DE4224994A1 - Equipment to press module flush into impression on face of chip card - positions module and card on base and has system with heated centre tool to stamp module and outer part to act on surrounding card - Google Patents

Equipment to press module flush into impression on face of chip card - positions module and card on base and has system with heated centre tool to stamp module and outer part to act on surrounding card

Info

Publication number
DE4224994A1
DE4224994A1 DE4224994A DE4224994A DE4224994A1 DE 4224994 A1 DE4224994 A1 DE 4224994A1 DE 4224994 A DE4224994 A DE 4224994A DE 4224994 A DE4224994 A DE 4224994A DE 4224994 A1 DE4224994 A1 DE 4224994A1
Authority
DE
Germany
Prior art keywords
stamp
card
module
pressure
flush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4224994A
Other languages
German (de)
Inventor
Bernd Koenig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RUHLAMAT AUTOMATISIERUNGSTECHN
Original Assignee
RUHLAMAT AUTOMATISIERUNGSTECHN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RUHLAMAT AUTOMATISIERUNGSTECHN filed Critical RUHLAMAT AUTOMATISIERUNGSTECHN
Priority to DE4224994A priority Critical patent/DE4224994A1/en
Publication of DE4224994A1 publication Critical patent/DE4224994A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/64—Joining a non-plastics element to a plastics element, e.g. by force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Equipment presses a module into an impression in a flat card so that its face is flush with that of the card, and, in particular, presses a module with the cast chip of a chip card. The pressure tool used has a stamping member on the underside; because of its cross-section this rests only against the module; the tool also has a reference stamp which rests solely against the surface of the card round the impression and is synchronised with the stamping member. Pref., typically an adjustable height arm (3) on a column (2) holds a plate (4) carrying the stamping tool by its spring-loaded (7) flange (5). This tool consists of a pressure member (8) and its surrounding reference stamp (9). The centre of the inner member (8) has a heater (10) insulated by an outer sleeve (11); moreover both parts (8) and (9) rests on an insulating base (20). A top member (12) applies downward pressure to the flange (5). A chip card (14) lies on the plate (18) and has an impression (15) into which a flush module (16) fits. The inner stamp (8) is positioned on to the card (14), and the top pressure tool (12) applies pressure for the action required. ADVANTAGE - The flush impressed surfaces are produced without needing special high accuracy or expensive tight control in production.

Description

Die Erfindung betrifft eine Vorrichtung zum flächenbündi­ gen Eindrücken eines Moduls mittels eines Stempels in eine Ausnehmung einer auf einer Platte flach aufliegenden Karte, insbesondere eines Moduls mit vergossenem Chips in eine Chipkarte.The invention relates to a device for flush pressing a module in with a stamp in a recess of one lying flat on a plate Card, especially a module with potted chips in a chip card.

Bei der Herstellung von Chipkarten ist es erforderlich, daß der einen Modul bildende Chip flächenbündig in die Ausnehmung der Karte eingeklebt wird. Hierzu gibt man entweder in die Ausnehmung der Karte Sekundenkleber ein und drückt dann mittels eines unbeheizten Stempels den Modul so weit in die Ausnehmung, daß er bei der fertigen Karte mit seiner Oberfläche mit der Oberfläche der Karte fluchtet. Um das zu erreichen, muß der Stempel einen zur Oberseite der Karte sehr genau festgelegten Hub ausfüh­ ren, was bei der Presse hohe Präzision und konstruktiven Aufwand erfordert.When manufacturing chip cards, it is necessary that the chip forming a module is flush in the Recess of the card is glued. For this one gives either super glue into the recess of the card and then presses the with an unheated stamp Module so far into the recess that it is in the finished Map with its surface with the surface of the map flees. In order to achieve this, the stamp must be one Execute the top of the card very precisely defined stroke ren what the press high precision and constructive Effort required.

