EP0803822A1 - IC Karteneinheit und deren Herstellung - Google Patents

IC Karteneinheit und deren Herstellung Download PDF

Info

Publication number
EP0803822A1
EP0803822A1 EP97400931A EP97400931A EP0803822A1 EP 0803822 A1 EP0803822 A1 EP 0803822A1 EP 97400931 A EP97400931 A EP 97400931A EP 97400931 A EP97400931 A EP 97400931A EP 0803822 A1 EP0803822 A1 EP 0803822A1
Authority
EP
European Patent Office
Prior art keywords
slot
card
connector
board
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97400931A
Other languages
English (en)
French (fr)
Inventor
Motomu Mimachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of EP0803822A1 publication Critical patent/EP0803822A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/409Mechanical coupling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits

Definitions

  • the present invention relates to a card slot unit, its manufacturing method and a computer apparatus.
  • a card slot unit for mounting cards to the equipment so that a function-extending card can be utilised for achieving an augmentation of the functions of the equipment.
  • a card slot unit is becoming indispensable.
  • Function-extending cards are not limited to those providing additional memory.
  • Function-extending cards offering added value such as a facsimile-modem card, an SCSI (Small Computer System Interface) card, a hard-disk interface card, a LAN (Local Area Network) adapter card, a tuner-adapter card and a camera-adapter card have become available, widening the range of applications of the card slot unit.
  • SCSI Serial Computer System Interface
  • LAN Local Area Network
  • Fig. 1 is a block diagram showing a typical configuration of a PC having a card slot unit of the type described above.
  • a card slot unit 2 is built inside the main body 1 of a PC.
  • a function-extending card 3 such as a PC card can be plugged into the card slot unit 2.
  • the configuration of the card slot unit 2 comprises, as shown in Fig. 2, a slot board 4 serving as a base and a slot connector 5 mounted on the slot board.
  • the slot connector 5 is a part serving to establish contact with the function-extending card 3.
  • Signals from the function-extending card 3 are supplied to a card-control device 6, shown in Fig. 1, through a wiring pattern of the slot board 4 which is not shown in the figure.
  • the card-control device 6 is mounted on a main board, which is also not shown in the figure, along with a CPU chip (a microprocessor) 7, a memory/bus controller 8 and a main-storage chip 9.
  • a system bus 10 connected to the CPU chip 7 is created on the main board.
  • the card control device 6 and the memory/bus controller 8 are also connected to the system bus 10.
  • the function-extending card 3 is plugged into the card slot unit 2, providing an additional function to the main body 1 of the PC.
  • signals are exchanged between the function-extending card 3 and the main body 1 of the PC by way of signal wires extended through the card slot unit 2 and the card control device 6.
  • the present invention addresses the problems described above. It is thus a main object of the present invention to provide a card slot unit which allows a wiring path from a function-extending card to a card control device to be shortened substantially.
  • the present invention provides a card slot unit that allows a function-extending card having connection electrodes on an insertion-edge side thereof to be inserted for establishing electrical connection with the card slot unit and comprises:
  • the card slot unit has a card control device which is embedded therein to be used in conjunction with the function-extending card and electrically connected to the connector pins of the slot connector through the wiring pattern.
  • signals coming from the function-extending card connected to the slot connector are supplied to the card control device by way of the wiring pattern and signals are output from the card control device to the main body of the system by way of the wiring pattern and the output connector.
  • the wiring path from the function-extending card to the card control device is shortened substantially, the waveform of the signal rarely gets out of shape and is hardly affected by noise.
  • Fig. 3 is a diagram showing a perspective view of a first embodiment implementing a card slot unit provided by the present invention
  • Fig. 4 is a diagram showing a side view of this card slot unit.
  • the card slot unit 21 shown in Figs. 3 and 4 allows a function-extending card 23, such as a PC card, having connection electrodes 22 on an insertion-edge side thereof to be inserted for establishing electrical connection with the card slot unit 21.
