EP0811145A1 - Generation de donnees relatives a la surface d'un objet - Google Patents

Generation de donnees relatives a la surface d'un objet

Info

Publication number
EP0811145A1
EP0811145A1 EP96943625A EP96943625A EP0811145A1 EP 0811145 A1 EP0811145 A1 EP 0811145A1 EP 96943625 A EP96943625 A EP 96943625A EP 96943625 A EP96943625 A EP 96943625A EP 0811145 A1 EP0811145 A1 EP 0811145A1
Authority
EP
European Patent Office
Prior art keywords
sensing
sensing element
providing
array
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96943625A
Other languages
German (de)
English (en)
Other versions
EP0811145A4 (fr
Inventor
Saul Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sven Technologies Inc
Original Assignee
Sven Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sven Technologies Inc filed Critical Sven Technologies Inc
Publication of EP0811145A1 publication Critical patent/EP0811145A1/fr
Publication of EP0811145A4 publication Critical patent/EP0811145A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/28—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring contours or curvatures
    • G01B7/287—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques

Definitions

  • the invention relates generally to generating representations of a three- dimensional object on a computer screen, and more particularly to surface sensing devices that quickly and efficiently generate data representing the contour of the surface of a three-dimensional object.
  • a stylus is used to depress the touch-sensitive surface and cause electrical signals to be generated relating to the position of the stylus on the table. These stylus position signals may be used to generate two-dimensional data about the object. These two-dimensional digitizing systems, however, are not suitable for generating data about the surface of three-dimensional objects.
  • SUBSTTTUTE SHEET include either a mechanical probe coordinate measuring machine (CMM), or an optical system.
  • CMM systems generally use a type of electromechanical probe to contact and follow the surface of the object and generate data relating to the surface of the object along the scan line. The data generation process is repeated for successive scan lines until data is gathered for the entire object. Then, the data is combined to form a three-dimensional representation of the object.
  • the systems for combining scan-line data into a representation of the object are well known.
  • These mechanical probe systems are slow because the mechanical probe has to be moved over the entire surface of the three-dimensional object in order to generate the data.
  • these mechanical probe systems require expensive, complex, large machines, and require a large amount of processing power to control the mechanical probe and process the scan-line data. In addition, only a person that is specifically trained can operate the system.
  • the known optical systems typically use incandescent light or laser light to generate data relating to the surface of the object.
  • light is projected towards the object and the reflected light from the surface of the object is received by a sensor.
  • a video camera is used to form images of an object at various different angles to generate data about the surface of the object.
  • optical systems are susceptible to misalignment problems that can corrupt the generated data.
  • these optical systems are expensive, large machines that must be operated by a trained person.
  • the invention provides a surface sensing system which is inexpensive, portable, and can quickly generate three-dimensional data about the surface of an object.
  • the surface sensing system of the invention may be easily moved and may also be quickly calibrated.
  • the surface sensing system is a device that may be easily interfaced to a personal computer and may be operated by an average person without any specific training.
  • a surface sensing system in accordance with the invention includes an array of sensing elements for contacting the surface of the object, and a system associated with each sensing element for providing a signal representing the location of a corresponding point on the surface of the object contacted by the sensing element relative to a reference plane.
  • a processor generates a representation of the object from the signals generated by the sensing elements.
  • Each sensing element may have a system for indicating a relative displacement of the sensing element with respect to the reference plane.
  • the system may use either resistive sensing elements or reactive, e.g., capacitive, sensing elements.
  • the array of sensing elements may be of any convenient size and may have a density of sensing elements per unit area that affords the desired degree of resolution of measurement.