Der Erfindung liegt das Problem zugrunde, eine Vorrich­ tung der eingangs genannten Art so auszubilden, daß ohne unerwünscht hoher Fertigungsgenauigkeit oder größeren Steuerungsaufwand bei der Vorrichtung ein flächenbündiges Eindrücken eines Moduls in eine Karte möglich wird.The invention is based on the problem, a Vorrich tion of the type mentioned in such a way that without undesirably high manufacturing accuracy or larger Control effort for the device a flush Pushing a module into a card becomes possible.

Dieses Problem wird erfindungsgemäß dadurch gelöst, daß der Stempel aus einem an seiner Unterseite im Querschnitt ausschließlich zum Aufsitzen auf den Modul bemessenen Druckstempel und einem ausschließlich zum Aufpressen auf der die Ausnehmung umgebenden Oberfläche der Karte be­ messenen, beim Pressen synchron mit dem Druckstempel auf die Chipkartenoberfläche aufsetzenden Referenzstempel be­ steht.This problem is solved according to the invention in that the stamp of a cross section on its underside only for mounting on the module Stamp and one only for pressing on the surface of the card surrounding the recess measured, synchronized with the pressure stamp when pressing  the reference stamp on the chip card surface stands.

Durch diese zweiteilige Ausbildung des Stempels kann die­ ser beim Pressen einfach so weit in Richtung der Karte bewegt werden, bis sein Referenzstempel auf ihr aufsitzt. Der Druckstempel hat dann zwangsläufig die richtige Stel­ lung erreicht, um ein flächenbündiges Verkleben des Mo­ duls in der Ausnehmung zu ermöglichen. Die erfindungsge­ mäße Vorrichtung ermöglicht deshalb, mit geringem kon­ struktiven Aufwand bei der Gestaltung und Steuerung der als Presse dienenden Vorrichtung die erforderliche Flä­ chenbündigkeit zu erreichen.Through this two-part design of the stamp, the When pressing, just so far in the direction of the card be moved until its reference stamp sits on it. The pressure stamp then necessarily has the correct position achieved to ensure that the Mo to allow duls in the recess. The fiction moderate device therefore allows, with low con structural effort in the design and control of the as a press device the required area to achieve flush.

Konstruktiv besonders einfach ist der Stempel gestaltet, wenn der Referenzstempel den Druckstempel umschließt und koaxial zu ihm angeordnet ist. Weiterhin wird hierdurch die Karte rund um ihre Ausnehmung herum gleichmäßig nie­ dergehalten, was zusätzlich die Flächenbündigkeit för­ dert.The stamp has a particularly simple design, if the reference stamp encloses the printing stamp and is arranged coaxially to him. This will continue the card never evenly around its recess which also promotes flushness different.

Die für die Klebeverbindung eventuell erforderliche Wärme kann ohne wesentliche Verluste vom Druckstempel über den Modul zum Heißkleber gelangen, so daß keine unerwünschte Erwärmung der Karte in dem den Modul umgebenden Bereich über den Referenzstempel eintritt, wenn gemäß einer ande­ ren Weiterbildung der Erfindung der Druckstempel eine Heizpatrone enthält und zwischen dem Druckstempel und dem Referenzstempel eine Isolierhülse angeordnet ist.The heat that may be required for the adhesive connection can without significant losses from the stamp over the Module to the hot glue so that no unwanted Heating of the card in the area surrounding the module via the reference stamp if, according to another ren further development of the invention of the pressure stamp Includes heating cartridge and between the pressure stamp and the Reference stamp an insulating sleeve is arranged.

Der Stempel kann sich zu Beginn des Preßvorganges durch geringfügiges Kippen nach der Oberfläche der Karte aus­ richten, so daß ein Pressen senkrecht zur Kartenebene zwangsläufig sichergestellt ist, wenn der aus Druckstem­ pel und Referenzstempel bestehende Stempel mit einem Flansch oder einem anderen radial vorspringenden Teil an seiner oberen Seite von oben her auf einer Halteplatte eines die Preßkraft übertragenden, höhenverfahrbaren Hal­ tearmes aufsitzt und wenn der Haltearm mit geringem Ab­ stand zur Oberseite des Stempels oberhalb von ihm ein Druckstück hat.The stamp can go through at the beginning of the pressing process slightly tilting towards the surface of the card align so that pressing perpendicular to the plane of the card is inevitably ensured if the out of pressure system existing stamp with a Flange or other radially projecting part  its upper side from above on a holding plate a height-moving Hal that transmits the pressing force tearmes sits on and if the holding arm with little ab stood at the top of the stamp above him Pressure piece has.