  • the main components of the card slot unit 21 are a slot board 24, a slot connector 25, a card control IC 26 used as a card control device and an output connector 27.
  • the slot board 24 is a square printed circuit board on which a wiring pattern 28 is formed by using a generally known patterning technique such as the lithography method or the screen printing method.
  • a device mounting area 29 for mounting the card control IC 26.
  • the wiring pattern 28 is spread to form a radiating shape with the device mounting area 29 taken as a base point and, at the end of the spreading of the wiring pattern 28, square lands (which are not shown in the figure) are provided. These lands are arranged on connector mounting areas on both sides of the device mounting area 29, with land pitches matching the pin pitches of the slot and output connectors 25 and 27. It should be noted that the connector mounting areas are also not shown in the figure.
  • the slot connector 25 has connection pins 30 which are electrically and mechanically connectable to connection electrodes 22 of the function-extending card 23.
  • the slot connector 25 is mounted on the connector mounting area on one side of the slot board 24, that is, on the right hand side in Figure 4.
  • the shape of each of the connector pins 30 of the slot connector 25 matches the shape of the connection electrodes 22 of the function-extending card 23, which is a circular hole in the case of the present embodiment.
  • the connector pins 30 are each a pin-resembling conductor having a structure bent to form a crank shape. As many connector pins 30 as the connection electrodes 22 of the function-extending card 23 are provided on the slot connector 25 to give a 1:1 relation between the connector pins 30 and the connection electrodes 22.
  • connection electrodes 22 on the upper and lower rows on the insertion-edge side are each set to 34 to give a total of 68 in accordance with the specifications of such a card.
  • 68 connector pins 30 need to be provided on the slot connector 25 to be connected to the connection electrodes 22.
  • one end 30a of each of the connector pins 30 of the slot connector 25 shown in Fig. 4 is soldered to a land, that is, an extension tip of the wiring pattern 28, on the slot board 24.
  • the other end 30b of the connection pin 30 (also shown in Fig. 4) is parallel to the slot board 24 in the card insertion direction.
  • the other ends 30b of the connector pins 30 are further laid out in two rows matching the layout of the connection electrodes 22 of the function-extending card 23.
  • two slot connectors 25 are provided, on respective surfaces of the slot board 24, in the so-called two-slot-type configuration so that two function-extending cards 23 can be plugged in to the card slot unit 21 at the same time.
  • the card control IC 26 is mounted on the device mounting area 29 preserved on the surface of the slot board 24 by using the bare-chip method. To put it in more detail, the card control IC 26 is a bare IC chip. It should be noted that bumps 31 provided on chip electrodes of the card control IC can each be a solder or metal bump. The bumps 31 provided on chip electrodes are connected to the wiring pattern 28 on the slot board 24 with the card control IC 26 facing downward by using the so-called FCB (Flip Chip Bonding) technique in order to mount the card control IC 26 on the slot board 24.
  • FCB Flip Chip Bonding
  • the card control IC 26 is sealed by chip coat resin 32 typically having epoxy resin as the main component thereof.
  • the chip coat resin 32 protects the card control IC 26 from characteristics of the external environment such as temperature and humidity as well as maintaining the electrical insulation of the card control IC 26 from the external world. Since the bumps 31 provided on the chip electrodes are connected to the wiring pattern 28 in such a mounting state as described above, the card control IC 26 is electrically connected to the connector pins 30 of the slot connector 25 through the wiring pattern 28.
  • the output connector 27 serves as a contact means for connecting signal lines on the main board (not shown in the figure) to signal lines on the slot board 24.
  • the output connector 27 is mounted on a connector mounting area on the other side of the slot board 24, that is, the left side in Figure 4.
  • a plurality of connector pins 33 are provided inside the output connector 27, in two rows in the longitudinal direction.
  • Each of the connector pins 33 is made of a thin metallic plate having a bent structure approximately resembling the letter L.
