Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/07773—Antenna details
  • G06K19/07788—Antenna details the antenna being of the capacitive type
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
  • G06K7/0008—General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
  • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
  • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
  • G06K7/10019—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves resolving collision on the communication channels between simultaneously or concurrently interrogated record carriers.
  • G06K7/10069—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves resolving collision on the communication channels between simultaneously or concurrently interrogated record carriers. the collision being resolved in the frequency domain, e.g. by hopping from one frequency to the other
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
  • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
  • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
  • G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
  • G06K7/10326—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers the antenna being of the very-near field type, e.g. capacitive
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Definitions

• the invention relates generally to portable remotely powered communication devices and to systems for powering up and receiving info ⁇ nation from such devices, and more particularly, to such devices and systems that employ electrostatic coupling.
• U.S. Patent No. 5,009,227 discloses a remotely powered device which uses electromagnetic coupling to derive power from a remote source and which uses both electromagnetic and electrostatic coupling to transmit stored data back to the source.
• an electromagnetic mechanism is used to remotely couple the remote device with either one or both of an exciter system and a receiver system.
• the exciter generates an excitation signal used to power up the device.
• the receiver receives the signal produced by the remote device.
• electromagnetic coupling One reason for the use of electromagnetic coupling in prior devices is that it was believed to be more efficient to remotely couple power from an exciter to a device via an electromagnetic field rather than via an electrostatic field.
• Previously electromagnetic coupling mechanisms included an oscillator as part ofthe exciter circuitry and coil antennas mounted on both the exciter circuitry and a tag or other article that embodied the device and contained its electronic circuit.
• excitation circuitry is connected to a coil antenna which radiates excitation signals that are picked up by a coil antenna mounted on a tag that contains the electronic circuit.
• the excitation signals energize the electronic circuit which automatically produces an information carrying signal that is transmitted to the receiver using electromagnetic or electrostatic coupling.
• An ongoing objective in the development of remote communication devices and associated exciters receivers ofthe general type described above has been to minimize cost and size and to improve efficiency of operation.
• a problem with the use of electromagnetic coupling between a remote device and either an exciter or a reader has been the additional complexity involved in the manufacture of remote devices that employ a coil antenna.
• the spiral layout of a typical coil antenna can be more difficult to produce than the simpler layout of an electrostatic antenna which often can be in the form of a straight wire or planar and plate-like.
• Another problem, explained above, has been the inability to efficiently couple power electrostatically using acceptable voltage levels. As a consequence, electromagnetic coupling generally has been favored over electrostatic coupling.
• the present invention provides an improved electrostatically coupled communication device and associated methods of operation, methods of manufacture and related exciter/reader systems.
• the invention provides an electronic communication device which is powered-up by electrostatic signals.
• the novel device can be relatively inexpensively produced since it employs electrostatic (capacitive) plates for both data transmission and for power-up, and therefore, does not require a magnetic coil.
• FIG. 1 is a block diagram of an exciter/reader and a remotely powered communication device in accordance with a presently preferred embodiment ofthe invention
• FIG. 2 is a block diagram of an alternative embodiment of an exciter/reader and a remotely powered communication device in which the device has a dedicated data transmission antenna element;
• FIGS 3 A-3B illustrate a test set up used to perform voltage measurements (V), across Tl and T2, in which a Tl terminal was connected to ground potential and load resistance values (K_) represented different possible loads attributable to a different possible integrated circuits connected between the Tl and T2 terminals;
• Figure 4 A provides a curve which plots voltage across Tl and T2 versus distance away from El and E2 over one inch intervals from 1 inch to 8 inches, where Tl and T2 each is rectangular and measures 4 inches by 5 inches;
• Figure 4B provides the actual voltage measurements plotted in Figure 4A
• Figure 5 A provides a curve which plots voltage across Tl and T2 versus distance away from El and E2 over one inch intervals from 1 inch to 8 inches, where Tl and T2 each is rectangular and measures 3 inches by 4 inches;
• Figure 5B provides the actual voltage measurements plotted in Figure 5A
• Figure 6 A provides a curve which plots voltage across Tl and T2 versus distance away from El and E2 over one inch intervals from 1 inch to 8 inches, where Tl and T2 each is rectangular and measures 2 inches by 3 inches;
• Figure 6B provides the actual voltage measurements plotted in Figure
• Figure 7 A provides a curve which plots voltage across Tl and T2 versus distance away from El and E2 over one inch intervals from 1 inch to 8 inches, where Tl and T2 each is rectangular and measures 0.5 inches by 5 inches;
