EP0851727A1 - Method and apparatus for mounting electronic part - Google Patents

Method and apparatus for mounting electronic part Download PDF

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Publication number
EP0851727A1
EP0851727A1 EP96930352A EP96930352A EP0851727A1 EP 0851727 A1 EP0851727 A1 EP 0851727A1 EP 96930352 A EP96930352 A EP 96930352A EP 96930352 A EP96930352 A EP 96930352A EP 0851727 A1 EP0851727 A1 EP 0851727A1
Authority
EP
European Patent Office
Prior art keywords
rotary head
mounting
driving motor
head driving
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96930352A
Other languages
German (de)
French (fr)
Other versions
EP0851727A4 (en
Inventor
Koji Hirotani
Ryoji Inutsuka
Kunio Ohe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP0851727A1 publication Critical patent/EP0851727A1/en
Publication of EP0851727A4 publication Critical patent/EP0851727A4/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Definitions

  • the present invention relates to an electronic part mounting method for mounting an electronic part on a substrate, and its apparatus.
  • Fig. 5 is a perspective view of a conventional electronic part mounting apparatus.
  • the electronic part mounting apparatus is basically composed of an XY table 7 for disposing a substrate thereon and moving in two axial directions (X, Y directions), a parts feed table 6 for mounting an electronic part thereon and feeding in a rotary head drive section, and a rotary head drive section 8 for feeding and mounting an electronic part, and by moving the XY table 7, the substrate is moved to a specified mounting position, the part is supplied into a suction nozzle 5 of the rotary head drive section 8 from the parts feed table 6, and the electronic part is supplied and mounted on the substrate by the suction nozzle 5.
  • Fig. 4 is a perspective view of the rotary drive section 8 in the conventional electronic part mounting apparatus.
  • a rotary head 1 supplies and mounts electronic parts on a plurality of suction nozzles 5 disposed around the rotary head 1, and a rotary head driving motor 2 intermittently rotates the rotary head 1 through a mechanism (not shown) for converting the continuous rotation of the motor 2 into intermittent rotation.
  • the rotary head driving motor 2 is to rotate the rotary head 1 and to move up and down the suction nozzles 5, and by rotating a cam 4 through a timing belt 3, the suction nozzle is moved up and down.
  • Fig. 3 is a diagram to explain the operation of the rotary head, showing the rotary head 1 having sixteen suction and mounting nozzles 5 as an example.
  • This rotary head 1 rotates intermittently in the arrow direction in the drawing while stopping at each station indicated by ST1 to ST16 in the drawing.
  • the electronic parts are sucked by the suction and mounting nozzles 5, and the electronic parts are mounted at the fifteenth station (ST15).
  • mounting and suction of electronic parts and rotation of the rotary head are executed alternately.
  • Fig. 2 is a drawing showing rotational speed curve of the rotary head driving motor, and as shown in the drawing the rotational speed V L (pulses/s) of the rotary head driving motor 2 is constant during the mounting cycle T.
  • the rotational speed of the rotary head driving motor is defined to be pulses/s, and the acceleration to be pulses/s 2 .
  • the rotary head driving motor is provided with an encoder as an angle detector in the AC servo motor, and driving of the motor is controlled by using a pulse signal from the encoder. (In this example, 1000 pulses of digital signal are issued per revolution of the motor).
  • the rotational speed V L can be defined by the number of encoder pulses for driving the motor per second, so that the quantity of rotation and number of revolutions of the motor can be determined.
  • the mounting cycle is generally the time required for mounting one part, and as shown in Fig. 2 it is the total time T of rotation of rotary head and suction and mounting of part. More specifically, as shown in Fig. 3, it refers to the time from start of move of the suction nozzle 5 of the rotary head until moving to adjacent suction nozzle and starting to move to next place, and for example, it refers to the time required from star of move of ST7 until suction nozzle 5 starts to move to ST8.
  • the rotational speed V L is the lower rotational speed of either the rotational speed for sucking and mounting the electronic part stably when the rotary head 1 is stopped, or the rotational speed not changing in the suction posture when the rotary head 1 rotates.
  • the problem was that the mounting cycle T was dominated only by the lower rotational speed of either the rotational speed of the rotary head driving motor 2 for sucking and mounting stably when the rotary head 1 is stopped, or the rotational speed of the rotary head driving motor 2 not causing change in suction posture when the rotary head 1 rotates. Accordingly, the electronic parts could not be mounted efficiently hitherto.
  • Fig. 1 is a drawing showing a driving speed of a rotary head of an electronic part mounting apparatus in an embodiment of the invention.
  • Fig. 2 is a drawing showing the driving speed of a conventional rotary head.
  • Fig. 3 is a drawing for explaining the operation of rotary head.
