FR2752077A1 - Integrated circuit with dual connection modes - Google Patents
Integrated circuit with dual connection modes Download PDFInfo
- Publication number
- FR2752077A1 FR2752077A1 FR9609802A FR9609802A FR2752077A1 FR 2752077 A1 FR2752077 A1 FR 2752077A1 FR 9609802 A FR9609802 A FR 9609802A FR 9609802 A FR9609802 A FR 9609802A FR 2752077 A1 FR2752077 A1 FR 2752077A1
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- Prior art keywords
- integrated circuit
- module
- pads
- antenna
- conductive
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Abstract
Description
La présente invention concerne une carte à circuit intégré à connexion mixte. The present invention relates to an integrated circuit card with mixed connection.
On entend par carte à connexion mixte une carte pouvant être reliée avec un appareil soit par une liaison avec contact soit par une liaison sans contact. By mixed connection card is meant a card which can be connected with a device either by a contact link or by a contactless link.
On connaît du document EP 682 321 une carte à circuit intégré à connexion mixte comportant un corps de carte dans lequel est noyée une antenne reliée à un module comprenant un circuit intégré relié à des plages conductrices portées par un film support, l'antenne ayant des extrémités à l'aplomb des plages conductrices. Ce document prévoit la mise en contact directe des plages conductrices du module avec les extrémités de l'antenne. Ceci pose un problème de positionnement du module qui doit être extrêmement précis et est donc incompatible avec une fabrication à cadence élevée. Document EP 682 321 discloses an integrated circuit card with mixed connection comprising a card body in which is embedded an antenna connected to a module comprising an integrated circuit connected to conductive pads carried by a support film, the antenna having ends plumb with conductive pads. This document provides for the direct contact of the conductive pads of the module with the ends of the antenna. This poses a problem in positioning the module which must be extremely precise and is therefore incompatible with high-speed manufacturing.
Selon l'invention on propose une carte à circuit intégré à connexion mixte comportant un corps de carte dans lequel est noyée une antenne reliée à un module comprenant un circuit intégré relié à des plages conductrices portées par un film support, l'antenne ayant des extrémités s'étendant à l'aplomb de plages conductrices à distance de celles-ci et étant reliées à celles-ci par un organe conducteur s'étendant à travers le corps de carte. According to the invention there is provided an integrated circuit card with mixed connection comprising a card body in which is embedded an antenna connected to a module comprising an integrated circuit connected to conductive pads carried by a support film, the antenna having ends extending directly above conductive pads at a distance therefrom and being connected thereto by a conductive member extending through the card body.
Selon un autre aspect, l'invention concerne un module à circuit intégré comportant un film support équipé de plages de contact reliées à un circuit intégré dans lequel en regard d'au moins deux plages de contact le film support est percé de trous pourvus de plots de connexion s'étendant en saillie sur une face du film support opposé aux plages conductrices. On facilite ainsi la réalisation d'une liaison entre les plages conductrices et les extrémités de l'antenne lors de la mise en place du module dans la carte à circuit intégré. According to another aspect, the invention relates to an integrated circuit module comprising a support film equipped with contact pads connected to an integrated circuit in which, facing at least two contact pads, the support film is pierced with holes provided with studs connection extending projecting from one face of the support film opposite the conductive pads. This facilitates the creation of a connection between the conductive pads and the ends of the antenna when the module is placed in the integrated circuit card.
