EP0842491B1 - Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees - Google Patents

Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees Download PDF

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Publication number
EP0842491B1
EP0842491B1 EP96921032A EP96921032A EP0842491B1 EP 0842491 B1 EP0842491 B1 EP 0842491B1 EP 96921032 A EP96921032 A EP 96921032A EP 96921032 A EP96921032 A EP 96921032A EP 0842491 B1 EP0842491 B1 EP 0842491B1
Authority
EP
European Patent Office
Prior art keywords
coil
carrier
module
data carrier
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP96921032A
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German (de)
English (en)
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EP0842491A1 (fr
Inventor
Markus Prancz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Austria Card Plastikkarten und Ausweissysteme GmbH
Original Assignee
Austria Card Plastikkarten und Ausweissysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AT0042295U external-priority patent/AT1470U1/de
Application filed by Austria Card Plastikkarten und Ausweissysteme GmbH filed Critical Austria Card Plastikkarten und Ausweissysteme GmbH
Priority to AT96921032T priority Critical patent/ATE297573T1/de
Publication of EP0842491A1 publication Critical patent/EP0842491A1/fr
Application granted granted Critical
Publication of EP0842491B1 publication Critical patent/EP0842491B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the invention relates to a data carrier with a data carrier body of a body surface is limited and in the one module and one opposite the module separate coil windings and at least two coil terminal contacts having Spool is accommodated, wherein the module a plate-shaped carrier, in the substantially parallel to said body surface and that of one of said Body surface facing first carrier main surface and one of the said Body surface facing away from and substantially parallel to the first carrier main surface second carrier main surface is limited, and at least one component, in the Volume body recorded and connected to the carrier and against the second support main surface is raised and in a transversely to the said Body surface extending component level range is, and at least two Module connection contacts which are connected to the carrier and in the region of second carrier main surface are provided, and wherein the coil turns and the Coil terminal contacts of the coil at least in their adjacent to the component Area in a transversely extending to the said body surface and outside the Component level range lying coil level range are and where each Coil terminal contact in a transverse to the second carrier main surface extending Towards a module connection
  • the invention relates to a method for producing a data carrier, in which a data carrier body bounded by a body surface is produced, and in the case of manufacturing the data carrier body, a coil, the coil turns and has at least two coil terminal contacts in the disk body is received, wherein the coil turns and the coil connection contacts at least in their area adjacent to the component in a transverse to the said body surface extending and lying outside of the component level range Coil level range come to lie, and in which in the disk body a module which is a plate-shaped, from a first carrier main surface and of one second to the first carrier main surface substantially parallel second Carrier main surface limited carrier and one connected to the carrier, opposite the second carrier main surface raised component and at least two with the carrier connected, provided in the region of the second carrier main surface Module connection contacts, wherein the first carrier main surface of said Body surface facing and the second carrier main surface of the said body surface come to lie facing away from and wherein the component in a transverse to the said Body surface extending component level range comes to lie, and in the ever one
  • the channels over their entire longitudinal extent an always the same cross-sectional area, so that the channels over their entire Longitudinal extension are formed exactly cylindrical.
  • a pasty electrically conductive mass can be introduced, with their Help the electrically conductive connection between the module connection contacts and the Coil connection contacts is made.
  • the known smart card is the Difficulty that the introduction of pasty mass must be dosed very accurately, to be sure an electrically conductive connection between the To ensure module connection contacts and the coil connection contacts or to To avoid contamination by excess pasty mass. Namely in the known chip card to little pasty mass introduced into the channels, then this can The result is that no electrically conductive connection between the pasty mass and the module connection contacts is obtained.
  • the invention has for its object, the above-mentioned problems and To avoid difficulties in a simple way and with simple means and one Data carrier according to the genus mentioned in the first paragraph and a Method according to the beginning mentioned in the second paragraph genus improve and thereby obtain an improved disk, which is always a reliable electrical connection between the coil terminals and the with this is achieved in electrically conductive connection module connection contacts and avoid unwanted contamination by an excess pasty mass are.
  • each channel facing away from its adjacent to the coil terminal contact and the end of the module adjacent to the terminal facing him one of the Channel laterally extending pocket has, in the excess electrically conductive Mass is absorbable.
  • the inventive measures is extremely simple and inexpensive Way and practically without any additional means achieved when producing a
  • the data carrier according to the invention the dosing of the pasty to be introduced into the channels Mass is relatively uncritical, namely to the effect that readily a minor Overdosing the pasty mass is beneficial because in this way always with certainty an electrically conductive connection between the module connection contacts and the pasty mass and consequently the coil connection contacts is obtained.
  • the data carrier is a graduated Having recess which opens into said body surface and the one to the said body surface adjacent, in cross-section larger first recessed area, which extends through a substantially parallel to the said body surface annular boundary surface is limited, and one to the first recessed area at its side facing away from said body surface side, in Cross-section smaller second recessed area and in which the module is inserted, wherein the carrier of the module with an annular portion of the second Carrier main surface of the annular boundary surface of the first recessed area is opposite, and wherein the module connection contacts at least partially in the area of the annular portion of the second support main surface are provided and in which the channels of the annular boundary surface of the first recessed area starting through the data carrier body through to the coil connection contacts
  • the channels from the side away extending pockets also from the annular boundary surface of the first Ausappelungs Schemes go out and are open to this boundary surface.