• Figure 7B provides the actual voltage measurements plotted in Figure
• Figure 8 A is a top elevation view showing the layout of a presently preferred embodiment ofthe remotely powered communication device of
• Figure 8B is a top elevation view showing the layout of an alternative embodiment ofthe remotely powered communication device of Figure 1;
• Figure 8C is a top elevation view showing the layout of a presently preferred embodiment ofthe remotely powered communication device of Figure 2;
• Figure 8D is a top elevation view showing the layout of an alternative embodiment ofthe remotely powered communication device of Figure 1 in which no substrate is employed;
• Figure 8E is a top elevation view showing the layout of an alternative embodiment ofthe remotely powered communication device of Figure 2 in which no substrate is employed;
• Figure 9A-9C are side cross-sectional views ofthe three different constructions ofthe devices of Figures 8 A-C;
• Figure 10 is a top elevation view of an alternative embodiment of a remotely powered communication device in accordance with the invention which includes two pairs of antenna elements;
• Figure 11 is a top elevation view of an alternative embodiment of a remotely powered communication device in accordance with the invention which includes four pairs of antenna elements;
• Figures 12A-12B show the device of Figure 8 A in two different orientations relative to a portion of an array of exciter elements
• Figure 13 is a simplified top elevation view of a portion of an array of fixed exciter elements which includes elongated horizontal exciter elements and elongated vertical elements;
• Figure 14A-14C are simplified top elevation views of three more alternative configurations of a portion of an array of commutated exciter elements;
• Figure 14A shows a horizontal configuration;
• Figure 14B shows a diagonal configuration;
• Figure 14C shows a vertical configuration;
• Figure 15 is a simplified top elevation view of yet another alternative commutated exciter array configuration in which two parallel stripes of exciter elements are dynamically swept in a circular pattern;
• Figure 16 is a top elevation view of still another alternative commutated exciter array configuration in which the array is bounded by sensors which detect the motion of a communication device across the array.
• the present invention comprises a novel remotely powered communication device, an associated exciter/reader system and related methods.
• the following description is presented to enable any person skilled in the art to make and use the invention. Descriptions of specific applications are provided only as examples. Various modifications to the preferred embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
• FIG. 1 a block diagram of an exciter/reader apparatus 30 and a remotely powered communication device 32 in accordance with a presently preferred embodiment ofthe invention.
• the exciter portion ofthe apparatus 30 produces ele ⁇ rostatic signals that are used to power up the device 32.
• the reader portion ofthe apparatus 30 receives electrostatic communication signals produced by the device 32 once it has been powered up.
• the device for example, can serve as an electronic identification card.
• the exciter sends electrostatic signals that power up the device 32.
• the device then automatically transmits an electrostatic signal that carries identifying information
• the reader portion ofthe apparatus 30 receives the identifying signals and determines whether to trigger some a ⁇ ion such as the opening of a locked door.
• the exciter portion ofthe apparatus 30 includes an oscillator 34, which generates a signal at frequency F 0 .
• the oscillator is conne ⁇ ed to a power amplifier 35 which, in turn, is conne ⁇ ed to the primary coil 36 of an impedance transformer 37.
• a secondary coil 38 of the impedance transformer 37 is conne ⁇ ed in parallel with a capacitor 39.
• a top terminal ofthe secondary coil 38 is conne ⁇ ed to a first electrostatic exciter antenna plate El, and a bottom terminal ofthe secondary coil 38 is conne ⁇ ed to a second electrostatic exciter antenna plate E2.
• the exciter includes a pair of antenna plates that operate as a balanced out of phase pair.
• the exciter includes an array of balanced out of phase antenna plates.
• Figures 1 discusses only two exemplary exciter plates, El and
• wire antenna exciter elements or a comb-like structure may be employed instead of antenna plates, for example.
• the reader portion ofthe apparatus 30 includes a single-plate electrostatic reader antenna plate Rl conne ⁇ ed to a receiver 40 which provides input signals to a dete ⁇ or 41.
• An I O processor 42 receives signals from the dete ⁇ or 41.
• a current embodiment ofthe remotely powered communication device 32 includes first and second electrostatic device antenna plates Tl and T2 which are connected as shown to provide clock A and clock B inputs to a full wave bridge re ⁇ ifier 43. Note that Tl and T2 are electrically isolated from each other. Alternatively, for example, wire antenna elements can be used instead of plates.
• a capacitor 44 is conne ⁇ ed across the V+ and "common" terminals ofthe rectifier 43.
• the clock B input is also provided to a frequency dividing counter circuit 45.
• the counter 45 is conne ⁇ ed to provide address signals to a digital storage device, a read only memory (ROM) 46 in a current embodiment.
• ROM read only memory
• a modulator circuit in the illustrative embodiment a biphase modulator implemented as an exclusive-or gate 47, receives clock signals, at frequency F ⁇ n, from the counter 45 and data output from the ROM 46.
• the output of modulator circuit (the exclusive-or gate 47) is provided via diode 48 and resistor 49 to the clock B line.
• the device 32 of the presently preferred embodiment employs biphase modulation
• any modulation technique can be used consistent with the invention.
