • the first punch has a stroke bringing its active face beyond the face of the card body in which the integrated circuit is implanted.
  • it relates to a tool suitable for the manufacture of a card according to the invention.
  • an integrated circuit comprising a first punch having a central core having a free end forming an active face, and a stroke limiting member adjacent to the central core and having a terminal face set back from the active face.
  • the stroke limiting member comprises a peripheral skirt delimi ⁇ as with the central core an annular cavity.
  • the tool comprises a second punch having an active face with a larger surface than that of the active face of the first punch.
  • FIGS. 2 to 4 are partial sectional views illustrating the different stages of manufacturing a card according to the invention.
  • FIG. 1 there is shown in perspective with cutaway a contactless card according to the invention.
  • This card comprises a card body 1 consisting of a mass of homogeneous thermoplastic material having an upper face 2.
  • An integrated circuit 3 is embedded in the card body 1.
  • This integrated circuit in a manner known per se comprises different layers forming an electronic circuit comprising a memory and associated with a contactless communication member forming an antenna constituted, for example, of a winding associated with the electronic circuit on the same substrate as the latter or an optical communication member associated with a card body made of material transparent to the wavelength used for the communication.
  • a relief 4 here in the form of a disc, extends projecting from the upper face 2 of the card body 1, in line with the integrated circuit 3.
  • This relief 4 are associated with the manufacturing method which will now be explained in relation to FIGS. 2 to 4.
  • This tool comprises a first punch 5 which is shown in section in FIG. 2.
  • This first punch comprises a central core 6 having an end face 7 with a surface area smaller than that of the integrated circuit 3.
  • This face 7 forms an active face of the punch 5
  • the punch 5 also comprises a stroke limiting member formed by a peripheral skirt 8 which extends around the core 6 and delimits therewith a annular cavity 9
  • the peripheral skirt 8 has an end face 10 which is parallel to the active face 7 and which extends back relative to this face. The distance between the planes of the active face 7 and of the end face 10 of the skirt 8 has been noted p.
  • the tool also includes a second punch 11 which has an active face 12 with a surface greater than that of the integrated circuit 3.
  • the first punch 5 and the second punch 11 are heated, that is to say that their active faces can be brought to a desired temperature
  • FIGS. 2 to 4 the principal steps of the process for manufacturing the card according to the invention are shown. This process uses the tool which has just been described.
  • a first step illustrated by FIG. 2, hot pressure is exerted on the integrated circuit 3, by means of the heating punch 5.
  • the integrated circuit 3 conducts the heat diffused by the heating punch and gradually sinks into the body card 1 by expelling the thermoplastic material constituting this body
  • the repressed material rises to form an annular bead 13 projecting from the upper face 2 of the card body 1 around the integrated circuit 3.
  • the stroke of the punch 5 is determined for that at the end of travel the end face 10 of the peripheral skirt 8 comes into abutment on the upper face 2 of the card body 1.
  • the peripheral skirt 8 is preferably cooled so that it does not sink into the body of card under the action of the force to which the punch is subjected.
  • the bead 13 is thus formed in the annular cavity 9 between the core 6 and the peripheral skirt 8.
  • the peripheral skirt 8 therefore has the function of limiting the stroke of the punch 5 and of channeling the material discharged by the integrated circuit so that it this remains in the vicinity of integrated circuit.
  • the active face 7 extends beyond the upper face 2 of the card body 1 and the integrated circuit 3 is therefore depressed below this face.
  • the insertion depth of the integrated circuit 3, that is to say the distance separating it from the upper face 2 of the card body 1, is equal to the distance p between the faces 7 and 10 of the punch 5. This depth can therefore be very exactly predetermined during the manufacture of the punch 5. It can be easily determined by modifying the height of the peripheral skirt 8
  • a second step is to release the punch 5
  • a third step consists in exerting a hot pressure on the bead 13, by means of the second heating punch 11.
  • this second punch has an active surface surface greater than that of the integrated circuit 3, it repels the thermoplastic material forming the bead 13 towards the integrated circuit 3, so that this material covers the integrated circuit 3
  • the end of travel of the punch 11 is illustrated in FIG. 4 It can be seen that the active face 12 of the punch 11 stops in a position slightly spaced from the upper face 2 of the card body 1
  • the thermoplastic material which formed the bead 13 therefore forms a covering zone 4 of the integrated circuit 3 in which the integrated circuit is surrounded by a mass of homogeneous material ⁇ does
  • the covering zone 4 has an upper face 4.1 which extends slightly above the upper face 2 of the body 1.
  • the overlap zone 4 therefore forms, in its part upper, a slightly protruding relief of the body of card 1
  • the thickness of this relief is noted e We understand that this relief has a volume substantially equal to that occupied by the integrated circuit 3
  • the invention is not limited to the embodiment described and it is possible to make alternative embodiments without departing from the scope of the invention.
  • the hot pressing of the integrated circuit has been illustrated by direct pressurization of the integrated circuit by means of a heating punch, provision may be made for a prior step of softening the card body in the zone of the card body intended to receive the integrated circuit
  • first heating punch having an area less than that of the integrated circuit
  • first punch having an area equal to or even slightly greater than that of the integrated circuit in order to ensure that the punch rests on the entire surface of the integrated circuit even if the punch and the integrated circuit are slightly off-center with respect to each other It should however be noted that in this case the displacement matter is more important. Care must therefore be taken not to use a first punch having an active face of too large a surface.
  • the stroke of the punch can be limited by very varied means such as a mechanical stop associated with the punch or a piston for operating the punch or an electronic, optoelectronic or electromechanical device secured to the punch or to a support part thereof.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

