JPH09181494A - Chip-part mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve working efficiency by providing the first and second head units on the first and second supporting member, which can be independently moved to each other, respectively, and arranging working heads at the inside with respect to each supporting member to each other at the first and second head units. SOLUTION: A head supporting member 22 is provided at a fixed rail 17 as the supporting member in the direction of a Y axis. A screw shaft 21 is rotated and driven through a toothed belt 20 by a servomotor 19 of a feeding device 18 and driven into the direction of the Y axis. The head supporting member 22 is driven into the direction of an X axis by the rotation of a feed screw 25 by a servomotor 28. First and second head units U1 and U2 are provided for the head supporting member 22. Working heads 13 are arranged at the inside of the head supporting member 22 for the first and second head units U1 and U2 and driven at the same time so that collision and interference with each other do not occur.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting apparatus for mounting an electronic component (hereinafter referred to as a chip component) in the form of a small piece such as an IC, a resistor or a capacitor on a printed circuit board.

[0002]

2. Description of the Related Art As a mounting apparatus of this type, conventionally, a work station is formed on a conveyer on which a printed circuit board is conveyed, and a head supporting member for moving at high speed in the XY directions in a horizontal plane parallel to the conveyer at this work station. It is known that the head support member is provided with a working head for adsorbing the chip component supplied from the component supply unit and transferring it to a predetermined position on the printed circuit board (for example, Japanese Patent Application No. 61- 118719).

[0003]

By the way, in the mounting work of electronic parts by such a mounting device, suitable parts are mounted from various kinds of parts at various places widely distributed on the printed circuit board. It is necessary.
For this purpose, the work head needs to pick up a required chip component from a centrally arranged component supply device and move the chip component to a desired location on the printed circuit board.
In order to improve the work efficiency of the mounting work, it is conceivable to increase the moving speed of the work head, but at the same time, it is naturally necessary to maintain the positioning accuracy of the chip component at a predetermined level or more. However, in order to improve the working efficiency by increasing the moving speed of the working head in this way, in order to maintain the positioning accuracy of the chip component, a highly rigid head supporting member or moving the working head is performed at high speed. Therefore, it is necessary to use a drive motor having a large output, and it is necessary to use these as a whole structure. As a result, the device itself becomes large. The present invention has been made in view of the above circumstances, and provides a chip component mounting apparatus that can improve work efficiency without resorting to a technique of increasing the moving speed of a work head using a motor having a large output. Aim.

[0004]

In order to achieve the above object, the present invention is directed to a board transfer path formed on a base, a component supply section located on the side of the board transfer path, and a component pickup. A head unit that is provided above the base so as to be movable on the X and Y planes, and a driving unit that drives the head unit.
Picking up chip components from the component supply unit by the work head of the head unit in a state where the printed circuit board is stopped within a predetermined substrate installation area on the substrate transfer path,
In a chip component mounting apparatus configured to mount the chip component on a printed circuit board, first and second support members movable independently of each other and drive means for individually driving the respective support members are provided. Together with the above first and second
The moving ranges of the head units are set so that the first and second head units respectively provided on the supporting members have a common work area in a range including the substrate installation area,
The working heads of the first head unit and the second head unit are arranged inside each of the support members.

[0005]

[Operation] According to this configuration, after the printed circuit board transported by the substrate transport path is stopped in the substrate installation area, the component picked up from the component supply unit by the working head of the head unit is printed on the printed circuit board. By repeating the work of mounting on the printed circuit board, the components are mounted on a predetermined number of places on the printed circuit board. In this case, since the first and second head units that are individually driven are provided, each head unit can simultaneously take out the component from the component supply unit and mount the component on the printed circuit board.
Alternatively, the operations are performed in parallel with a certain time lag, and in particular, since both head units have a common work area in a range including the board installation area, each of the heads can be processed with respect to one printed circuit board. The work by the units is performed in parallel, and the mounting of the plurality of chip components on the printed circuit board is efficiently performed. It is not necessary to use a motor having a particularly large output to increase the moving speed of the working head, and the magnitude of the force generated in the apparatus is kept relatively small, so that the rigidity of the base, the feeder, etc. The need for enhancement is reduced.