  • the connector pins 33 are laid out so that the L-shaped connector pins 33 on one of the rows is in an orientation opposite to that on the other row in the so-called back-to-back arrangement.
  • the lower end of each of the connector pins 33 is soldered to a land on the slot board 24, that is, an extension tip of the wiring pattern 28. In this way, the output connector 27 is connected electrically to the card control IC 26 through the wiring pattern 28.
  • the structure of the output connector 27 of the slot board 24, such as the shape, the dimensions and the pin pitch thereof, must conform to the structure of the connector on the main board to which the card slot unit is to be provided.
  • the structure of the output connector 27 is not limited to specifications of the connector of a specific main board.
  • the structure of the slot connector 25 of the slot board 24, such as the shape, the dimensions and the pin pitch thereof, must conform to the specifications of the function-extending card 23 to be plugged into the card slot unit 21.
  • the structure of the slot connector 25 is not limited to the specifications of the connector electrodes 22 of a specific function-extending card 23.
  • the slot connector 25 on the card slot unit 21 must have a structure conforming to the specifications wherein connector pins 30 having a proper spring characteristic are provided on the slot connector 25 to be brought into contact with the connector electrodes 22 on the function-extending card 23 by using the spring characteristic.
  • the card control IC 26 is embedded therein so that the wiring path from the function-extending card 23 plugged to the slot connector 25 to the card control IC 26 is extremely short in comparison with the wiring path in the card slot unit of the related art.
  • the inductance L and capacitance C of the wires on the wiring path are also decreased proportionally to the reduction of the wiring path.
  • the waveform of the signal hardly gets out of shape, providing endurance against a relatively high impedance.
  • the wiring path is shortened, the effect of noise is reduced accordingly, allowing the number of errors generated in the signal to be decreased.
  • the card control device such as the card control IC 26 is mounted on the main board of a PC or another information apparatus.
  • the number of connector pins connecting the main board to the slot boards 24 increases. This is because the number of slot boards 24 is increased to handle a plurality of function-extending cards even if the function-extending cards can be controlled by using a single card control device.
  • the card control device such as the card control IC 26 is embedded on the card slot unit 21 as described above, however, the number of connector pins connecting the main board to the slot board 24 can also be reduced by half as well.
  • the slot connector 25, the card control IC 26 and the output connector 27 are mounted on one of the surfaces, that is, the upper surface in the figure, of the slot board 24. It should be noted, however, that while the present invention has been described with reference to the first illustrative embodiment, the description is not intended to be construed in a limiting sense. It is to be understood that the subject matter encompassed by the present invention is not limited to the first embodiment. That is to say, other embodiments different from the first embodiment can also be used.
  • the slot connector 25 and the output connector 27 may be mounted on one of the surfaces, for example, the upper surface in the figure, of the slot board 24 while the card control IC 26 is mounted on the other surface on the opposite side, that is, the lower surface in the figure, of the slot board 24 as shown in Fig. 5.
  • a multi-layer wiring structure using plated though-holes is adopted as a structure of the slot board 24 and the slot connector 25 is electrically connected to the card control IC 26 while the card control IC 26 is electrically connected to the output connector 27 by different wiring patterns which are not shown in the figure.
  • the area on the surface of the slot board 24 occupied by the control IC 26 can be reduced to a minimum.
  • this feature of the first illustrative embodiment is not intended to be construed in a limiting sense. It is to be understood that the subject matter encompassed by the present invention is not limited to the above-described embodiments. That is to say, other embodiments different from these can also be used.
