EP0718911A1 - Réseau conformateur de faisceaux pour antenne radiofréquence mettant en oeuvre la Transformée de Fourier Rapide et structure matérielle implantant un tel réseau, notamment pour les applications spatiales - Google Patents

Réseau conformateur de faisceaux pour antenne radiofréquence mettant en oeuvre la Transformée de Fourier Rapide et structure matérielle implantant un tel réseau, notamment pour les applications spatiales Download PDF

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Publication number
EP0718911A1
EP0718911A1 EP95402749A EP95402749A EP0718911A1 EP 0718911 A1 EP0718911 A1 EP 0718911A1 EP 95402749 A EP95402749 A EP 95402749A EP 95402749 A EP95402749 A EP 95402749A EP 0718911 A1 EP0718911 A1 EP 0718911A1
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EP
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Prior art keywords
cells
cfh
row
inputs
outputs
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EP95402749A
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German (de)
English (en)
French (fr)
Inventor
Francesc Coromina Pi
Mike Yarwood
Javier Ventura-Traveset Bosch
Wolfgang Bosch
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Agence Spatiale Europeenne
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Agence Spatiale Europeenne
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
    • H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
    • H01Q3/40—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with phasing matrix

Definitions

  • the invention relates to a beam shaping network for radio frequency antenna implementing the Fast Fourier Transform, which will be called in the following, for reasons of simplification, "FFT” (commonly used abbreviation of the English expression “Fast Fourier Transform”).
  • FFT Fast Fourier Transform
  • It also relates to a hardware structure implanting such a network.
  • the invention applies advantageously, but not exclusively, to the field of antennas of the phase antenna array type for the generation of multiple beams for applications on board satellites.
  • a level of the order of -1 dB is required.
  • a well-known solution is to oversize the former and use only part of the die. As an example, using a 2N ⁇ 2N matrix , we obtain a transition level of -1.5 dB.
  • array antennas are normally used with a hexagonal grid topology instead of rectangular. Greater efficiency is obtained with regard to compactness: the number of radiating elements required, as is well known, is less, for the same coverage. However, in this case, a simple layout of the row / column type, as described in relation to the Butler matrix conformers, is no longer possible.
  • phase-shifting circuits placed on two levels.
  • the circuits are not very modular. With the exception of cells with three inputs and three outputs, there are no repetitive modules.
  • the antenna has a hexagonal shape.
  • the antenna may also be of triangular shape.
  • the signal processing algorithm must use Discrete Fourier Transform, which will be called in the following, for reasons of simplification, "DFT” (abbreviation of the commonly used Anglo-Saxon expression “Discrete Fourier Transform”) .
  • DFT Discrete Fourier Transform
  • This "DFT” operates on a series of signals for sampling power supply of the radiating elements of the type antenna. hexagonal, such that the coefficients resulting from the “DFT” are also sampling of the hexagonal type in the domain of the transform (that is to say representing the center of the beams).
  • the requirement for hexagonal type sampling in the origin domain (generally called “time domain” in the signal processing technique) is essentially due to the usually hexagonal shape of the antenna.
  • the requirement for hexagonal type sampling in the transform domain (generally called “frequency domain” in the signal processing technique) comes from the fact that it allows more efficient coverage when the beams coincide with a hexagonal grid.
  • the invention therefore sets itself the aim of solving this problem, namely to offer both an efficient architecture and compatible with current integration technologies, the efficiency being expressed in terms of low mass, of simple implementation. , reliability and easy testing; and an optimized algorithm, the term "optimized" must in turn be included in criteria for technological rather than mathematical optimization.
  • the invention also relates to a structure for the mechanical implantation of such a network.
  • L I / N is an algebraic sequence called the modulo n residue sequence of the algebraic sequence LI, which is a two-dimensional lattice of integers.
  • the input values x (n) of equation (3) are determined (or alternatively the input values X (k) of equation (2)).
