EP0762800A3 - - Google Patents
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- Publication number
- EP0762800A3 EP0762800A3 EP96306415A EP96306415A EP0762800A3 EP 0762800 A3 EP0762800 A3 EP 0762800A3 EP 96306415 A EP96306415 A EP 96306415A EP 96306415 A EP96306415 A EP 96306415A EP 0762800 A3 EP0762800 A3 EP 0762800A3
- Authority
- EP
- European Patent Office
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
- H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22995495 | 1995-09-07 | ||
JP229954/95 | 1995-09-07 | ||
JP254090/95 | 1995-09-29 | ||
JP07254090A JP3142754B2 (ja) | 1995-09-07 | 1995-09-29 | 電気音響変換器用リードフレーム |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0762800A2 EP0762800A2 (en) | 1997-03-12 |
EP0762800A3 true EP0762800A3 (da) | 1997-04-23 |
EP0762800B1 EP0762800B1 (en) | 1998-11-25 |
Family
ID=26529078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19960306415 Expired - Lifetime EP0762800B1 (en) | 1995-09-07 | 1996-09-04 | Lead frame for electroacoustic transducer and electroacoustic transducer |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0762800B1 (da) |
JP (1) | JP3142754B2 (da) |
DE (1) | DE69601021T2 (da) |
HK (1) | HK1012487A1 (da) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI109075B (fi) * | 1998-10-05 | 2002-05-15 | Nokia Corp | Akustisen muuntimen alustan kiinnitysmenetelmä |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5914658A (ja) * | 1982-07-16 | 1984-01-25 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
JPS59168660A (ja) * | 1983-03-15 | 1984-09-22 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
JPS63143246A (ja) * | 1986-12-04 | 1988-06-15 | Kobe Steel Ltd | 高力、高導電性銅合金の製造方法 |
JPH01109756A (ja) * | 1987-10-23 | 1989-04-26 | Kobe Steel Ltd | 半導体装置用リードフレーム |
EP0650308A1 (en) * | 1993-10-25 | 1995-04-26 | Star Micronics Co., Ltd. | Electroacoustic transducer and method of fabricating the same |
-
1995
- 1995-09-29 JP JP07254090A patent/JP3142754B2/ja not_active Expired - Fee Related
-
1996
- 1996-09-04 DE DE1996601021 patent/DE69601021T2/de not_active Expired - Fee Related
- 1996-09-04 EP EP19960306415 patent/EP0762800B1/en not_active Expired - Lifetime
-
1998
- 1998-12-14 HK HK98113341A patent/HK1012487A1/xx not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5914658A (ja) * | 1982-07-16 | 1984-01-25 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
JPS59168660A (ja) * | 1983-03-15 | 1984-09-22 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
JPS63143246A (ja) * | 1986-12-04 | 1988-06-15 | Kobe Steel Ltd | 高力、高導電性銅合金の製造方法 |
JPH01109756A (ja) * | 1987-10-23 | 1989-04-26 | Kobe Steel Ltd | 半導体装置用リードフレーム |
EP0650308A1 (en) * | 1993-10-25 | 1995-04-26 | Star Micronics Co., Ltd. | Electroacoustic transducer and method of fabricating the same |
Non-Patent Citations (5)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 008, no. 095 (E - 242) 2 May 1984 (1984-05-02) * |
PATENT ABSTRACTS OF JAPAN vol. 009, no. 019 (E - 292) 25 January 1985 (1985-01-25) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 398 (C - 538) 21 October 1988 (1988-10-21) * |
PATENT ABSTRACTS OF JAPAN vol. 013, no. 350 (E - 800) 7 August 1989 (1989-08-07) * |
R.SCHETTY: "Outer Lead Plating Process Protects Solderability", ELECTRONIC PACKAGING AND PACKAGING, vol. 34, no. 2, February 1994 (1994-02-01), NEWTON, MASS., US, pages 114 - 116, XP000430271 * |
Also Published As
Publication number | Publication date |
---|---|
JP3142754B2 (ja) | 2001-03-07 |
JPH09135492A (ja) | 1997-05-20 |
EP0762800A2 (en) | 1997-03-12 |
EP0762800B1 (en) | 1998-11-25 |
DE69601021T2 (de) | 1999-06-10 |
DE69601021D1 (de) | 1999-01-07 |
HK1012487A1 (en) | 1999-07-30 |
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