  • bare chip mounting technology adopting the wire bonding technique and the TAB (Tape Automatic Bonding) technology of the bare chip methods other than the flip chip bonding technology can be embraced, to result in yet equivalent space saving.
  • a CSP Chip Size Package or Chip Scale Package
  • a method of manufacturing the card slot unit 21 will be explained by referring to Fig. 6. It should be noted that, normally, a plurality of card slot units 21 are assembled concurrently at the same time. In order to make the explanation easy to understand, however, a procedure for assembling only one card slot unit 21 is described here.
  • the assembly work sequence starts with a step F1 in which a slot board 24 serving as a base on which a wiring pattern has been created is prepared.
  • a card control IC 26 to be used as a card control device is prepared by creating stud bumps on the chip electrodes thereof using ball bonding technology.
  • the card control IC 26 is mounted on the slot board 24 by adjusting the position of the card control IC 26 in such a way that the chip electrodes coincide with the respective wires on the wiring pattern on the slot board 24.
  • the slot board 24 is passed through a nitrogen-atmosphere furnace in order to melt the bumps. In this way, the card control IC 26 and the slot board 24 are electrically and mechanically joined to each other.
  • step F2 chip coat resin, a mixture of, typically, epoxy resin and a filler such as silica or calcium carbonate, is poured as drops to the device mounting area on the slot board 24 by using equipment such as a dispenser, before being cured by means of an oven or the like.
  • chip coat resin a mixture of, typically, epoxy resin and a filler such as silica or calcium carbonate
  • step F2 only the card control IC 26 is mounted on the slot board 24, being sealed by the chip coat resin 32 as shown in Fig. 7.
  • step F3 the assembly work sequence proceeds to a step F3 in which the operation of the card control IC 26 is checked through the wiring pattern 28 created on the slot board 24.
  • a probe is typically brought into contact with connection lands 28a and 28b for the slot connector 25 and the output connector 27 as shown in Fig. 7.
  • a signal is then transmitted by a test circuit, for checking the operation of the card control IC 26 by way of the probe. In this way, an open or short circuit between the slot board 24 and the card control IC 26 and the operation of the card control IC 26 can be checked.
  • step F4 the slot connector 25 and the output connector 27 are mounted on the slot board 24.
  • the pins 30 and 33 of the slot and output connectors 25 and 27 are then fixed to the connection lands 28a and 28b by solder.
  • step F5 the assembly work sequence then goes on to step F5 in which other discrete components, such as a chip capacitor required for supplying a stable voltage to the card control IC 26, are mounted.
  • step F5 the mounting of all components on the slot board 24 is completed.
  • step F6 a function-extending card 23 is plugged into the slot connector 25 and the card slot unit 21 is operated under the same condition as the actual application.
  • the characteristics of the card slot unit 21 are then measured.
  • step F7 the assembly work sequence goes on to step F7 to carry out the so-called burn-in test in which the card slot unit 21 is operated in a real mode under the same conditions as the actual application except that the ambient temperature is raised to about 85 degrees Celsius for 2 to 4 hours.
  • step F8 a final measurement of the characteristics of the card slot unit 21 is carried out with the ambient temperature lowered to a room-temperature level of 25 degrees Celsius.
  • step F9 marking is carried out to put a product name, a manufacturing lot number and other pieces of information at prescribed locations on the card slot unit 21. At this point in time, the sequence of assembly processes are completed.
  • the operation of the card control IC 26 is checked through the wiring pattern 28 on the slot board 24. Only if the product is determined to be good are the slot connector 25 and the output connector 27 mounted on the slot board 24. If the mounted card control IC 26 is found defective or if the contact between the card control IC and the slot board 24 is found bad, on the other hand, the assembly work sequence is discontinued to prevent the assembly processes following the mounting of the card control IC 26 and the other components from being wasted. If the defective card control IC 26 is to be replaced by a good one, the replacement work or the repair work can be carried out with relative ease since the slot and output connectors 25 and 27 have not been mounted yet on the slot board 24.