  • a data carrier according to the invention as mentioned in the preceding paragraph has proved to be particularly advantageous when the recess and the channels and the Bags are made by a milling process. This is in terms of one high-precision manufacturability of the recess provided for receiving the module and the channels to the coil connection contacts and the pockets particularly advantageous.
  • any channel as the electrically conductive mass, which is the electrically conductive Connecting means forms contains an electrically conductive adhesive. That way is ensures that the connection means not only serve for electrical connection, but In addition, also form a good and solid mechanical adhesive bond with the via the module connection contacts the module to the disk body of the data carrier is held.
  • a data carrier in which a module carrying a component is inserted into a recess opening into a body surface of the data carrier body, in which case the first carrier main surface of the carrier of the module is usually of is mechanically scannable and visually perceptible outside the data carrier, the first carrier main surface of the carrier of the module to achieve an optical Effect be provided with a print.
  • the carrier of the module in the region of its first carrier main surface further module connection contacts are connected, which cooperate with outside the data carrier with them in contact connection mating contacts are formed.
  • a so-called dual-purpose chip can be used, whose in Provided region of the second carrier main surface module connection contacts with the Coil connection contacts of a coil are connected to the non-contact Data exchange between the dual-purpose chip and a read / write station and optionally for non-contact energy transfer to the dual-purpose chip is provided, and provided in the region of the first support main surface further Module connection contacts for contact-based data exchange between the dual-purpose chip and a read / write station and for contact-type power transmission are provided for the dual-purpose chip.
  • Inventive data carriers can serve different purposes and have various shapes, such as a key shape, a rod shape and other forms.
  • a key shape such as a key shape, a rod shape and other forms.
  • Inventive data carriers can serve different purposes and have various shapes, such as a key shape, a rod shape and other forms.
  • a Bar shape may represent the said body surface in the present context
  • This also applies to a key-shaped disk and also different shaped Disk.
  • a particularly preferred variant of a data carrier according to the invention is characterized in that the data carrier is designed as a chip card.
  • a method according to the beginning mentioned in the second paragraph genus is according to the invention characterized in that the channels with a Material removal procedures are made and that each channel at its from the End facing away from him coil terminal contact with a preferably with the same material removal method with one of the channel laterally away extending pocket is provided in the excess material is receivable.
  • data carriers according to the invention are very attractive inexpensive and reliable way with high quality and high precision in one Mass production can be produced.
  • a stepped recess which opens into said body surface and the one to the said body surface adjacent, in cross-section larger first recessed area, by an im substantially parallel to the said body surface extending annular Limiting surface is limited, and one to the first recessed area at the adjoining the said body surface side, in cross section smaller second recessed area, and in the disk body Channels are produced, each of which is separated from the annular boundary surface of the first recessed area, starting through the disk body through up to a coil terminal contact, has further proved to be very advantageous when in the produced data carrier with one, preferably with the same Material removal process made the stepped recess and the channels and if the module with the component and the module connection contacts advance in the recess is inserted, each connected to the support of the module Module connection contact with the introduced into a channel electrically conductive material with an opposite coil terminal contact in electrically conductive connection is brought and optionally excess electrically conductive mass in one of Channel is pushed
  • a polycarbonate film is used as a carrier foil, on which the coil turns and the coil connection contacts the Coil are applied.
  • a polycarbonate film has proven to be particularly advantageous in practice because During the lamination process, the coil together with its coil connection contacts in such a film is pressed in evenly and consequently the coil together with its coil connection contacts virtually without mechanical stress and stress in the finished Disk body is embedded.
  • a large area shown in FIG Carrier sheet 1 fed to a screen printing device The carrier film 1 has a Area dimension of 530 mm x 660 mm.
  • the thickness of the carrier film 1 is approximately 125 ⁇ m.
  • the carrier film 1 is made of polycarbonate, which is in the case described here Method has proved to be very beneficial.
  • a plurality of coils. 2 applied in the present case a total of six formed by tracks Have coil turns 3.
  • the number and shape of the Coil windings 3 of the coils 2 can also be chosen differently.
  • forty-eight coils are applied to the large-area carrier foil 1, of in which only one coil 2 is shown in Figures 1 and 2. At the free end of the outermost coil turn and at the free end of the innermost coil turn of each coil 2 is ever a rectangular coil terminal contact 4 or 5 is provided.
  • the two Coil connection contacts 4 and 5 are likewise formed by conductor tracks which are analog how the coil turns 3 are applied to the carrier film 1.
  • the thickness of the Coil windings 3 and the coil connection contacts 4 and 5 of the coil 2 is about 25 microns. To achieve this thickness by means of a conventional screen printing technique, can also several printing operations are performed, with each subsequent Print Silver Conductive Paste to the print applied during the previous printing process Silver conductive paste is applied, so that by repeatedly taking place over each other Apply silver conductive paste in a screen printing process to the desired height Coil windings 3 and the coil connection contacts 4 and 5 of the coil 2 can be achieved.
