EP0718906B1 - Stripline filter - Google Patents

Stripline filter Download PDF

Info

Publication number
EP0718906B1
EP0718906B1 EP95118894A EP95118894A EP0718906B1 EP 0718906 B1 EP0718906 B1 EP 0718906B1 EP 95118894 A EP95118894 A EP 95118894A EP 95118894 A EP95118894 A EP 95118894A EP 0718906 B1 EP0718906 B1 EP 0718906B1
Authority
EP
European Patent Office
Prior art keywords
stripline
coupling
resonators
filter according
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95118894A
Other languages
German (de)
French (fr)
Other versions
EP0718906A1 (en
Inventor
Christian Block
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG filed Critical Siemens Matsushita Components GmbH and Co KG
Publication of EP0718906A1 publication Critical patent/EP0718906A1/en
Application granted granted Critical
Publication of EP0718906B1 publication Critical patent/EP0718906B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/203Strip line filters
    • H01P1/20327Electromagnetic interstage coupling

Definitions

  • the invention relates to a stripline filter according to the Preamble of claim 1.
  • Such a stripline filter is from the US-A-5,248,949.
  • metallizations on the top and bottom of a dielectric substrate galvanic connections in the form of metallizations End faces of the substrate provided.
  • a microwave bandpass filter is known from EP-A-0 429 067, with the metallizations on the top and bottom of a dielectric substrate through metallized through holes are galvanically connected to each other.
  • the coupling takes place the stripline resonators are usually capacitive by on the base of the ceramic substrate an area of the surrounding mass is electrically isolated, so that this Area to a separated by the dielectric on top a capacitance arranged on the ceramic substrate forms.
  • This capacitance is according to the plate capacitor formula depending on the ⁇ of the dielectric, the thickness of the substrate and the size of the area. Slight fluctuations in the location of the Area can, if this coupling capacity z.
  • B. for Injecting microwave power into a power resonator is needed, the frequency of the coupling change detuned resonator.
  • the object of the present invention is therefore almost a resonance-free resonator for a stripline filter inexpensive to manufacture, even when coupled with others Low resonators for the production of appropriate filters Has resonance frequency tolerances and is narrow tolerance Coupling capacities.
  • a ceramic substrate 1 is shown on the two stripline resonators 2 are arranged.
  • Coupling metal surfaces 3 are by a galvanic isolation 4 separated from all-sided mass metallization.
  • metal surfaces 5 are arranged, with the help of, preferably internally metallized, Through holes 6 with the coupling metal surfaces 3 are contacted.
  • the coupling of the stripline filter thus takes place in that the through the dividing surfaces 4th Coupling metal surfaces galvanically separated from the surrounding mass 3 plated through to the other side of the ceramic substrate 1 are and the capacitive coupling with the stripline resonators 2 on the opposite side.
  • the coupling is mainly increased by the Distance of the structures determined and not by the substrate thickness, which are preferably made of high-dielectric microwave ceramics consists.
  • the substrate thickness which are preferably made of high-dielectric microwave ceramics consists.
  • Through holes 6 can increase the adhesive strength of the coupling structure be significantly improved.
  • the structure on the Base area can be mechanically or etched with clearly greater tolerances and thus possibly less effort become.
  • the coupling can also be created using etching technology be, the location of the photo mask for the coupling capacity is less critical.
  • the line structures can either be in thick-film technology (Screen printing with thick-film silver) or in thin-film technology (Copper etched).
  • Another possibility is to pre-sinter the Press structure into the ceramic body. At distance The metallization on the top becomes the resonance frequency not or hardly influenced.
  • the distance b between the stripline resonators 2 and determines the metal surfaces 5 of the coupling structure Size of the coupling capacity. Capacitive coupling accomplished the transformation of the low-resistance stripline resonator (typically 5 to 10 ⁇ ) to those in the Most applications require adjustment to 50 or 75 ⁇ .
  • the distance a between the metal surfaces 5 of the coupling structure determines the size of the external coupling. over the setting of the capacity can be the location of the two Adjust notches of the filter characteristics to suit the application.
  • the filter created in this way is characterized by low Insertion loss, high blocking selection and by high or complete freedom from comparison. It is also much flatter as a comparable one in its properties Coaxial resonators existing microwave ceramic filter.
  • the stripline filter according to FIG. 1 is shown in FIG Side view shown.
  • a further development of the two-pole filter described can consist of adding more stripline resonators increase the selection properties of the filter.
  • an additional coupling capacitor 9th has the coupling structures additionally capacitive coupled.
  • Through-contacts holes 12 or slots 13
  • Through-contacts in addition to setting the coupling be used between the individual resonators 2.
  • the embodiment 3 is in the area of the coupling structure the open side (metallization-free) 11 and opposite the short-circuit side 10.
  • Another way to unilaterally improve Edge steepness is a line discontinuity in the form of a broadside jump in the resonator line 2 to create. This happens because either the stripline resonator 2 in the area of the short-circuit side 10 reduced cross-section (metal-free surface 8) or is widened in this area (additional metallization 7). In the first case, an inductive and second, a capacitive effect.
  • Such filters with a broad side jump in the stripline resonators 2 are characterized in that the filter characteristic a steepening to lower frequencies having.
  • the broadside jumps become the open side 11 mirrored, steepening to higher frequencies will be realized.
  • the broadside jumps with capacitive Draw the effect is particularly characterized by the fact that the coupling is very reproducible because the line jump to the outside is led.
  • the broadside jump can optionally also be carried out in this way be that one piece of the inner conductor is shifted against the other is. With this, the emergency strike can be added to adjust. Because this is an undercut acts, you can only this body in the previously described Make mold, i.e. it is not in one piece to press (monolithic).
  • the stripline filter can insofar the losses be constructed asymmetrically that the ceramic substrate 1 thicker than the ceramic lid is.
  • the unstressed quality of the resonators can be increased by up to 50% in this way.