Die Preßkraft läßt sich ohne eine Verkantungskomponente in den Stempel einleiten, wenn das Druckstück eine dem Stempel zugewandte, kugelförmige Oberfläche hat.The pressing force can be done without a tilting component introduce into the stamp if the pressure piece is one of the Stamp has a spherical surface facing.

Statt das Druckstück mit einer kugelförmigen Fläche zu versehen, kann man gemäß einer besonders einfachen Wei­ terbildung der Erfindung zwischen dem Druckstück und der Oberseite des Stempels eine Kugel mit axialem Spiel an­ ordnen. Diese Kugel überträgt dann beim Pressen die Kraft vom Druckstück auf den Stempel.Instead of the thrust piece with a spherical surface provided, you can according to a particularly simple Wei terbildung the invention between the pressure piece and the Ball with axial play on top of the stamp organize. This ball then transmits the force when pressed from the pressure piece to the stamp.

Der Stempel wird auf einfache Weise in einer Grundstel­ lung gehalten, wenn er gemäß einer anderen Ausgestaltung der Erfindung durch zumindest drei Federn mit seinem Flansch gegen die Halteplatte vorgespannt ist.The stamp is simple in a basic position lung held if it is according to another configuration the invention by at least three springs with his Flange is biased against the holding plate.

Von Vorteil kann es auch sein, wenn der Referenzstempel über eine Anpaßscheibe gegenüber dem Druckstempel so an­ geordnet ist, daß die untere Stirnfläche des Druckstem­ pels nach unten hin geringfügig über den Referenzstempel ragt. Hierdurch kann berücksichtigt werden, daß der Modul nach dem Einpressen dazu neigen kann, einen geringen Be­ trag "zurückzufedern".It can also be advantageous if the reference stamp via a matching disc opposite the pressure stamp is ordered that the lower end face of the Druckstem pels down slightly over the reference stamp protrudes. This can take into account that the module after being pressed in may have a low loading "spring back".

Die Erfindung läßt zahlreiche Ausführungsformen zu. Zur weiteren Verdeutlichung ihres Grundprinzips ist eine da­ von in der Zeichnung dargestellt und wird nachfolgend be­ schrieben. Diese zeigt in The invention permits numerous embodiments. For there is a further clarification of their basic principle of shown in the drawing and will be below wrote. This shows in  

Fig. 1 einen senkrechten Schnitt durch die Vor­ richtung nach der Erfindung, Fig. 1 is a vertical section through the device according to the invention before,

Fig. 2 einen Schnitt durch einen Teilbereich einer Karte mit einem eingeklebten Modul. Fig. 2 shows a section through a portion of a card with a glued-in module.

Die erfindungsgemäße Vorrichtung hat auf einem Tisch 1 eine Säule 2, auf der höhenverfahrbar ein Haltearm 3 an­ geordnet ist. Dieser Haltearm 3 hat eine Halteplatte 4, auf der von oben her ein Flansch 5 eines Stempels 6 auf­ liegt. Eine schwache Feder 7, die zwischen der Oberseite des Flansches 5 und einer nach unten weisenden Fläche des Haltearmes 3 gespannt ist, spannt den Flansch 5 in der auf der Halteplatte 4 aufsitzenden Lage vor.The device according to the invention has a column 2 on a table 1 , on which a holding arm 3 can be moved in height. This holding arm 3 has a holding plate 4 , on which a flange 5 of a plunger 6 lies from above. A weak spring 7 , which is stretched between the top of the flange 5 and a downward-facing surface of the holding arm 3 , biases the flange 5 in the position seated on the holding plate 4 .