An integrated circuit is embedded in the body of a card by means of a first hot punch (5) with a core (6) engaging the integrated circuit in such a way that the material of the card body is driven aside and forms a bead (13), whereafter the first hot punch is removed and the bead (13) is squashed using a second hot punch with a larger working surface so that said material is driven back over the integrated circuit, which is then surrounded by a uniform mass of material that includes a raised portion on at least one surface thereof above the integrated circuit.

Description

Carte à circuit intégré sans contact, procédé et outillage pour la fabrication d'une telle carte Contactless integrated circuit card, method and tool for manufacturing such a card
La présente invention concerne une carte à circuit intégré sans contact ainsi qu'un procédé et un outillage pour la fabrication d'une telle carte.The present invention relates to a contactless integrated circuit card and a method and tool for the manufacture of such a card.
Une carte à circuit intégré comporte habituelle- ment un corps de carte en matière plastique et un circuit intégré monté dans le corps de carte.An integrated circuit card usually includes a plastic card body and an integrated circuit mounted in the card body.
On connaît actuellement des cartes dites avec contact dans lesquelles le circuit intégré est relié à des plages de contact s'étendant à la surface de la carte et des cartes dites sans contact dans lesquelles le circuit intégré est noyé dans le corps de carte et comprend un organe de communication sans contact qui est également noyé dans le corps de carte et qui forme une antenne capable de recevoir et d'émettre des signaux. Cet organe de communica- tion est généralement réalisé sous la forme d'un enroule¬ ment porté par le circuit intégré.Currently known as contact cards in which the integrated circuit is connected to contact pads extending over the surface of the card and so-called contactless cards in which the integrated circuit is embedded in the card body and includes a contactless communication device which is also embedded in the card body and which forms an antenna capable of receiving and transmitting signals. This communication member is generally produced in the form of a winding carried by the integrated circuit.
On connaît du document WO 94/22111 des cartes à circuit intégré sans contact comportant un corps de carte constitué de plusieurs couches de matière plastique entre lesquelles le circuit intégré est disposé puis les couches sont soumises simultanément à une température et une pression élevée. Afin que le circuit intégré soit noyé dans la matière constituant le corps de carte il est nécessaire de chauffer l'ensemble du corps de carte puis de laisser refroidir celui-ci. La fabrication des cartes selon ce procédé est donc longue et donc coûteuse.Document WO 94/22111 discloses contactless integrated circuit cards comprising a card body made up of several layers of plastic material between which the integrated circuit is disposed, then the layers are simultaneously subjected to a high temperature and pressure. So that the integrated circuit is embedded in the material constituting the card body it is necessary to heat the whole of the card body and then allow it to cool. The manufacture of cards according to this process is therefore long and therefore expensive.
On connaît par ailleurs un procédé d'implantation d'un circuit intégré dans un corps de carte à contact. Ce procédé, notamment décrit dans le document US-A-3.615.946 , consiste à :There is also known a method of implanting an integrated circuit in a contact card body. This process, notably described in document US-A-3,615,946, consists in:
- ramollir la matière thermoplastique constituant le corps de carte dans une zone d' implantation du circuit intégré et enfoncer le circuit intégré à l'aide d'un poinçon chauffant ayant une surface active plus grande que la face supérieure du circuit intégré implanté et ce afin que la matière therτnoplastique refoulée par le circuit intégré lors de son implantation ne forme pas un bourrelet annulaire autour du circuit intégré. On utilise un seul et même poinçon chauffant pour ramollir la matière thermoplastique, enfoncer le circuit intégré et exercer la pression à chaud sur le circuit intégré implanté. Dans la carte obtenue, la face supérieure du circuit intégré affleure la face correspondante du corps de carte et est donc accessible de l'extérieur. De ce fait, ce procédé est donc exclusivement utilisé pour la fabrica¬ tion des cartes à contact .- soften the thermoplastic material constituting the card body in an implanted area of the integrated circuit and press the integrated circuit using a heating punch having an active surface larger than the upper face of the integrated circuit implanted so that the therτnoplastic material pushed back by the integrated circuit during its implantation does not form an annular bead around the integrated circuit. One and the same heating punch is used to soften the thermoplastic material, push in the integrated circuit and exert hot pressure on the implanted integrated circuit. In the card obtained, the upper face of the integrated circuit is flush with the corresponding face of the card body and is therefore accessible from the outside. Therefore, this process is therefore exclusively used for the manufacture of contact cards.