  • the individual sensing elements may also be of any convenient size.
  • the invention also provides a method for generating a representation of an object in which the surface of the object is contacted by an array of sensing elements, signals representing the locations of points on the surface of the object relative to reference plane are generated by the array of sensing elements, and the signals are processed to generate a representation of the object.
  • Figure 1 is a block diagram depicting a surface sensing system in accordance with the invention
  • Figure 2 is a perspective view of an embodiment of a surface sensing device in accordance with the invention that may employed with the surface sensing system shown in Figure 1;
  • Figure 3 is an enlarged cross-sectional view of a first embodiment of a sensing element of the sensing device of Figure 2;
  • Figure 4 is a front view of the back mounting plate of the sensing device shown in Figure 2;
  • Figure 5 is a front view of the front mounting plate of the sensing device shown in Figure 2;
  • Figure 6 is a enlarged cross-sectional view of another embodiment of a sensing element of the sensing device of Figure 2;
  • Figure 7 is a side view showing the surface sensing device of the invention being used to generate data about a three-dimensional object;
  • Figure 8 is a top view showing the surface scanning device of the invention being used to generate data about the three-dimensional object of Figure 7;
  • Figure 9 is a flowchart showing a method of sensing a three- dimensional object in accordance with the invention.
  • Figure 10 is a flowchart showing a method of sensing one side of a three-dimensional object in accordance with the invention. Detailed Description of Preferred Embodiments
  • the invention is particularly applicable to a surface sensing system and method that provides an inexpensive, fast way of sensing a three-dimensional object, such as small hand-held objects, to produce data about the surface of the object, to permit generation of a representation of the object on a computer screen, and will be described in that context. It will be appreciated, however, that the system and method in accordance with the invention has greater utility.
  • FIG. 1 is a block diagram depicting a sensing system in accordance with the invention.
  • the sensing system may include a surface sensing device
  • the surface sensing device 20 is generally used to generate data about the surface characteristics of a three-dimensional object 22. Generally, the surface sensing device generates signals that represent the contour of the surface of the object. This may be by signals that represent the locations, e.g., heights, of various points on the surface of the object relative to a reference plane. Once these signals are produced, they can be processed to generate representations
  • the surface sensing device may have a plurality of sensing elements 23 arranged in an array or matrix supported by a mounting plate 21. However, the surface sensing device may be composed of any number of sensing elements in any desired configurations and may have any desired density of sensing elements per unit area.
  • the matrix of sensing elements may be an X-Y matrix of sensing elements.
  • an X multiplexer 24 and a Y multiplexer 26 may be used to sequentially sample each sensing element within the X-Y matrix in order to determine the signals from each individual sensing element in the array.
  • the X multiplexer and the Y multiplexer allow the sensing system to scan each row and column of the array of sensing elements in order to generate signals for each individual point on the surface of the object contacted by the corresponding sensing element.
  • the matrix of sensing elements may also be sampled by any other sampling system, such as multiple parallel inputs. The method of generating three-dimensional data using these multiplexers will be described in more detail below.
  • Each sensing element has a system associated with it for producing a signal representing the location of a point on the surface of the object contacted by the sensing element relative to a reference plane.
  • each sensing element has a system that converts the signal from the sensing element into a signal that corresponds to the location of a point on the surface of the object relative to a reference plane.
  • the system for producing the signals representing the location of points of the surface of the object relative to a reference plane may include a sampling circuit 28.
  • This sampling circuit may be a high frequency A/C capacitance bridge that generates an electrical signal corresponding to the capacitance of a capacitive sensing element, or a Wheatstone bridge that generates an electrical signal corresponding to the resistance of a resistive sensing element.