Wichtig für die Erfindung ist, daß der Stempel 6 aus ei­ nem Druckstempel 8 und einem diesen umgebenden, rohrför­ migen Referenzstempel 9 besteht. Im Inneren des Druck­ stempels 8 ist eine Heizpatrone 10 angeordnet. Um zu ver­ hindern, daß die von der Heizpatrone 10 erzeugte Wärme vom Druckstempel 8 in den Referenzstempel 9 gelangen kann, ist zwischen dem Druckstempel 8 und dem Referenz­ stempel 9 eine Isolierhülse 11 angeordnet. Desweiteren sitzen der Druckstempel 8 und der Referenzstempel 9 auf einer Isolierscheibe 20, was einen direkten Kontakt bei­ der Stempel zueinander verhindert.It is important for the invention that the stamp 6 consists of egg nem stamp 8 and a surrounding, rohrför shaped reference stamp 9 . Inside the pressure stamp 8 , a heating cartridge 10 is arranged. To ver prevent that the heat generated by the heating cartridge 10 from the plunger 8 can move in the reference punch 9, between the plunger 8 and the reference is arranged stamp 9 an insulating sleeve. 11 Furthermore, the pressure stamp 8 and the reference stamp 9 are seated on an insulating disk 20 , which prevents direct contact with one another in the stamp.

Der Haltearm 3 hat oberhalb des Stempels 6 ein Druckstück 12. Unterhalb dieses Druckstückes 12 ist im Haltearm 3 mit geringem Abstand zum Druckstück 12 eine Kugel 13 an­ geordnet, welche auf der Oberseite des Flansches 5 auf­ liegt.The holding arm 3 has a pressure piece 12 above the plunger 6 . Below this pressure piece 12, a ball 13 of the supporting arm 3 is at a small distance to pressure piece 12 arranged, which is located on the upper side of the flange 5 on.

Unterhalb des Stempels 6 ist in Fig. 1 eine auf einer Platte 18 aufliegende Karte 14 dargestellt, bei der es sich um eine Chipkarte handeln kann und von der in Fig. 2 stark vergrößert ein Bereich im Schnitt dargestellt ist. Wie die Fig. 2 zeigt, hat die Karte 14 eine durch Fräsen erzeugte Ausnehmung 15, in der ein Modul 16 mit vergossenem Chip mittels eines Heißklebers 17 derart ein­ geklebt ist, daß der Modul 16 genau flächenbündig in der Karte 14 sitzt.Below the punch 6, a surface mounted on a plate 18 is card 14 in Fig. 1, which may be a smart card and greatly from that in Fig. 2 enlarges an area is shown in section. As shown in FIG. 2, the card 14 has a recess 15 produced by milling, in which a module 16 with a potted chip is glued by means of a hot glue 17 such that the module 16 sits precisely flush in the card 14 .

Zum Einpressen des Moduls 16 in die Ausnehmung 15 fährt man zunächst den Haltearm 3 nach unten. Dabei setzen sich zunächst mit geringer Kraft der Druckstempel 8 mit einem Preßkörper 19 auf den Modul 16 und der Referenzstempel 9 auf die Karte 14. Da zwischen der Kugel 13 und dem Druck­ stück 12 geringes Spiel besteht, kann der Stempel 4 sich begrenzt relativ zum Haltearm 3 bewegen und dadurch nach der Karte ausrichten. Erst wenn das Spiel zwischen Kugel 13 und Druckstück 12 überwunden ist wird vom Druckstück 12 über die Kugel 13 die erforderliche Preßkraft auf den Modul 16 und die Karte 14 übertragen.To press the module 16 into the recess 15 , the holding arm 3 is first moved downwards. Initially, the pressure stamp 8 with a pressing body 19 sits on the module 16 and the reference stamp 9 on the card 14 with little force. Since there is little play between the ball 13 and the pressure piece 12 , the stamp 4 can move relative to the holding arm 3 to a limited extent and thereby align with the card. Only when the clearance between the ball 13 and pressure piece 12 has been overcome, the required pressing force to the module 16 and the card 14 is transmitted from the pressing piece 12 via the ball. 13