  • a next method step is - as in the Figure 3 schematically is shown - the large-scale carrier film 1 with the coils 2 applied to it a total of five further films 8, 9, 10, 11 and 12 stacked in the present case, wherein the coils 2 and thus also their coil connection contacts 4 and 5 between the Carrier film 1 and a cover sheet 11 come to rest.
  • the cover sheet 11 is too mention that this is a polyvinyl chloride film that has a thickness of about 200 microns.
  • the surface dimensions of the other films 8, 9, 10, 11 and 12 coincide nominally with the areal dimension of the carrier foil 1.
  • the film 12 which faces away from the coils 2 surface side of the Carrier film 1 is, is still to mention that this is also a slide Polyvinyl chloride is, but has a thickness of only about 100 microns.
  • the film 8 Like the film 12, it is made of polyvinyl chloride and has, like the film 12 a thickness of about 100 microns.
  • the film 9 is made as well as the carrier film 1 Polycarbonate and has as well as the carrier film 1 has a thickness of about 125 microns.
  • the Slide 10 is as well as the film 11 made of polyvinyl chloride and has as well as the Foil 11 has a thickness of about 200 ⁇ m.
  • the stacked films by a Laminating laminated.
  • the films 8, 9, 10, 11, 1 and 12 connected under the action of pressure and heat, with a through controlled merging of the individual foils with each other a so-called Homogenizing the films takes place, so that a large-area film body 13 is obtained is as shown in Figure 4.
  • a large-area film body 13 with The surface dimensions of 530 mm ⁇ 660 mm are a plurality of coils 2 embedded, as shown for a coil 2 in Figure 4.
  • a punching tool in a Punching process from the large-area film body 13 a plurality of as Disk body to be regarded card bodies 14 punched out.
  • a total of forty-eight card bodies 14 are punched out of a film body, one of which is shown in FIG.
  • the punching of the in the figure 5 shown card body 14 from the large-area film body 13 is along the in the figure 2 indicated by the reference numeral 6 dash-dotted line made.
  • the card body 14 is of a first body main surface 15 and one of the first first body main surface 15 parallel second body main surface 16 limited.
  • the coil 2 is embedded, in the present case, both the Coil windings 3 of the coil 2 and the coil connection contacts 4 and 5 of the coil. 2 parallel to the two main body surfaces 15 and 16 extending into the card body 14th are taken and in a cross, in this case perpendicular to the first Body main surface 15 and in this case also to the second body main surface 16 extending Windungspar Buffalo Club Z1 of the card body 14 are.
  • the Windungspar Silver Z1 in which the coil 2 is located at a distance D1 from the second main body surface 16.
  • the distance D1 in this case has a value of about 200 ⁇ m.
  • a graded Recess 17 produced, as can be seen from the figure 6.
  • the recess 17 opens into the first body main surface 15.
  • this two milling steps performed, whereby a recess 17 is formed, the a first body main surface 15 adjacent, in cross section larger first Recess area 18, which inter alia by a parallel to the first Body main surface 15 extending annular boundary surface 19 is limited, and one to the first recess portion 18 at the first body main surface thereof 15 opposite side subsequent, in cross section smaller second Recess area 20 has.
  • a third milling step and in a fourth milling step of the aforementioned Milling process are in the card body 14 by material removal two channels 21st and 22, each of which is defined by the annular boundary surface 19 of the first Ausappelungs Societyes 18 starting through the card body 14 through to a Coil connection contact 4 or 5 is sufficient.
  • the two channels 21 and 22 extend in this case transverse to the first body main surface 15 and the second body main surface 16 of the Map body 14, in the present case perpendicular to the two Body major surfaces 15 and 16, and are over their entire length from the card body 14 surrounded.
  • the two channels 21 and 22 are over theirs of the two Coil connection contacts 4 and 5 opposite ends accessible from the outside.
  • Everyone Channel 21 or 22 has its coil terminal contact 4 adjacent to it or 5 end facing away from the respective channel 21 and 22 laterally away extending pocket 23 and 24, which in the course of the third and fourth milling step getting produced.
  • a subsequent method step is through the recess 17 and through the two channels 21 and 22 through with the two coil connection contacts 4 and 5 the coil 2 a schematically indicated in Figure 6 with a dashed line Test device 25 for checking the proper functioning of the coil 2 in Active compound brought.
  • Test device 25 is the perfect Functionality of the coil 2 detectable. If with the test device 25 a faulty or unserviceable coil 2 is detected, then the relevant Card body 14 together with the embedded therein defective coil 2 excreted. If with the test device 25 a positive test result in terms of flawless Functionality of the coil 2 is detected, then the card body in question 14 including the coil 2 embedded therein for producing a chip card reused.
  • Module 29 is shown schematically in FIG.
  • the module 29 has a plate-shaped carrier 30.
  • the carrier 30 is of a first support main surface 31 and parallel to the first support main surface 31 second carrier main surface 32 limited.