  • the capacitive sensing element will be described below with reference to Figure 3, and the resistive sensing element will be described below with reference to Figure 6.
  • Wheatstone bridge sample either the capacitance or resistance, respectively, of the sensing element and generate a corresponding electrical signal.
  • the signals are converted into digital signals by an analog-to-digital (A/D) converter 30.
  • A/D analog-to-digital
  • the computer interface 32 controls the operation of the X multiplexer 24 and the Y multiplexer 26 in order to generate signals for each sensing element of the sensing device and also processes the signals from the signal producing system in order to generate a representation of the object that can be displayed on a computer display.
  • the computer interface in turn, may be connected to a computer 34 that has a display 36.
  • Figure 2 is a perspective view of the sensing device 20 shown in Figure
  • the sensing device may comprise a plurality of individual sensing elements arranged in an array or matrix.
  • the sensing device may include a front mounting plate 50 and a back mounting plate 52.
  • These sensing elements may be any type of sensing device that provides a signal representing the location of a point on the surface of an object relative to a reference plane. Preferred embodiments of these sensing elements will be described in more detail below with reference to Figures 3 and 6.
  • Each of the sensing elements may comprise a body portion 54 having a sensing pin 56 that is biased to extend outwardly from the end of the sensing element body.
  • the sensing device may have, for example, a full X-Y matrix of sensing elements of any appropriate size and density.
  • the sensing pins may be of any desirable length and depends on the size of the object.
  • the plurality of the sensing elements may form an array of sensing elements. The number of sensing elements within the array per unit area and the spacing of the sensing elements within the array, e.g., the density of sensing elements, determine the resolution of the sensing device. For example, if the array has many closely spaced sensing elements, then the sensing device has a high resolution. On the other hand, an array with fewer sensing elements spaced farther apart from each other has a lower resolution.
  • the number and spacing of the sensing elements in the array may vary and be selected for the resolution required for a particular application.
  • the sensing elements within the array may be detachable from the front and back mounting plates, if desired, so that the array may be customized easily.
  • Each sensing element independently generates a signal representing the location of a point on the surface of the object relative to a reference plane.
  • the sensing elements determine a contour of the surface of an object by measuring the location of a point on the surface of the object relative to any plane.
  • the reference plane may be the back mounting plate so that the sensing elements measure the height of points on the surface of the object relative to the back mounting plate. If the reference plane is the back mounting plate, then the sensing device of the invention may be used to produce data about an object even if the sensing device is upside down.
  • the reference plane may be any other plane, such as the surface upon which the object is resting.
  • FIG 3 is a cross-sectional side view of a first embodiment of a sensing element 23 that may be employed in the sensing device 20 shown in Figure 2.
  • the sensing element shown in Figure 3 is a capacitive sensing element 55 that may be attached between the front mounting plate 50 and the back mounting plate 52 of the sensing device.
  • the capacitive sensing element is a variable capacitance device, and may include a sensing pin 56 that is slideably disposed within a cylindrical housing 72, and biased outwardly from the housing by a spring 66.
  • An interior end of the sensing pin may be attached to a stopper and sliding guide 64.
  • the spring 66 may engage the guide 64 to bias the sensing pin outwardly through the front mounting plate.
  • an insulating pin guide 68 disposed in front plate 50 may guide the sensing pin, and a back plug 70 may attach the spring to the back mounting plate.
  • the sensing pin 56 and the cylindrical housing 72 that surrounds the sensing pin may both be metallic.
  • the combination of the metallic sensing pin 56 and the cylindrical housing 72 form a capacitor whose capacitance varies with the location of the sensing pin in the cylindrical housing. In other words, the distance that the sensing pin is pushed back into the cylindrical housing may be determined by measuring the change in capacitance relative to a reference value.