[0006]

[Embodiment] An embodiment of the present invention will be described with reference to the drawings. In the drawing, a conveyor 12 as a transport path is horizontally set on an upper surface of a base 11 in the chip component mounting apparatus 10. The work head 1 of the chip component mounting apparatus 10 is provided on the conveyor path of the conveyor 12.
3 is a work station for mounting chip parts 14
Are formed. A printed board 15 is transported onto the conveyor 12 from one side (the right side in FIG. 1), and the transport of the printed board 15 by the conveyor 12 is temporarily stopped at a predetermined position in the work station 14. At the time of work, this work station 14
The printed circuit board is held at a predetermined position in the inside. The work station 14 has a rectangular shape, and its longitudinal direction coincides with the X-axis direction which is the transfer direction of the conveyor 12. On both sides of the work station 14 in the Y-axis direction (a direction orthogonal to the conveyor 12), component supply units 16 to be described later are arranged along the long sides of the work station 14. A fixed rail 17 and a feeding device 18 are installed as Y-axis direction support members on both sides of the work station in the X-axis direction so as to extend over the conveyor 12. The feeding device 18 is composed of a ball screw device, and a screw shaft (feed screw) of the servo motor (driving motor) 19 via a toothed belt 20.
21 is rotationally driven, whereby the head support member 22 described later is driven in the Y-axis direction. Above the base 11, two head supporting members 22 for supporting the working head 13 movably in the X-axis direction are provided. The head support member 22 is as follows. That is, the head support member 22 has a linearly formed frame 23, a guide rail 24 fixed on the frame 23, and a feed device (feed screw) 25 installed in parallel with the guide rail 24. However, the three work heads 13 are vertically supported by the guide rails 24 via mounting plates 26. These work heads 13 are moved up and down by a command signal of a CPU (not shown) to perform necessary work at the time of picking up each required chip component and at the time of placing work on a printed circuit board. A head unit is constituted by the work heads 13, a mechanism for moving them up and down, and the mounting plate 26, and two head support members 22 support the first and second head units U1 and U2, respectively. The head support member 22 (the head support member including the first head unit U1 is also referred to as a first support member, and the head support member including the second head unit U2 is also referred to as a second support member). A female screw of a ball screw device which is a feeding device 18 (the feeding device of the first supporting member is also referred to as a first feeding device and the feeding device of the second supporting member is also referred to as a second feeding device) on one end side of the A portion 27 is provided, which meshes with the feed screw 21 installed in parallel with the fixed rail 17, and the feed screw 21 is rotated by the servo motor 19, so that the entire head support member 22 moves in the Y-axis direction. Feed is given. The head unit U1, U2 supported by the head support member 22 has a mounting plate 26 supported by a guide rail 24, and
A feed screw 25 arranged in parallel with the guide rail 24
A female screw portion of a ball screw device fixedly provided on the mounting plate 26 meshes with the mounting plate 26, and can be moved in the X-axis direction by rotation of the feed screw 25 by a servo motor 28. Therefore, the first and second head units U1 and U2 each having three working heads 13 move the head support member 22 in the direction of the fixed rail 17 (Y-axis direction) and move the head support member 22 on the head support member 22 respectively. Can be moved in the direction of the guide rails 24 (X-axis direction), and two-dimensional movement within the work area of the work station 14 is performed. On the other hand, the component supply unit 16 installed on the base 11 is provided with various types of chip components in a form in which, for example, chip components having a rectangular parallelepiped shape are stored at regular intervals on a supply tape 29 wound on a reel. Although not shown, a ratchet-type feed mechanism for intermittently feeding the supply tape 29 is incorporated at the feed end of the supply tape 29, and a projection provided on the working head 13 presses the feed mechanism. Thereby, the pick-up operation of the chip component by the operation head 13 is enabled. In the drawing, reference numeral 31 denotes a suction nozzle, which is connected to a vacuum pump (not shown). Reference numeral 32 denotes a correction arm.
Is closed, the suction position of the chip component sucked by the suction nozzle 31 is corrected. by the way,
The two head support members 22 are arranged symmetrically in parallel with each other so as to extend in the X-axis direction.
It is movable in the axial direction. Each head support member 22
The head units U1 and U2 supported by the head support member 22 are located inside the head support member 22 in the Y-axis direction, that is, both head support members 2
It is placed on the side facing the space surrounded by 2. These head support members 22 are individually driven by the two feeding devices 18. Ball screw devices as the feeding devices 18 are arranged on both outer sides of fixed rails 17 installed on both sides of the work station 14, respectively.
In order to move and position these head support members 22 with high precision, this feed screw 2 is used as shown in FIG.