Un but de l'invention est de réaliser une carte sans contact dont la fabrication soit plus simple et moins coûteuse, en comparaison aux cartes à corps multicouchesAn object of the invention is to provide a contactless card, the manufacture of which is simpler and less costly, in comparison with cards with multilayer bodies.
En vue de la réalisation de ce but, on prévoit selon l'invention une carte sans contact comportant un corps de carte et au moins un circuit intégré noyé dans le corps de carte, dans laquelle le corps de carte présente, sur au moins une de ses faces, un relief situé au droit du circuit intégré.With a view to achieving this aim, a contactless card is provided according to the invention comprising a card body and at least one integrated circuit embedded in the card body, in which the card body has, on at least one of its faces, a relief located to the right of the integrated circuit.
Ainsi, pour la réalisation d'une telle carte il suffit de chauffer localement le corps de carte La constitution d'un relief au droit du circuit intégré permet de répartir localement et de façon homogène la matière chassée lors de l'enfoncement du circuit intégré de sorte que l'opération d'enfoncement peut être réalisée très rapidementThus, for the production of such a card, it suffices to locally heat the card body. The constitution of a relief in line with the integrated circuit makes it possible to distribute locally and homogeneously the material expelled during the insertion of the integrated circuit of so the sinking operation can be carried out very quickly
Selon un autre aspect de l'invention, celle-ci concerne un procédé de fabrication d'une carte sans contact comprenant les étapes de :According to another aspect of the invention, it relates to a method of manufacturing a contactless card comprising the steps of:
- enfoncer un circuit intégré dans une face d'un corps de carte en matière thermoplastique en exerçant une pression sur le circuit intégré, au moyen d'un premier poinçon chauffant ayant une face active de surface sensi- blement égale à celle du circuit intégré, afin qu'une partie de la matière thermoplastique soit refoulée par le circuit intégré lors de son implantation pour former un bourrelet annulaire autour du circuit intégré ; - dégager le premier poinçon ;- driving an integrated circuit into one face of a card body made of thermoplastic material by exerting pressure on the integrated circuit, by means of a first heating punch having an active face with a sensitive surface; completely equal to that of the integrated circuit, so that part of the thermoplastic material is forced back by the integrated circuit during its implantation to form an annular bead around the integrated circuit; - release the first punch;
- exercer une pression à chaud sur le bourrelet annulaire formé par la matière refoulée du corps de carte autour du circuit intégré, au moyen d'un second poinçon chauffant ayant une face active de plus grande surface que celle du circuit intégré, de telle sorte que la matière formant le bourrelet annulaire recouvre le circuit intégré- exert a hot pressure on the annular bead formed by the material discharged from the card body around the integrated circuit, by means of a second heating punch having an active face of larger surface than that of the integrated circuit, so that the material forming the annular bead covers the integrated circuit
Avantageusement, le premier poinçon a une course amenant sa face active au-delà de la face du corps de carte dans laquelle le circuit intégré est implanté. Selon un autre aspect de l'invention, celle-ci concerne un outillage adapté à la fabrication d'une carte selon l'invention.Advantageously, the first punch has a stroke bringing its active face beyond the face of the card body in which the integrated circuit is implanted. According to another aspect of the invention, it relates to a tool suitable for the manufacture of a card according to the invention.
En vue de la réalisation de ce but, on prévoit selon l'invention un circuit intégré comprenant un premier poinçon présentant un noyau central ayant une extrémité libre formant une face active, et un organe limiteur de course adjacent au noyau central et possédant une face terminale en retrait par rapport à la face active.In order to achieve this goal, an integrated circuit is provided according to the invention comprising a first punch having a central core having a free end forming an active face, and a stroke limiting member adjacent to the central core and having a terminal face set back from the active face.
Selon un mode de réalisation préféré, l'organe limiteur de course comprend une jupe périphérique délimi¬ tant avec le noyau central une cavité annulaire.According to a preferred embodiment, the stroke limiting member comprises a peripheral skirt delimi¬ as with the central core an annular cavity.
Avantageusement, l'outillage comporte un second poinçon ayant une face active de surface plus grande que celle de la face active du premier poinçon D'autres caractéristiques et avantages de l'in¬ vention apparaîtront à la lecture de la description qui suit d'un mode de réalisation particulier et non limitatif de l'invention.Advantageously, the tool comprises a second punch having an active face with a larger surface than that of the active face of the first punch. Other characteristics and advantages of the invention will become apparent on reading the following description of a particular and non-limiting embodiment of the invention.