Abschließend sei bemerkt, daß es auch vorteilhaft sein kann, den Druckstempel 8 nach unten hin geringfügig über den Referenzstempel 9 ragen zu lassen, was vorteilhafter­ weise dadurch geschieht, daß zwischen dem Referenzstempel 9 und dem Druckstempel 8 eine Anpaßscheibe 21 angeordnet wird.Finally it should be noted that it may also be advantageous to allow the plunger 8 downwards slightly protrude above the reference punch 9, which is done advantageously, that between the reference punch 9 and the plunger 8 is arranged a Impedance adapter 21st

BezugszeichenlisteReference list

 1 Tisch
 2 Säule
 3 Haltearm
 4 Halteplatte
 5 Flansch
 6 Stempel
 7 Feder
 8 Druckstempel
 9 Referenzstempel
10 Heizpatrone
11 Isolierhülse
12 Druckstück
13 Kugel
14 Karte
15 Ausnehmung
16 Modul
17 Heißkleber
18 Platte
19 Preßkörper
20 Isolierscheibe
21 Anpaßscheibe 1 table
2 pillar
3 holding arm
4 holding plate
5 flange
6 stamps
7 spring
8 stamps
9 reference stamps
10 heating cartridges
11 insulating sleeve
12 pressure piece
13 bullet
14 card
15 recess
16 module
17 hot glue
18 plate
19 compacts
20 insulating washer
21 adapter plate

Claims (8)