Abstract

The filter has a ceramic substrate (1) onto which a pair of stripline resonators (2) are formed. Coupling metal surfaces (3) are electrically isolated (4) on the underside. Metallic pads (5) are formed on the topside with through hole contacts (6). Capacitive coupling between the surfaces (3) on one side and the strip resonators on the other is obtained. The metallic surfaces are produced by photo etching.

Description

Die Erfindung betrifft ein Streifenleitungsfilter nach dem Oberbegriff des Patentanspruch 1.The invention relates to a stripline filter according to the Preamble of claim 1.

Ein derartiges Streifenleitungsfilter ist aus der US-A-5,248,949 bekannt. Dabei sind zwischen Metallisierungen auf der Ober- und Unterseite eines dielektrischen Substrats galvanische Verbindungen in Form von Metallisierungen auf Stirnseiten des Substrats vorgesehen.Such a stripline filter is from the US-A-5,248,949. There are between metallizations on the top and bottom of a dielectric substrate galvanic connections in the form of metallizations End faces of the substrate provided.

Aus der EP-A-0 429 067 ist ein Mikrowellen-Bandpaßfilter bekannt, bei dem Metallisierungen auf der Ober- und Unterseite eines dielektrischen Substrates durch metallisierte Durchgangslöcher galvanisch miteinander verbunden sind.A microwave bandpass filter is known from EP-A-0 429 067, with the metallizations on the top and bottom of a dielectric substrate through metallized through holes are galvanically connected to each other.

Bei bekannten Streifenleistungsfiltern erfolgt die Ankopplung der Streifenleitungsresonatoren üblicherweise kapazitiv, indem auf der Grundfläche des Keramiksubstrats eine Fläche von der umgebenen Masse galvanisch getrennt wird, so daß diese Fläche zu einer durch das Dielektrikum getrennten oben auf dem Keramiksubstrat angeordneten Leiterbahn eine Kapazität bildet. Diese Kapazität ist nach der Plattenkondensatorformel abhängig vom ε des Dielektrikums, der Dicke des Substrates und der Größe der Fläche. Geringe Schwankungen der Lage der Fläche können, wenn diese Ankopplungskapazität z. B. zur Injizierung einer Mikrowellenleistung in einem Leistungsresonator benötigt wird, die Frequenz des durch die Ankopplung verstimmten Resonators verändern. In known strip power filters, the coupling takes place the stripline resonators are usually capacitive by on the base of the ceramic substrate an area of the surrounding mass is electrically isolated, so that this Area to a separated by the dielectric on top a capacitance arranged on the ceramic substrate forms. This capacitance is according to the plate capacitor formula depending on the ε of the dielectric, the thickness of the substrate and the size of the area. Slight fluctuations in the location of the Area can, if this coupling capacity z. B. for Injecting microwave power into a power resonator is needed, the frequency of the coupling change detuned resonator.