• PSK, FSK, AM or other modulation schemes can be used as alternatives.
• the modulated signal is returned to the clock B input for transmission to the reader via antenna plate T2.
• the modulated signal could be provided to a separate antenna element (not shown) for transmission to the reader.
• An alternate embodiment which includes such a separate data transmission antenna element is discussed below with reference to Figure 2.
• the oscillator 34 of a presently preferred embodiment generates a 4 Megahertz signal which is approximately 2-5 volts peak to peak.
• the signal is boosted to approximately 20-30 volts peak to peak by the amplifier 35.
• the impedance transformer 37 further boosts the voltage to approximately 300-400 volts peak to peak.
• the parallel connected capacitor 39 tunes the transformer circuitry to make it resonant at the oscillator frequency.
• the signal provided to exciter plate El via the top terminal ofthe secondary coil 38 is balanced and 180° out of phase with the signal provided via the bottom terminal ofthe secondary coil 38 to exciter plate E2.
• the exciter plates El and E2 produce electrostatic energy, indicated by the arrows, which is used to power-up the communication device 32.
• the desired voltage levels ofthe electric field may depend upon fa ⁇ ors such as the distance over which the exciter is to power-up the device 32. Additionally, the desired voltage levels may, for example, depend upon frequency emission requirements ofthe country in which the exciter will operate. Moreover, certain operations such as writing data into device memory may require more power than other operations such as reading information from device memory.
• the ele ⁇ rostatic field produced by the exciter elements El and E2 excites voltages on antenna elements Tl and T2.
• the Tl element is conne ⁇ ed to provide the clock A input to the full wave bridge rectifier 43
• the T2 element is conne ⁇ ed to provide the clock B input to the rectifier 43.
• Tl and T2 are not conne ⁇ ed directly to each other.
• the capacitor 44 filters out exciter pulses from the received power up signals to ensure a pure DC output ofthe re ⁇ ifier.
• the re ⁇ ifier provides a V+ DC voltage signal relative to a "common" terminal ofthe rectifier 43. It will be appreciated that a pure D.C. signal is not required.
• the counter 45 receives the 4 Megahertz clock B signal and provides a set of address signals on lines 50 which are used to address and to set the data rate for the output of data from the ROM 46.
• the different signals on the different lines 50 are produced by dividing the 4 Megahertz by different values in a manner well known by those skilled in the art.
• the data rate out ofthe ROM is significandy
• Megahertz signal signals of a different frequency could be used.
• a 13.56 Megahertz signal or a 37.5 Megahertz signal could be employed.
• the counter also provides on line 51 a 2 Megahertz carrier signal which serves as the clock input (or carrier signal input) to the exclusive-or gate 47.
• the data output ofthe ROM 46 serves as a data input (or modulation signal input) to the exclusive-or gate 47.
• the counter therefore, divides the input frequency by two to provide a carrier signal and sets the data rate of data signals output by the ROM 46 that modulate the carrier.
• the exclusive-or gate 47 serves as a biphase modulation circuit, and its output is a biphase modulated signal which is provided via diode 48 and resistor 49 to clock B signal line.
• the biphase signal is inje ⁇ ed back onto the T2 device element and is ele ⁇ rostatically transmitted to the receiver portion ofthe exciter/receiver 30.
• the role ofthe diode 48 and the resistor 49 is to couple modulated signals back to the clock B input.
• the electrostatic receiver antenna Rl receives the ele ⁇ rostatically transmitted signals emitted by device antenna element T2, and provides those received signals to the receiver 40 which amplifies the signals and may convert their frequency to an intermediate frequency for further amplification and bandpass filtering ofthe signals before providing them to the dete ⁇ or circuit 41 which dete ⁇ s data carried by the received signals.
• the receiver 40 and the dete ⁇ or 41 are well known circuits which need not be described in detail herein.
• the dete ⁇ or 41 provides the data signals to the I O processor 42 which produces an output in a format usable by a host computer (not shown), for example.
• the transmission of balanced out of phase electrostatic signals via exciter elements El and E2 couples energy to the device 32 via the device electrostatic antenna elements Tl and T2.
• the voltage on exciter element El is at a positive level, for example, the voltage on element E2 is at a negative level.
• the voltage on exciter element El is at a negative level.
• the voltage on exciter element E2 is at a positive level.
• the obje ⁇ ive is to have the balanced out of phase voltages on El and E2 cause the voltages of device antenna elements Tl and T2 to produce a balanced out of phase relation to each other.
• the desired result is to always have a voltage potential difference between the device elements, Tl and T2, such that a V+ DC supply voltage source can be produced relative to a "common" potential.
• the exciter elements, El and E2 are capacitively coupled to the device elements, Tl and T2. This approach permits power to be more efficiently coupled using ele ⁇ rostatic energy.