Il sera fait référence aux dessins en annexe, dans lesquels : - la figure 1 est une vue en perspective avec arraché d'une carte sans contact conforme à l'invention ,• Reference will be made to the accompanying drawings, in which: - Figure 1 is a perspective view with cutaway of a contactless card according to the invention, •
- les figures 2 à 4 sont des vues partielles en coupe illustrant les différentes étapes de fabrication d'une carte selon l'invention.- Figures 2 to 4 are partial sectional views illustrating the different stages of manufacturing a card according to the invention.
A la figure 1, on a représenté en perspective avec arraché une carte sans contact conforme à l'invention. Cette carte comporte un corps de carte 1 constitué d'une masse de matière thermoplastique homogène présentant une face supérieure 2.In Figure 1, there is shown in perspective with cutaway a contactless card according to the invention. This card comprises a card body 1 consisting of a mass of homogeneous thermoplastic material having an upper face 2.
Un circuit intégré 3 est noyé dans le corps de carte 1. Ce circuit intégré de façon connue en soi comporte différentes couches formant un circuit électronique comprenant une mémoire et associé à un organe de communica- tion sans contact formant une antenne constituée, par exemple, d'un enroulement associé au circuit électronique sur le même substrat que celui-ci ou un organe de communi¬ cation optique associé à un corps de carte en matière transparente à la longueur d'onde utilisée pour la communi- cation.An integrated circuit 3 is embedded in the card body 1. This integrated circuit in a manner known per se comprises different layers forming an electronic circuit comprising a memory and associated with a contactless communication member forming an antenna constituted, for example, of a winding associated with the electronic circuit on the same substrate as the latter or an optical communication member associated with a card body made of material transparent to the wavelength used for the communication.
Dans le mode de réalisation illustré, un relief 4, ici en forme de disque, s'étend en saillie sur la face supérieure 2 du corps de carte 1, au droit du circuit intégré 3. L'existence et la hauteur de ce relief 4 sont associés au mode de fabrication qui va maintenant être exposé en relation avec les figures 2 à 4.In the illustrated embodiment, a relief 4, here in the form of a disc, extends projecting from the upper face 2 of the card body 1, in line with the integrated circuit 3. The existence and the height of this relief 4 are associated with the manufacturing method which will now be explained in relation to FIGS. 2 to 4.
Pour la fabrication de la carte qui vient d'être décrite, on utilise un outillage spécifique. Cet outillage comporte un premier poinçon 5 qui est représenté en coupe à la figure 2. Ce premier poinçon comporte un noyau central 6 ayant une face terminale 7 de surface inférieure à celle du circuit intégré 3. Cette face 7 forme une face active du poinçon 5. Le poinçon 5 comporte également un organe limiteur de course formé par une jupe périphérique 8 qui s'étend autour du noyau 6 et délimite avec celui-ci une cavité annulaire 9 La jupe périphérique 8 possède une face terminale 10 qui est parallèle à la face active 7 et qui s'étend en retrait par rapport à cette face. On a noté p la distance entre les plans de la face active 7 et de la face terminale 10 de la jupe 8.For the manufacture of the card which has just been described, a specific tool is used. This tool comprises a first punch 5 which is shown in section in FIG. 2. This first punch comprises a central core 6 having an end face 7 with a surface area smaller than that of the integrated circuit 3. This face 7 forms an active face of the punch 5 The punch 5 also comprises a stroke limiting member formed by a peripheral skirt 8 which extends around the core 6 and delimits therewith a annular cavity 9 The peripheral skirt 8 has an end face 10 which is parallel to the active face 7 and which extends back relative to this face. The distance between the planes of the active face 7 and of the end face 10 of the skirt 8 has been noted p.
L'outillage comporte également un second poinçon 11 qui possède une face active 12 de surface supérieure à celle du circuit intégré 3.The tool also includes a second punch 11 which has an active face 12 with a surface greater than that of the integrated circuit 3.
Le premier poinçon 5 et le second poinçon 11 sont chauffants, c'est-à-dire que leurs faces actives peuvent être portées à une température souhaitéeThe first punch 5 and the second punch 11 are heated, that is to say that their active faces can be brought to a desired temperature
Aux figures 2 à 4, on a représenté les principa¬ les étapes du procédé de fabrication de la carte selon l'invention. Ce procédé utilise l'outillage qui vient d'être décrit.In FIGS. 2 to 4, the principal steps of the process for manufacturing the card according to the invention are shown. This process uses the tool which has just been described.