Zur Behebung dieser Schwierigkeiten waren bisher aufwendige Strukturierungsverfahren, Photolithograpie/Ätztechniken und hoch genaue Schlifftechniken bei der Substratherstellung erforderlich.Up to now, elaborate on these difficulties Structuring processes, photolithography / etching techniques and Highly precise grinding techniques required when manufacturing substrates.

Aufgabe der vorliegenden Erfindung ist es daher, einen nahezu abgleichfreien Resonator für ein Streifenleitungsfilter kostengünstig herzustellen, der auch bei Verkoppelung mit anderen Resonatoren zur Herstellung entsprechender Filter geringe Resonanzfrequenztoleranzen aufweist und sich durch engtolerierte Ankopplungskapazitäten auszeichnet.The object of the present invention is therefore almost a resonance-free resonator for a stripline filter inexpensive to manufacture, even when coupled with others Low resonators for the production of appropriate filters Has resonance frequency tolerances and is narrow tolerance Coupling capacities.

Diese Aufgabe wird erfindungsgemäß mit einem Streifenleitungsfilter gelöst, das die im Patentanspruch 1 angegebenen Merkmale aufweist. This object is achieved according to the invention with a strip line filter solved that specified in claim 1 Features.

Zweckmäßige Ausgestaltungen dieses Streifenleitungsfilters sind Gegenstand von Unteransprüchen.Appropriate configurations of this stripline filter are the subject of subclaims.

Die Erfindung wird im folgenden anhand von Ausführungsbeispielen naher erläutert.The invention is described below using exemplary embodiments explained in more detail.

In der dazu gehörenden Zeichnungen zeigen

Figur 1
die Ansicht eines Streifenleitungsfilters,
Figur 2
eine Seitenansicht des Streifenleitungsfilters nach Figur 1 und
Figur 3
eine weitere Ausführungsform eines Streifenleitungsfilters in Draufsicht.
Show in the accompanying drawings
Figure 1
the view of a stripline filter,
Figure 2
a side view of the stripline filter of Figure 1 and
Figure 3
a further embodiment of a stripline filter in plan view.