• the exciter antenna elements El and E2 produce ele ⁇ rostatic fields that are balanced and out of phase, these fields often tend to cancel each other at farther distances, reducing the risk of exceeding FCC or other regulatory agency emissions limits, for example. As a consequence, the exciter signals often can use higher power up voltage levels.
• unbalanced excitation signals can be used as an alternative in accordance with the invention.
• a single excitation antenna element could be employed to produce a periodic electrostatic excitation signal.
• a remotely powered communication device for example, that was powered up by such an unbalanced signal would include a single antenna element with one terminal conne ⁇ ed to a clock A input. It is important, however, that such alternative remotely powered communication device be coupled to an external ground potential. Note that for balanced signals there is no need for an external ground connection since a "common" ground is produced using a clock B input and balanced out of phase signals.
• the single power-up element also could be used to transmit and receive data signals as well.
• the device 32 It is desirable for the device 32 to consume relatively little power. Hence, the information carrying signals transmitted by antenna element T2 are relatively low power.
• the receiver 40 is highly sensitive and capable of extra ⁇ ing data from the relatively (low power) weak signals transmitted by the device 32.
• Tl and T2 are not required to have half wavelength dimensions of a typical ele ⁇ romagnetically excited two element antenna.
• the elements are electrostatically excited, through capacitive coupling, and need not be resonant as required for electromagnetic coupling.
• the elements can, therefore, be of an arbitrary size sufficient for capacitive (ele ⁇ rostatic) coupling.
• capacitive coupling in ⁇ eases with increased antenna area and increased signal frequency.
• the device antenna elements need not have a chara ⁇ eristic impedance as do resonant antenna elements.
• the spacing apart ofthe exciter antenna elements El and E2 should be well matched to the spacing ofthe device antenna elements Tl and T2 in order to efficiently couple energy from the exciter to the device.
• FIG. 2 there is shown a simplified block diagram of an alternative embodiment of a communication device 32" and exciter/reader 30" in accordance with the invention.
• the alternative device 32" of Figure 2 is identical to the device 32 of Figure 1 except for the addition of a third antenna element (T3) which is used solely for data transmission.
• T3 third antenna element
• the internal circuit conne ⁇ ions are identical for device 32 and device 32" except that in device 32", neither Tl" nor T2" is conne ⁇ ed to receive the output ofthe data transmission circuitry. Instead, Tl" and T2" are dedicated to receipt ofthe electrostatic power-up field that emanates from the exciter elements El" and E2".
• Tl" and T2" are conne ⁇ ed to a bridge circuit 43" and to a counter 45", but there is no connection between the clock A" node or the clock B" node and the output ofthe data modulation circuitry 47".
• the data terminal T3 is disposed in a null region between the power-up terminals Tl" and T2".
• the null position is the place on the device 32" where the power-up fields produced by the exciter elements El" and E2" substantially cancel each other out, and therefore, produce the minimum amount of interference with data signals transmitted by the device 32".
• the data transmission element T3 will experience minimal interference with transmissions to the reader element Rl".
• remote is intended to be a relative term. Depending upon the circumstances, the term, remote, may apply to distances from millimeters to larger ranges. Depending upon fa ⁇ ors such as the voltage level ofthe electrostatic signals radiated by the exciter, the exciter and the device may have to be positioned very close to one another in order to power up the device; or it may be that they can be spaced farther apart and still achieve coupling.
• the term remote just means that power is coupled over the air from the exciter to the device. It is believed that, in general, increased signal frequency and increased antenna plate area tend to increase the distance over which electrostatic signals can power-up a tag device.
• the power-up ofthe integrated circuit device 32 using ele ⁇ rostatic fields applied over distances such as those achieved in the experiments described with reference to the tables below, is a su ⁇ rising result.
• ele ⁇ rostatic signals had been used to transmit data from a tag device to a reader device.
• the data transfer signal often operated at approximately 80% ofthe power level ofthe power-up signal used to power-up the earlier tag device.
• a typical earlier reader had to be highly sensitive, achieving approximately 80-1 lOdB gain, in order to extract data from a carrier signal.
• Tl and T2 are conne ⁇ ed to opposed nodes ofthe bridge circuit 43. Each feeds the same plate of the capacitor 44.
• the capacitor plate is a node within the device 32 that is coupled to both Tl and
• FIG. 3-7 The exemplary test results illustrated in Figures 3-7 demonstrate that electrostatic coupling, in accordance with the invention, can generate sufficient energy to power-up an integrated circuit device. It will be appreciated that power is proportional to V 2 R L
• Figures 3 A-3B show the test set up used to perform voltage measurements (V) across Tl and T2. The tests were performed on a tag device in which the Tl terminal was conne ⁇ ed to ground potential.
• the load resistance values (R_) represent different possible loads attributable to a different possible integrated circuits conne ⁇ ed between the Tl and T2 terminals.