  • Fig. 4 is a drawing showing a rotary drive section of en electronic part mounting apparatus.
  • Fig. 5 is a drawing showing an electronic part mounting apparatus.
  • the electronic part mounting method and electronic part mounting apparatus of the invention relate to electronic part mounting for converting continuous rotation of a rotary head driving motor into intermittent rotation of a rotary head comprising plural suction and mounting nozzles, moving the suction and mounting nozzles up and down in cooperation with the rotation of the rotary head driving motor, and mounting electronic parts by the suction and mounting nozzles while rotating intermittently so as to stop temporarily at plural stations, in which depending on the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped, and the rotational speed of the rotary head driving motor for not changing the suction posture when the rotary head rotates, the rotary head driving motor is rotated at high speed when the rotary head rotates in the case the former is smaller, and the rotary head driving motor is rotated at high speed when sucking and mounting the rotary head in the case the latter is smaller.
  • the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped if the former is smaller, the rotary head driving motor is rotated at high speed when the rotary head rotates, thereby shortening the mounting cycle, and if the latter is smaller, the rotary head driving motor is rotated at high speed when the rotary head is stopped, that is, when sucking and mounting, thereby shortening the mounting cycle.
  • a basic constitution of the rotary head 1 in the embodiment is same as the constitution of the conventional rotary head explained above, and as shown in Fig. 3, the rotary head 1 having sixteen suction and mounting nozzles 5 rotates intermittently in the arrow direction in the drawing while stopping at each station. Suction of electronic part is executed at the seventh station (ST7), and mounting of electronic part, at the fifteenth station (ST15).
  • Fig. 1 (a) to (d) are diagrams showing the driving speed of the rotary head driving motor 2 in this embodiment, and more specifically Fig. 1 (a) and (b) show that the rotational speed of the rotary head driving motor 2 for stably sucking and mounting stably when the rotary head 1 is stopped is smaller than the rotational speed of the rotary head driving motor 2 for not changing the suction posture when the rotary head 1 rotates, and Fig. 1 (c) and (d) show that the rotational speed of the rotary head driving motor 2 for stably sucking and mounting stably when the rotary head 1 is stopped is greater than the rotational speed of the rotary head driving motor 2 for not changing the suction posture when the rotary head 1 rotates.
  • Fig. 1 (a) when the rotary head 1 rotates, the rotary head driving motor 2 is accelerated up to a rotational speed V H (pulses/s) at an acceleration of ⁇ (pulses/s 2 ), and after lapse of a specified time, at the same acceleration ⁇ , it is decelerated to a rotational speed V L (pulses/s) (at acceleration - ⁇ ).
  • the values of the acceleration ⁇ and rotational speed V H are set at values so as not to change suction posture when the rotary head 1 rotates.
  • Fig. 1 (c) when the rotary head 1 is stopped, that is, when sucking and mounting, the rotary head driving motor 2 is accelerated up to a rotational speed V H (pulses/s) at an acceleration of ⁇ , and after lapse of a specified time, at the same acceleration ⁇ , it is decelerated to a rotational speed V L .
  • the values of the acceleration ⁇ and rotational speed V H are set at values so as to suck and mount stably when the rotary head 1 rotates.
  • Fig. 1 (d) if the maximum speed does not reach V H , after accelerating (acceleration ⁇ ), it is immediately decelerated (acceleration - ⁇ ).
  • the rotational speed of the rotary head driving motor 2 is constant at V L .
  • the calculation formula of the mounting cycle T in each one of Fig. 1 (a) to (d) is shown below.
  • the number of pulses of the encoder required when the rotary head 1 is stopped, that is, when sucking and mounting is expressed as I 1
  • the number of pulses of the encoder required when the rotary head 1 rotates is expressed as I 2 .
  • the mounting cycle T is expressed as in formula (1).
  • T (V H -V L ) 2 /( ⁇ ⁇ V H )+I 1 /V H +I 2 /V L
  • the area of the shaded section denotes the number of pulses of the encoder for detecting the rotation, and this area is not changed. Therefore, by referring to the diagrams, it is evident that the mounting cycle T is shortened by using the speed curve of the above rotary head driving motor 2 in the embodiment.
  • the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped and the rotational speed of the rotary head driving motor for not changing the suction posture when the rotary head rotates
  • the former is smaller, by rotating the rotary head driving motor at high speed when the rotary head rotates, the mounting cycle is shortened, and if the latter is smaller, by rotating the rotary head driving motor at high speed when the rotary head is stopped, that is, when sucking and mounting, the mounting cycle is shortened, so that the mounting cycle can be shortened in stable sucking and mounting operation.