  • the capacitive sensing element may also include an outer shielded housing 74 that protects the capacitor from damage.
  • An electrical brush contact 76 connects the sensing pin 56 to the front mounting plate 50.
  • the cylindrical housing 72 which is the other part of the capacitor, is connected to the back mounting plate 52 by the back plug 70.
  • FIG 4 is a front view of the back mounting plate 52 of the sensing device shown in Figure 2.
  • the back mounting plate may have a plurality of electrical traces 80 that vertically (in this figure) connect the back plug 70 and the cylindrical metallic housing (not shown) of various sensing elements of the sensing device to each other.
  • One end of all of the electrical traces 80 are connected together to form a common lead 82.
  • the other ends of the electrical traces are combined into a cable 84 as individual conductors that connect to the Y multiplexer (not shown).
  • Figure 5 is a front view of the front mounting plate 50 of the sensing device as shown in Figure 2.
  • the front mounting plate may also have a plurality of electrical traces 90 that are connected to a horizontal (in this figure) row of electrical brush contacts 76 of various sensing elements. One end of these electrical traces are connected together to form a second common lead 92. The other end of the electrical traces are combined in a cable 94 as individual conductors that connect to the X multiplexer (not shown).
  • each sensing pin is displaced into the cylindrical housing a certain amount depending on the height of the corresponding point on the
  • the electrical traces 80, 90 form an X-Y matrix of conductors.
  • the capacitance of each individual sensing element may be measured by selecting a particular electrical trace on the back mounting plate using the Y multiplexer, and a particular electrical trace on the front mounting plate using the X multiplexer which intersect at the selected sensing element.
  • an electrical trace 97 on the back mounting plate in combination with an electrical trace 98 on the front mounting plate are selected by the multiplexers.
  • the capacitance is then measured by the sampling circuit as the capacitance of the electrical circuit formed by the electrical trace 97, the back plug 70, the cylindrical housing 72, the sensing pin
  • FIG. 6 is a cross-sectional view of another embodiment of a sensing element 23 that may be employed in the sensing device 20 shown in Figure 2.
  • the sensing element shown in Figure 6 is a resistive sensing element 100 that may have a sensing pin 102 slideably disposed within a guide housing 104 that may have a resistive strip 106 attached to it.
  • the sensing pin is biased outwardly from the housing by a spring 109.
  • the resistive sensing element is a variable resistance device.
  • the sensing pin and guide housing may both be metallic. An interior end of the sensing pin may be attached to a stop plug
  • a front electrical brush contact 112 electrically connects the sensing pin to an electrical trace (not shown) of the front mounting plate 50.
  • a rear stopper 114 connects the guide housing 104 to the back mounting plate
  • a second electiical brush contact 116 electrically connects the sensing pin to the resistive strip.
  • An electrical connector 118 connects the resistive strip to the electrical traces (not shown) on the back mounting plate 52.
  • the electrical traces of the front and back mounting plates, described above with reference to Figures 4 and 5, may also be used in connection with this resistive sensing eleme
  • the second electrical brush contact 116 slides backwards over the resistive strip 106 and the resistance of the resistive sensing element is reduced.
  • the resistance of an individual resistive sensing element is determined by selecting the individual resistive sensing element using the multiplexers and by using the sampling circuit to measure the resistance of the electrical circuit formed by the electrical trace on the front mounting plate, the front electrical brush contact
  • the resistive sensing element has a varying resistance that can be measured by the sampling circuit, such as a Wheatstone bridge, as described above, and converted into an electrical signal representing the
  • Figure 7 is a side view of the surface sensing device of the invention being used to generate data about a three-dimensional object 130, such as a vase.
  • the object 130 is three-dimensional, but only its side shape is shown for clarity.
  • data must be generated for two or more sides of the object by moving either the object or the sensing device.