• Figure 4A provides a curve which plots voltage across Tl and T2 versus distance away from El and E2 over one inch intervals from 1 inch to 8 inches, where Tl and T2 each is re ⁇ angular and measures 4 inches by 5 inches.
• the table in Figure 4B provides the actual voltage measurements plotted in Figure 4A.
• the curves and tables in Figures 5A-5B, 6A-6B and 7A- 7B provide similar measurements for Tls and T2s that measure 3" x 4", 2" x 3" and 0.5" x 5", respe ⁇ ively.
• Vt/Vx 0.132586((A x *A l ) 0 "/D,
• V d device voltage
• FIG. 8 A a top elevation view of a presently preferred embodiment of a remote communication device 32 in accordance with the invention.
• the device 32 includes a substrate 58, a two element antenna 60, which includes a first element 62 (Tl) and a second element 64 (T2), and an integrated circuit (IC) transponder 66.
• the antenna element 60 and the IC 66 are mounted on the substrate 58.
• the entire device 32 can be encapsulated in a protective structure (not shown) such as plastic or other material.
• the IC contains the device electronics described above.
• the first and second elements 62 (Tl) and 64 (T2) comprise a conductive patte formed on the substrate.
• the elements 62 and 64 can be electrically conne ⁇ ed to high impedance terminations to pads on the bottom of the IC 66. Since the device 32 operates as a low current device, high impedance terminations can be employed.
• the two element antenna 60 and the IC 66 can be electrically conne ⁇ ed by any of a number of different mechanisms. For example, portions ofthe plates may be soldered to IC pads; or they may be secured to the pads with a condu ⁇ ive adhesive or by wire conne ⁇ ions
• FIG. 8B there is shown an alternative embodiment of a remote device 32' with an alternate antenna configuration.
• the antenna elements 62' and 64' are conne ⁇ ed to an integrated circuit 66'.
• the antenna plates and the IC all are disposed on a substrate 58'.
• the altemative device 32' operates as described with reference to Figure 1.
• the antenna elements 62' and 64' are disposed such that they are maximally spaced apart. That is, their elongated dimensions are substantially parallel to each other and pe ⁇ endicular to an axis that extends between them and interse ⁇ s the IC.
• An advantage of this increased spacing ofthe device antenna plates is a reduction ofthe risk of destructive interference between signals emanating from balanced out of phase exciter plates.
• the device 32 (32' or 32") can be produced relatively inexpensively because ofthe simple layout and construction ofthe antenna elements 62 and 64.
• Figures 9A-9C are side cross- se ⁇ ional drawings of three different constructions ofthe device of Figure 8A (8B or 8C).
• the substrate member 58 can be formed from any suitable material having desired chara ⁇ eristics such as, strength or flexibility, including paper, electrically insulating tape, polyester, polyethylene, polycarbonate, polypropylene, polypropylene with calcium carbonate (CACO 3 ) filler, plastic, or ac ⁇ ate for example.
• the antenna elements 62 and 64 are seie ⁇ ed from any suitable condu ⁇ ive material such as copper, aluminum, silver or condu ⁇ ive ink contaimng copper, aluminum, silver, graphite or other conductive fillers for example.
• the antenna material can be seie ⁇ ed based upon fa ⁇ ors such as cost and ease of assembly or construction as well as intended usage.
• the elements can be produced on the substrate by any suitable process such as deposition, printing or etching.
• any process such as offset printing or roll printing, whereby a layer of (quasi) condu ⁇ ive material is deposited on the substrate can be used.
• photocopying antenna plate pattems on paper or acetate using carbon loaded ink is possible.
• antenna pattems on a substrate are possible.
• copper antenna elements can be produced using printed circuit board (PCB) manufa ⁇ uring techniques.
• PCB printed circuit board
• etching processes such as etched copper, for instance, that can be used to produce antenna pattems on substrates.
• antenna patterns may be cut from larger sheets of conducting material or hot stamped and adhered to the substrates.
• the production method can be seie ⁇ ed based on fa ⁇ ors such as cost, durability and performance ofthe remote device.
• a communication device in accordance with the invention may comprise an integrated circuit plus electrostatic antenna elements which are not disposed on a substrate.
• FIGs 8D and 8E there are shown communication devices in accordance with the invention, each of which includes an integrated circuit and electrostatic antenna elements. Neither the device of Figure 8D nor the device of Figure 8E, however, is mounted on a substrate.
• the integrated circuit of Figure 8D is the general type described above in conne ⁇ ion with Figure 1 and is coupled to two ele ⁇ rostatic antenna elements.
• the integrated circuit of Figure 8E is the general type described above in connection with Figure 2 and is coupled to three ele ⁇ rostatic antenna elements.
• a device like that in Figures 8D or 8E, in which the IC and antenna elements are not disposed on a substrate at the time of manufacture may, nevertheless, be bonded subsequently to a substrate such as paper or plastic in order to ensure mechanical stability.