  • Fig. 8 is a block diagram showing an embodiment of computer apparatus provided by the present invention. To be more specific, the diagram shows an internal configuration of the main body of the computer apparatus.
  • a CPU chip (a microprocessor) 41, a memory/bus controller 42 and a main-storage chip (a DRAM chip) 43 are mounted on the main board 40.
  • a main-storage chip (a DRAM chip) 43 is mounted on the main board 40.
  • an external connector 44 is provided to interface with a card slot unit.
  • a system bus 45 is provided to connect the external connector 44 to the memory/bus controller 42.
  • a card slot unit 50 into which a function-extending card such as a PC card is plugged comprises a slot board 51 serving as a base, a slot connector 52, a card control device 53 and an output connector 54.
  • the slot connector 52, the card control device 53 and the output connector 54 are mounted on the slot board 51.
  • a predetermined wiring pattern 55 is created on the slot board 51 by using generally known patterning technology such as the lithography technique.
  • the slot connector 52 has connector pins which can be connected electrically as well as mechanically to connection electrodes provided on the insertion edge of the function-extending card. It should be noted that the connector pins themselves are not shown in the figure.
  • the slot connector 52 is mounted on the slot board 51 with ends on one side of the connector pins connected to the wiring pattern 55 on the slot board 51.
  • the card control device 53 is an integrated-circuit chip which is mounted on the slot board 51 with chip electrodes thereof connected to the wiring pattern 55 on the slot board 51. In this way, the chip electrodes are electrically connected to the connector pins of the slot connector 52 through the wiring pattern 55.
  • the output connector 54 is electrically and mechanically connected to the external connector 44 on the main board 40 of the PC apparatus. The output connector 54 is also electrically connected to the card control device 53 through the wiring pattern 55 created on the slot board 51.
  • the wiring path from the function extending card plugged to the slot connector 52 to the card control device 53 is extremely short in comparison with the wiring path in the conventional card slot unit.
  • the inductance L and capacitance C of the wires on the wiring path are also decreased proportionally to the reduction of the wiring path.
  • the waveform of the signal hardly gets out of shape, providing endurance against a relatively high impedance.
  • the wiring path is shortened, the effect of noise is reduced accordingly, allowing the number of errors generated in the signal to be decreased.
  • the operating frequency can be raised to a value in the high-frequency range, preventing the life of the battery from being shortened.
  • the present invention has been described with reference to a computer apparatus, the description is not intended to be construed in a limiting sense. It is to be understood that the subject matter encompassed by the present invention is not limited to computer apparatus including a potable or desktop PC. That is to say, the present invention can be applied, in general, to an apparatus to which a new function can be added by using a function-extending card. For example, the present invention can also be applied to a variety of computer apparatuses such as a word processor and a telephone set.
  • the slot connector, the output connector and the card control device are mounted on the slot board serving as a base in a configuration in which the card control device is embedded so that the wiring path from the function-extending card plugged into the slot connector to the card control device is extremely short in comparison with the wiring path in the conventional card slot unit.
  • the inductance L and capacitance C of the signal lines on the wiring path are also decreased proportionally to the reduction of the wiring path.
  • the waveform of the signal hardly gets out of shape, enhancing the endurance against a high impedance.
  • the wiring path is shortened, the effect of noise is reduced accordingly, allowing the number of errors generated in the signal to be decreased. As a result, a signal with a high frequency such as a moving-picture signal can be handled well.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
EP97400931A 1996-04-25 1997-04-24 IC Karteneinheit und deren Herstellung Withdrawn EP0803822A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8104980A JPH09289065A (ja) 1996-04-25 1996-04-25 カードスロットユニットとその製造方法、およびコンピュータ装置
JP104980/96 1996-04-25