In der Figur 1 ist ein Keramiksubstrat 1 dargestellt, auf dem zwei Streifenleitungsresonatoren 2 angeordnet sind. Ankopplungsmetallflachen 3 sind durch eine galvanische Trennung 4 von der allseitigen Massemetallisierung getrennt. Auf der Oberfläche des Keramiksubstrats 1, auf der sich die Streifenleitungsresonatoren 2 befinden, sind Metallflachen 5 angeordnet, die unter Zuhilfenahme von, vorzugsweise innen metallisierten, Durchgangslöchern 6 mit den Ankopplungsmetallflachen 3 kontaktiert sind. Die Ankopplung des Streifenleitungsfilters erfolgt somit dadurch, daß die durch die Trennflächen 4 galvanisch von der umgebenden Masse getrennten Ankopplungsmetallflachen 3 zur anderen Seite des Keramiksubstrats 1 durchkontaktiert sind und die kapazitive Kopplung mit den Streifenleitungsresonatoren 2 auf der gegenüberliegenden Seite erfolgt. Auch wenn das Bauelement durch diese Maßnahme geringfügig größer wird, wird die Kopplung hauptsächlich durch den Abstand der Strukturen bestimmt und nicht durch die Substratdicke, die vorzugsweise aus hochdielektrischer Mikrowellenkeramik besteht. Durch die Durchkontaktierung mit Hilfe der Durchgangslöcher 6 kann die Haftfestigkeit der Ankopplungsstruktur deutlich verbessert werden. Die Struktur auf der Grundfläche kann mechanisch oder atztechnisch mit deutlich größeren Toleranzen und somit ggf. geringerem Aufwand hergestellt werden. Die Kopplung kann ebenfalls atztechnisch erstellt werden, wobei die Lage der Fotomaske für die Koppelkapazität unkritischer ist.In the figure 1, a ceramic substrate 1 is shown on the two stripline resonators 2 are arranged. Coupling metal surfaces 3 are by a galvanic isolation 4 separated from all-sided mass metallization. On the Surface of the ceramic substrate 1 on which the stripline resonators are located 2 are located, metal surfaces 5 are arranged, with the help of, preferably internally metallized, Through holes 6 with the coupling metal surfaces 3 are contacted. The coupling of the stripline filter thus takes place in that the through the dividing surfaces 4th Coupling metal surfaces galvanically separated from the surrounding mass 3 plated through to the other side of the ceramic substrate 1 are and the capacitive coupling with the stripline resonators 2 on the opposite side. Even if the component is slightly affected by this measure the coupling is mainly increased by the Distance of the structures determined and not by the substrate thickness, which are preferably made of high-dielectric microwave ceramics consists. By through-plating with the help of Through holes 6 can increase the adhesive strength of the coupling structure be significantly improved. The structure on the Base area can be mechanically or etched with clearly greater tolerances and thus possibly less effort become. The coupling can also be created using etching technology be, the location of the photo mask for the coupling capacity is less critical.

Die Leitungsstrukturen können entweder in Dickschichttechnik (Siebdruck mit Dickschichtsilber) oder in Dünnschichttechnik (Kupfer geätzt) hergestellt werden.The line structures can either be in thick-film technology (Screen printing with thick-film silver) or in thin-film technology (Copper etched).

Eine andere Möglichkeit besteht darin, vor der Sinterung die Struktur in den Keramikkörper einzupressen. Bei Entfernung der Metallisierung an der Oberseite wird die Resonanzfrequenz nicht oder kaum beeinflußt.Another possibility is to pre-sinter the Press structure into the ceramic body. At distance The metallization on the top becomes the resonance frequency not or hardly influenced.

Der Abstand b zwischen den Streifenleitungsresonatoren 2 und den Metallflachen 5 der Ankopplungsstruktur bestimmt die Größe der Ankoppelkapazitat. Die kapazitive Kopplung bewerkstelligt die Transformation des niederohmigen Streifenleitungsresonators (typischerweise 5 bis 10 Ω) auf die in den meisten Anwendungen benötigte Anpassung auf 50 oder 75 Ω.The distance b between the stripline resonators 2 and determines the metal surfaces 5 of the coupling structure Size of the coupling capacity. Capacitive coupling accomplished the transformation of the low-resistance stripline resonator (typically 5 to 10 Ω) to those in the Most applications require adjustment to 50 or 75 Ω.

Der Abstand a zwischen den Metallflachen 5 der Ankopplungsstruktur bestimmt die Größe der externen Verkopplung. Über die Einstellung der Kapazität läßt sich die Lage der beiden Notches der Filtercharakteristik anwendungsgerecht einstellen.The distance a between the metal surfaces 5 of the coupling structure determines the size of the external coupling. over the setting of the capacity can be the location of the two Adjust notches of the filter characteristics to suit the application.

Das derart entstandene Filter zeichnet sich durch niedrige Einfügungsdämpfung, hohe Sperrselektion und durch hohe oder vollständige Abgleichfreiheit aus. Es ist zudem deutlich flacher als ein in seinen Eigenschaften vergleichbares aus gekoppelten Koaxialresonatoren bestehendes Mikrowellenkeramikfilter.The filter created in this way is characterized by low Insertion loss, high blocking selection and by high or complete freedom from comparison. It is also much flatter as a comparable one in its properties Coaxial resonators existing microwave ceramic filter.