  • Equation (1) Since the periodicity matrix (equation (1)) is not a diagonal matrix, it is not possible to carry out a row / column decomposition in equation (2), which is the first condition required by the invention to get an efficient implantation.
  • Equation (10) can be rewritten as follows:
  • equation (13) therefore describes a conventional rectangular "DFT", with a row / column decomposition.
  • micro blocks which have been qualified in the above as “macro blocks”. These blocks are repeated in architecture.
  • det ( D ) can be expressed as the product of two numbers (ie p and q ) which are prime to each other.
  • decomposition into "DFT" of smaller dimension can be carried out directly in the case in two dimensions and not independently in the case in one dimension.
  • MPFA Anglo-Saxon name
  • the large two-dimensional "FFT” will consist of a layer of simple one-dimensional "DFT” (of order 3 or 4) for the "DFT” lines and at more than two layers of one-dimensional "DFT” of small dimension for the one-dimensional "DFT” of columns. There are therefore three layers in total.
  • a first case concerning an architecture of a beam former of moderate size in this case a hexagonal beam former of size 27 ⁇ 27, and a second case concerning a beam former more complex, in this case a 48 ⁇ 48 size beam former.
  • Equation (21) determines the input and output rearrangements.
  • Equation (19) can be rewritten as follows: in which the following expressions have been defined:
  • C (n 2 , k 1 ) can be defined as follows:
  • the architecture of the beam former can be determined so that it satisfies these equations (32) and (33), that is to say so that the transforms "DFT” and "IDFT” are carried out.
  • FIG. 5 illustrates the architecture of a hexagonal beam former CFH, of dimensions 27 ⁇ 27, according to the invention.
  • the CFH hexagonal beam former according to the invention comprises only two main layers of circuits.
  • it uses only one kind of cell, very simple, in this case circuits performing a one-dimensional "DFT" 3 points.
  • the CFH hexagonal beam former includes four sets of cells: 1 to 4, the set referenced 4 constituting one of the circuit layers.
  • This layer includes nine identical cells or modules, 41 to 47, performing a one-dimensional 3-point "DFT". Such a module will be described later with reference to FIG. 6.
  • the inputs of these cells, referenced e 1 to e 27 , from top to bottom in FIG. 5, are in number equal to the number of elements El i .
  • the second layer of circuits includes three games, referenced 1 to 3. Each of these games has 9 inputs and 9 outputs. Each set consists of two rows of 3 basic cells, each performing a 3-point "DFT". The two rows are connected by paths of the line / column links incorporating phase shifters: 111 to 133, 211 to 233 and 311 to 333, called CLC 1 to CLC 3 respectively, for games 1 to 3. Each game is provided with identical topology.
  • the three outputs of the first module for example module 11, are each connected to 0 ° phase shifters: 111, 112 and 113. In other words, the output signals are not phase shifted.
  • the three outputs of the second module, for example module 12, are connected, respectively to 0 °, 40 ° and 80 ° phase shifters: 121, 122 and 123.
  • the three outputs of the third module are connected, respectively to 0 °, 80 ° and 160 ° phase shifters: 131, 132 and 133.
  • the outputs of the first phase shifters of each set for example 111, 121 and 131, are connected to one of the three inputs (from top to bottom in FIG. 5) of the first module of the second row, for example module 14.
  • the outputs of the second phase shifters of each set for example 112, 122 and 132, are connected to one of the three inputs of the second module of the second row, for example module 15.
  • the outputs of the third phase shifters of each set for example 113, 123 and 133, are connected to one of the three inputs of the third module of the second row, for example module 16.
  • the outputs of the cells, 14 to 16, 24 to 26 and 34 to 36, of the second row of sets 1 to 3 are connected to the radiating elements in the following order, in accordance with the aforementioned rearrangement: El 1 , El 13 , El 16 , El 2 , El 14 , El 17 , El 3 , El 15 , El 18 , El 6 , El 20 , El 23 , El 7 , El 21 , El 4 , El 19 , El 22 , El 5 , El 12 , El 26 , El 9 , El 24 , El 27 , El 10 , El 25 , El 8 and El 11 (from top to bottom in the figure).