  • the area dimensions of the carrier 30 are correct with the cross-sectional dimensions of the first recessed area 18 substantially match or are they only slightly smaller.
  • the outline contours of the first Ausappelungs Kunststoffes 18 and the support 30 correspond to that in the figure 2 with the dash-dotted line 7 course shown.
  • the module 29 further has a chip 33 as a component, in which it is known Way around an integrated building block.
  • the chip 33 is connected to the carrier 30 connected, on the second carrier main surface 32 of the carrier 30, for example with an adhesive connection. As can be seen from FIG. 7, the chip 33 is thus raised relative to the second support main surface 32.
  • the module 29 has two connected to the carrier 30, in the region of second carrier main surface 32 is located, for cooperation with the two Coil connection contacts 4 and 5 provided on module connection contacts 34 and 35.
  • the two module connection contacts 34 and 35 are in this case plate-shaped and formed by attached to the carrier 30 conductor tracks.
  • the two Module connection contacts 34 and 35 are - which is shown only schematically in Figure 7 - About each a so-called bonding wire 36 and 37 with not shown in the figure 7 Chip connection contacts of the chip 33 electrically connected, the skilled in the art often referred to as pads.
  • Such modules are delivered in large quantities, these modules, for example, in a so-called belt packaging are delivered.
  • the module 29 using a in the Figure 7 schematically indicated by dash-dotted lines Bondarmes 41 with the Chip 33 and the two module connection contacts 34 and 35 in the direction of the arrow 42 inserted into the recess 17.
  • Bondarmes 41 with the Chip 33
  • the two module connection contacts 34 and 35 in the direction of the arrow 42
  • the two plate-shaped module connection contacts 34 and 35 with the as electrical conductive connecting means 28 provided electrically conductive adhesive in contact.
  • the two module connection contacts 34 and 35 with the two coil connection contacts 4 and 5 brought into electrically conductive and also mechanically strong connection.
  • the first carrier main surface 31 of the carrier is applied 30 a in the figure 8 schematically indicated by two arrows Bankstkov 43 a in the figure 8 schematically indicated by dash-dotted lines heating device 44 for Activation of the hot melt adhesive 40 mounted.
  • the applied heat stamp 43 heat over the carrier 30 to the hot melt adhesive 40 transfer, after which then the heating punch 43 of the carrier 30 again is lifted.
  • For holding the module 29 to the card body 14 may also be an adhesive come from the field of so-called cold glue technology used.
  • Chip card 45 is obtained as a disk according to a first embodiment of the invention. These Chip card 45 is shown in fragmentary form in FIG.
  • the first carrier main surface 31 of the carrier 30 of the first body main surface 15 of the Card body 14 is aligned with the first body main surface 15.
  • the second support main surface 32 of the carrier 30 comes from the first body main surface 15 of FIG Card body 14 away and the second main body surface 16 of the card body 14th to be facing.
  • the provided as a component chip 33 comes in a transverse, in this case perpendicular to the first body main surface 15 and in this case too extending perpendicular to the second main body surface 16 of the card body 14 Component level range Z2 of the card body 14 to lie.
  • the Component level range Z2 at a distance D2 from the first body main surface 15th Der Distance D2 in this case has a value of about 100 microns.
  • the component level area extends Z2 of the card body 14 over the entire height range of the enclosure 38th.
  • the chip card 45 advantageously has the Training made such that the coil turns 3 of the coil 2 and in the present Case additionally also the two coil connection contacts 4 and 5 of the coil 2 in one lie outside the component level range Z2 lying Windungspar Scheme Z1 and that the two module connection contacts 34 and 35 via the component level range Z2 through and in the present case also beyond the component level range Z2 with the help of the two channels 21 and 22 contained as electrically conductive Connecting means 28 provided electrically conductive adhesive with the two Coil terminal contacts 4 and 5, both electrically and mechanically well connected are.
  • a chip card 45 is a data carrier in accordance with a second Embodiment of the invention shown.
  • this smart card 45 are two channels 21 and 22, which in this case transverse to the first body main surface 15 and the second Body main surface 16 of the card body 14 extend, in the present case in the way obliquely to the two main body surfaces 15 and 16 that the distance between the two channels 21 and 22 in the region of the two coil connection contacts 4 and 5 is greater than in the region of the two module connection contacts 34 and 35. Because of this Forming the two channels 21 and 22 is advantageously achieved that between the two coil terminal contacts 4 and 5, a larger number of coil windings. 3 can be accommodated, as is the case with a chip card 45 according to FIG. 9.
  • a chip card 45 is used as a data carrier in accordance with a third Embodiment of the invention shown.
  • this smart card 45 the two Channels, of which Figure 11 shows only the channel 22, also an inclined course opposite to the first body main surface 15 and the second body main surface 16 of FIG Chip card 45 on.
  • the chip card 45 according to the figure 11 enforce the two channels the two coil connection contacts, of which the figure 11 only the Coil connection contact 5 shows.
  • the passage of the coil connection contacts through the Channels is obtained by virtue of the fact that, during the production of the chip card 45, the channels are connected via the Coil terminal contacts are milled out.
