EP0850442A1 - Gestaltbare intelligente markierung - Google Patents

Gestaltbare intelligente markierung

Info

Publication number
EP0850442A1
EP0850442A1 EP97914493A EP97914493A EP0850442A1 EP 0850442 A1 EP0850442 A1 EP 0850442A1 EP 97914493 A EP97914493 A EP 97914493A EP 97914493 A EP97914493 A EP 97914493A EP 0850442 A1 EP0850442 A1 EP 0850442A1
Authority
EP
European Patent Office
Prior art keywords
conformable
tag
intelligent
intelligent tag
peeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97914493A
Other languages
English (en)
French (fr)
Inventor
Michael Chinoporos
Nikolaos Tsambourakis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Edis Sa
Original Assignee
Edis Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edis Sa filed Critical Edis Sa
Publication of EP0850442A1 publication Critical patent/EP0850442A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D55/00Accessories for container closures not otherwise provided for
    • B65D55/02Locking devices; Means for discouraging or indicating unauthorised opening or removal of closure
    • B65D55/028Locking devices; Means for discouraging or indicating unauthorised opening or removal of closure initial opening or unauthorised access being indicated by the presence or absence of an audible or electrical signal
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86Secure or tamper-resistant housings
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073Special arrangements for circuits, e.g. for protecting identification code in memory
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07798Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/02Mechanical actuation
    • G08B13/12Mechanical actuation by the breaking or disturbance of stretched cords or wires
    • G08B13/126Mechanical actuation by the breaking or disturbance of stretched cords or wires for a housing, e.g. a box, a safe, or a room
    • G08B13/128Mechanical actuation by the breaking or disturbance of stretched cords or wires for a housing, e.g. a box, a safe, or a room the housing being an electronic circuit unit, e.g. memory or CPU chip
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • G08B13/2417Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags having a radio frequency identification chip
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2431Tag circuit details
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • G08B13/2442Tag materials and material properties thereof, e.g. magnetic material details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2203/00Decoration means, markings, information elements, contents indicators
    • B65D2203/10Transponders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]