1. Vorrichtung zum flächenbündigen Eindrücken eines Mo­ duls mittels eines Stempels in eine Ausnehmung einer auf einer Platte flach aufliegenden Karte, insbesondere eines Moduls mit vergossenem Chip einer Chipkarte, dadurch ge­ kennzeichnet, daß der Stempel (6) aus einem an seiner Un­ terseite im Querschnitt ausschließlich zum Aufsitzen auf den Modul (16) bemessenen Druckstempel (8) und einem aus­ schließlich zum Aufsitzen auf der die Ausnehmung (15) um­ gebenden Oberfläche der Karte (14) bemessenen, beim Pres­ sen synchron mit dem Druckstempel (8) auf die Chipkarten­ oberfläche aufsetzenden Referenzstempel (9) besteht.1. Device for flush-fitting a Mo module by means of a stamp in a recess of a card lying flat on a plate, in particular a module with potted chip of a chip card, characterized in that the stamp ( 6 ) from a on its underside in cross section exclusively for sitting on the module ( 16 ) sized pressure stamp ( 8 ) and one finally for sitting on the recess ( 15 ) surrounding surface of the card ( 14 ) sized, when pressing in sync with the pressure stamp ( 8 ) on the chip cards reference stamp ( 9 ) on the surface. 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß der Referenzstempel (9) den Druckstempel (8) um­ schließt und koaxial zu ihm angeordnet ist.2. Device according to claim 1, characterized in that the reference stamp ( 9 ) closes the pressure stamp ( 8 ) and is arranged coaxially to it. 3. Vorrichtung nach den Ansprüchen 1 oder 2, dadurch ge­ kennzeichnet, daß der Druckstempel (8) eine Heizpatrone (10) enthält und zwischen dem Druckstempel (8) und dem Referenzstempel (9) eine Isolierhülse (11) angeordnet ist.3. Device according to claims 1 or 2, characterized in that the pressure stamp ( 8 ) contains a heating cartridge ( 10 ) and between the pressure stamp ( 8 ) and the reference stamp ( 9 ) an insulating sleeve ( 11 ) is arranged. 4. Vorrichtung nach zumindest einem der vorangehenden An­ sprüche, dadurch gekennzeichnet, daß der aus Druckstempel (8) und Referenzstempel (9) bestehende Stempel (6) mit einem Flansch (5) oder einem anderen radial vorspringen­ den Teil an seiner oberen Seite von oben her auf einer Halteplatte (4) eines die Preßkraft übertragenden, höhen­ verfahrbaren Haltearmes (3) aufsitzt und daß der Haltearm (3) mit geringem Abstand zur Oberseite des Stempels (6) oberhalb von ihm ein Druckstück (12) hat. 4. The device according to at least one of the preceding claims, characterized in that the pressure stamp ( 8 ) and reference stamp ( 9 ) existing stamp ( 6 ) with a flange ( 5 ) or another radially project the part on its upper side from above forth on a holding plate ( 4 ) of the pressing force transmitting, vertically movable holding arm ( 3 ) and that the holding arm ( 3 ) with a small distance to the top of the punch ( 6 ) above it has a pressure piece ( 12 ). 5. Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, daß das Druckstück (12) eine dem Stempel (6) zugewandte, kugelförmige Oberfläche hat.5. The device according to claim 4, characterized in that the pressure piece ( 12 ) has a spherical surface facing the stamp ( 6 ). 6. Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, daß zwischen dem Druckstück (12) und der Oberseite des Stempels (6) eine Kugel (13) mit axialem Spiel angeordnet ist.6. The device according to claim 4, characterized in that a ball ( 13 ) is arranged with axial play between the pressure piece ( 12 ) and the top of the stamp ( 6 ). 7. Vorrichtung nach zumindest einem der vorangehenden An­ sprüche, dadurch gekennzeichnet, daß der Stempel (6) durch zumindest drei Federn (7) mit seinem Flansch (5) gegen die Halteplatte (4) vorgespannt ist.7. The device according to at least one of the preceding claims, characterized in that the stamp ( 6 ) by at least three springs ( 7 ) with its flange ( 5 ) against the holding plate ( 4 ) is biased. 8. Vorrichtung nach zumindest einem der vorangehenden An­ sprüche, dadurch gekennzeichnet, daß der Referenzstempel (9) über eine Anpaßscheibe (21) gegenüber dem Druckstem­ pel (8) so angeordnet ist, daß die untere Stirnfläche des Druckstempels (8) nach unten hin geringfügig über den Re­ ferenzstempel (9) ragt.8. The device according to at least one of the preceding claims, characterized in that the reference stamp ( 9 ) via an adapter plate ( 21 ) relative to the Druckstem pel ( 8 ) is arranged so that the lower end face of the pressure stamp ( 8 ) slightly downward protrudes beyond the reference stamp ( 9 ).
DE4224994A 1992-07-29 1992-07-29 Equipment to press module flush into impression on face of chip card - positions module and card on base and has system with heated centre tool to stamp module and outer part to act on surrounding card Withdrawn DE4224994A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4224994A DE4224994A1 (en) 1992-07-29 1992-07-29 Equipment to press module flush into impression on face of chip card - positions module and card on base and has system with heated centre tool to stamp module and outer part to act on surrounding card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4224994A DE4224994A1 (en) 1992-07-29 1992-07-29 Equipment to press module flush into impression on face of chip card - positions module and card on base and has system with heated centre tool to stamp module and outer part to act on surrounding card

Publications (1)

Publication Number Publication Date
DE4224994A1 true DE4224994A1 (en) 1994-02-03

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DE4224994A Withdrawn DE4224994A1 (en) 1992-07-29 1992-07-29 Equipment to press module flush into impression on face of chip card - positions module and card on base and has system with heated centre tool to stamp module and outer part to act on surrounding card

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997029455A1 (en) * 1996-02-09 1997-08-14 Solaic Contactless integrated circuit card, and method and equipment for making same
DE19637213C1 (en) * 1996-08-22 1998-02-19 Pav Card Gmbh Manufacturing method for chip card
WO1998008191A1 (en) * 1996-08-22 1998-02-26 Pav Card Gmbh Method for manufacturing an electric and mechanical connexion in a chip card module placed in a card holder recess
EP1239412A1 (en) * 2001-03-07 2002-09-11 Muehlbauer Ag Method for heat bonding a chip module with a carrier substrate
WO2004070769A2 (en) * 2003-02-05 2004-08-19 Infineon Technologies Ag Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
WO2009081251A1 (en) 2007-12-26 2009-07-02 Datacard Corporation Method and device for interleaving a module or chip
WO2020011485A1 (en) 2018-07-12 2020-01-16 Bayerische Motoren Werke Aktiengesellschaft Tool and method for pressing an auxiliary joining element together with a workpiece formed separately from the auxiliary joining element, in particular for producing a motor vehicle