De préférence les plots de connexion sont formés d'une matière conductrice dans un état plastique. Ainsi la mise en place du module dans la carte à circuit intégré provoque un écrasement de la matière conductrice qui déborde des trous dans le film support du module à circuit intégré et permet l'établissement d'une liaison avec les extrémités de l'antenne même dans le cas d'un léger décalage entre les trous dans le film support du module à circuit intégré et les extrémités de l'antenne. Preferably the connection pads are formed of a conductive material in a plastic state. Thus the installation of the module in the integrated circuit card causes a crushing of the conductive material which overflows from the holes in the support film of the integrated circuit module and allows the establishment of a connection with the ends of the antenna itself. in the case of a slight offset between the holes in the support film of the integrated circuit module and the ends of the antenna.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description qui va suivre d'un mode de réalisation particulier non limitatif de l'invention, en référence aux figures ci-jointes parmi lesquelles:
- la figure 1 est une vue en perspective éclatée des feuilles constituant le corps de la carte selon un mode de réalisation de l'invention,
- la figure 2 est une vue partielle en coupe agrandie selon la ligne II-II de la figure 1 dans une étape intermédiaire de réalisation d'un premier mode de réalisation de la carte selon l'invention,
- la figure 3 est une vue en coupe analogue à celle de la figure 2 dans une étape ultérieure,
- la figure 4 est une vue en perspective partiellement écorchée d'un module à circuit intégré au premier mode de réalisation de l'invention,
- la figure 5 est une vue en coupe analogue à celle de la figure 2, après mise en place du module à circuit intégré,
- la figure 6 est une vue en coupe analogue à celle de la figure 5 pour un second mode de réalisation de l'invention,
- la figure 7 est une vue en coupe analogue à celle de la figure 5 pour un troisième mode de réalisation de l'invention.Other characteristics and advantages of the invention will appear on reading the following description of a particular non-limiting embodiment of the invention, with reference to the attached figures among which:
FIG. 1 is an exploded perspective view of the sheets constituting the body of the card according to an embodiment of the invention,
FIG. 2 is a partial view in enlarged section along the line II-II of FIG. 1 in an intermediate stage of production of a first embodiment of the card according to the invention,
FIG. 3 is a sectional view similar to that of FIG. 2 in a later step,
FIG. 4 is a partially cutaway perspective view of an integrated circuit module in the first embodiment of the invention,
FIG. 5 is a sectional view similar to that of FIG. 2, after installation of the integrated circuit module,
FIG. 6 is a sectional view similar to that of FIG. 5 for a second embodiment of the invention,
- Figure 7 is a sectional view similar to that of Figure 5 for a third embodiment of the invention.
En référence aux figures, dans le premier mode de réalisation la carte à circuit intégré à connexion mixte selon l'invention est réalisée à partir d'une antenne 1 portée par une feuille support 2 et d'un module, généralement désigné en 3 comprenant (voir figures 4 et 5) un film support 4 équipé de plages conductrices 5 reliées à un circuit intégré 6 par des fils 7, le circuit intégré 6 et les fils de liaison 7 étant noyés dans un bloc de résine 8. With reference to the figures, in the first embodiment the integrated circuit card with mixed connection according to the invention is produced from an antenna 1 carried by a support sheet 2 and from a module, generally designated in 3 comprising ( see FIGS. 4 and 5) a support film 4 equipped with conductive pads 5 connected to an integrated circuit 6 by wires 7, the integrated circuit 6 and the connection wires 7 being embedded in a block of resin 8.
L'antenne 1 comporte deux extrémités adjacentes l'une à l'autre sur lesquelles sont formés des plots de liaison 11 s'étendant en saillie par rapport aux extrémités de l'antenne (voir figure 2). Les plots de liaison 11 peuvent être réalisés par sérigraphie d'un polymère conducteur ou par dépôt mécanique d'une goutte de métal. The antenna 1 has two ends adjacent to each other on which are formed connecting studs 11 projecting from the ends of the antenna (see Figure 2). The connection pads 11 can be produced by screen printing of a conductive polymer or by mechanical deposition of a drop of metal.
Le film support 4 du module à circuit intégré 3 comporte en regard de deux plages de contact 5 des trous 9 pourvus de plots de connexion 10, par exemple une matière conductrice comprenant un polymère contenant des grains conducteurs, s'étendant en saillie sur une face du film support 4 opposée aux plages de contact 5. Dans le cas de plots de connexion 10 en matière conductrice, celle-ci est de préférence dans un état plastique avant l'incorporation du module à la carte à circuit intégré selon l'invention. The support film 4 of the integrated circuit module 3 comprises, opposite two contact pads 5, holes 9 provided with connection pads 10, for example a conductive material comprising a polymer containing conductive grains, projecting on one side of the support film 4 opposite the contact pads 5. In the case of connection pads 10 of conductive material, the latter is preferably in a plastic state before the incorporation of the module into the integrated circuit card according to the invention.
Afin de permettre une liaison entre les plages conductrices 5 du module et les extrémités de l'antenne 1, les trous 9 dans le film support du module sont réalisés selon une disposition permettant leur mise en regard des plots de liaison 11 lorsque le module à circuit intégré 3 est implanté dans la carte. In order to allow a connection between the conductive pads 5 of the module and the ends of the antenna 1, the holes 9 in the support film of the module are made in an arrangement allowing their connection pads 11 to be brought into contact when the circuit module integrated 3 is installed in the card.