• a feature of electrostatic coupling is the use of relatively low currents and relatively high voltages when compared with ele ⁇ romagn ⁇ ic couphng.
• An advantage of lower currents is that lower conductivity materials can be used for the device antenna plates. This means that materials that are less costly and/or easier to fabricate into antenna plates often can be employed. This can reduce the cost of remotely powered communication devices produced in accordance with the invention.
• the IC 66 may have multiple high impedance terminals or pads 68 that are ele ⁇ rically conne ⁇ ed to the antenna 60. Each ofthe antenna elements 62 and 64 of the antenna ele ⁇ rically conta ⁇ s a different pad. The two plates are kept electrically isolated from each other.
• an anisotropic condu ⁇ ive adhesive 70 such as approximately 40% condu ⁇ or filler (gold, silver or copper spheres or perhaps graphite for example) is used for the dual pu ⁇ oses of securing the IC to the substrate 58 and providing an ele ⁇ rical connection between the antenna elements 62 and 64 and the IC pads.
• the anisotropic conductive adhesive 70 conducting in one direction and nonconductive in a direction approximately pe ⁇ endicular to the condu ⁇ ion path. In a present embodiment, it condu ⁇ s better along paths in which the adhesive is subje ⁇ ed to greater pressure.
• the anisotropic conductive adhesive is cured under greater pressure in the two narrow regions 72 where it is squeezed between the antenna elements 62 and 64 and the IC pads than in the wider recessed region 74 that separates the two plates between the rest ofthe IC and the substrate.
• the elements 62 and 64 therefore, are ele ⁇ rically isolated from each other.
• An advantage ofthe use ofthe anisotropic condu ⁇ ive adhesive 70 is that it need not be applied to the IC pads or to the antenna plates with precision since its condu ⁇ ivity depends upon applied pressure. Therefore, it can be easier to manufacture devices using the anisotropic condu ⁇ ive material because the adhesive can be applied to the a ⁇ ive side of an IC or onto the substrate without the concern about overlapping onto other areas. As long as regions ofthe adhesive that are to be noncondu ⁇ ing are cured under lower pressure than the condu ⁇ ive regions, they will remain nonconducting and will not interfere with the isolation ofthe two antenna elements.
• isotropic conductive adhesive 76 such as is used to secure the IC to the substrate 58 and to create an electrical connection between the antenna elements 62 and 64 and the IC pads 68.
• An isolation material 78 such as solder mask or nonconductive ink or epoxy, is used to ele ⁇ rically isolate different globs ofthe isotropic conductive adhesive 76 used to adhere the different elements 62 and 64 to different pads 68.
• the isotropic conductive adhesive condu ⁇ s equally well in all directions. It must be applied with care so that no conductive path is formed between the two ele ⁇ rically isolated antenna plates.
• Figure 9C is similar to Figure 9A except that an intermediate layer of paper or other material 80 is bonded over the antenna plate structure; a layer of adhesive 82 is applied to the intermediate layer 80; and a peel and stick layer 84 is apphed over the adhesive layer 82.
• the device 32 can be adhered or stuck to an object by peeling off the peel and stick layer 84 and pressing the adhesive layer 82 against an obje ⁇ to be identified.
• an obje ⁇ can be easily "tagged" with an inexpensive device which can store ele ⁇ ronic information about the object.
• the object for example, can be airline luggage.
• the tag device may have passenger identifying information written into its ele ⁇ ronic memory during passenger check-in.
• the device is stuck to the side ofthe luggage to identify its owner. When the owner r ⁇ rieves the luggage, he peels off the tag and discards it
• T2 must be at different voltages in order to power up the device 32.
• electrostatic coupling for power up requires that a voltage differential (between V+ supply and "common”) be s ⁇ up within the device.
• the voltage differential is established a ⁇ oss the two elements 62 and 64 by the balanced out of phase power up signals produced by the exciter.
• the two antenna elements are conne ⁇ ed to a rectifier circuit, a full bridge rectifier in the presently preferred embodiment.
• a DC voltage is produced between V+ and common.
• V+ serves as VDD voltage supply
• common serves as substrate ground for the mtegrated circuit ofthe current embodiment.
• FIG. 10 there is shown a first altemative embodiment of a remote communication device 190 in accordance with the invention.
• the device includes two pairs of antenna elements 192 and 194 disposed on a substrate 196 and conne ⁇ ed to an IC 198 as shown.
• FIG. 11 there is shown a second altemative embodiment of a remote communication device 200.
• the device includes four pairs of antenna elements 202-208 disposed on a substrate 210 and conne ⁇ ed to an IC 212 as shown.
• the manufacture ofthe devices 190 and 200 can be similar to that of the devices of Figures 9 A-C.