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EP0013557A2 (en) * 1979-01-12 1980-07-23 Hoechst Aktiengesellschaft Method of laminating sheets and a press comprising two plates for the application of this method
DE3741925A1 (en) * 1986-12-11 1988-06-23 Mitsubishi Electric Corp IC CARDS AND METHOD FOR THEIR PRODUCTION
DE9107569U1 (en) * 1991-06-20 1991-09-26 Interlock Ag, Schlieren Pressing device for producing identification cards
DE4109959A1 (en) * 1990-03-26 1991-10-02 Mitsubishi Electric Corp METHOD FOR PRODUCING AN IC CARD

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EP0013557A2 (en) * 1979-01-12 1980-07-23 Hoechst Aktiengesellschaft Method of laminating sheets and a press comprising two plates for the application of this method
DE3741925A1 (en) * 1986-12-11 1988-06-23 Mitsubishi Electric Corp IC CARDS AND METHOD FOR THEIR PRODUCTION
DE4109959A1 (en) * 1990-03-26 1991-10-02 Mitsubishi Electric Corp METHOD FOR PRODUCING AN IC CARD
DE9107569U1 (en) * 1991-06-20 1991-09-26 Interlock Ag, Schlieren Pressing device for producing identification cards

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997029455A1 (en) * 1996-02-09 1997-08-14 Solaic Contactless integrated circuit card, and method and equipment for making same
FR2744819A1 (en) * 1996-02-09 1997-08-14 Solaic Sa CONTACTLESS INTEGRATED CIRCUIT CARD, METHOD AND TOOLS FOR MANUFACTURING SUCH A CARD
DE19637213C1 (en) * 1996-08-22 1998-02-19 Pav Card Gmbh Manufacturing method for chip card
WO1998008191A1 (en) * 1996-08-22 1998-02-26 Pav Card Gmbh Method for manufacturing an electric and mechanical connexion in a chip card module placed in a card holder recess
EP1239412A1 (en) * 2001-03-07 2002-09-11 Muehlbauer Ag Method for heat bonding a chip module with a carrier substrate
WO2004070769A2 (en) * 2003-02-05 2004-08-19 Infineon Technologies Ag Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
WO2004070769A3 (en) * 2003-02-05 2005-02-24 Infineon Technologies Ag Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
WO2009081251A1 (en) 2007-12-26 2009-07-02 Datacard Corporation Method and device for interleaving a module or chip
FR2925969A1 (en) * 2007-12-26 2009-07-03 Datacard Corp METHOD AND DEVICE FOR INTEGRATING A MODULE OR CHIP
CN101952840A (en) * 2007-12-26 2011-01-19 咨询卡有限公司 The method and apparatus that is used for insert module or chip
US8562782B2 (en) 2007-12-26 2013-10-22 Datacard Corporation Method and device for interleaving a module or chip
WO2020011485A1 (en) 2018-07-12 2020-01-16 Bayerische Motoren Werke Aktiengesellschaft Tool and method for pressing an auxiliary joining element together with a workpiece formed separately from the auxiliary joining element, in particular for producing a motor vehicle
DE102018211566A1 (en) 2018-07-12 2020-01-16 Bayerische Motoren Werke Aktiengesellschaft Tool and method for pressing an auxiliary joining element with a workpiece formed separately from the auxiliary joining element, in particular for producing a motor vehicle
US11267043B2 (en) 2018-07-12 2022-03-08 Bayerische Motoren Werke Aktiengesellschaft Tool and method for pressing an auxiliary joining element together with a workpiece formed separately from the auxiliary joining element, in particular for producing a motor vehicle

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