Publications (1)

Publication Number Publication Date
EP0803822A1 true EP0803822A1 (de) 1997-10-29

Family

ID=14395249

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97400931A Withdrawn EP0803822A1 (de) 1996-04-25 1997-04-24 IC Karteneinheit und deren Herstellung

Country Status (5)

Country Link
US (1) US5923529A (de)
EP (1) EP0803822A1 (de)
JP (1) JPH09289065A (de)
KR (1) KR970073264A (de)
CN (1) CN1166640A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916678A (en) * 1995-06-30 1999-06-29 Kimberly-Clark Worldwide, Inc. Water-degradable multicomponent fibers and nonwovens
CN110311237A (zh) * 2018-03-23 2019-10-08 鸿富锦精密工业(武汉)有限公司 连接组件及应用所述连接组件的程序烧录装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1093276C (zh) * 1998-09-01 2002-10-23 国家科学技术委员会高技术研究发展中心 插槽式通用多片数字信号处理单元硬件装置
JP2000155631A (ja) 1998-11-20 2000-06-06 Nec Yonezawa Ltd Pcカード用周辺装置
US6360435B1 (en) * 1999-08-25 2002-03-26 Qualcomm Incorporated Bidirectional interface tool for PWB development
US20050086702A1 (en) * 2003-10-17 2005-04-21 Cormack Christopher J. Translation of text encoded in video signals
JP4653525B2 (ja) * 2005-03-09 2011-03-16 株式会社東芝 電子機器
JP4877455B2 (ja) * 2005-03-28 2012-02-15 ミツミ電機株式会社 二次電池保護モジュールおよびリード実装方法
US7715206B2 (en) * 2007-07-27 2010-05-11 Hewlett-Packard Development Company, L.P. System board with edge connector
TWI377736B (en) * 2007-12-31 2012-11-21 Hon Hai Prec Ind Co Ltd Electrical card connector
CN102012495B (zh) * 2010-08-13 2013-04-17 深圳市科陆电子科技股份有限公司 一种用于检定费控电能表费控功能的装置及方法
JP5197806B2 (ja) * 2011-06-17 2013-05-15 株式会社東芝 電子機器
CN107112292B (zh) * 2015-01-28 2021-04-27 惠普发展公司,有限责任合伙企业 插入器设备
US10974750B2 (en) 2019-03-07 2021-04-13 Dishcraft Robotics, Inc. Adjustable dish stacking cart
US11390308B2 (en) 2019-03-07 2022-07-19 Dishcraft Robotics, Inc. Automated dish drop
US10654504B1 (en) 2019-03-07 2020-05-19 Dishcraft Robotics, Inc. Dish stacking cart
US11198461B2 (en) * 2019-03-07 2021-12-14 Dishcraft Robotics, Inc. Dish collection and dispensing system
CN111416230A (zh) * 2020-01-21 2020-07-14 东莞立讯技术有限公司 风扇连接器
US11381045B2 (en) * 2020-01-21 2022-07-05 Dongguan Luxshare Technologies Co., Ltd Fan connector
US11818842B1 (en) * 2020-03-06 2023-11-14 Amazon Technologies, Inc. Configurable circuit board for abstracting third-party controls

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04288000A (ja) * 1990-12-28 1992-10-13 Tdk Corp プリント基板回路の組立方法及び装置
EP0571138A2 (de) * 1992-05-20 1993-11-24 Codemasters Limited Speicherkassette und Schnittstelle für Videospielkonsole
EP0589743A1 (de) * 1992-09-24 1994-03-30 Sextant Avionique Modulare Vorrichtung zur Kupplung und zum Multiplexer von verschiedenen Bussen
US5502617A (en) * 1992-11-13 1996-03-26 Seiko Epson Corporation Electronic device having a flat, card-like casing enclosing components for a complete computer system
JPH096482A (ja) * 1995-06-16 1997-01-10 Toshiba Corp ポータブルコンピュータ及びレジュームモード下でのpcカード拡張方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2901091B2 (ja) * 1990-09-27 1999-06-02 株式会社日立製作所 半導体装置
US5248853A (en) * 1991-11-14 1993-09-28 Nippondenso Co., Ltd. Semiconductor element-mounting printed board
US5428535A (en) * 1992-09-17 1995-06-27 Kansei Corporation Vehicle control unit structure
US5305182A (en) * 1992-10-14 1994-04-19 Chen Teng Ka Read/write unit for two integrated circuit cards
US5408386A (en) * 1992-10-30 1995-04-18 Intel Corporation Socket assembly including a first circuit board located between a receptacle housing and a second circuit board
US5454725A (en) * 1993-05-17 1995-10-03 3Com Corporation Circuit card with low profile detachable interface
US5571996A (en) * 1995-01-17 1996-11-05 Dell Usa, L.P. Trace conductor layout configuration for preserving signal integrity in control boards requiring minimum connector stub separation
US5576935A (en) * 1995-03-24 1996-11-19 Compaq Computer Corporation Common circuit board connectable to multiple alternative single-sided expansion boards
GB9524543D0 (en) * 1995-11-30 1996-01-31 Amp Great Britain Interconnection system for electronic controllers to a bus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04288000A (ja) * 1990-12-28 1992-10-13 Tdk Corp プリント基板回路の組立方法及び装置
EP0571138A2 (de) * 1992-05-20 1993-11-24 Codemasters Limited Speicherkassette und Schnittstelle für Videospielkonsole
EP0589743A1 (de) * 1992-09-24 1994-03-30 Sextant Avionique Modulare Vorrichtung zur Kupplung und zum Multiplexer von verschiedenen Bussen
US5502617A (en) * 1992-11-13 1996-03-26 Seiko Epson Corporation Electronic device having a flat, card-like casing enclosing components for a complete computer system
JPH096482A (ja) * 1995-06-16 1997-01-10 Toshiba Corp ポータブルコンピュータ及びレジュームモード下でのpcカード拡張方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section EI Week 9712, Derwent World Patents Index; Class T01, Page 1-2, AN 97123365, XP000101654, "Portable computer with programmable controller card extension unit" *
LEGG G: "SPECIAL COMPONENTS SIMPLIFY INTERFACE TO PCMCIA CARDS", EDN ELECTRICAL DESIGN NEWS, vol. 38, no. 12, 10 June 1993 (1993-06-10), pages 61, 63 - 64, 66, 68, XP000382982 *
PATENT ABSTRACTS OF JAPAN vol. 17, no. 97 (E - 1326) 25 February 1993 (1993-02-25) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916678A (en) * 1995-06-30 1999-06-29 Kimberly-Clark Worldwide, Inc. Water-degradable multicomponent fibers and nonwovens
CN110311237A (zh) * 2018-03-23 2019-10-08 鸿富锦精密工业(武汉)有限公司 连接组件及应用所述连接组件的程序烧录装置