In der Figur 2 ist das Streifenleitungsfilter nach Figur 1 in Seitenansicht dargestellt. The stripline filter according to FIG. 1 is shown in FIG Side view shown.

Eine Weiterbildung des beschriebenen Zweipolfilters kann darin bestehen, durch Hinzufügen weiterer Streifenleitungsresonatoren die Selektionseigenschaften des Filters zu erhöhen.A further development of the two-pole filter described can consist of adding more stripline resonators increase the selection properties of the filter.

Es besteht ferner auch die Möglichkeit, flache Einzelresonatoren mit nur einem Streifenleitungsresonator herzustellen, die beispielsweise als frequenzbestimmende Komponente eines Oszillators (Bandpaßbeschaltung) oder als Bandsperre geschaltet als Notchfilter zur zusätzlichen Filterung von Störfrequenzen dienen können. Hierbei können die Leiterbahnen sehr schmal ausgeführt und somit höhere charakteristische Impedanzen hergestellt werden. Ein Oszillator läßt sich dann besser ziehen (höhere Güte).There is also the possibility of flat individual resonators with only one stripline resonator, which, for example, as a frequency-determining component of a Oscillators (bandpass circuit) or switched as a bandstop as a notch filter for additional filtering of interference frequencies can serve. Here, the conductor tracks can be very slim design and therefore higher characteristic impedances getting produced. An oscillator can then be better draw (higher goodness).

Ferner ist es möglich, das Filter durch einen über der Oberseite angeordneten Bügel oder ein Gehäuse zu schirmen, die beispielsweise mit dem Keramiksubstrat 1 verlötet bzw. verklebt sind. Hierbei kann bei besonders hohen Anforderungen an die Frequenzgenauigkeit das Filter durch Gehäuseschlitze oder in die Schlitze eingefügte Abstimmlaschen nachjustiert werden.It is also possible to pass the filter through one over the top arranged brackets or a housing to shield the for example, soldered or glued to the ceramic substrate 1 are. This can apply to particularly high requirements the frequency accuracy of the filter through housing slots or adjustment tabs inserted into the slots can be readjusted.

Zur weiteren Miniaturisierung besteht zusätzlich die Möglichkeit, anstelle eines Abschirmbleches ein bis auf die dem Filter zugewandte Fläche metallisiertes Substrat auf das Grundsubstrat 1 zu montieren (Fügen durch Löten oder Kleben möglich).For further miniaturization, there is also the possibility instead of a shielding plate except for the filter facing surface of metallized substrate on the base substrate 1 to be assembled (joining possible by soldering or gluing).

Bei verschiedenen Anwendungen im Bereich schnurloser Telefone und Mobilfunk ist eine besonders hohe einseitige Versteilerung der Filtercharakteristik gewünscht, um Spiegelfrequenzen - oder bei Duplexerbetrieb das Nachbarband - gezielt zu unterdrücken. Hierfür ist in der Figur 3 ein Ausführungsbeispiel dargestellt, das einen zusätzlichen Koppelkondensator 9 aufweist, der die Ankopplungsstrukturen zusätzlich kapazitiv verkoppelt. Hierbei können Durchkontaktierungen (Löcher 12 oder Schlitze 13) zusätzlich zur Einstellung der Kopplung zwischen den Einzelresonatoren 2 verwendet werden. Beim Ausführungsbeispiel der Figur 3 ist im Bereich der Ankopplungsstruktur die offene Seite (metallisierungsfrei) 11 und gegenüberliegend die Kurzschlußseite 10.For various applications in the field of cordless telephones and mobile radio is a particularly high one-sided steepening the filter characteristics desired to mirror frequencies - or the neighboring band in duplex mode - selectively suppress. An exemplary embodiment is shown in FIG shown that an additional coupling capacitor 9th has the coupling structures additionally capacitive coupled. Through-contacts (holes 12 or slots 13) in addition to setting the coupling be used between the individual resonators 2. In the embodiment 3 is in the area of the coupling structure the open side (metallization-free) 11 and opposite the short-circuit side 10.