This is because it is preferable to reduce the distance a between the fixed rail 17 and the fixed rail 17 because the bending moment due to the feed driving force applied to the head support member 22 is reduced. Further, in order to maintain high positioning accuracy by the head support member 22 against this feed driving force, it is preferable to increase the interval b of the slide bearing 33 of the head support member 22 with respect to the fixed rail 17. According to the arrangement of this embodiment, even if the distance between the feed screw 21 and the fixed rail 17 is narrowed and the distance between the slide bearings 33 is increased, two heads are mounted on the same set of fixed rails 17. Since the support members 22 are provided, the positioning accuracy of the two head support members 22 can be maintained satisfactorily, and the approach distance between the two head support members 22 can be reduced. It is possible to expand the work space. In the feed device 18 for the head support member 22 of this embodiment, the screw shaft 21 and the drive motor 19 are interlocked via the toothed belt 20.
The size of the work station 14 in the Y-axis direction can be increased relative to the size of the device in the Y-axis direction, and when the screw shaft 21 is arranged along the fixed rail 17, restrictions due to the outer shape of the servo motor 19 are imposed. Since they can be avoided and installed close to each other, the overall rigidity required for the device can be reduced. Also, as described above, the working head 1
By arranging 3 inside the head support member 22 in the Y-axis direction, the stop distance between the work heads 13 installed on both head support members can be reduced,
Even if the other head supporting member is not moved, the work area in which the work head can install the chip component is expanded and the work efficiency can be improved. Both head support members 2
With respect to the movement of 2 in the Y-axis direction, the number of pulses generated by the detector provided in the servo motor 19 is detected and the gap between both head supporting members 22 is monitored every 20 msec, as described below. Then, the collision of both head support members 22,
Corresponding to avoid interference. Therefore, as shown in FIG. 5, the work area of each head unit U1, U2 in the work station 14 of this mounting apparatus 10 is dedicated to the component supply section 16 arranged on the side of each head support member 22 and on the conveyor 12. The portion on the printed circuit board 15 stopped at is overlapped as a common operation area of both head supporting members 22. In FIG. 5, A in the drawing shows the work area of the working head 13 of the first head unit U1 supported by the head supporting member 22 drawn as the front side in FIG. 1, and B in the drawing shows the head supporting member on the other side. The work area of the work head 13 of the second head unit U2 supported by 22 is shown. That is, the working head 13 of the first head unit U1 picks up the chip component from the supply tape 29 of the component supply unit 16 installed on the first head support member side, and sets the chip component over the entire area on the printed circuit board 15; Working head 13 of second head unit U2
From the component supply unit 16 on the same side in the same manner as the printed circuit board 1
The chip parts are set for the entire area on the upper side. Then, the above operations by the head units U1 and U2 are performed simultaneously or in parallel with a certain time lag, so that chip components can be efficiently mounted on one printed circuit board. next,
In order to move the above-mentioned two head support members 22 without colliding with each other and without causing interference, this embodiment is programmed by a well-known technique so as to be controlled and appropriately operated by a CPU (not shown). There is. In this embodiment, it is intended to completely avoid collision and interference between these two head support members 22 by causing the CPU to perform the following tasks. The operation of this task will be described below with reference to the flowchart of FIG.
Note that this task uses a timer in the CUP that starts to operate at the same time when the power of the mounting device 10 is turned on,
The following tasks are to be repeated for each ec. For this reason, the task described below functions regardless of whether the operation of the chip component mounting apparatus is performed in the manual mode or the automatic mode. However, collision of the head support member, occurrence of interference, and the like are prevented. First, based on the command signal of the timer as described above,
Start the task. Step 1 The positions of the two head support members 22 in the Y-axis direction (indicated as Y1 and Y2 in FIG. 6) and their changes are detected to determine whether the two head support members 22 are approaching. Since a pulse generator is provided in the drive motor 19 of both head support members 22, the difference between the number of pulses from the encoder portion is detected and the CPU compares the number of pulses with a predetermined amount. And if this judgment is YES,
Proceed to step 2, and if NO, end this task. Step 2 When it is determined that both head support members 22 are approaching,
The position at which both head support members 22 can be smoothly decelerated and stopped is calculated. Step 3 Next, the stop position interval between the two head support members 22 calculated in Step 2 is calculated. Step 4 Then, the interval obtained in Step 3 is compared with a preset minimum interval between the two head support members 22 (preferably, it is preferable that the interval can be set so as to be changeable). Predict the potential of If YES (when there is a possibility of collision), the process proceeds to step 5, and if NO (when there is no possibility of collision), this task ends. Step 5 If it is determined in step 4 that there is a possibility of collision or the like, the two head supporting members 22 and the respective working heads 13 of these head supporting members 22 (in this embodiment, the mounting plate 26 is used instead). (This is also possible.) The movement is braked, these are decelerated and stopped, and a collision or the like is avoided to end this task. In this case, a warning may be issued by a buzzer or the like at the same time as this operation.

