EP0836536A4 - On-site generation of ultra-high-purity buffered-hf for semiconductor processing - Google Patents
On-site generation of ultra-high-purity buffered-hf for semiconductor processingInfo
- Publication number
- EP0836536A4 EP0836536A4 EP96922477A EP96922477A EP0836536A4 EP 0836536 A4 EP0836536 A4 EP 0836536A4 EP 96922477 A EP96922477 A EP 96922477A EP 96922477 A EP96922477 A EP 96922477A EP 0836536 A4 EP0836536 A4 EP 0836536A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- ultra
- semiconductor processing
- site generation
- purity buffered
- buffered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01C—AMMONIA; CYANOGEN; COMPOUNDS THEREOF
- C01C1/00—Ammonia; Compounds thereof
- C01C1/02—Preparation, purification or separation of ammonia
- C01C1/024—Purification
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D1/00—Evaporating
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B7/00—Halogens; Halogen acids
- C01B7/19—Fluorine; Hydrogen fluoride
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B7/00—Halogens; Halogen acids
- C01B7/19—Fluorine; Hydrogen fluoride
- C01B7/191—Hydrogen fluoride
- C01B7/195—Separation; Purification
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B7/00—Halogens; Halogen acids
- C01B7/19—Fluorine; Hydrogen fluoride
- C01B7/191—Hydrogen fluoride
- C01B7/195—Separation; Purification
- C01B7/197—Separation; Purification by adsorption
- C01B7/198—Separation; Purification by adsorption by solid ion-exchangers
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01C—AMMONIA; CYANOGEN; COMPOUNDS THEREOF
- C01C1/00—Ammonia; Compounds thereof
- C01C1/16—Halides of ammonium
- C01C1/162—Ammonium fluoride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
WOPCT/US95/07649 | 1995-06-05 | ||
PCT/US1995/007649 WO1996039358A1 (en) | 1995-06-05 | 1995-06-05 | Point-of-use ammonia purification for electronic component manufacture |
US49942795A | 1995-07-07 | 1995-07-07 | |
US499427 | 1995-07-07 | ||
PCT/US1996/010388 WO1996039266A1 (en) | 1995-06-05 | 1996-06-05 | On-site generation of ultra-high-purity buffered-hf for semiconductor processing |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0836536A1 EP0836536A1 (en) | 1998-04-22 |
EP0836536A4 true EP0836536A4 (en) | 1999-12-15 |
Family
ID=26789686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96922477A Withdrawn EP0836536A4 (en) | 1995-06-05 | 1996-06-05 | On-site generation of ultra-high-purity buffered-hf for semiconductor processing |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0836536A4 (en) |
JP (1) | JP2001527697A (en) |
KR (1) | KR100379886B1 (en) |
AU (1) | AU6333896A (en) |
WO (1) | WO1996039266A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7980753B2 (en) | 1998-04-16 | 2011-07-19 | Air Liquide Electronics U.S. Lp | Systems and methods for managing fluids in a processing environment using a liquid ring pump and reclamation system |
US6799883B1 (en) | 1999-12-20 | 2004-10-05 | Air Liquide America L.P. | Method for continuously blending chemical solutions |
US7871249B2 (en) | 1998-04-16 | 2011-01-18 | Air Liquide Electronics U.S. Lp | Systems and methods for managing fluids using a liquid ring pump |
US6224252B1 (en) | 1998-07-07 | 2001-05-01 | Air Products And Chemicals, Inc. | Chemical generator with controlled mixing and concentration feedback and adjustment |
DE19837041A1 (en) * | 1998-08-14 | 2000-02-24 | Messer Griesheim Gmbh | Production of ready-to-use solutions |
DE19905798A1 (en) * | 1999-02-12 | 2000-08-17 | Bayer Ag | Process for the production of pure hydrofluoric acid |
DE10115345A1 (en) * | 2001-03-28 | 2002-10-02 | Merck Patent Gmbh | Process for the purification of corrosive gases |
FR2834045B1 (en) * | 2001-12-20 | 2004-05-28 | Air Liquide Electronics Sys | METHOD AND SYSTEM FOR PRODUCING A CHEMICAL SOLUTION FROM THE GASEOUS PHASE OF A CHEMICAL |
KR100475272B1 (en) * | 2002-06-29 | 2005-03-10 | 주식회사 하이닉스반도체 | Manufacturing Method of Semiconductor Device |
US20160296902A1 (en) | 2016-06-17 | 2016-10-13 | Air Liquide Electronics U.S. Lp | Deterministic feedback blender |
CN108609585A (en) * | 2018-08-08 | 2018-10-02 | 宣城亨泰电子化学材料有限公司 | A kind of hydrofluoric acid arsenic removal process |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4828660A (en) * | 1986-10-06 | 1989-05-09 | Athens Corporation | Method and apparatus for the continuous on-site chemical reprocessing of ultrapure liquids |
US5164049A (en) * | 1986-10-06 | 1992-11-17 | Athens Corporation | Method for making ultrapure sulfuric acid |
US4929435A (en) * | 1987-02-12 | 1990-05-29 | Allied-Signal Inc. | Manufacture of high purity low arsenic anhydrous hydrogen fluoride |
US4756899A (en) * | 1987-02-12 | 1988-07-12 | Allied-Signal Inc. | Manufacture of high purity low arsenic anhydrous hydrogen fluoride |