Dans une première étape, illustrée par la figure 2, on exerce une pression à chaud sur le circuit intégré 3, au moyen du poinçon chauffant 5. Le circuit intégré 3 conduit la chaleur diffusée par le poinçon chauffant et s'enfonce progressivement dans le corps de carte 1 en chassant la matière thermoplastique constituant ce corps La matière refoulée remonte pour former un bourrelet annulaire 13 s'étendant en saillie de la face supérieure 2 du corps de carte 1 autour du circuit intégré 3. La course du poinçon 5 est déterminée pour qu'en fin de course la face terminale 10 de la jupe périphérique 8 vienne en butée sur la face supérieure 2 du corps de carte 1. La jupe périphérique 8 est de préférence refroidie afin qu'elle ne s'enfonce pas dans le corps de carte sous l'action de la force à laquelle le poinςon est soumis. Le bourrelet 13 se forme ainsi dans la cavité annulaire 9 entre le noyau 6 et la jupe périphérique 8. La jupe périphérique 8 a donc pour fonction de limiter la course du poinçon 5 et de canaliser la matière refoulée par le circuit intégré afin que celle-ci reste au voisinage du circuit intégré. En fin de course, la face active 7 s'étend au-delà de la face supérieure 2 du corps de carte 1 et le circuit intégré 3 est donc enfoncé en-dessous de cette face. La profondeur d'enfoncement du circuit intégré 3, c'est-à-dire la distance le séparant de la face supérieure 2 du corps de carte 1, est égale à la distance p entre les faces 7 et 10 du poinçon 5. Cette profondeur peut donc être très exactement prédéterminée lors de la fabrication du poinçon 5. Elle peut être aisément déterminée en modifiant la hauteur de la jupe périphérique 8In a first step, illustrated by FIG. 2, hot pressure is exerted on the integrated circuit 3, by means of the heating punch 5. The integrated circuit 3 conducts the heat diffused by the heating punch and gradually sinks into the body card 1 by expelling the thermoplastic material constituting this body The repressed material rises to form an annular bead 13 projecting from the upper face 2 of the card body 1 around the integrated circuit 3. The stroke of the punch 5 is determined for that at the end of travel the end face 10 of the peripheral skirt 8 comes into abutment on the upper face 2 of the card body 1. The peripheral skirt 8 is preferably cooled so that it does not sink into the body of card under the action of the force to which the punch is subjected. The bead 13 is thus formed in the annular cavity 9 between the core 6 and the peripheral skirt 8. The peripheral skirt 8 therefore has the function of limiting the stroke of the punch 5 and of channeling the material discharged by the integrated circuit so that it this remains in the vicinity of integrated circuit. At the end of the race, the active face 7 extends beyond the upper face 2 of the card body 1 and the integrated circuit 3 is therefore depressed below this face. The insertion depth of the integrated circuit 3, that is to say the distance separating it from the upper face 2 of the card body 1, is equal to the distance p between the faces 7 and 10 of the punch 5. This depth can therefore be very exactly predetermined during the manufacture of the punch 5. It can be easily determined by modifying the height of the peripheral skirt 8
Le fait que la surface de la face active 7 soit inférieure à celle du circuit intégré 3 permet à la matière thermoplastique refoulée par le circuit intégré 3 lors de son implantation de remonter pour former le bourrelet annulaire 13.The fact that the surface of the active face 7 is less than that of the integrated circuit 3 allows the thermoplastic material discharged by the integrated circuit 3 during its implantation to rise to form the annular bead 13.
Une seconde étape consiste à dégager le poinçon 5A second step is to release the punch 5
Une troisième étape consiste à exercer une pression à chaud sur le bourrelet 13, au moyen du second poinçon chauffant 11. Comme ce second poinçon possède une face active de surface supérieure à celle du circuit intégré 3, il repousse la matière thermoplastique formant le bourrelet 13 en direction du circuit intégré 3, de sorte que cette matière vient recouvrir le circuit intégré 3 La fin de course du poinçon 11 est illustrée par la figure 4 On constate que la face active 12 du poinçon 11 s'arrête dans une position légèrement espacée de la face supérieure 2 du corps de carte 1 La matière thermoplasti¬ que qui formait le bourrelet 13 forme donc une zone de recouvrement 4 du circuit intégré 3 dans laquelle le circuit intégré est entouré d'une masse de matière homogè¬ ne La zone de recouvrement 4 possède une face supérieure 4.1 qui s'étend légèrement au-dessus de la face supérieure 2 du corps 1. La zone de recouvrement 4 forme donc, dans sa partie supérieure, un relief légèrement en saillie du corps de carte 1 L'épaisseur de ce relief est notée e On comprend que ce relief a un volume sensiblement égal a celui qui est occupé par le circuit intégré 3A third step consists in exerting a hot pressure on the bead 13, by means of the second heating punch 11. As this second punch has an active surface surface greater than that of the integrated circuit 3, it repels the thermoplastic material forming the bead 13 towards the integrated circuit 