  • the first outputs of the first three cells, 41 to 43, of set 4 are connected to the first inputs of cells, 11 to 13, of the first row of set 1.
  • the first outputs of the following three cells , 44 to 46 are connected to the second inputs of the three cells, 11 to 13, and the first outputs of the last three cells, 47 to 49, to the third inputs of the three cells, 11 to 13.
  • the architecture of the hexagonal beam former according to the invention is therefore perfectly regular. In addition, it proves to be much less complex than the architecture of an equivalent hexagonal beam former according to the known art, such as that described, for example, in the aforementioned article by Chadwick.
  • the number of phase shifters is reduced to a minimum, according to one of the aims of the invention.
  • the hexagonal beam shaping architecture CFH which has just been described lends itself to very easy integration of a matrix of radiofrequency switches. By directly incorporating this matrix into the architecture of the shaper, a high degree of beam switching possibility is obtained. More precisely, the resulting architecture performs both the functions corresponding to a hexagonal beam former and those corresponding to a beam changer.
  • FIG. 6 schematically illustrates such an architecture, in the particular example of a hexagonal beam former CFH ', of dimensions 27 ⁇ 27. It takes up, in its entirety, the architecture of the shaper of FIG. 5 which it is useless to rewrite.
  • Each layer comprises nine matrixes of switches of dimensions 3 ⁇ 3: Co 11 to Co 19 , for the first layer Co 1 ; Co 21 to Co 29 , for the second layer Co 2 ; Co 31 to Co 39 , for the third layer Co 3 .
  • the first layer Co 1 is inserted between the inputs, e 1 to e 27 , and the inputs of the 3 ⁇ 3 cells, 41 to 49, of the circuits 4.
  • the second layer Co 2 is interposed between the outputs of the set of row / column connections 4a and the inputs of the cells of dimensions 3 ⁇ 3, 41 to 49.
  • the third layer Co 3 is inserted between the outputs of the three sets of row / column links, CLC 1 to CLC 3 , and the inputs of the 3 ⁇ 3 cells, 41 to 49.
  • crossbar reconfigurable circuits, divider-power mixer circuits, etc.
  • circuit layouts are limited by the insulation that can be reached between ports, insulation that decreases with the size of the switch matrix and / or with the associated insertion losses.
  • each signal propagates only through the switching circuits of a matrix of dimension 3 ⁇ 3, for a hexagonal beam former of dimensions 27 ⁇ 27.
  • the increase in insertion losses is negligible.
  • FIG. 7 very schematically illustrates the functional diagram of a circuit performing a one-dimensional "DFT" 3 points on three input signals, referenced I 1 to I 3 .
  • the output signals are referenced O 1 to O 3 .
  • it may be cell 11, it being understood that all the cells are identical.
  • It is a conventional circuit diagram, well known to those skilled in the art and which need not be described further. It is only useful to note that the connections between the inputs and the signal output O 3 are free of phase shifters. It is the same between I 1 and O 1 .
  • the direct links I 2 -O 2 and I 3 -O 3 include a phase shifter 120 °, ⁇ 22 and ⁇ 33 respectively.
  • the I 2 -O 3 and I 3 -O 2 cross links include a 240 ° phase shifter, ⁇ 23 and ⁇ 32 respectively.
  • the basic cells 11 to 49 can be produced by using miniaturization technologies, for example the technology known by the Anglo-Saxon name "GaAs MMIC” (for Monolithic Microwave Integrated Circuits on Gallium Arsenide ). Depending on the dimensions of the base cell, one or more "MMICs” chips will be required to integrate the cell.
  • the basic cell can be produced as illustrated in FIG. 8.