US4952386A (en) * | 1988-05-20 | 1990-08-28 | Athens Corporation | Method and apparatus for purifying hydrogen fluoride |
US4980032A (en) * | 1988-08-12 | 1990-12-25 | Alameda Instruments, Inc. | Distillation method and apparatus for reprocessing sulfuric acid |
US5288333A (en) * | 1989-05-06 | 1994-02-22 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method and apparatus therefore |
JPH05121390A (en) * | 1991-10-29 | 1993-05-18 | Koujiyundo Silicon Kk | Removing method for acid |
DE4135918A1 (en) * | 1991-10-31 | 1993-05-06 | Solvay Fluor Und Derivate Gmbh, 3000 Hannover, De | MANUFACTURE OF HIGHLY PURE FLUORED HYDROGEN |
US5500098A (en) * | 1993-08-05 | 1996-03-19 | Eco-Tec Limited | Process for regeneration of volatile acids |
US5496778A (en) * | 1994-01-07 | 1996-03-05 | Startec Ventures, Inc. | Point-of-use ammonia purification for electronic component manufacture |
-
1996
- 1996-06-05 WO PCT/US1996/010388 patent/WO1996039266A1/en not_active Application Discontinuation
- 1996-06-05 KR KR1019970708706A patent/KR100379886B1/en not_active IP Right Cessation
- 1996-06-05 AU AU63338/96A patent/AU6333896A/en not_active Abandoned
- 1996-06-05 JP JP50228497A patent/JP2001527697A/en not_active Ceased
- 1996-06-05 EP EP96922477A patent/EP0836536A4/en not_active Withdrawn
Non-Patent Citations (2)
Title |
---|
No further relevant documents disclosed * |
See also references of WO9639266A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1996039266A1 (en) | 1996-12-12 |
JP2001527697A (en) | 2001-12-25 |
KR19990022227A (en) | 1999-03-25 |
KR100379886B1 (en) | 2003-06-19 |
AU6333896A (en) | 1996-12-24 |
EP0836536A1 (en) | 1998-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR0171436B1 (en) | Forming method of semiconductor device | |
SG55280A1 (en) | Fabrication process of semiconductor substrate | |
SG66317A1 (en) | Process for producing semiconductor substrate | |
EP0740340A3 (en) | Structure and process for mounting semiconductor chip | |
GB2287827B (en) | Method for wet processing of a semiconductor substrate | |
EP0628992A3 (en) | Method of making semiconductor wafers. | |
GB2347268B (en) | Method of semiconductor device fabrication | |
SG71006A1 (en) | Fabrication process of soi substrate | |
SG64393A1 (en) | Semiconductor substrate and process for production thereof | |
DE69628903D1 (en) | Plasma reactors for processing semiconductor wafers | |
GB2296818B (en) | Method of producing semiconductor wafer | |
KR0165499B1 (en) | Capacitor fabrication method of semiconductor device | |
EP0831978A4 (en) | On-site ammonia purification for semiconductor manufacture | |
EP0739032A3 (en) | Isolation method of semiconductor device | |
EP0744770A3 (en) | Semiconductor apparatus | |
AU6103696A (en) | On-site generation of ultra-high-purity buffered hf for semi conductor processing | |
GB2275364B (en) | Semiconductor etching process | |
EP0836536A4 (en) | On-site generation of ultra-high-purity buffered-hf for semiconductor processing | |
GB2297427B (en) | Process of fabricating semiconductor device | |
GB2299705B (en) | Semiconductor memory devices | |
AU6178196A (en) | System and method for on-site mixing of ultra-high-purity ch emicals for semiconductor processing | |
SG47194A1 (en) | Member for production device of semiconductor | |
TW336770U (en) | Semi-conductor manufacturing waste gas treatment system | |
GB2307787B (en) | A set of labels for a semiconductor wafer | |
AU6161896A (en) | On-site manufacture of ultra-high-purity hydrofluoric acid f or semiconductor processing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19971231 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT NL |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: AIR LIQUIDE AMERICA CORPORATION |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 19991104 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): DE FR GB IT NL |
|
RIC1 | Information provided on ipc code assigned before grant |
Free format text: 6B 08B 7/04 A, 6B 01D 1/00 B, 6B 01D 3/14 B, 6B 01D 3/02 B, 6B 01D 3/00 B, 6C 01B 7/19 B, 6C 01B 7/07 B, 6F 26B 7/00 B, 6C 01C 1/02 B, 6H 01L 21/306 B, 6H 01L 21/311 B, 6C 01C 1/16 B |
|
APAB | Appeal dossier modified |
Free format text: ORIGINAL CODE: EPIDOS NOAPE |
|
APAB | Appeal dossier modified |
Free format text: ORIGINAL CODE: EPIDOS NOAPE |
|
APAB | Appeal dossier modified |
Free format text: ORIGINAL CODE: EPIDOS NOAPE |
|
APAD | Appeal reference recorded |
Free format text: ORIGINAL CODE: EPIDOS REFNE |
|
17Q | First examination report despatched |
Effective date: 20020220 |
|
APAF | Appeal reference modified |
Free format text: ORIGINAL CODE: EPIDOSCREFNE |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20051231 |