• the presence of additional antennas provides greater opportunities for the remote device to align with the exciter plates as will be appreciated from the following discussion.
• the excitation pattem of an array of exciter plates can be systematically varied in order to produce the greatest likelihood of power up of a remote device regardless of device antenna orientation.
• the device 32 of Figure 3A in two different orientations relative to a portion of an antenna array 86 that can be employed by the exciter/reader apparatus 30.
• the antenna array portion includes a first exciter element 88 (El) and a second exciter element 90 (E2).
• the exciter elements 88 (El) and 90 (E2) have balanced out of phase power up signals applied to them as described above. It should be appreciated that the following discussion applies to the embodiment of Figures 8B and 8C as well.
• the device 32 has its two antenna elements 62 (Tl) and 64 (T2) oriented so that one ofthe two elements, element 62 (Tl), is ele ⁇ ro ⁇ statically coupled to the exciter element 88 (El), and the other antenna element 64 (T2) is electrostatically coupled to the second exciter element 90 (E2).
• the antenna element 62 (Tl) should be positioned opposite (over) the first exciter element 88 (El) in order for the first exciter element 88 to ele ⁇ rostatically couple its voltage to the element 62 (Tl) This positioning is represented in Figure 7A by the curved arrows.
• the device antenna element 64 (T2) should be positioned opposite (over) the second exciter element 90 (E2) to ele ⁇ rostatically couple its voltage to element 64 (T2). It will be appreciated, of course, that it is the voltage differential between the two elements 62 (Tl) and 64 (T2) that is important.
• the voltages on device elements 62 and 64 is dynamic.
• the device 32 is shown oriented relative to the portion of the antenna array 86 such that power up will not be successful.
• Both ofthe device elements 62 (Tl) and 64 (T2) are opposite (over) the same exciter element 90 (E2).
• E2 exciter element 90
• a voltage differential is unlikely to be set up between the two elements 62 (Tl) and 64 (T2), and power up is unlikely.
• power up would be impossible if both device elements 62 and 64 were disposed opposite (over) the other exciter element 88 (El) or if both device elements were positioned equally opposite (over) each ofthe exciter elements 88 (El) and 90 (E2).
• a challenge in achieving sufficient electrostatic couphng between the device 32 and the exciter/receiver apparatus 30 is to achieve appropriate orientation and positioning ofthe device elements 62 (Tl) and 64 (T2) and the exciter array elements 88 (El) and 90 (E2). It is, therefore, important that shape, dimensions and spacing between device antenna elements be appropriately matched to the shape dimensions and spacing ofthe balanced exciter elements. It is not necessary, however, that device antenna element dimensions be the same as exciter element dimensions. For example, an altemative embodiment (not shown) might employ elongated thin device antenna elements excited by wider exciter elements.
• exciter element sizes and shapes may depend, not only upon the size and shape of remote device antenna elements, but also up on the likely traje ⁇ ory of a device as it passes over an array of exciter elements.
• the required device antenna orientation relative to an array of exciter elements can be achieved dynamically by electronically changing the relative positioning ofthe balanced out of phase exciter elements 88 and 90 within the antenna array 86.
• an exciter antenna array in accordance with the invention may comprise either a fixed array or a commutating array of exciter elements.
• a fixed array the relative phasing of voltage signals applied to different exciter elements is fixed. That is, if two exciter elements have a balanced out of phase relation with each other, then that relationship is fixed.
• a commutating array the phase relationships of voltage signals apphed to different exciter elements can change.
• a controller determines the phase relation ofthe excitation of different antenna elements. For instance, as explained below, in one configuration two adjacent elements may be in a balanced out of phase relationship.
• FIG. 13 shows a fixed exciter antenna array 100 in accordance with the invention.
• the array 100 includes a group of elongated horizontal exciter antenna elements 102 and a group of elongated verticai exciter elements 104. Each ofthe horizontal exciter elements is conne ⁇ ed to either the top or the bottom terminal ofthe secondary coil 38.
• each ofthe vertical exciter elements is conne ⁇ ed to either the top or the bottom terminal ofthe secondary coil 38.
• the horizontal exciter elements on either side of any given horizontal exciter element have a balanced out of phase voltage relationship to the given horizontal exciter element.
• the vertical exciter elements on either side of any given vertical exciter element have a balanced out of phase voltage relationship to the given vertical exciter element. For example, if horizontal exciter elements 106 and 108 are conne ⁇ ed to the top ofthe secondary coil, then exciter elements 110 and 112 are connected to the bottom ofthe secondary coil.
• vertical exciter elements 114 and 116 conne ⁇ ed to the top ofthe secondary coil
• vertical exciter elements 118 and 120 are conne ⁇ ed to the bottom of the secondary coil.
• the spacing between adjacent horizontal exciter elements and between adjacent vertical exciter elements is approximately the same as the spacing between the remotely powered communication device elements.