Dans le mode de réalisation illustré, la feuille support 2 de l'antenne 1 est réalisée en une matière synthétique renforcée, par exemple une résine époxy renforcée par des fibres de verre ou des fibres polyester et l'antenne 1 est réalisée sous forme d'un circuit imprimé sur la feuille support 2. Dans ce mode de réalisation la feuille support 2 comporte une ouverture 12 ayant une dimension transversale D supérieure à la dimension transversale d du bloc de résine 8 contenant le circuit intégré 6 (figure 5). In the illustrated embodiment, the support sheet 2 of the antenna 1 is made of a reinforced synthetic material, for example an epoxy resin reinforced with glass fibers or polyester fibers and the antenna 1 is made of a printed circuit on the support sheet 2. In this embodiment the support sheet 2 has an opening 12 having a transverse dimension D greater than the transverse dimension d of the resin block 8 containing the integrated circuit 6 (FIG. 5).
Pour la réalisation de la carte selon l'invention telle qu'illustrée sur la figure 5, la feuille support 2 de l'antenne 1 est tout d'abord recouverte sur ses deux faces avec des feuilles de matière isolante 13. Des feuilles de matière thermoplastique telles que du PVC sont par exemple appliquées sur la feuille support 2 par laminage à chaud de sorte que les feuilles de matière isolante 13 adhèrent à la feuille support 2 et fluent pour remplir de façon homogène l'ouverture 12 dans la feuille support 2. La matière remplissant l'ouverture 12 assure en outre un encastrement de la feuille support 2 dans la masse de matière thermoplastique formée par le ramollissement des feuilles 13. On obtient ainsi la structure en sandwich représentée en coupe sur la figure 2. For the production of the card according to the invention as illustrated in FIG. 5, the support sheet 2 of the antenna 1 is first of all covered on its two faces with sheets of insulating material 13. Sheets of material thermoplastic such as PVC are for example applied to the support sheet 2 by hot rolling so that the sheets of insulating material 13 adhere to the support sheet 2 and flow to homogeneously fill the opening 12 in the support sheet 2. The material filling the opening 12 also ensures that the support sheet 2 is embedded in the mass of thermoplastic material formed by the softening of the sheets 13. The sandwich structure shown in section in FIG. 2 is thus obtained.
Une cavité généralement désignée en 14 est ensuite creusée dans le corps de carte ainsi constitué (figure 3). La cavité 14 comporte une partie centrale 15 de faible diamètre mais de forte profondeur destinée à recevoir le bloc de résine 8 du module 3, et une partie périphérique 16 de plus grand diamètre et de plus faible profondeur destinée à recevoir le film support 4 et les plages conductrices 5 du module 3. On notera à ce propos que la hauteur des plots de liaison 11 est prévue pour que lors de la réalisation de la partie 16 de la cavité 14 les plots de liaison 11 de l'antenne débouchent dans le fond de la cavité. La réalisation de plots de liaison en saillie par rapport aux extrémités de l'antenne permet un usinage de la cavité avec des tolérances habituelles sans risquer d'endommager l'antenne. A cavity generally designated at 14 is then hollowed out in the card body thus formed (FIG. 3). The cavity 14 comprises a central part 15 of small diameter but of great depth intended to receive the resin block 8 of the module 3, and a peripheral part 16 of larger diameter and of smaller depth intended to receive the support film 4 and the conductive pads 5 of the module 3. It will be noted in this regard that the height of the connection pads 11 is provided so that during the production of part 16 of the cavity 14 the connection pads 11 of the antenna open into the bottom of the cavity. The production of connecting studs projecting from the ends of the antenna allows machining of the cavity with usual tolerances without risking damaging the antenna.
En outre on remarquera que la réalisation dans la feuille support 2 d'une ouverture 12 ayant une dimension transversale supérieure à la dimension transversale du bloc de résine du module 3 permet de réaliser la cavité dans une masse de matière homogène, ce qui permet d'utiliser un outil particulièrement adapté à cette matière. En outre, la matière thermoplastique homogène qui entoure la partie 15 de la cavité réalise un encastrement du bord de l'ouverture 12 de la feuille support 2, ce qui assure une meilleure résistance de la carte aux efforts auxquels elle est soumise lors des différentes manipulations que ce soit pendant la fabrication ou lors de l'utilisation. Furthermore, it will be noted that the production in the support sheet 2 of an opening 12 having a transverse dimension greater than the transverse dimension of the resin block of the module 3 makes it possible to produce the cavity in a mass of homogeneous material, which makes it possible to use a tool particularly suited to this material. In addition, the homogeneous thermoplastic material which surrounds the part 15 of the cavity embeds the edge of the opening 12 of the support sheet 2, which ensures better resistance of the card to the forces to which it is subjected during the various manipulations. whether during manufacture or during use.