Abstract

The invention presents an electronic part mounting method capable of appropriately shortening the mounting cycle depending on the situation of the rotary head.
To achieve the object, the invention relates to electronic part mounting for converting continuous rotation of a rotary head driving motor into intermittent rotation of a rotary head comprising plural suction and mounting nozzles, moving the suction and mounting nozzles up and down in cooperation with the rotation of the rotary head driving motor, and mounting electronic parts by the suction and mounting nozzles while rotating intermittently so as to stop temporarily at plural stations, in which depending on the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped, and the rotational speed of the rotary head driving motor for not changing the suction posture when the rotary head rotates, the rotary head driving motor is rotated at high speed when the rotary head rotates in the case the former is smaller, and the rotary head driving motor is rotated at high speed when sucking and mounting the rotary head in the case the latter is smaller.

Description

Technical Field
The present invention relates to an electronic part mounting method for mounting an electronic part on a substrate, and its apparatus.
Background Art
Referring now to the drawings, conventional electronic part mounting is described below.
Fig. 5 is a perspective view of a conventional electronic part mounting apparatus. The electronic part mounting apparatus is basically composed of an XY table 7 for disposing a substrate thereon and moving in two axial directions (X, Y directions), a parts feed table 6 for mounting an electronic part thereon and feeding in a rotary head drive section, and a rotary head drive section 8 for feeding and mounting an electronic part, and by moving the XY table 7, the substrate is moved to a specified mounting position, the part is supplied into a suction nozzle 5 of the rotary head drive section 8 from the parts feed table 6, and the electronic part is supplied and mounted on the substrate by the suction nozzle 5.
Fig. 4 is a perspective view of the rotary drive section 8 in the conventional electronic part mounting apparatus. A rotary head 1 supplies and mounts electronic parts on a plurality of suction nozzles 5 disposed around the rotary head 1, and a rotary head driving motor 2 intermittently rotates the rotary head 1 through a mechanism (not shown) for converting the continuous rotation of the motor 2 into intermittent rotation. Moreover, the rotary head driving motor 2 is to rotate the rotary head 1 and to move up and down the suction nozzles 5, and by rotating a cam 4 through a timing belt 3, the suction nozzle is moved up and down.
Fig. 3 is a diagram to explain the operation of the rotary head, showing the rotary head 1 having sixteen suction and mounting nozzles 5 as an example.
This rotary head 1 rotates intermittently in the arrow direction in the drawing while stopping at each station indicated by ST1 to ST16 in the drawing. At the seventh station (ST7), the electronic parts are sucked by the suction and mounting nozzles 5, and the electronic parts are mounted at the fifteenth station (ST15). Thus, mounting and suction of electronic parts and rotation of the rotary head are executed alternately.
Fig. 2 is a drawing showing rotational speed curve of the rotary head driving motor, and as shown in the drawing the rotational speed VL (pulses/s) of the rotary head driving motor 2 is constant during the mounting cycle T. Herein, the rotational speed of the rotary head driving motor is defined to be pulses/s, and the acceleration to be pulses/s2. The rotary head driving motor is provided with an encoder as an angle detector in the AC servo motor, and driving of the motor is controlled by using a pulse signal from the encoder. (In this example, 1000 pulses of digital signal are issued per revolution of the motor). Hence, the rotational speed VL can be defined by the number of encoder pulses for driving the motor per second, so that the quantity of rotation and number of revolutions of the motor can be determined.
The mounting cycle is generally the time required for mounting one part, and as shown in Fig. 2 it is the total time T of rotation of rotary head and suction and mounting of part. More specifically, as shown in Fig. 3, it refers to the time from start of move of the suction nozzle 5 of the rotary head until moving to adjacent suction nozzle and starting to move to next place, and for example, it refers to the time required from star of move of ST7 until suction nozzle 5 starts to move to ST8.