  • the cell 11, the functional diagram of which is illustrated by FIG. 7, is physically produced using radiofrequency "MMICs", integrating the circuits CI-1 to CI-3, each forming a 90 ° / 3 dB hybrid technology sub-cell, each having two inputs and two outputs, one of the outputs being 90 ° phase shifted.
  • the CI-2 sub-cell performs an asymmetrical division of the electrical power received, in the sense that 2/3 of the power is transmitted to the port marked "0" and 1/3 of the power to the port marked "-90".
  • the number of "MMICs" depends on the technological design. A solution based on a single chip is feasible if the total size of the chip remains compatible with the integration technologies used in the field.
  • the phase shift is obtained using capacitors and inductors, with localized constants, in the wavelength band "L” or "S”.
  • the additional phase shifters ⁇ -90 , ⁇ +30 and ⁇ +60 provide the phase shifts 120 ° and 240 ° of Figure 6.
  • the phase shifters 111 to 333 of Figure 5 could also be included in the "MMICs".
  • MMICs is (are) advantageously included (s) in a single microwave package.
  • MMICs in passive circuits based on circuits comprising only capacitors and inductances, a very high efficiency can be achieved during the manufacture of these, with low costs associated with this return.
  • FIG. 9 schematically illustrates the topology of a 3 ⁇ 3 cell according to a preferred embodiment of the invention.
  • capacitors and inductances are used, with localized constants, in the wavelength band "L” or "S".
  • the inductors are all marked “L” and the capacitors "C”, because these elements are all identical. This constitutes a first simplification.
  • the cell is extremely symmetrical and therefore easy to produce.
  • This 3 ⁇ 3 cell configuration allows, at a minimum, integration on a single "MMIC”. It is actually possible to integrate several cells on a single "MMIC" of larger dimensions, which is not possible to do simply for the cells produced in accordance with FIG. 8.
  • FIG 10 illustrates such an arrangement.
  • the capacitance C ′ is placed in parallel with a transistor T r of the MESFET type whose source and drain are at the potential of the earth M a .
  • this particular configuration is adopted for all the capacities of a 3 ⁇ 3 cell.
  • the initial two-dimensional "DFT” was converted into an "FFT” algorithm requiring only the calculation of a "DFT” of order 3 for the first level and of order 4 for the second and third levels. Only two types of one-dimensional "DFT” modules are used, 3 ⁇ 3 and 4 ⁇ 4 respectively.
  • FIG. 11 illustrates the architecture allowing the installation of a hexagonal beam former CFH ", according to the invention, of dimensions 48 ⁇ 48.
  • This architecture comprises two layers of circuits, comprising set 5 (one-dimensional "DFT” of order 3) for the first layer of circuits and sets 7 to 9 ("FFT" rectangular 4 ⁇ 4) for the second circuit layer.
  • the first set 5 is made up of 16 unidimensional 3 ⁇ 3 "DFT" cells, all identical, marked 51a - 54a, 51b - 54b, 51c - 54c and 51d - 54d (from bottom to top of Figure 11). Each cell has four inputs and four outputs. Only the extreme inputs e ' 1 and e' 48 have been identified so as not to overload the figure.
  • Sets 7 to 9 are made up of one-dimensional 4 ⁇ 4 "DFT" cells, also all identical, arranged in two rows of 4 modules to form what has been called above the second and third levels.
  • the first row includes cells 71 to 74, 81 to 84 and 91 to 94, for sets 7, 8 and 9, respectively.
  • the second row includes cells 75 to 78, 85 to 88 and 95 to 98, for sets 7, 8 and 9, respectively.
  • the two rows of cells are interconnected by line / column link paths marked 79, 89 and 99 for sets 7, 8 and 9, respectively. These paths are similar (well than slightly more complex) to those described in more detail with regard to the architecture of FIG. 5, relating to a hexagonal beam former of dimensions 27 ⁇ 27. They must check equation (44).
  • the first outputs of modules 71 to 74 are each connected to an input of cell 75, directly or via an additional phase shifter (in a similar manner to FIG. 5), the second outputs of cells 71 to 74 are each connected to an input of cell 76, and so on. It is the same, naturally for games 8 and 9.