• a first communication device 32-1 is oriented so that its antenna elements will be opposite adjacent horizontal exciter elements as it moved across the face ofthe antenna array 100 in the dire ⁇ ion ofthe horizontal arrow.
• the first device will be oriented for maximal power coupling with the horizontal exciter elements as it horizontally crosses the group of horizontal elements 102
• a second device 32-2 is oriented so that its device antenna elements will be opposite adjacent vertical exciter elements as it moves across the face ofthe antenna array 100 in the direction ofthe vertical arrow.
• the second device will be oriented for maximal power coupling with the vertical exciter elements as it vertically crosses the group of vertical elements 104.
• FIG. 13 represent only a portion of a larger array in which there are numerous groups, 102 and 104, of horizontal and vertical exciter elements oriented as shown. During intervals when a device 32-1 or 32-2 is disposed for maximal power coupling, the device will power up and transmit information.
• the illustrated grouping of exciter elements seeks to ensure that at some point as device is moved across the exciter antenna array, the device will have sufficient power coupled to it to power up and become operational.
• FIG. 14A-14C there are shown three different configurations of a single portion of a commutated antenna array 124 in accordance with a current embodiment ofthe invention. Over the course of three time intervals, the array 124 is switched from the horizonal configuration in Figure 14 A, to the diagonal configuration in Figure
• the array consists of a plurahty of identically shaped (square in the current embodiment) exciter plates that are arranged in symmetrical rows and columns as shown.
• each exciter element in a given row is in a balanced out of phase voltage relation with adjacent exciter elements on either side of it in the same row and with adjacent exciter elements above and below it in the same column.
• each exciter element in a given column is in a balanced out of phase relation with exciter elements above and below it in the same column and with adjacent exciter elements on either side of it in the same row. That is, for example, exciter element 134 is in a balanced out of phase voltage, relation with exciter elements 136 and 138 on either side of it in the same row and with exciter elements 140 and 142 above and below it in the same column.
• the array is optimally configured to couple power to a communication device 32 moving diagonally across the array, such as in the dire ⁇ ion ofthe diagonal arrow.
• the array is optimally configured to couple power to a communication device 32 moving a ⁇ oss the array in the direction ofthe vertical arrow.
• Figure 15 illustrates y ⁇ another altemative technique for energizing an array of exciter elements. Rather than step through a sequence of horizontal, diagonal and vertical stripes of plates as shown in Figures 14A-14C, a pair of appropriately spaced balanced out of phase stripes 202 and 204 (of individual elements), is swept in a circular pattem a ⁇ oss the exciter element array as indicated by the arrows. At some point during the sweep, the antenna elements of a remote device (not shown) disposed sufficiently close to the exciter are likely to be suitably aligned for power up. More specifically, in Figure 15, there is shown a portion of an array 200 of exciter elements.
• the individual exciter elements ofthe array 200 are energized such that a plurality of individual exciter elements that comprise the two stripes (shaded) 202 and 204 are in phase with each other but out of phase with other individual (unshaded) exciter elements.
• the orientation ofthe two stripes changes with time, but they remain parallel to each other.
• the stripes 202 and 204 are shown vertically oriented. At other times they will be horizontally oriented, and at still other times they will be diagonally oriented. While a pair of balanced out of phase stripes rotating in a circular motion is shown, it will be appreciated that other dynamically changing exciter element pattems and movements can be practiced consistent with the invention.
• the illustrative drawing of Figure 16 depicts yet another approach to energizing an array of exciter elements in accordance with the invention.
• the exciter antenna elements are arranged in an array of rows and columns.
• An array of sensors such as optical sensors, are disposed about the periphery ofthe array of exciter antenna elements.
• the sensors dete ⁇ the presence and direction of motion of a communication device, such as device "A" (horizontal), "B"(diagonal) or “C” (vertical).
• an array controller (not shown) sele ⁇ s an excitation configuration for the array which is likely to couple energy most efficiently to the device as the device passes across the face ofthe array.
• the optimal array configuration may be a horizontal configuration as illustrated in Figure 14 A, a diagonal configuration as illustrated in Figure 14B, or a vertical configuration as illustrated in Figure 14C.

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• 1996
  • 1996-09-04 CN CN96197551A patent/CN1101037C/zh not_active Expired - Fee Related
  • 1996-09-04 WO PCT/US1996/014271 patent/WO1997014112A1/en active IP Right Grant
  • 1996-09-04 CA CA002234686A patent/CA2234686C/en not_active Expired - Fee Related
  • 1996-09-04 NZ NZ318619A patent/NZ318619A/xx not_active IP Right Cessation
  • 1996-09-04 EP EP96931470A patent/EP0855064A4/en not_active Withdrawn
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  • 1996-09-04 BR BR9610948A patent/BR9610948A/pt not_active Application Discontinuation
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