  • the surface sensing device 20 may be placed over the vase so that the front mounting plate 50 is near the highest surface of the vase.
  • the sensing pins 56 of the sensing elements 54 are pushed back various distances depending on the height of the surface of the vase.
  • the varying distances of the sensing pins correspond to varying capacitance or resistive values of the sensing element, as described above.
  • the sensing pins 56 are fully extended due to the spring and have a maximum resistance value or a minimum capacitance value, depending on the type of sensing element used.
  • the length of the sensing pins may preferably be long enough so that the sensing pins, that do not touch the surface of the object, contact the surface that the object is resting on.
  • Figure 8 is a top view of the sensing device 20 of the invention being used to generate data about the object 130.
  • the array of sensing elements 56 in this embodiment is a rectangular configuration, but any configuration, such as a circle or square may be used.
  • the number of sensing elements within the array of sensing elements may be increased or decreased depending on the size of the object and the desired resolution.
  • the array of sensing elements allows the sensing device to generate data for a large portion of an object quickly. If the object is larger that the sensing device, then extra sensing elements may be added. If the object is still too large with the addition of the extra sensing elements, then data about the surface of the entire object may be generated by repeatedly using the sensing device of the
  • FIG 9 is a flowchart showing a method of sensing a three- dimensional object and generating a representation of the object in accordance with the invention.
  • the method is started in Step 140.
  • Step 142 the heights of various points on a first side of an object are determined using the sensing device.
  • Step 144 the data for another side of the object is generated using the sensing device.
  • Step 146 it is determined whether or not data has been generated for all of the sides of the object.
  • the vase shown in Figures 7 and 8 may require two sides of the vase to be sensed using the scanning device in order to generate sufficient data. The details of sensing each side of an object are described below with reference to Figure 10.
  • Step 148 the data from the various sides of the object are processed and combined together to generate a representation of the object.
  • Step 150 a graphical representation of a three- dimensional object may be generated and displayed on a computer system.
  • FIG. 10 is a flowchart showing a method of generating data for each side of a three-dimensional object in accordance with the invention.
  • Step 160 the method is begun.
  • Step 162 a first electrical trace on the front mounting plate is selected by the X multiplexer. This first electrical trace horizontally connects a number of sensing elements.
  • Step 164 a first electrical trace on the back mounting plate is selected by the Y multiplexer. The combination of the electrical trace of the front mounting plate and the electrical trace of the back mounting plate selects a single sensing element that is then sampled in accordance with the invention.
  • Step 166 the next sensing element in the row selected by the X multiplexer is sampled by incrementing the Y multiplexer.
  • Step 168 it is determined whether or not the row is complete (i.e., whether each sensing element in the row has been sampled). If the row has been completed, then the method returns to Step 166 in which the next column is selected by the Y multiplexer and the next sensing element is the row is sampled. If the row is complete, it is then determined in Step 170 whether or not the entire scan of the array has been completed. If the scan has not been completed, then the method returns to Step 162 in which the next row of sensing elements is selected by selecting the next electrical trace on the front mounting plate. On the other hand, if the scan is done then the method is completed in Step 172. In this manner, using the X and Y multiplexers, the entire array of sensing elements are scanned and signals are generated for each element. These signals are then processed and turned into electrical signals representing the height of the surface of the object above a reference plane.
  • the three-dimensional sensing device of the invention may also be quickly and easily calibrated by placing an object with a known surface contour, e.g., flat, underneath the sensing device. Then, the actual output of the sensing device may be compared to the anticipated output and the sensing device may be adjusted. This process of calibrating the sensing device may be conducted by the computer interface.
  • a known surface contour e.g., flat