3, so that this material covers the integrated circuit 3 The end of travel of the punch 11 is illustrated in FIG. 4 It can be seen that the active face 12 of the punch 11 stops in a position slightly spaced from the upper face 2 of the card body 1 The thermoplastic material which formed the bead 13 therefore forms a covering zone 4 of the integrated circuit 3 in which the integrated circuit is surrounded by a mass of homogeneous material ¬ does The covering zone 4 has an upper face 4.1 which extends slightly above the upper face 2 of the body 1. The overlap zone 4 therefore forms, in its part upper, a slightly protruding relief of the body of card 1 The thickness of this relief is noted e We understand that this relief has a volume substantially equal to that occupied by the integrated circuit 3
Toutefois, il est possible de supprimer ce relief en prévoyant de réaliser un second poinçon ayant une face active de grande surface et en poursuivant la progression de ce second poinçon jusqu'à la face supérieure 2 du corps de carte 1, de façon à provoquer un étalement du surplus de matière thermoplastique sur une surface importante de la face supérieure 2 du corps de carte 1However, it is possible to remove this relief by planning to make a second punch having an active face of large area and by continuing the progression of this second punch to the upper face 2 of the card body 1, so as to cause a spreading of the excess thermoplastic material over a large surface of the upper face 2 of the card body 1
Bien entendu, l'invention n'est pas limitée au mode de réalisation décrit et on peut y apporter des variantes de réalisation sans sortir du cadre de l'inven¬ tion En particulier, bien que l'enfoncement à chaud du circuit intégré ait été illustré par une mise en pression directe du circuit intégré au moyen d'un poinçon chauffant, on peut prévoir une étape préalable de ramollissement du corps de carte dans la zone du corps de carte destinée a recevoir le circuit intégre Après incorporation du circuit intégré au corps de carte, on prévoira généralement une étape d'impression d'une ou des faces de la carte Après impression, on peut prévoir de recouvrir la face comportant le relief 4 avec un vernis afin que la carte présente une surface uniforme cette étape pouvant être réalisée de façon très simple, par exemple par une application au rouleauOf course, the invention is not limited to the embodiment described and it is possible to make alternative embodiments without departing from the scope of the invention. In particular, although the hot pressing of the integrated circuit has been illustrated by direct pressurization of the integrated circuit by means of a heating punch, provision may be made for a prior step of softening the card body in the zone of the card body intended to receive the integrated circuit After incorporating the integrated circuit into the body card, we will usually provide a step of printing one or more sides of the card After printing, we can plan to cover the face with the relief 4 with a varnish so that the card has a uniform surface this step can be performed very simply, for example by roller application
Bien que l'invention ait été décrite en relation avec un premier poinçon chauffant ayant une surface inférieure à celle du circuit intégré, on peut utiliser un premier poinçon ayant une surface égale ou même légèrement supérieure à celle du circuit intégré afin de s'assurer que le poinçon prend appui sur l'ensemble de la surface du circuit intégré même si le poinçon et le circuit intègre sont légèrement décentrés l'un par rapport a l'autre II convient toutefois de noter que dans ce cas le déplacement de matière est plus important. Il y a donc lieu de veiller à ne pas utiliser un premier poinçon présentant une face active de trop grande surface.Although the invention has been described in relation to a first heating punch having an area less than that of the integrated circuit, it is possible to use a first punch having an area equal to or even slightly greater than that of the integrated circuit in order to ensure that the punch rests on the entire surface of the integrated circuit even if the punch and the integrated circuit are slightly off-center with respect to each other It should however be noted that in this case the displacement matter is more important. Care must therefore be taken not to use a first punch having an active face of too large a surface.
Bien que l'invention ait été décrite en relation avec un premier poinçon comportant un organe limiteur de course formé par une jupe périphérique entourant le noyau central, on peut limiter la course du poinçon par des moyens très variés tels qu'une butée mécanique associée au poinçon ou à un piston de manoeuvre du poinçon ou encore un dispositif électronique, optoélectronique ou électroméca¬ nique solidaire du poinçon ou d'une pièce support de celui- ci . Although the invention has been described in relation to a first punch comprising a stroke limiting member formed by a peripheral skirt surrounding the central core, the stroke of the punch can be limited by very varied means such as a mechanical stop associated with the punch or a piston for operating the punch or an electronic, optoelectronic or electromechanical device secured to the punch or to a support part thereof.