Definitions

  • a conformable and intelligent tag is used in a system and method for detecting the unauthorised opening of packages that have a distinct way of opening.
  • the intelligent tag being conformable, may be used for the preservation of authenticity of a number of articles for example music records, audio and visual cassettes, compact disks, mini disks, CD-ROM's, VCD's, boxes containing cigars, spirits, perfumes, etc., the tag being glued across the sealing edges and following the contour of these articles.
  • the intelligent tag may have embedded an appropriate electronic circuitry that therein may be interrogated by a transmitting and receiving unit either by ensuring ohmic contact with the appropriate pads provided on the surface of the intelligent tag or from a relatively short distance in a wireless manner.
  • the electronic circuit is necessary for storing a number of data related to the producer of the goods, the contents of the package and any other information relevant to the nature of the contents. For example, in the case of musical compact disks information is required to be stored related to the so-called "label copy", i.e. catalogue number and ID of producing company, date of release, the most famous composer involved, etc.
  • the intelligent tag with its electronic circuitry may be adhered to the appropriate position of the package to be protected so that any attempt to remove it either by cutting or peeling will induce a permanent damage of the embedded electronic circuitry.
  • a transmitting and receiving unit may detect the operating condition of the circuitry and subsequently the information stored in its memory by providing an appropriate interrogation protocol after the external powering of the embedded circuitry either by electrical contact or by a radio frequency emission.
  • the present invention relates to a system and method for sealing packages and securing the authenticity of the contents of the package. More particularly the present invention relates to a system and method for electronically and visually detecting the opening of the package and thus preventing the frauding of the contents by sticking a conformable intelligent tag on the appropriate sealing edge(s) of the packages so that to have a permanent damage induced to the incorporated electronic circuit upon removal of the tag.
  • Frauding detection technology as it has been applied to the sealing of such items, has usually included an indicator tag in the form of printed paper and/or laminated structure containing a hologram, attached to the package by glue. Such systems may be easily defeated. The disadvantage of such systems, despite their relatively low cost, lies in the ease with which can be removed and substituted by fraud ones.
  • the deformation is either detected using strain gauges (resistors which change their resistance value when they are stretched) or it induces a high voltage spike, that damages the integrated circuits, from a piezoelectric material incorporated in the encapsulation.
  • strain gauges resistors which change their resistance value when they are stretched
  • high voltage spike that damages the integrated circuits, from a piezoelectric material incorporated in the encapsulation.
  • the published devices refer to the protection against access to secure information and they have the disadvantage that require the use of rigid encapsulation materials in order to function successfully.
  • the present invention refers to a conformable intelligent tag which incorporates an electronic circuitry which may be activated by a transmitting and receiving unit.
  • the electronic circuitry consists of two parts: 10 and 20.
  • Part 10 is an interconnection circuit consisting of a thin conducting metal path of copper or aluminium laminated between two appropriate polymer sheets so that the laminated structure is highly conformable.
  • the information carrying means 20 are provided on an integrated circuit carrier 21 , as shown in FIG. 3, and they are coupled via the conducting spacers 25 onto the conducting path 10.
  • FIG. 2 shows a pictorial view of the architecture of the conformable intelligent tag of the present invention. It consists of one polymer layer 30 that carries the conducting path 10 which is electrically connected to the information carrying means 20. Layer 30, carrying the conducting path 10, is laminated with an appropriate adhesive 40 to another pol ⁇ meric layer 50, in a way that secures both conducting path 10 and the information carrying means 20 between the two aforementioned la ⁇ ers 30 and 50. In the wireless version of communication the conducting metal path 10 may play the role of the necessary antenna.
  • the conducting path ma ⁇ be a metal foil laminated in a conventional way with layer 30 or a thin metal film evaporated onto layer 30.
  • the required pattem of the conducting path 10 ma ⁇ be induced b ⁇ well known photo-lithographic techniques.
  • Part 20 is a rigidised substrate, the so-called "chip carrier", which ma ⁇ be an epox ⁇ t ⁇ pe printed circuit board 21, that carries one Application Specific Integrated Circuit (ASIC) 22 as shown in FIG. 3 or in another embodiment all the necessar ⁇ integrated circuits as Chips-on-Board (COB).
  • the application specific integrated circuit is attached on the chip carrier b ⁇ commercial adhesive and it is electrically connected to the conducting spacers 25 b ⁇ wire bonding 23 and through the conducting paths 24.
  • the wire bondings ma ⁇ be substituted b ⁇ flip-chip techniques.
  • the conducting spacers 25 are extended to the back of the substrate where suitable copper pads 90 are formed like in the case of double-sided printed circuit boards. These pads are coated with a thin film of gold to prevent copper oxidation, when exposed as in the case of FIG. 5, and the ⁇ are electrically connected to the conducting spacers 25 with plated-through holes drilled through the epox ⁇ substrate of the chip carrier.
  • an embodiment of the device according to the invention is characterised, in that at least one of the la ⁇ ers 30 of the comformable laminated structure which carries the conducting paths is laminated with a commercial adhesive 40 to another layer 50 having a relatively lower peeling strength in comparison to the one of adhesive 60 that is used for the gluing of the whole conformable structure on package 70 under protection.
  • the lamination adhesive 40 ma ⁇ also be used to protect from moisture and to isolate electrically electronic circuit 20 from the adjacent part of the conducting path 10.
  • the Application Specific integrated Circuit 22 ma ⁇ have its own protective isolation la ⁇ er.
  • the joint ma ⁇ be a commercial metal-doped, i.e. silver-doped, self- cured conductive adhesive.
  • Fig.'s 4 and 5 show the cross sections of the two t ⁇ pes of the proposed intelligent conformable tag.
  • FIG. 4 shows the cross section of the intelligent tag that ma ⁇ be interrogated in the contactless manner.
  • a transmitting and receiving unit ma ⁇ be used for the contactless interrogation of an intelligent tag.
  • the circuitr ⁇ 10 and 20 of the intelligent tag and the transmitting and receiving unit ma ⁇ be a s ⁇ stem known in the art, that is able to provide a communication link for information exchange.
  • radio frequenc ⁇ transmitters, transponders, reprogrammable memor ⁇ modules and the like may be used with the appropriate receiving equipment in order to establish the contactless exchange of information between the transmitting and receiving unit and the circuitr ⁇ 10 and 20 of the intelligent tag.
  • the electronic circuitr ⁇ 10 which acts as an antenna, receives the interrogation signals and according to a predefined protocol for information exchange stored in 20, the receiving unit ma ⁇ receive through antenna 10 all the information contained in a EEPROM embedded in the intelligent tag but without an ⁇ possibilit ⁇ of altering this information.
  • the intelligent tag has been damaged b ⁇ peeling, detaching or cutting, its circuitr ⁇ 20 will not be functioning and consequentl ⁇ no answer will be received b ⁇ the interrogating unit.
  • an answer is expected to be transmitted b ⁇ circuitr ⁇ 20 with the aid of 10 which, however, will not contain the predefined ke ⁇ ID numbers expected.
  • FIG. 5 shows the cross section of the intelligent tag that ma ⁇ be interrogated b ⁇ a transmitting and receiving unit that ma ⁇ have the proper configuration of contact pins that will ensure electrical contacts onto the pads 90 provided on the rigid part of the intelligent tape.
  • the conducting path 10 is connected in series with the integrated circuit 22.
  • Figures 2,3,4 and 5 show onl ⁇ one embodiment of the architecture.
  • the comformable part of the circuitr ⁇ containing the conducting paths may be provided on both sides of the rigid printed circuit board containing the integrated circuits; both sides being glued to the package under protection.
  • FIG. 1 is a pictorial depiction of a conformable intelligent tag of the present invention being applied to a Compact Disk package.
  • FIG.2 is a pictorial depiction of the architecture of the wiring or antenna part of the conformable intelligent tag of the present invention.
  • FIG. 3 is a pictorial depiction of the right part which carries the Application Specific Integrated Circuit as Chip-on-Board or in another embodiment the integrated circuits which are embedded in the intelligent tag of the present invention.
  • FIG. 4 is a cross-sectional view of the intelligent tag of the present invention illustrating the circuitr ⁇ embedded therein in the case of the contactless interrogation.
  • FIG. 5 is a cross-sectional view of the intelligent tag of the present invention, requiring direct electrical contact for the interrogation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Mechanical Engineering (AREA)
  • Burglar Alarm Systems (AREA)
EP97914493A 1996-04-11 1997-04-01 Gestaltbare intelligente markierung Withdrawn EP0850442A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GR96100123 1996-04-11
GR96100123 1996-04-11
PCT/GR1997/000010 WO1997038364A1 (en) 1996-04-11 1997-04-01 A conformable intelligent tag

Publications (1)

Publication Number Publication Date
EP0850442A1 true EP0850442A1 (de) 1998-07-01

Family

ID=10942371

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97914493A Withdrawn EP0850442A1 (de) 1996-04-11 1997-04-01 Gestaltbare intelligente markierung

Country Status (4)

Country Link
EP (1) EP0850442A1 (de)
AU (1) AU2173097A (de)
GR (1) GR1002609B (de)
WO (1) WO1997038364A1 (de)

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WO1997038364A1 (en) 1997-10-16
AU2173097A (en) 1997-10-29
GR1002609B (el) 1997-02-18

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