  • the advantage of such training is that the depth of the milling operations for making the channels is relatively uncritical and consequently requires less precision.
  • FIG. 12 is a chip card 45 as a disk according to a fourth Embodiment of the invention shown.
  • this smart card 45 training is the two channels 21 and 22 and the formation of the two coil terminal contacts. 4 and 5 and the two module connection contacts 34 and 35, over the in the two Channels 21 and 22 contained electrically conductive adhesives are interconnected, ident with the formation of these smart card components in the smart card 45 according to the FIG. 9.
  • the carrier 30 of the module 29 additionally provided in the region of its first main support surface 31 further Module connection contacts connected to from outside the Chip card 45 formed with them in contact connection mating contacts are formed.
  • the chip card 45 according to FIG. 12 eight such are further Module connection contacts provided, of which in the figure 12 but only two more Module connection contacts 46 and 47 are shown.
  • the other module connection contacts are - as for the other two module connection contacts 46 and 47 of FIG. 12 it can be seen - over further bonding wires with other, not shown Chip connection contacts (pads) of the chip 33, of which in the figure 12 the two further bonding wires 48 and 49 are shown.
  • the other bonding wires are in this case passed through holes provided in the carrier 30, of which in the FIG. 12 shows two bores 50 and 51.
  • the chip card 45 is a so-called dual-purpose chip whose in the range of the second Carrier main surface 32 provided module connection contacts 34 and 35 with the Coil terminal contacts 4 and 5 of the coil 2 are connected to the non-contact Data exchange between the dual-purpose chip and a read / write station and optionally for non-contact energy transfer to the dual-purpose chip is provided, and provided in the region of the first support main surface 31 further module connection contacts for contact-type data exchange between the Dual-purpose chip and a read / write station and contact-based Energy transfer to the dual-purpose chip are provided.
  • chip card 45 also in the chip card 45 according to the figure 12 are provided as a component chip 33 together with its envelope 38 and the coil 2 with its coil turns 3 and with their two coil connection contacts 4 and 5 in different levels, namely the provided as a component chip 33 together with its enclosure 38 in the Component level range Z2 and the coil 2 in the winding level range Z1, which also in the chip card 45 according to the figure 12 brings the great advantage that - still the chip 33 and its enclosure 38 and the two module connection contacts 34 and 35 of the same main support surface, namely the second support main surface 32 of the support 30 of the Module 29 protrude - the course of the coil turns 3 of the coil 2 and the training the coil 2 in the vicinity of the chip 33 no limiting influences through the Presence of the chip 33 subject.
  • the invention is not to the embodiments described above limited.
  • other suitable techniques for use come, for example, etching techniques or laser techniques.
  • the coils provide other suitable techniques, such as etching techniques.
  • a module inserted into a data carrier does not necessarily have to have only one chip Component included, but can also be a capacitor or a pressure-sensitive Foil switch and the like as a component. It should also be mentioned that in optionally not only a chip card forming a data carrier according to the invention a single chip as a component, but also two or more chips to be included can.
  • a smart card also two modules, each with a chip or a module with two chips are used.
  • the carriers of the modules in the region of the first Body main surface of the card body accessible, wherein the first support main surface and the first body main surface in the smart cards according to the three above-described Embodiments are aligned; but it can also be provided with a chip card, in that the first carrier main surface of the carrier of a module is covered by a cover layer is covered, in which case the outer boundary surface of this cover layer with the first body main surface of the card body of this chip card is aligned.
  • the Coil windings and the coil connection contacts lie in one plane, so that then the Coil terminals and also the coil windings along their entire area or course in a wire diameter corresponding Windungsforementioned Scheme Z1, which lies outside of the component level range Z2.
  • the coil turns in their to the component on the module of the disk is not adjacent, ie in a transverse to the carrier main surfaces of the support of the module extending direction of the component not opposite area, where appropriate, also within the component level range Z2 can be, which by appropriate bent or angled shape of the coil can be reached.