Eine weitere Möglichkeit zur einseitigen Verbesserung der Flankensteilheit besteht darin, eine Leitungsdiskontinuität in Form eines Breitseitensprunges in der Resonatorleitung 2 zu erzeugen. Dies geschieht dadurch, daß entweder der Streifenleitungsresonator 2 im Bereich der Kurzschlußseite 10 einen verminderten Querschnitt aufweist (metallfreie Fläche 8) oder in diesem Bereich verbreitert ist (zusätzliche Metallisierung 7). Im ersten Fall resultiert eine induktive und im zweiten eine kapazitive Wirkung.Another way to unilaterally improve Edge steepness is a line discontinuity in the form of a broadside jump in the resonator line 2 to create. This happens because either the stripline resonator 2 in the area of the short-circuit side 10 reduced cross-section (metal-free surface 8) or is widened in this area (additional metallization 7). In the first case, an inductive and second, a capacitive effect.

Derartige Filter mit einem Breitseitensprung in den Streifenleitungsresonatoren 2 zeichnen sich dadurch aus, daß die Filtercharakteristik eine Versteilerung zu niedrigeren Frequenzen aufweist. Werden die Breitseitensprünge zur offenen Seite 11 hingespiegelt, kann eine Versteilerung zu höheren Frequenzen realisiert werden. Die Breitseitensprünge mit kapazitiver Wirkung (Vergrößerung der Abmessungen um die Fläche 7) zeichnen sich besonders dadurch zusätzlich aus, daß die Kopplung sehr gut reproduzierbar ist, da der Leitungssprung nach außen geführt ist.Such filters with a broad side jump in the stripline resonators 2 are characterized in that the filter characteristic a steepening to lower frequencies having. The broadside jumps become the open side 11 mirrored, steepening to higher frequencies will be realized. The broadside jumps with capacitive Draw the effect (enlarging the dimensions by area 7) is particularly characterized by the fact that the coupling is very reproducible because the line jump to the outside is led.

Der Breitseitensprung kann gegebenenfalls auch so ausgeführt sein, daß ein Stück des Innenleiters gegen das andere verschoben ist. Hiermit läßt sich die Notchlage zusätzlich einstellen. Da es sich hierbei um eine Hinterschneidung handelt, kann man diesen Körper nur in der vorher beschriebenen Form herstellen, d.h. er ist nicht in einem Stück (monolithisch) zu pressen.The broadside jump can optionally also be carried out in this way be that one piece of the inner conductor is shifted against the other is. With this, the emergency strike can be added to adjust. Because this is an undercut acts, you can only this body in the previously described Make mold, i.e. it is not in one piece to press (monolithic).

Falls zusätzlich ein Keramikdeckel montiert werden soll, besteht auch die Mögichkeit, den Deckel im gepreßten Zustand mit dem ebenfalls grünen Grundsubstrat zu fügen und anschließend zu sintern. Man erspart sich dadurch den im anderen Fall notwendigen Arbeitsschritt, die funktional notwendigen metallisierungsfreien Flächen zu entmetallisieren bzw. metallisierungsfrei zu halten.If a ceramic lid is also to be installed, there is also the possibility of the lid in the pressed state with the green base substrate and then add to sinter. This saves you the other way necessary work step, the functionally necessary metallization-free Demetallize surfaces or metallization-free to keep.

Zur Minimierung der Einfügungsdämpfung und somit zur Reduktion der Verluste kann das Streifenleitungsfilter insofern unsymmetrisch aufgebaut werden, daß das Kermiksubstrat 1 dikker als der Keramikdeckel ist. Die unbelastete Güte der Resonatoren läßt sich auf diese Weise um bis zu 50 % steigern.To minimize insertion loss and thus to reduce it the stripline filter can insofar the losses be constructed asymmetrically that the ceramic substrate 1 thicker than the ceramic lid is. The unstressed quality of the resonators can be increased by up to 50% in this way.