Après réalisation de la cavité, le module 3 est implanté dans la carte, par exemple en disposant dans le fond de la cavité une faible quantité de colle 17 qui se répand dans l'intervalle entre le bloc de résine 8 et la paroi de la cavité 14. Lors de cette mise en place du module 3 dans le corps de carte, la matière conductrice 10 disposée dans les trous 9 du film support 4 s'écrase comme illustré par la figure 5 et assure un contact avec les plots de liaison 11, formant ainsi un organe conducteur entre les plages conductrices 5 et l'antenne 1. Lorsque la matière conductrice 10 est dans un état plastique avant la mise en place du module, on prévoit de préférence après mise en place un durcissement en température de la matière conductrice afin d'assurer une fiabilité supérieure de la connexion. On notera à ce propos que dans ce mode de réalisation les plages conductrices 5 qui sont reliées aux extrémités de l'antenne, bien qu'elles soient tournées vers l'extérieur du module, c'est-à-dire sur une face opposée au circuit intégré 6, ne sont pas utilisées pour réaliser un contact avec une machine. Les plages conductrices 5 qui sont reliées à l'antenne servent donc seulement à effectuer un pontage entre les extrémités de l'antenne et les fils 7 correspondant. After the cavity has been produced, the module 3 is installed in the card, for example by placing a small amount of glue 17 in the bottom of the cavity which spreads in the gap between the resin block 8 and the wall of the cavity 14. During this positioning of the module 3 in the card body, the conductive material 10 disposed in the holes 9 of the support film 4 is crushed as illustrated in FIG. 5 and ensures contact with the connection pads 11, thus forming a conductive member between the conductive pads 5 and the antenna 1. When the conductive material 10 is in a plastic state before the installation of the module, provision is preferably made after setting a temperature hardening of the conductive material to ensure superior reliability of the connection. It will be noted in this connection that in this embodiment the conductive pads 5 which are connected to the ends of the antenna, although they are turned towards the outside of the module, that is to say on a face opposite to the integrated circuit 6, are not used to make contact with a machine. The conductive pads 5 which are connected to the antenna therefore only serve to effect a bridging between the ends of the antenna and the corresponding wires 7.
La figure 6 illustre un second mode de réalisation dans lequel les plages conductrices 18 servant de pontage entre le circuit intégré 6 et les extrémités de l'antenne sont cette fois disposées sur la face du film support 4 portant le circuit intégré 6. FIG. 6 illustrates a second embodiment in which the conductive pads 18 serving as bridging between the integrated circuit 6 and the ends of the antenna are this time arranged on the face of the support film 4 carrying the integrated circuit 6.
Dans ce cas le module comporte de préférence à l'aplomb des plages conductrices 18, des trous 19 qui permettent de mettre un outil chauffant en contact avec les plages conductrices 18 lors de la mise en place du module. In this case, the module preferably comprises plumb with the conductive pads 18, holes 19 which make it possible to put a heating tool in contact with the conductive pads 18 when the module is put in place.
Les plots de connexion 10 et les plots de liaison 11 qui servent à relier les plages conductrices 18 aux extrémités de l'antenne 1 sont alors avantageusement réalisés en matière conductrice fusible, ce qui permet de réaliser une soudure à chaud et d'obtenir une liaison présentant une résistance électrique particulièrement faible entre les plages conductrices et l'antenne.The connection pads 10 and the connection pads 11 which serve to connect the conductive pads 18 to the ends of the antenna 1 are then advantageously made of fusible conductive material, which makes it possible to carry out hot welding and to obtain a connection having a particularly low electrical resistance between the conductive pads and the antenna.
Par ailleurs dans ce mode de réalisation le module est fixé par un cordon de colle 20 disposé dans le fond de la partie 16 de la cavité 14 en l'interrompant à l'aplomb des plots de liaison 11. Furthermore, in this embodiment, the module is fixed by a bead of glue 20 disposed in the bottom of the part 16 of the cavity 14, interrupting it directly above the connection pads 11.