  • Decisive is in the present context that the coil terminal contacts and the coil turns the coil at least in their area adjacent to the component in an outside of the Component level range Z2 lying winding level Z1 lie.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Claims (19)

  1. Support de données (45) avec un corps de support de données (14) qui est délimité par une surface de corps (15) et dans lequel sont insérés un module (29) et une bobine (2), séparée par rapport au module (29), présentant des enroulements de bobine (3) et au moins deux contacts de connexion de bobine (4, 5), le module (29) présentant un support (30) en forme de plaque qui est essentiellement parallèle à ladite surface de corps (15) et qui est délimité par une première surface principale de support (31) tournée vers l'une desdites surfaces de corps (15) et une deuxième surface principale de support (32) essentiellement parallèle à la première surface principale de support (31) et opposée à ladite surface de corps (15) et au moins un composant (33) qui est inséré dans le corps de support de données (14) et est relié avec le support (30) et est relevé par rapport à la deuxième surface principale de support (32) et qui se trouve dans une zone du niveau des composants (Z2) s'étendant perpendiculairement à ladite surface de corps (15) et au moins deux contacts de connexion de module (34, 35) qui sont reliés avec le support (30) et sont prévus dans la région de la deuxième surface principale de support (32) et dans lequel les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) se trouvent au moins dans sa région proche du composant (33) dans une zone de niveau de bobine (Z1) se situant à l'extérieur de la zone du niveau des composants (Z2) et s'étendant perpendiculairement par rapport à ladite surface de corps (15) et dans lequel chaque contact de connexion de bobine (4, 5) est opposé à un contact de connexion de module (34, 35) s'étendant perpendiculairement à la deuxième surface principale de support (32) et se trouve en liaison conductrice électriquement avec ce dernier et dans lequel il est prévu, entre chaque contact de connexion de module (34, 35) et le contact de connexion de bobine (4, 5) opposé à celui-ci, un canal (21, 22) adjacent aux deux contacts de connexion (34, 35, 4, 5) et entouré sur toute sa longueur du corps de support de données (14) et dans lequel chaque canal (21, 22) contient comme moyen de connexion (28) électriquement conducteur une masse électriquement conductrice (28) à introduire dans le canal (21, 22) à l'état pâteux ou liquide, avec laquelle la connexion électriquement conductrice est formée entre un contact de connexion de module (34, 35) et un contact de connexion de bobine (34, 35), caractérisé en ce que chaque canal (21, 22) présente une poche (23, 24) s'écartant latéralement du canal (21, 22) dans laquelle la masse électriquement conductrice (28) excédentaire peut être recueillie sur son extrémité opposée au contact de connexion de bobine (4, 5) adjacent à celui-ci et sur son extrémité tournée vers le contact de connexion de module (34, 35) adjacent à celui-ci.
  2. Support de données (45) selon la revendication 1, dans lequel le support de données (45) présente un évidement (17) étagé qui débouche dans ladite surface de corps (15) et présente une première zone d'évidement (18) de section plus grande et adjacente à ladite surface de corps (15) qui est délimitée par une surface de délimitation (19) circulaire s'étendant essentiellement parallèlement à ladite surface de corps (15) et une deuxième zone d'évidement (20) de section plus petite qui fait suite à la première zone d'évidement (18) sur sa face opposée à ladite surface de corps (15) et dans laquelle le module (29) est inséré, le support (30) du module (29) avec une section circulaire (39) de la deuxième surface principale de support (32) faisant face à la surface de délimitation (19) circulaire de la première zone d'évidement (18) et dans lequel les contacts de connexion de module (34, 35) sont prévus, du moins en partie, dans la région de la section circulaire (39) de la deuxième surface principale de support (32) et dans lequel les canaux (21, 22) s'étendent en partant de la surface de délimitation (19) circulaire de la première zone d'évidement (18) au travers du corps de support de données (14) et jusqu'aux contacts de connexion de bobine (4, 5) caractérisé en ce que les poches (23, 24) s'écartent latéralement des canaux (21, 22), tout comme la surface de délimitation (19) circulaire de la première zone d'évidement (18) et sont ouvertes vers cette surface de délimitation (19).
  3. Support de données (45) selon la revendication 2, caractérisé en ce que l'évidement (17) et les canaux (21, 22) et les poches (23, 24) sont fabriqués par une procédure de fraisage.
  4. Support de données (45) selon l'une des revendications 1 à 3, caractérisé en ce que chaque canal (21, 22) contient un adhésif électriquement conducteur comme masse (28) électriquement conductrice qui forme le moyen de connexion (28) électriquement conducteur.
  5. Support de données (45) selon l'une des revendications 1 à 4, caractérisé en ce que les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) sont formés par des pistes conductrices fabriquées avec un procédé de sérigraphie.
  6. Support de données (45) selon la revendication 5, caractérisé en ce que les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) sont formés des par pistes conductrices fabriquées avec un procédé de sérigraphie en utilisant une pâte conductrice en argent.
  7. Support de données (45) selon l'une des revendications 1 à 6, caractérisé en ce qu'on relie au support (30) du module (29) des contacts de connexion de module (46, 47) supplémentaires, prévus dans la région de sa première surface principale de support (31), qui sont conçus pour coopérer avec des contre-contacts à mettre en relation par contact avec eux en dehors du support de données (45).
  8. Support de données (45) selon l'une des revendications 1 à 7, caractérisé en ce que le support de données (45) est conçu comme une carte à puce.