Claims (9)

  1. Stripline filter having at least two stripline resonators (2) arranged on a surface side of a ceramic substrate (1), having capacitive coupling structures (3 to 6) for the coupling of an RF signal, having an earth metallization layer on the ceramic substrate (1) on all sides with the exception of the end side of the substrate (1) with the coupling structures (3 to 6) and the surface side with the stripline resonators (2), the capacitive coupling structures (3 to 6) being formed by virtue of the fact that coupling metal areas (3) isolated from the earth metallization layer by DC-isolation (4) are provided on that surface side of the substrate (1) which is opposite to the stripline resonators (2) and DC-isolated metal areas (5) are provided on that surface side of the substrate (1) which carries the stripline resonators, and having an electrically conductive connection between the coupling metal areas (3) and the metal areas (5),
    characterized
    in that the electrically conductive connection between the coupling metal areas (3) and the metal areas (5) is formed by through holes (6) in the substrate (1), and in that the coupling structures (3 to 6) are capacitively coupled by a coupling capacitor (9).
  2. Stripline filter according to Claim 1,
    characterized
    in that the coupling capacitance between the coupling structures (3 to 6) and the stripline resonators (2) is defined by a distance (b) between coupling structures (3 to 6) and stripline resonators (2).
  3. Stripline filter according to Claim 1 or 2,
    characterized
    in that the size of the external coupling is defined by a distance (a) between the metal areas (5).
  4. Stripline filter according to one of Claims 1 to 3,
    characterized
    in that the selection properties of the filter are increased by further stripline resonators (2) that are added.
  5. Stripline filter according to one of Claims 1 to 4,
    characterized
    in that the metallization structures are produced by means of thick-film technology (for example screen printing with thick-film silver) or by means of thin-film technology (copper, etched).
  6. Stripline filter according to one of Claims 1 to 4,
    characterized
    in that the metallization structures are pressed into the ceramic substrate (1) prior to the sintering process.
  7. Stripline filter according to one of Claims 1 to 6,
    characterized
    in that a line discontinuity in the form of a broadside discontinuity (7, 8) is arranged in the stripline resonators (2).
  8. Stripline filter according to one of Claims 1 to 7,
    characterized
    in that a ceramic cover is arranged over the ceramic substrate (1).
  9. Stripline filter according to Claim 8,
    characterized
    in that the ceramic substrate (1) is thicker than the ceramic cover.
EP95118894A 1994-12-22 1995-11-30 Stripline filter Expired - Lifetime EP0718906B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4446103 1994-12-22
DE4446103 1994-12-22

Publications (2)

Publication Number Publication Date
EP0718906A1 EP0718906A1 (en) 1996-06-26
EP0718906B1 true EP0718906B1 (en) 1999-05-12

Family

ID=6536790

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95118894A Expired - Lifetime EP0718906B1 (en) 1994-12-22 1995-11-30 Stripline filter

Country Status (7)

Country Link
US (1) US5812037A (en)
EP (1) EP0718906B1 (en)
AT (1) ATE180107T1 (en)
DE (1) DE59505908D1 (en)
DK (1) DK0718906T3 (en)
ES (1) ES2134398T3 (en)
GR (1) GR3030890T3 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997050144A1 (en) * 1996-06-27 1997-12-31 E.I. Du Pont De Nemours And Company Planar high temperature superconductor filters or multiplexers with backside coupling
DE19652799C2 (en) * 1996-12-18 1999-05-20 Siemens Ag Microwave filter
DE19742971C2 (en) * 1997-09-29 1999-12-09 Siemens Matsushita Components Stripline filter
US6147576A (en) * 1998-04-10 2000-11-14 Ameramp Llc Filter designs utilizing parasitic and field effects
JP2000252716A (en) * 1999-03-03 2000-09-14 Sony Corp Distributed constant filter, its manufacture and distributed constant filter printed circuit board
US20040085165A1 (en) * 2002-11-05 2004-05-06 Yung-Rung Chung Band-trap filter
DE10311041A1 (en) * 2003-03-13 2004-10-07 Kathrein-Werke Kg High-frequency connection or high-frequency distribution network
US7411474B2 (en) * 2005-10-11 2008-08-12 Andrew Corporation Printed wiring board assembly with self-compensating ground via and current diverting cutout
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
US7940148B2 (en) * 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
WO2008063507A2 (en) * 2006-11-17 2008-05-29 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
US20090236134A1 (en) * 2008-03-20 2009-09-24 Knecht Thomas A Low frequency ball grid array resonator