[0007]

As described above, according to the present invention, the work head of the movable head unit is used to move the chip parts from the component parts to the chip parts while the printed board is stopped within the predetermined board setting area on the board conveying path. Which are picked up and mounted on a printed circuit board, are provided with first and second head units that are movable independently of each other and are individually driven, and each head unit includes the board installation area. Since it has a common work area, the component mounting work by each of the head units can be performed in parallel on one printed circuit board located in the board installation area. Therefore, the working efficiency of the component mounting work on one printed circuit board can be improved without using a motor having a particularly large output to increase the moving speed of the working head. Further, since the work efficiency is improved without using a motor having a particularly large output, the magnitude of the force generated in the device can be kept relatively small, and the head support member by the drive motor can be Since the action of the driving torque is suppressed, the base, the feeder, and the like are prevented from increasing in size. That is, with such a configuration, the work efficiency can be significantly improved while being relatively small. Further, since the work heads of the first head unit and the second head unit are arranged inside each other with respect to each head support member, each work head is located inside the head support member in the Y-axis direction. The stop distance between both work heads installed on both support members can be made significantly smaller than that when the work heads are arranged outside each other in the Y-axis direction, and the other head support member is moved. Even if it is not necessary, the work area where the chip parts can be installed can be expanded by one work head, and the work efficiency can be improved accordingly.

[Brief description of the drawings]

 The drawings relate to embodiments of the present invention,

FIG. 1 is a plan view of a chip component mounting device with a cover removed.

FIG. 2 is a sectional view taken along the line AA.

FIG. 3 is a side view thereof.

FIG. 4 is an explanatory diagram of a driving system of a head supporting member in a plan view.

FIG. 5 is an explanatory diagram of a work area of both head support members in a work station.

FIG. 6 is a flowchart of a task for avoiding a collision of a head support member of the chip component mounting apparatus.

[Explanation of symbols]

 10 ... Chip component mounting device 11 ... Base 13 ... Work head 14 ... Work station 17 ... Fixed rail 18, 25 ... Feed device 22 ... Head support member 24 ...・ Guide rail

Claims (1)

[Claims] 1. A substrate carrying path formed on a base, a component supply section located on the side of the substrate carrying path, and a work head for picking up a component, and X above the base. A head unit provided so as to be movable on the Y plane, and a drive unit for driving the head unit,
Picking up chip components from the component supply unit by the work head of the head unit in a state where the printed circuit board is stopped within a predetermined substrate installation area on the substrate transfer path,
In a chip component mounting apparatus configured to mount the chip component on a printed circuit board, first and second support members movable independently of each other and drive means for individually driving the respective support members are provided. Together with the above first and second
The moving ranges of the head units are set so that the first and second head units respectively provided on the supporting members have a common work area in a range including the substrate installation area,
A chip component mounting apparatus, wherein the working heads of the first head unit and the second head unit are arranged inside each other with respect to each support member.