  9. Procédé de fabrication d'un support de données (45) au cours duquel un corps de support de données (14) qui est limité par une surface de corps (15) est confectionné et au cours duquel, pour la confection du corps de support de données (14), une bobine (2) qui contient des enroulements de bobine (3) et au moins deux contacts de connexion de bobine (4, 5), est incluse dans le corps de support de données (14), dans lequel les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) viennent se placer, du moins dans leur zone voisine à un composant (33), dans une zone de niveau de bobine (Z1) s'étendant perpendiculairement à ladite surface de corps (15) et située à l'extérieur de la zone du niveau des composants (Z2) et dans lequel on inclut dans le corps de support de données (14) un module (29) qui présente un support (30) en forme de plaque délimité par une première surface principale de support (31) et par une deuxième surface principale de support (32) essentiellement parallèle à la première surface principale de support (31) et un composant (33) relié au support (30) et relevé par rapport à la deuxième surface principale de support (32) et au moins deux contacts de connexion de module (34, 35) reliés au support (30) et prévus dans la région de la deuxième surface principale de support (32), la première surface principale de support (31) étant tournée vers ladite surface de corps (15) et la deuxième surface principale de support (32) étant opposée à ladite surface de corps (15) et dans lequel le composant (33) vient se placer dans une zone de niveau des composants (Z2) s'étendant perpendiculairement à ladite surface de corps (15) et dans lequel un contact de connexion de module (34, 34) et un contact de connexion de bobine (4, 5) viennent respectivement se placer en vis-à-vis dans une direction s'étendant perpendiculairement à la deuxième surface principale de support (32) et sont mis en liaison de manière électriquement conductrice et dans lequel sont confectionnés des canaux (21, 22) entourés par le corps de support de données (14) sur toute sa longueur et s'étendant dans le corps de support de données (14) perpendiculairement à ladite surface de corps (15), chacun d'eux allant jusqu'à un contact de connexion de bobine (4, 5) et étant accessible de l'extérieur avant l'introduction du module (29) dans le corps de support de données (14) par l'intermédiaire de son extrémité opposée au contact de connexion de bobine (4, 5), dans lequel une masse électriquement conductrice (28) pâteuse ou liquide est introduite dans chaque canal (21, 22) comme moyen de liaison électriquement conducteur (28) et dans lequel, lors de l'introduction du module (29) dans le corps du support de données (14), chaque contact de connexion de module 34, 35) relié au support (30) du module (29) est mis en liaison électriquement conductrice avec la masse (28) électriquement conductrice introduite dans un canal (21, 22) avec un contact de connexion de bobine (4, 5) opposé, caractérisé en ce que les canaux (21, 22) sont fabriqués par un procédé d'enlèvement de matière et que chaque canal (21, 22) est doté à son extrémité opposée au contact de connexion de bobine (4, 5) adjacent à celui-ci avec une poche (24, 25) s'écartant latéralement du canal (21, 22) dans laquelle la masse (28) électriquement conductrice excédentaire peut être recueillie.
  10. Procédé selon la revendication 9, dans lequel on ménage dans le corps de support de données (14) un évidement (17) étagé qui débouche dans ladite surface de corps (15) et présente une première zone d'évidement (18) de section plus grande et adjacente à ladite surface de corps (15) qui est délimitée par une surface de délimitation (19) circulaire s'étendant essentiellement parallèlement à ladite surface de corps (15) et une deuxième zone d'évidement (20) de section plus petite qui fait suite à la première zone d'évidement (18) sur sa face opposée à ladite surface de corps (15) et dans laquelle le module (29) est inséré, le support (30) du module (29) avec une section circulaire (39) de la deuxième surface principale de support (32) faisant face à la surface de délimitation (19) circulaire de la première zone d'évidement (18) et dans lequel les contacts de connexion de module (34, 35) sont prévus, du moins en partie, dans la région de la section circulaire (39) de la deuxième surface principale de support (32) et dans lequel les canaux (21, 22) s'étendent en partant de la surface de délimitation (19) circulaire de la première zone d'évidement (18) au travers du corps de support de données (14) et jusqu'aux contacts de connexion de bobine (4, 5), caractérisé en ce que, dans le corps de support de données (14) fabriqué, on fabrique l'évidement (17) étagé avec un procédé d'enlèvement de matière et que, dans le corps de support de données (14) fabriqué, on fabrique avec un procédé d'enlèvement de matière, de préférence avec le même, les canaux (21, 22), tout comme les poches (23, 24) s'écartant latéralement des canaux (21, 22), dont chacune part de la surface de délimitation (19) circulaire de la première zone d'évidement (18) et est ouverte vers cette surface de délimitation (19) et que le module (29) est inséré avec le composant (33) et les contacts de connexion de module (34, 35) par l'avant dans l'évidement (17), chaque contact de connexion de module (34, 35) relié au support (30) du module (29) étant mis en liaison électriquement conductrice avec la masse (28) électriquement conductrice introduite dans un canal (21, 22) avec un contact de connexion de bobine (4, 5) opposé et la masse (28) électriquement conductrice éventuellement excédentaire est expulsée dans la poche (23, 24) s'écartant latéralement d'un canal (21, 22).
  11. Procédé selon la revendication 10, caractérisé en ce que l'enlèvement de matière est effectué pour la fabrication de l'évidement (17) et des canaux (21, 22) ainsi que des poches (23, 24) par une procédure de fraisage.
  12. Procédé selon l'une des revendications 9 à 11, caractérisé en ce que, dans chaque canal (21, 22), un adhésif électriquement conducteur est introduit comme masse (28) électriquement conductrice qui forme le moyen de liaison électriquement conducteur.