  • first and second layers of circuits are interconnected by a path of connections, marked 6, and which will be described in more detail below.
  • the 48 outputs of cells 75 to 78, 85 to 88 and 95 to 98 are connected to the 48 radiating elements of the antenna (not shown in the figure).
  • the architecture of the hexagonal beam former according to the invention is therefore perfectly regular. In addition, it also turns out to be much less complex than the architecture of an equivalent hexagonal beam former according to known art such as, for example, than that described in the aforementioned article by Chadwick.
  • the matrices of the first layer have the same dimensions as the switching matrices described with reference to FIG. 6 since they must deliver signals on the three cell inputs of dimensions 3 ⁇ 3.
  • the matrices of the second and third layers are of 4 ⁇ 4 dimensions, the cells to be served being of 4 ⁇ 4 dimension.
  • the elementary matrices of switching circuits will have respective dimensions R ⁇ R, for the first layer, and N ⁇ N for the second and third layers.
  • the 3 ⁇ 3 “DFT” modules (51a to 54d) can be produced identically to the modules described in relation to FIGS. 7 and 8.
  • FIG. 12 very schematically illustrates the functional diagram of a one-dimensional 4 ⁇ 4 “DFT” calculation cell, for example the cell constituting the module 71; it being understood that all the modules 71 to 98 are identical.
  • the signal inputs have been marked I 1 to I 4 and the outputs O 1 to O 4 . All inputs are connected to all outputs (trellis), some directly (i.e. without phase shift): I 1 to all outputs, I 2 to O 1 , I 3 to O 1 and O3, d ' others via phase shifters.
  • I 2 is connected to O 2 by a phase shifter ⁇ '22 90 ° to O 3 by a phase shifter ⁇ ' 23 180 ° and O 4 by a phase shifter ⁇ '24 270 °.
  • I 3 is connected to O 2 by a 180 ° phase shifter 32 '32 and to 04 by a 180 ° phase shifter 34 ' 34 also.
  • I 4 is connected to O 2 by a phase shifter ⁇ '42 by 270 °, to O 3 by a phase shifter ⁇ ' 43 by 180 ° and to O 4 by a phase shifter ⁇ '44 by 90 °.
  • the 4 ⁇ 4 cells can be produced in the form of modules based on “MMIC” in Gallium Arsenide (AsGa).
  • FIG. 13 illustrates an example of integration of the basic cell "DFT" 4 ⁇ 4, for example cell 71, the functional diagram of which has just been recalled.
  • the module includes one or more "MMICs” in hybrid technology, integrating circuits CI-41 to CI-44 with two inputs and two outputs, including a direct output (without phase shift, indicated by an arrow in the figure) and a phase-shifted output 180 °.
  • the circuit CI-43 receives, at the input, the input signals I 1 and I 4 .
  • hybrid technology means that it is a circuit with four ports: two input ports and two output ports.
  • a signal present on a first input port (I 1 for example for the CI-43 circuit) is divided into two signals of the same power and of the same phase, transmitted to the two output ports, and that '' a signal present on the second input port (indicated by an arrow in figure 13: I 2 for example for the CI-43 circuit) is divided into two signals of the same power and of opposite phase, transmitted to the two ports of exit.
  • the circuit CI-44 receives as input the signals of the inputs I 2 and I 3 .
  • the direct output of the CI-43 circuit is crossed and connected to the first input of the CI-42 circuit (left in the figure).
  • the phase-shifted output of circuit CI-44 is crossed and transmitted to the second input of circuit CI-42 (right in the figure).
  • the exit direct from circuit CI-44 is transmitted, via an additional phase shifter ⁇ -90 to the second input of circuit CI-42 and the phase-shifted output of circuit CI-41 is transmitted to the first input of circuit CI-41.
  • the first and second outputs of the CI-41 circuit constitute the outputs O 1 and O 3 , respectively.