Also Published As

Publication number Publication date
CN1166640A (zh) 1997-12-03
US5923529A (en) 1999-07-13
JPH09289065A (ja) 1997-11-04
KR970073264A (ko) 1997-11-07

Similar Documents

Publication Publication Date Title
US5923529A (en) Card slot unit for a personal computer
US6462570B1 (en) Breakout board using blind vias to eliminate stubs
KR100403621B1 (ko) 전기적 특성 평가를 위한 테스트 패드를 갖는 칩 온 필름패키지 및 칩 온 필름 패키지 형성 방법
CA2331813C (en) Circuit board of protective circuit for storage battery, protective circuit device for storage,and storage battery pack
US5834705A (en) Arrangement for modifying eletrical printed circuit boards
US6836138B1 (en) Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same
US20060288567A1 (en) Sacrificial component
KR100268460B1 (ko) 표면실장용 반도체ic의 위치결정장치
EP1791407A1 (de) Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte mit Kontaktloch
US20060091538A1 (en) Low profile and tight pad-pitch land-grid-array (LGA) socket
US8709832B2 (en) Chip on film (COF) package having test line for testing electrical function of chip and method for manufacturing same
US6657133B1 (en) Ball grid array chip capacitor structure
KR20010017187A (ko) 인쇄 회로 기판 및 이 인쇄 회로 기판의 스크린 프린팅을 위한마스크
US6825679B2 (en) Electrically conductive structure and method for implementing circuit changes on printed circuit boards
US5869961A (en) Smart IC-test receptacle having holes adapted for mounting capacitors arranged adjacent to pin positions
CN217133316U (zh) 芯片测试工具及芯片测试装置
US5890281A (en) Method for simplified and compact component addition to a printed circuit board
US6507205B1 (en) Load board with matrix card for interfacing to test device
JPH077038B2 (ja) プリント基板検査装置
US6809524B1 (en) Testing of conducting paths using a high speed I/O test package
US5880936A (en) PC card test and configuration connector
JP4022698B2 (ja) 検査回路基板
CN215953778U (zh) 一种用于信号引出的测试设备
KR100216894B1 (ko) Bga 반도체패키지의 전기테스트장치
JP2002040097A (ja) グリッドアレイパッケージの試験用実装

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB

17P Request for examination filed

Effective date: 19980415

17Q First examination report despatched

Effective date: 20011105

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20020516