Conventionally, the rotational speed VL is the lower rotational speed of either the rotational speed for sucking and mounting the electronic part stably when the rotary head 1 is stopped, or the rotational speed not changing in the suction posture when the rotary head 1 rotates.
In the prior art, however, the problem was that the mounting cycle T was dominated only by the lower rotational speed of either the rotational speed of the rotary head driving motor 2 for sucking and mounting stably when the rotary head 1 is stopped, or the rotational speed of the rotary head driving motor 2 not causing change in suction posture when the rotary head 1 rotates. Accordingly, the electronic parts could not be mounted efficiently hitherto.
Disclosure of the Invention
In the light of the above problems, it is an object of the invention to present an electronic part mounting method and an electronic part mounting apparatus capable of appropriately shortening the mounting cycle depending on the situation of the rotary head.
Brief Description of the Drawings
Fig. 1 is a drawing showing a driving speed of a rotary head of an electronic part mounting apparatus in an embodiment of the invention.
Fig. 2 is a drawing showing the driving speed of a conventional rotary head.
Fig. 3 is a drawing for explaining the operation of rotary head.
Fig. 4 is a drawing showing a rotary drive section of en electronic part mounting apparatus.
Fig. 5 is a drawing showing an electronic part mounting apparatus.
Best Mode for Carrying Out the Invention
To achieve the object, the electronic part mounting method and electronic part mounting apparatus of the invention relate to electronic part mounting for converting continuous rotation of a rotary head driving motor into intermittent rotation of a rotary head comprising plural suction and mounting nozzles, moving the suction and mounting nozzles up and down in cooperation with the rotation of the rotary head driving motor, and mounting electronic parts by the suction and mounting nozzles while rotating intermittently so as to stop temporarily at plural stations, in which depending on the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped, and the rotational speed of the rotary head driving motor for not changing the suction posture when the rotary head rotates, the rotary head driving motor is rotated at high speed when the rotary head rotates in the case the former is smaller, and the rotary head driving motor is rotated at high speed when sucking and mounting the rotary head in the case the latter is smaller.
According to the method and apparatus of the invention, of the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped, and the rotational speed of the rotary head driving motor for not changing the suction posture when the rotary head rotates, if the former is smaller, the rotary head driving motor is rotated at high speed when the rotary head rotates, thereby shortening the mounting cycle, and if the latter is smaller, the rotary head driving motor is rotated at high speed when the rotary head is stopped, that is, when sucking and mounting, thereby shortening the mounting cycle.
(First embodiment)
Referring now to the drawings, an embodiment of the invention is described below. Members corresponding to the members explained in Fig. 1 and Fig. 3 are identified with same reference numerals and detailed description is omitted.
A basic constitution of the rotary head 1 in the embodiment is same as the constitution of the conventional rotary head explained above, and as shown in Fig. 3, the rotary head 1 having sixteen suction and mounting nozzles 5 rotates intermittently in the arrow direction in the drawing while stopping at each station. Suction of electronic part is executed at the seventh station (ST7), and mounting of electronic part, at the fifteenth station (ST15).
Fig. 1 (a) to (d) are diagrams showing the driving speed of the rotary head driving motor 2 in this embodiment, and more specifically Fig. 1 (a) and (b) show that the rotational speed of the rotary head driving motor 2 for stably sucking and mounting stably when the rotary head 1 is stopped is smaller than the rotational speed of the rotary head driving motor 2 for not changing the suction posture when the rotary head 1 rotates, and Fig. 1 (c) and (d) show that the rotational speed of the rotary head driving motor 2 for stably sucking and mounting stably when the rotary head 1 is stopped is greater than the rotational speed of the rotary head driving motor 2 for not changing the suction posture when the rotary head 1 rotates.