Claims

REVENDICATIONS
1. Carte sans contact comportant un corps de carte (1) et au moins un circuit intégré (3) noyé dans le corps de carte (1) , caractérisée en ce que le corps de carte (1) présente, sur au moins une de ses faces, un relief (4) situé au droit du circuit intégré (3) .1. Contactless card comprising a card body (1) and at least one integrated circuit (3) embedded in the card body (1), characterized in that the card body (1) has, on at least one of its faces, a relief (4) located to the right of the integrated circuit (3).
2. Procédé de fabrication d'une carte sans contact, caractérisé en ce qu'il comporte les étapes de2. Method for manufacturing a contactless card, characterized in that it comprises the steps of
- enfoncer un circuit intégré (3) dans une face d'un corps de carte (1) en matière thermoplastique en exerçant une pression sur le circuit intégré (3) , au moyen d'un premier poinçon chauffant (6) ayant une face active (7) de surface sensiblement égale a celle du circuit intégré (3) , afin qu'une partie de la matière thermoplasti- que soit refoulée par le circuit intégré (3) lors de son implantation pour former un bourrelet annulaire (13) autour du circuit intégré ;- driving an integrated circuit (3) into one face of a card body (1) made of thermoplastic material by exerting pressure on the integrated circuit (3), by means of a first heating punch (6) having an active face (7) with a surface substantially equal to that of the integrated circuit (3), so that part of the thermoplastic material is forced back by the integrated circuit (3) during its implantation to form an annular bead (13) around the integrated circuit ;
- dégager le premier poinçon ,-- release the first punch, -
- exercer une pression à chaud sur le bourrelet annulaire (13) formé par la matière refoulée du corps de carte (1) autour du circuit intégré (3) , au moyen d'un second poinçon chauffant (11) ayant une face active (12) de plus grande surface que celle du circuit intégré (3) , de telle sorte que la matière formant le bourrelet annulaire (13) recouvre le circuit intégré (3) .- exert a hot pressure on the annular bead (13) formed by the material discharged from the card body (1) around the integrated circuit (3), by means of a second heating punch (11) having an active face (12 ) larger area than that of the integrated circuit (3), so that the material forming the annular bead (13) covers the integrated circuit (3).
3. Procédé selon la revendication 2, caractérisé en ce que le premier poinçon a une course amenant sa face active (7) au-delà de la face du corps de carte dans laquelle le circuit intégré (3) est implanté. 3. Method according to claim 2, characterized in that the first punch has a stroke bringing its active face (7) beyond the face of the card body in which the integrated circuit (3) is implanted.
4. Procédé selon la revendication 2, caractérisé en ce que le second poinçon (11) a une course amenant sa face active (12) dans une position espacée de la face du corps de carte dans lequel le circuit intégré est implanté.4. Method according to claim 2, characterized in that the second punch (11) has a stroke bringing its active face (12) in a position spaced from the face of the card body in which the integrated circuit is implanted.
5. Outillage pour la mise en oeuvre du procédé selon la revendication 2, caractérisé en ce qu'il comprend un premier poinçon présentant un noyau central (6) ayant une extrémité libre formant la face active (7) , et un organe limiteur de course (8) adjacent au noyau central et possédant une face terminale (10) en retrait par rapport à la face active.5. Tools for implementing the method according to claim 2, characterized in that it comprises a first punch having a central core (6) having a free end forming the active face (7), and a stroke limiting member (8) adjacent to the central core and having an end face (10) recessed from the face active.
6. Outillage selon la revendication 5, caracté¬ risé en ce que l'organe limiteur de course comprend une jupe périphérique (8) délimitant avec le noyau central une cavité annulaire (9) . 6. Tool according to claim 5, caracté¬ ized in that the stroke limiting member comprises a peripheral skirt (8) defining with the central core an annular cavity (9).
7. Outillage selon la revendication 5, caracté¬ risé en ce qu'il comporte un second poinçon (11) ayant une face active (12) de surface plus grande que celle de la face active (7) du premier poinçon. 7. Tool according to claim 5, caracté¬ ized in that it comprises a second punch (11) having an active face (12) of larger surface than that of the active face (7) of the first punch.
EP97903425A 1996-02-09 1997-02-07 Contactless integrated circuit card, and method and equipment for making same Withdrawn EP0880753A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9601617 1996-02-09
FR9601617A FR2744819B1 (en) 1996-02-09 1996-02-09 CONTACTLESS INTEGRATED CIRCUIT CARD, METHOD AND TOOLS FOR MANUFACTURING SUCH A CARD
PCT/FR1997/000248 WO1997029455A1 (en) 1996-02-09 1997-02-07 Contactless integrated circuit card, and method and equipment for making same