La figure 7 illustre un troisième mode de réalisation dans lequel l'antenne 1 n'est plus portée par une feuille support en résine époxy prise en sandwich entre deux feuilles thermoplastiques, mais est directement réalisée sur une feuille thermoplastique qu'il suffit donc de recouvrir sur la face comportant l'antenne avec une feuille de même nature pour obtenir un corps de carte en matière homogène. FIG. 7 illustrates a third embodiment in which the antenna 1 is no longer carried by an epoxy resin support sheet sandwiched between two thermoplastic sheets, but is directly produced on a thermoplastic sheet which therefore suffices to cover on the face comprising the antenna with a sheet of the same kind to obtain a card body of homogeneous material.
En outre dans ce troisième mode de réalisation la liaison entre les plages conductrices 5 et l'antenne 1 est assurée par des organes conducteurs rigides, ici des vis 21 qui traversent les plages conductrices 5 et les extrémités correspondantes de l'antenne 1. Dans ce cas l'organe conducteur est mis en place après fixation du module dans la cavité de la carte. Furthermore, in this third embodiment, the connection between the conductive pads 5 and the antenna 1 is ensured by rigid conductive members, here screws 21 which pass through the conductive pads 5 and the corresponding ends of the antenna 1. In this if the conductive member is put in place after fixing the module in the cavity of the card.
Bien entendu l'invention n'est pas limitée au mode de réalisation décrit et on peut y apporter des variantes de réalisation sans sortir du cadre de l'inven tion tel que défini par les revendications. Of course, the invention is not limited to the embodiment described and it is possible to make variant embodiments without departing from the scope of the invention as defined by the claims.
En particulier, les différents modes de réalisation du corps de carte et du module peuvent être combinés selon des assemblages différents de ceux illustrés. In particular, the different embodiments of the card body and of the module can be combined according to assemblies different from those illustrated.
Bien que l'invention ait été décrite en disposant de la matière conductrice dans les trous 9 du film support 4 pour former des plots de connexion 10, préalablement à la mise en place du module 3, cette partie de l'organe conducteur entre les plages conductrices 5 et l'antenne 1 peut être réalisée en disposant des gouttes de matière conductrice 10 sur les plots de liaison 11 après réalisation de la cavité 14, la matière conductrice venant alors remplir les trous 9 du film support 4 pour assurer une liaison avec les plages conductrices 5 lors de la mise en place du module 3 dans le corps de carte. On peut également réaliser des plots de connexion 10 sous forme de pions en matériau rigide, par exemple en métal, qui sont insérés dans les trous 9 et s'enfoncent dans les plots de liaison 11 lors de la mise en place du module. Although the invention has been described by disposing the conductive material in the holes 9 of the support film 4 to form connection pads 10, prior to the installation of the module 3, this part of the conductive member between the pads 5 and the antenna 1 can be produced by placing drops of conductive material 10 on the connection pads 11 after the cavity 14 has been produced, the conductive material then filling the holes 9 of the support film 4 to ensure a connection with the conductive pads 5 when the module 3 is placed in the card body. It is also possible to make connection pads 10 in the form of pins of rigid material, for example metal, which are inserted into the holes 9 and sink into the connection pads 11 during the positioning of the module.
Comme illustré par la figure 1, la feuille support 2 et les feuilles de recouvrement 13 sont de préférence réalisées sous forme de bande continue, éventuellement pourvues de perforations latérales non représentées, afin de réaliser une série de cartes par déplacements séquentiels des bandes à des postes de travail successifs. As illustrated in FIG. 1, the support sheet 2 and the covering sheets 13 are preferably produced in the form of a continuous strip, possibly provided with lateral perforations not shown, in order to produce a series of cards by sequential movement of the strips at stations successive work.