In Fig. 1 (a), when the rotary head 1 rotates, the rotary head driving motor 2 is accelerated up to a rotational speed VH (pulses/s) at an acceleration of α (pulses/s2), and after lapse of a specified time, at the same acceleration α, it is decelerated to a rotational speed VL (pulses/s) (at acceleration - α). The values of the acceleration α and rotational speed VH are set at values so as not to change suction posture when the rotary head 1 rotates.
Or, as shown in Fig. 1 (b), if the maximum speed does not reach VH, after accelerating (acceleration α), it is immediately decelerated (acceleration - α). In both Fig. 1 (a) and (b), when the rotary head 1 is stopped, that is, when sucking and mounting, the rotational speed of the rotary head driving motor 2 is constant at VL.
In Fig. 1 (c), when the rotary head 1 is stopped, that is, when sucking and mounting, the rotary head driving motor 2 is accelerated up to a rotational speed VH (pulses/s) at an acceleration of α, and after lapse of a specified time, at the same acceleration α, it is decelerated to a rotational speed VL. The values of the acceleration α and rotational speed VH are set at values so as to suck and mount stably when the rotary head 1 rotates. Or, as shown in Fig. 1 (d), if the maximum speed does not reach VH, after accelerating (acceleration α), it is immediately decelerated (acceleration - α). When the rotary head 1 rotates, the rotational speed of the rotary head driving motor 2 is constant at VL.
In this way, of the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped, and the rotational speed of the rotary head driving motor for not changing the suction posture when the rotary head rotates, if the former is smaller, by rotating the rotary head driving motor at high speed when the rotary head rotates, the mounting cycle is shortened, and if the latter is smaller, by rotating the rotary head driving motor at high speed when the rotary head is stopped, that is, when sucking and mounting, the mounting cycle is shortened. As a result, the mounting cycle is shortened while sucking and mounting stably.
The calculation formula of the mounting cycle T in each one of Fig. 1 (a) to (d) is shown below. Herein, the number of pulses of the encoder required when the rotary head 1 is stopped, that is, when sucking and mounting is expressed as I1, and the number of pulses of the encoder required when the rotary head 1 rotates is expressed as I2.
In Fig. 1 (a), the mounting cycle T is expressed as in formula (1). T=(VH-VL)2/(α · VH)+I1/VH+I2/VL
In Fig. 1 (b), the mounting cycle T is expressed as in formula (2). T=t+I2/VL where t is the solution of (1/2) · α · t2+VL · t-I1/2=0
In Fig. 1 (c), the mounting cycle T is expressed as in formula (3). T=(VH-VL)2/(α · VH)+I2/VH+I1/VL
In Fig. 1 (d), the mounting cycle T is expressed as in formula (4). T=t+I1/VL where t is the solution of (1/2) · α · t2+VL · t-I2/2=0
Thus, in Fig. 1 and Fig. 2, the area of the shaded section denotes the number of pulses of the encoder for detecting the rotation, and this area is not changed. Therefore, by referring to the diagrams, it is evident that the mounting cycle T is shortened by using the speed curve of the above rotary head driving motor 2 in the embodiment.
Industrial Applicability
Thus, according to the electronic part mounting method and electronic part mounting apparatus of the invention, of the rotational speed of the rotary head driving motor for sucking and mounting stably when the rotary head is stopped, and the rotational speed of the rotary head driving motor for not changing the suction posture when the rotary head rotates, if the former is smaller, by rotating the rotary head driving motor at high speed when the rotary head rotates, the mounting cycle is shortened, and if the latter is smaller, by rotating the rotary head driving motor at high speed when the rotary head is stopped, that is, when sucking and mounting, the mounting cycle is shortened, so that the mounting cycle can be shortened in stable sucking and mounting operation.
Reference Numerals
1
Rotary head
2
Rotary head driving motor
3
Timing belt
4
Cam
5
Suction and mounting nozzle
6
Parts feed table
7
XY table
8
Rotary head drive section