  13. Procédé selon l'une des revendications 9 à 12, caractérisé en ce qu'avant l'introduction de la masse électriquement conductrice (28) dans les canaux (21, 22) et avant l'introduction du module (29) dans l'évidement (17) par les canaux (21, 22), un dispositif de contrôle pour le contrôle de la fonctionnalité impeccable de la bobine (2) est mis en relation opérationnelle avec les contacts de connexion de bobine (4, 5).
  14. Procédé selon l'une des revendications 9 à 13, caractérisé en ce qu'avant l'introduction du module (29) dans l'évidement (17), on applique un adhésif à fusion à chaud (40) dans une zone de bordure (39) de la deuxième surface principale de support (32) du support (30) du module (29) et qu'après l'introduction du module (29) dans l'évidement (17) un poinçon chauffant (43) d'un dispositif de chauffage est appliqué sur la première surface principale de support (31) du support (30) du module (29) pour l'activation de l'adhésif à fusion à chaud (40).
  15. Procédé selon l'une des revendications 9 à 14, caractérisé en ce que les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) sont appliqués sur une feuille de support (1) et qu'ensuite, la feuille de support (1), avec les enroulements de bobine (3) appliqués sur celle-ci et les contacts de connexion de bobine (4, 5) de la bobine (2) est empilée avec au moins une feuille supplémentaire (8, 9, 10, 11, 12), les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) venant se placer entre la feuille de support (1) et une feuille de couverture (11) et qu'ensuite, les feuilles empilées (1, 8, 9, 10, 11, 12) sont laminées par une procédure de laminage pour la fabrication du corps de support de données (14).
  16. Procédé selon la revendication 15, caractérisé en ce qu'une feuille composée de polycarbonate est utilisée comme feuille de support (1) sur laquelle les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) sont appliqués.
  17. Procédé selon la revendication 16, caractérisé en ce qu'une feuille composée de chlorure de polyvinyle est utilisée comme feuille de couverture (11) qui fait face directement aux enroulements de bobine (3) et aux contacts de connexion de bobine (4, 5), de la bobine (2) lors de l'empilage des feuilles (1, 8, 9, 10, 11, 12).
  18. Procédé selon l'une des revendications 15 à 17, caractérisé en ce que les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) sont fabriqués par application d'une matière conductrice sur la feuille de support (1) dans une procédure de sérigraphie.
  19. Procédé selon la revendication 18, caractérisé en ce que les enroulements de bobine (3) et les contacts de connexion de bobine (4, 5) de la bobine (2) sont fabriqués par application d'une pâte conductrice en argent sur la feuille de support (1) dans une procédure de sérigraphie.
EP96921032A 1995-08-01 1996-07-15 Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees Expired - Lifetime EP0842491B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT96921032T ATE297573T1 (de) 1995-08-01 1996-07-15 Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
AT42295 1995-08-01
AT0042295U AT1470U1 (de) 1995-08-01 1995-08-01 Laminierte karte und verfahren zu ihrer herstellung
AT422/95 1995-08-01
PCT/IB1996/000690 WO1997005569A1 (fr) 1995-08-01 1996-07-15 Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees

Publications (2)

Publication Number Publication Date
EP0842491A1 EP0842491A1 (fr) 1998-05-20
EP0842491B1 true EP0842491B1 (fr) 2005-06-08

Family

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Application Number Title Priority Date Filing Date
EP96921032A Expired - Lifetime EP0842491B1 (fr) 1995-08-01 1996-07-15 Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees

Country Status (8)

Country Link
US (1) US5996897A (fr)
EP (1) EP0842491B1 (fr)
JP (1) JP3735374B2 (fr)
CN (1) CN1106627C (fr)
AT (1) ATE297573T1 (fr)
AU (1) AU6238296A (fr)
DE (1) DE59611233D1 (fr)
WO (1) WO1997005569A1 (fr)

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* Cited by examiner, † Cited by third party
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DE102007020475A1 (de) 2007-04-27 2008-11-06 Häusermann GmbH Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung
DE102012002945A1 (de) 2012-02-16 2013-08-22 Häusermann GmbH Multifunktionelle Mehrlagenleiterplatte mit einer elektrisch leitfähigen Hochstrom-Leitstruktur
WO2022167150A1 (fr) * 2021-02-03 2022-08-11 Giesecke+Devrient Mobile Security Gmbh Procédé de production d'une carte à puce, corps de carte pour une carte à puce, et carte à puce

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WO2022167150A1 (fr) * 2021-02-03 2022-08-11 Giesecke+Devrient Mobile Security Gmbh Procédé de production d'une carte à puce, corps de carte pour une carte à puce, et carte à puce

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JPH11513154A (ja) 1999-11-09
EP0842491A1 (fr) 1998-05-20
CN1106627C (zh) 2003-04-23
DE59611233D1 (de) 2005-07-14
US5996897A (en) 1999-12-07
JP3735374B2 (ja) 2006-01-18
CN1201542A (zh) 1998-12-09
WO1997005569A1 (fr) 1997-02-13
ATE297573T1 (de) 2005-06-15
AU6238296A (en) 1997-02-26

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