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Manipulator (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

L'invention concerne un système de détection comprenant un dispositif (20) de détection de surface destiné à générer une représentation d'un objet (22) à l'aide d'un réseau d'éléments de détection (23) pouvant présenter une pointe de détection ainsi qu'un logement cylindrique. Les éléments de détection (23) génèrent un signal représentatif d'une hauteur de divers points se trouvant sur la surface de l'objet (22) par rapport à un plan de référence. Les éléments de détection (23) peuvent être des éléments de détection résistifs ou des éléments de détection capacitifs.
EP96943625A 1995-12-05 1996-12-05 Generation de donnees relatives a la surface d'un objet Withdrawn EP0811145A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US56776295A 1995-12-05 1995-12-05
US567762 1995-12-05
PCT/US1996/019448 WO1997021069A1 (fr) 1995-12-05 1996-12-05 Generation de donnees relatives a la surface d'un objet

Publications (2)

Publication Number Publication Date
EP0811145A1 true EP0811145A1 (fr) 1997-12-10
EP0811145A4 EP0811145A4 (fr) 1998-07-08

Family

ID=24268545

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96943625A Withdrawn EP0811145A4 (fr) 1995-12-05 1996-12-05 Generation de donnees relatives a la surface d'un objet

Country Status (6)

Country Link
EP (1) EP0811145A4 (fr)
JP (1) JPH11502027A (fr)
KR (1) KR19980702065A (fr)
AU (1) AU1282097A (fr)
CA (1) CA2212355A1 (fr)
WO (1) WO1997021069A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6378221B1 (en) * 2000-02-29 2002-04-30 Edwards Lifesciences Corporation Systems and methods for mapping and marking the thickness of bioprosthetic sheet
KR20040009550A (ko) * 2002-07-24 2004-01-31 고태조 역공학의 센서융합에 의한 데이터 획득방법
ITRM20070135A1 (it) * 2007-03-15 2008-09-16 Space Software Italia S P A Apparato per il rilevamento di oggetti immersi in materiali incoerenti e metodo di rilevamento
NL1037301C2 (nl) * 2009-09-21 2011-03-22 Sebastiaan Henri Alphons Boers Systeem voor het besturen van een pennenbedmal.
US9358107B2 (en) 2011-06-30 2016-06-07 Edwards Lifesciences Corporation Systems, dies, and methods for processing pericardial tissue
CN107101552B (zh) * 2017-06-13 2019-04-02 京东方科技集团股份有限公司 一种靶材余量测量装置

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US4653196A (en) * 1984-11-15 1987-03-31 Elgema Gmbh Device for measuring the profile shape of cylindrical workpiece surfaces
EP0335035A2 (fr) * 1988-03-31 1989-10-04 Nkk Corporation Méthode et appareil pour mesurer la forme d'une surface tri-dimensionnelle courbée
US4876758A (en) * 1987-03-31 1989-10-31 Amfit Inc. System and method for forming custom-made shoe inserts
US4969110A (en) * 1988-08-01 1990-11-06 General Electric Company Method of using a priori information in computerized tomography
JPH04203914A (ja) * 1990-11-29 1992-07-24 Mitsubishi Electric Corp 撮像装置
JPH0783629A (ja) * 1993-04-26 1995-03-28 Koyo Seiko Co Ltd ３次元形状測定装置
US5450505A (en) * 1992-11-06 1995-09-12 University Of New Mexico Construction and reconstruction of probe microscope images by function envelope methods
EP0683379A1 (fr) * 1994-05-19 1995-11-22 SOLLAC (Société Anonyme) Mesure tridimensionnelle de la surface d'un objet de grande dimension

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US4890235A (en) * 1988-07-14 1989-12-26 The Cleveland Clinic Foundation Computer aided prescription of specialized seats for wheelchairs or other body supports
US5060174A (en) * 1990-04-18 1991-10-22 Biomechanics Corporation Of America Method and apparatus for evaluating a load bearing surface such as a seat
US5440501A (en) * 1992-06-26 1995-08-08 Mitutoyo Corporation Energy saving capacitance type measuring device for absolute measurement of positions

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US4653196A (en) * 1984-11-15 1987-03-31 Elgema Gmbh Device for measuring the profile shape of cylindrical workpiece surfaces
US4876758A (en) * 1987-03-31 1989-10-31 Amfit Inc. System and method for forming custom-made shoe inserts
EP0335035A2 (fr) * 1988-03-31 1989-10-04 Nkk Corporation Méthode et appareil pour mesurer la forme d'une surface tri-dimensionnelle courbée
US4969110A (en) * 1988-08-01 1990-11-06 General Electric Company Method of using a priori information in computerized tomography
JPH04203914A (ja) * 1990-11-29 1992-07-24 Mitsubishi Electric Corp 撮像装置
US5450505A (en) * 1992-11-06 1995-09-12 University Of New Mexico Construction and reconstruction of probe microscope images by function envelope methods
JPH0783629A (ja) * 1993-04-26 1995-03-28 Koyo Seiko Co Ltd ３次元形状測定装置
EP0683379A1 (fr) * 1994-05-19 1995-11-22 SOLLAC (Société Anonyme) Mesure tridimensionnelle de la surface d'un objet de grande dimension

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Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 536 (P-1449), 6 November 1992 & JP 04 203914 A (MITSUBISHI ELECTRIC CORP), 24 July 1992, *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 006, 31 July 1995 & JP 07 083629 A (KOYO SEIKO CO LTD), 28 March 1995, *
See also references of WO9721069A1 *

Also Published As

Publication number Publication date
WO1997021069A1 (fr) 1997-06-12
AU1282097A (en) 1997-06-27
EP0811145A4 (fr) 1998-07-08
CA2212355A1 (fr) 1997-06-12
KR19980702065A (ko) 1998-07-15
JPH11502027A (ja) 1999-02-16

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