  • the first and second outputs of the CI-42 circuit constitute the outputs O 2 and O 4 , respectively.
  • FIG. 14 schematically illustrates the topology of a 4 ⁇ 4 cell according to a preferred embodiment of the invention.
  • capacitors and inductors are used, with localized constants, in the wavelength band "L” or "S".
  • the inductors are all marked “L” and the capacitors "C”, because these elements are all identical.
  • the cell is extremely symmetrical and therefore easy to produce.
  • This 4 ⁇ 4 cell configuration allows, at a minimum, their integration on a single "MMIC” and it is actually possible to integrate several cells on a single “MMIC” of larger dimensions.
  • the integration rate can be increased in large proportions.
  • FIG. 15 illustrates a first example of layout for a low complexity shaper ("normal" dimensions), for which the basic cells have been integrated on single "MMICs".
  • This example corresponds to a CFH hexagonal beam shaper of dimensions 27 ⁇ 27, as described in FIG. 5.
  • the same references have been kept to designate the elements thereof.
  • the CFH hexagonal beam former is installed in "2D", that is to say on a plane, for example a printed circuit board PCB. It comprises three layers of "MMICs” grouping, respectively, cells 4, cells 11 to 33 of the first row and cells 14 to 36 of the third row.
  • the interconnection lines of assemblies 4a and CLC 1 to CLC 3 are produced in multilayer technology. Examples of practical implementation will be detailed below.
  • FIG. 16 illustrates an example of physical layout of a CFH hexagonal beam former according to the invention of larger dimensions: second case mentioned above.
  • the base cells, 41 to 49, of the first layer of circuits are arranged on as many flat supports (printed circuit boards for example), all parallel to one another.
  • An exemplary embodiment will be detailed below, in relation to the description of FIG. 18.
  • the three sets, 1 to 3, making up the second layer of circuits, are each arranged on a support, also flat. These three planes are arranged at right angles to the planes formed by the supports of cells 41 to 49.
  • the first outputs of all the cells in set 4 are connected, only, to the inputs of set 1, the second outputs at the inputs of game 2 and the third outputs at the inputs of game 3. It is therefore easy to carry out in these circumstances the connection path connecting the first layer of circuits (set 4) to the second layer of circuits (sets 1 to 3), since the respective supports are in orthogonal planes.
  • the connectors C 1 to C 3 can be made integral with the supports of the cells 41 to 49. It then suffices to insert the three supports of the sets 1 to 3 in these connectors. No link crossing is necessary.
  • FIG. 17 illustrates an example of installation of a very large hexagonal beam former.
  • the assembly is carried out on the faces of a cube-shaped support S.
  • the sixteen 4 ⁇ 4 "DFT" modules can be grouped on a first side S 1 of this cube and rearranged in the form of a matrix comprising 4 rows and 4 columns of modules: 51a-54a, 51b-54b, 51c-54c and 51d-54d, respectively.
  • Each module has three input connections, only two of which, e ' 1 and e' 48 , for all the modules have been identified so as not to overload the figure unnecessarily.
  • the three sets 7, 8 and 9 of the second layer of circuits are arranged, for their part, on three faces of the cube, for example the upper face (in the figure) S 2 , the face S 3 , opposite the face S 1 , and the underside S 4 .
  • these faces are provided with four connectors, parallel to each other, in which will be inserted plates of rectangular parallelepiped shape, supports for modules 71-74, 81-84 and 91-94, for games 7, 8 and 9, respectively.
  • the assembly of the face S 2 has been identified and detailed (set 7). It should however be clear that this assembly is repeated in a similar manner on the faces S 3 and S 4 , for games 8 and 9.
  • the connectors fixed to the face S 2 are marked C 71 to C 74 .
  • a plate is inserted, supporting the modules 71 to 74, respectively.
  • the routing of the links (79, 89 and 99) interconnecting the first row of modules to the second row of modules makes it possible to physically carry out this routing in a very simple manner. It suffices to produce these modules (for example, modules 75 to 78) also in the form of plates.