Claims (3)

  1. An electronic part mounting method, being an electronic part mounting method for converting continuous rotation of a rotary head driving motor into intermittent rotation of a rotary head having plural suction and mounting nozzles, moving said plural suction and mounting nozzles up and down in cooperation with the rotation of said rotary head driving motor, and mounting electronic parts by said plural suction and mounting nozzles while rotating intermittently so as to stop temporarily at plural stations, wherein depending on the rotational speed of said rotary head driving motor for sucking and mounting stably when said rotary head is stopped, and the rotational speed of said rotary head driving motor for not changing the suction posture when said rotary head rotates, said rotary head driving motor is rotated at high speed when said rotary head rotates in the case the former is smaller, and said rotary head driving motor is rotated at high speed when sucking and mounting said rotary head in the case the latter is smaller.
  2. An electronic part mounting apparatus, being an electronic part mounting apparatus wherein a rotary head having plural suction and mounting nozzles comprises means for converting continuous rotation of a rotary head driving motor into intermittent rotation of a rotary head, and means for moving said plural suction and mounting nozzles up and down in cooperation with the rotation of said rotary head driving motor, for mounting electronic parts while rotating intermittently so as to stop temporarily at plural stations, further comprising means for rotating said rotary head driving motor at mutually different speeds when rotating said rotary head and when sucking and mounting said rotary head.
  3. An electronic part mounting apparatus of claim 2, wherein said means for rotating said rotary head driving motor at mutually different speeds when rotating said rotary head and when sucking and mounting said rotary head is designed to rotate, depending on the rotational speed of said rotary head driving motor for sucking and mounting stably when said rotary head is stopped, and the rotational speed of said rotary head driving motor for not changing the suction posture when said rotary head rotates, said rotary head driving motor at high speed when said rotary head rotates in the case the former is smaller, and rotate said rotary head driving motor at high speed when sucking and mounting said rotary head in the case the latter is smaller.
EP96930352A 1995-09-11 1996-09-11 Method and apparatus for mounting electronic part Withdrawn EP0851727A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23255995A JP3549073B2 (en) 1995-09-11 1995-09-11 Electronic component mounting method and electronic component mounting device
JP232559/95 1995-09-11
PCT/JP1996/002582 WO1997010695A1 (en) 1995-09-11 1996-09-11 Method and apparatus for mounting electronic part

Publications (2)

Publication Number Publication Date
EP0851727A1 true EP0851727A1 (en) 1998-07-01
EP0851727A4 EP0851727A4 (en) 1999-11-24

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Application Number Title Priority Date Filing Date
EP96930352A Withdrawn EP0851727A4 (en) 1995-09-11 1996-09-11 Method and apparatus for mounting electronic part

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US (1) US6131276A (en)
EP (1) EP0851727A4 (en)
JP (1) JP3549073B2 (en)
KR (1) KR100267039B1 (en)
CN (1) CN1110236C (en)
WO (1) WO1997010695A1 (en)

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JP2009111103A (en) * 2007-10-29 2009-05-21 Panasonic Corp Component mounting condition determining method, component mounting apparatus and program
JP5812456B2 (en) * 2012-02-28 2015-11-11 富士機械製造株式会社 Component mounter
CN105706543B (en) * 2013-10-31 2018-09-28 富士机械制造株式会社 Component mounter
DE112015007122T5 (en) 2015-11-13 2018-07-26 Yamaha Hatsudoki Kabushiki Kaisha Component mounting device, component mounting method and surface mount device

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Also Published As

Publication number Publication date
CN1110236C (en) 2003-05-28
JP3549073B2 (en) 2004-08-04
WO1997010695A1 (en) 1997-03-20
US6131276A (en) 2000-10-17
CN1196164A (en) 1998-10-14
KR19990044166A (en) 1999-06-25
EP0851727A4 (en) 1999-11-24
JPH0983191A (en) 1997-03-28
KR100267039B1 (en) 2000-09-15

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