Publications (1)

Publication Number Publication Date
EP0880753A1 true EP0880753A1 (en) 1998-12-02

Family

ID=9489033

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97903425A Withdrawn EP0880753A1 (en) 1996-02-09 1997-02-07 Contactless integrated circuit card, and method and equipment for making same

Country Status (4)

Country Link
EP (1) EP0880753A1 (en)
JP (1) JP2000505572A (en)
FR (1) FR2744819B1 (en)
WO (1) WO1997029455A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10304777B4 (en) * 2003-02-05 2006-11-23 Infineon Technologies Ag Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4224994A1 (en) * 1992-07-29 1994-02-03 Ruhlamat Automatisierungstechn Equipment to press module flush into impression on face of chip card - positions module and card on base and has system with heated centre tool to stamp module and outer part to act on surrounding card
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.
CH688696A5 (en) * 1993-03-17 1998-01-15 François Droz Card with electronic component and coil mfr. for use as bank card, access card
DE9411415U1 (en) * 1994-07-14 1994-09-08 Zeiss Carl Jena Gmbh Arrangement for the identification of measuring devices, in particular gauges

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9729455A1 *

Also Published As

Publication number Publication date
FR2744819A1 (en) 1997-08-14
JP2000505572A (en) 2000-05-09
WO1997029455A1 (en) 1997-08-14
FR2744819B1 (en) 1998-08-21

Similar Documents

Publication Publication Date Title
EP0793835B1 (en) Board with at least one built-in electronic element
EP1399880B1 (en) Contactless chipcard with an antenna support and chip support made from a fibrous material
EP0669597B1 (en) Method of manufacturing a contactless card
WO1996042109A1 (en) Smart card chip coated with a layer of insulating material, and smart card comprising same
FR2702067A1 (en) Method and device for manufacturing memory cards
EP0623897B1 (en) Portable object comprising an integrated circuit and method for manufacturing
EP0627707B1 (en) Method of manufacturing a memory card and memory card obtained thereby
WO1989000340A1 (en) Electronic microcircuit card and process for manufacturing same
EP0694871A1 (en) Method for implanting a micro-circuit on a smart and/or memory card body, and card comprising a micro circuit thus implanted
FR2778769A1 (en) Integrated circuit card with interface terminal strip between circuit and contacts formed by deposit of conductive ink
FR2749687A1 (en) MEMORY CARD AND METHOD FOR MANUFACTURING SUCH A CARD
FR2562725A1 (en) METHOD FOR INSERTING A MALE CONTACT IN A FEMALE CONTACT, AND MEANS FOR CARRYING OUT THE METHOD
WO1997029455A1 (en) Contactless integrated circuit card, and method and equipment for making same
FR2828953A1 (en) Portable electronic badge/card integrated circuit switch having electrical circuit structural switch two conductors spilling out onto surface formed and finger contact activated.
FR2817374A1 (en) ELECTRONIC INFORMATION SUPPORT
FR2741501A1 (en) Manufacturing procedure for multilayer printed circuit board for use in supporting aerial array
EP1080446B1 (en) Bi-standard integrated circuit card comprising an insulating slot
WO2000031686A1 (en) Method for making a flush chip card using a laser engraving step and resulting chip card
CH688696A5 (en) Card with electronic component and coil mfr. for use as bank card, access card
FR2777675A1 (en) METHOD FOR MANUFACTURING A MICROCIRCUIT CARD AND A MICROCIRCUIT CARD OBTAINED BY IMPLEMENTATION OF THIS PROCESS
EP0915431B1 (en) IC card and manufacturing method of such a card
FR2471263A1 (en) IMPROVEMENTS RELATING TO MOLDS FOR PRESSES INTENDED FOR THE MANUFACTURE OF PLATES OR SIMILAR ARTICLES IN CERAMIC MATERIAL
FR2752077A1 (en) Integrated circuit with dual connection modes
FR2736867A1 (en) Chip card - has a structured moulded dovetail recess to lock the micromodule assembly in the support material
FR2821959A1 (en) Method for fabricating a multi-layer body, especially a chip card, by milling of a slot for insertion of a chip module with a separation layer having previously been inserted so that cavity material is easily removed

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19980810

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE ES GB GR IT

17Q First examination report despatched

Effective date: 19981119

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SCHLUMBERGER SYSTEMES

RTI1 Title (correction)

Free format text: METHOD FOR MANUFACTURING A CONTACTLESS INTEGRATED CIRCUIT CARD

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20011228