  • Four rows of connectors, C 75 to C 78 , of module modules 71 to 74 are made integral, on the sides opposite to the connectors C 71 to C 74 .
  • the connectors C 75 to C 78 are mutually parallel and orthogonal to the connectors C 71 to C 74 .
  • each of these connectors is one of the plates, 75 to 78, respectively.
  • this arrangement is repeated for games 8 and 9, arranged on the sides S 3 and S 4 .
  • Each module has four output connections, of which only one, El ' 1 , for all the modules has been identified so as not to overload the figure unnecessarily.
  • the sixteen modules 51a to 54d comprising a total of 48 outputs (four per module), the connections 6 between the face S 1 and the three other faces can be produced, for example, using 48 coaxial cables.
  • the outgoing bundle 60 of 48 cables is divided into three sub-bundles of 16 cables: 61, 62 and 63, distributed at the inputs of the modules of sets 7, 8 and 9, respectively.
  • these cables will have to be adapted in phase and in insertion loss. We will also choose the constituent materials so that they have good temperature stability.
  • This material layout can be extended to more complex beam shapers. As the dimensions of these become larger, we can use the two free faces of the cube. When the complexity increases further, we can use, not a cube, but a polyhedral structure. Naturally, the structure of the basic cells constituting the modules also changes with the complexity of the hexagonal beam former.
  • the material structure of the hexagonal beam former shown in FIG. 16 (of dimensions 27 ⁇ 27 in the example illustrated), is a particular case which can be described as "limit" by compared to the more general structure shown in Figure 17. Indeed, it can be argued, in this particular case, that the supporting structure could have been reduced to its simplest expression, that is to say to a plane.
  • the connectors C 1 to C 3 play a role similar to the role played by the connectors C 74 to C 78 . It is no longer useful to have recourse to a bundle of coaxial cables, the connections between the cells of the first layer of circuits (4) and the second layer of circuits (1 to 3) being able to take place directly.
  • the modules of the second and third levels were, due to the low complexity of the circuits, arranged on a single wafer, which made it possible to eliminate the assembly using connectors between these modules as in the case of the shaper of dimensions 48 ⁇ 48 which has just been described (FIG. 17).
  • a cubic or even polyhedral structure could also have been used to mechanically implant the hexagonal beam shaper, of dimensions 27 ⁇ 27.
  • the modules 41 to 43 (set 4: FIG. 5) would be arranged on the face S 1 and the modules of the sets 1 to 3 (FIG. 5) on the faces S 2 to S 3 , respectively.
  • the second and third levels could have been separated.
  • the interconnections would then be made using connectors playing a role similar to connectors C 71 to C 78 .
  • the interconnections between the modules of the set 4 and the other modules could then be carried out, also, by using coaxial cables.
  • this structure while remaining consistent with the teaching of the invention, would however be more complex than that described with regard to FIG. 16.
  • the material constituting the cubic structure must be used as support. Various materials can be chosen. We will select a light material such as aluminum.
  • the connectors of the second stage establish the necessary interconnections between the modules of the second and third levels, in a manner very similar to what has been described in relation to FIG. 17.
  • the interconnections between the outputs of the N 2 modules of the first level and the inputs of the other modules require N t connections (trellis). They can be carried out, as before, using N t coaxial cables, adapted in phase and in insertion losses, and stable in temperature.
  • the general rule can be stated as follows: the outputs of rank i of each cell are each connected to one of the cell inputs of the independent game similarly rank ; with i ⁇ ⁇ 1, R ⁇ .
  • the rule is as follows: the output of row j of each cell of the first row is connected to an input of the cell of the same second row rank; with j ⁇ ⁇ 1, N ⁇ .
  • planar multilayer technology with radio frequency crossings.
  • Figure 18 illustrates such an arrangement.