Claims (10)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9609802A FR2752077B1 (en) | 1996-08-02 | 1996-08-02 | INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE |
| AT97936722T ATE194242T1 (en) | 1996-08-02 | 1997-07-31 | COMBINED CHIP CARD |
| US09/230,718 US6301119B1 (en) | 1996-08-02 | 1997-07-31 | Integrated circuit card with two connection modes |
| PCT/FR1997/001434 WO1998006063A1 (en) | 1996-08-02 | 1997-07-31 | Integrated circuit card with two connection modes |
| ES97936722T ES2149000T3 (en) | 1996-08-02 | 1997-07-31 | INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION. |
| AU39445/97A AU3944597A (en) | 1996-08-02 | 1997-07-31 | Integrated circuit card with two connection modes |
| DE69702399T DE69702399T2 (en) | 1996-08-02 | 1997-07-31 | COMBINED CHIP CARD |
| CN97196976A CN1116655C (en) | 1996-08-02 | 1997-07-31 | Integrated circuit card with two connection modes |
| EP97936722A EP0917688B1 (en) | 1996-08-02 | 1997-07-31 | Integrated circuit card with two connection modes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9609802A FR2752077B1 (en) | 1996-08-02 | 1996-08-02 | INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2752077A1 true FR2752077A1 (en) | 1998-02-06 |
| FR2752077B1 FR2752077B1 (en) | 1998-09-18 |
Family
ID=9494782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9609802A Expired - Fee Related FR2752077B1 (en) | 1996-08-02 | 1996-08-02 | INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2752077B1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2764414A1 (en) * | 1997-06-10 | 1998-12-11 | Gemplus Card Int | NON-CONTACT CHIP CARD MANUFACTURING PROCESS |
| FR2775810A1 (en) * | 1998-03-09 | 1999-09-10 | Gemplus Card Int | Ultra-flat thin contact-free chip card production |
| WO2000077731A1 (en) * | 1999-06-15 | 2000-12-21 | Gemplus | Device and method for making devices comprising at least a chip mounted on a support |
| FR3026529A1 (en) * | 2014-09-30 | 2016-04-01 | Linxens Holding | METHOD FOR MANUFACTURING CHIP CARD AND CHIP CARD OBTAINED THEREBY |
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|---|---|---|---|---|
| EP0671705A2 (en) * | 1994-02-14 | 1995-09-13 | Gemplus Card International | Manufacturing process for a contactless card and contactless card |
| EP0682321A2 (en) * | 1994-05-11 | 1995-11-15 | Giesecke & Devrient GmbH | Record carrier with integrated circuit |
| FR2726106A1 (en) * | 1994-10-21 | 1996-04-26 | Solaic Sa | Smart card usable with non-contact and contact type readers |
| DE19500925A1 (en) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Integrated circuit (I.C) card or "chip" card |
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- 1996-08-02 FR FR9609802A patent/FR2752077B1/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0671705A2 (en) * | 1994-02-14 | 1995-09-13 | Gemplus Card International | Manufacturing process for a contactless card and contactless card |
| EP0682321A2 (en) * | 1994-05-11 | 1995-11-15 | Giesecke & Devrient GmbH | Record carrier with integrated circuit |
| FR2726106A1 (en) * | 1994-10-21 | 1996-04-26 | Solaic Sa | Smart card usable with non-contact and contact type readers |
| DE19500925A1 (en) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Integrated circuit (I.C) card or "chip" card |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2764414A1 (en) * | 1997-06-10 | 1998-12-11 | Gemplus Card Int | NON-CONTACT CHIP CARD MANUFACTURING PROCESS |
| FR2775810A1 (en) * | 1998-03-09 | 1999-09-10 | Gemplus Card Int | Ultra-flat thin contact-free chip card production |
| WO1999046728A1 (en) * | 1998-03-09 | 1999-09-16 | Gemplus | Method for making contactless cards |
| US6957481B1 (en) | 1998-03-09 | 2005-10-25 | Gemplus | Method for making contactless cards |
| US7204427B2 (en) | 1998-03-09 | 2007-04-17 | Gemplus | Method for making contactless cards |
| US7494068B2 (en) | 1998-03-09 | 2009-02-24 | Gemalto Sa | Contactless transponder |
| WO2000077731A1 (en) * | 1999-06-15 | 2000-12-21 | Gemplus | Device and method for making devices comprising at least a chip mounted on a support |
| FR2795199A1 (en) * | 1999-06-15 | 2000-12-22 | Gemplus Card Int | DEVICE AND METHOD FOR MANUFACTURING DEVICES COMPRISING AT LEAST ONE CHIP MOUNTED ON A SUPPORT |
| FR3026529A1 (en) * | 2014-09-30 | 2016-04-01 | Linxens Holding | METHOD FOR MANUFACTURING CHIP CARD AND CHIP CARD OBTAINED THEREBY |
| US10592796B2 (en) | 2014-09-30 | 2020-03-17 | Linxens Holding | Chip card manufacturing method, and chip card obtained by said method |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2752077B1 (en) | 1998-09-18 |
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