  • the set of module 1 in FIG. 5 was taken as an example. This set comprises two rows of three 3 ⁇ 3 one-dimensional "DFT" cells: 11-13 and 14-16, respectively. It is assumed that it is produced on a single support which merges with the set 1 itself.
  • the connections between the modules of the two rows are effected by means of transmission lines arranged on two levels of a dielectric.
  • the latter also serves as a support for cells or modules 11 to 16.
  • the links 110 (cell 11 to cell 14), 111 (cell 11 to cell 15), 122 (cell 12 to cell 15), 132 (cell 13 to cell 15 ) and 133 (cell 13 to cell 16) occupies only one level (upper plane).
  • the links 112 (cell 11 to cell 16), 121 (cell 12 to cell 14), 123 (cell 12 to cell 16) and 131 (cell 13 to cell 14) occupy two levels (upper and lower planes).
  • Each of these links is divides into three sections: 112-112'-112 ", 121-121'-121", 123-123'-123 "and 131-131'-31", respectively.
  • the "lower” transmission lines are connected to the "upper” transmission lines using radio frequency feed-throughs: 1120-1121, 1210-1211, 1230-1231 and 1310-1311, respectively.
  • the dielectric material taking into account the frequency range used, is of the type known as "soft" substrates. More specifically, the material used can be, for example, Teflon, loaded or not with ceramic, or alumina.
  • adaptation elements or circuits may be necessary near the radio frequency crossings.
  • Ribbon-type lines are used, in thick or thin film depending on the precise application and the manufacturing methods involved.
  • the element shown, in section, in this figure comprises three parallel metallic ground planes PM 1 , PM 2 and PM 3 and, between these ground planes, two layers, D 1 and D 2 , forming supports, of dielectric material.
  • Two metallic ribbon lines, an upper line L 1 and a lower line L 2 are buried in the dielectric supports, respectively in D 1 and D 2 .
  • a radiofrequency crossing TR 1 in the form of a metallized hole.
  • an orifice of larger diameter, or more generally of larger dimensions is produced in the intermediate ground plane M 2 .
  • the latter plays the role of radio screen between the two lines L 1 and L 2 . This arrangement therefore ensures a very high level of radiofrequency insulation.
  • Another solution would be to provide a waveguide line on one level and a ribbon line on the other.
  • This solution offers a minimum of complexity, however the radiofrequency insulation is not as important as that offered by the ribbon lines. However, a sufficient degree of insulation can be achieved by increasing the thickness of the dielectric.
  • the mass per node "BFN" (from the Anglo-Saxon “BeamForming Network") is less than 1 g.
  • the number of nodes is defined as the product of the number of beams by the number of radiating elements.
  • a ratio of 10 g per node is commonly accepted as a reference ratio when total mass estimates are made for conforming networks of radiofrequency beams, using the usual technologies in the field.
  • the architecture of the invention therefore allows a reduction in the total mass in a ratio of about 1 to 10.
  • the invention cannot be confined to this single type of application. It applies to all radio frequency antennas of the network antenna type with phase control for the generation of multiple beams.

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EP95402749A 1994-12-19 1995-12-06 Réseau conformateur de faisceaux pour antenne radiofréquence mettant en oeuvre la Transformée de Fourier Rapide et structure matérielle implantant un tel réseau, notamment pour les applications spatiales Withdrawn EP0718911A1 (fr)

Applications Claiming Priority (2)

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FR9415229A FR2728366A1 (fr) 1994-12-19 1994-12-19 Reseau conformateur de faisceaux pour antenne radiofrequence mettant en oeuvre la transformee de fourier rapide et structure materielle implantant un tel reseau, notamment pour les applications spatiales
FR9415229 1994-12-19

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EP (1) EP0718911A1 (ja)
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CA2165635A1 (fr) 1996-06-20
FR2728366A1 (fr) 1996-06-21
JPH08330831A (ja) 1996-12-13
US5812088A (en) 1998-09-22
FR2728366B1 (ja) 1997-02-28

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