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266206A (en) * 1978-08-31 1981-05-05 Motorola, Inc. Stripline filter device
JPS623040A (en) * 1985-06-25 1987-01-09 Nippon Electric Glass Co Ltd Glass for coating of semiconductor
JPH0334305U (en) * 1989-08-14 1991-04-04
KR0174531B1 (en) * 1989-11-20 1999-04-01 이우에 사또시 Band-passfilter using microstrip lines and filter characteristic adjusting method thereof
DE4031536A1 (en) * 1990-10-05 1992-04-16 Rohde & Schwarz MICROWAVE CONTROL
US5105175A (en) * 1991-03-12 1992-04-14 Motorola, Inc. Resonant circuit element having insignificant microphonic effects
JP2502824B2 (en) * 1991-03-13 1996-05-29 松下電器産業株式会社 Flat type dielectric filter
JPH0529817A (en) * 1991-07-18 1993-02-05 Matsushita Electric Ind Co Ltd Lambda/4 type dielectric substance resonator
JPH0563405A (en) * 1991-09-03 1993-03-12 Tdk Corp Dielectric substrate triplet strip line

Also Published As

Publication number Publication date
ES2134398T3 (en) 1999-10-01
ATE180107T1 (en) 1999-05-15
GR3030890T3 (en) 1999-11-30
EP0718906A1 (en) 1996-06-26
DK0718906T3 (en) 1999-11-01
DE59505908D1 (en) 1999-06-17
US5812037A (en) 1998-09-22

Similar Documents

Publication Publication Date Title
US4757288A (en) Ceramic TEM bandstop filters
US5396201A (en) Dielectric filter having inter-resonator coupling including both magnetic and electric coupling
US5208565A (en) Dielectric filer having a decoupling aperture between coaxial resonators
EP0718906B1 (en) Stripline filter
DE69736617T2 (en) Dielectric laminated band elimination filter with electromagnetic coupling between resonators
DE19923476C2 (en) Chip-shaped piezoelectric resonator and method for adjusting its resonance frequency
DE4291076C2 (en) Mounting socket for attaching a dielectric filter and method for attaching a dielectric filter on a support
DE4030763C2 (en) Dielectric filter
DE10042229A1 (en) Electrical component, method for its production and its use
GB2269715A (en) RF filters
DE69729030T2 (en) Dielectric multilayer device and associated manufacturing process
DE2707176C3 (en) Resonance circuit formed using stripline technology
DE10015582B4 (en) The antenna device
US5278527A (en) Dielectric filter and shield therefor
EP0154703B1 (en) Resonator
DE19857062B4 (en) Method of making a dielectric filter
US4745379A (en) Launcher-less and lumped capacitor-less ceramic comb-line filters
US5291162A (en) Method of adjusting frequency response in a microwave strip-line filter device
JP2561775B2 (en) Dielectric filter and method of adjusting frequency characteristics thereof
JPH03108801A (en) Dielectric filter
US5859575A (en) Dielectric filter
US20070146098A1 (en) Compact printed filters with self-connected LC resonators
KR960012467B1 (en) Structure of high freq. filter
JP2661004B2 (en) Dielectric filter
US6034579A (en) Dielectric filter of the band elimination type

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LI LU NL PT SE

17P Request for examination filed

Effective date: 19960719

17Q First examination report despatched

Effective date: 19971127

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LI LU NL PT SE

REF Corresponds to:

Ref document number: 180107

Country of ref document: AT

Date of ref document: 19990515

Kind code of ref document: T

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: SIEMENS SCHWEIZ AG

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: GERMAN

REF Corresponds to:

Ref document number: 59505908

Country of ref document: DE

Date of ref document: 19990617

ET Fr: translation filed
GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19990707

ITF It: translation for a ep patent filed

Owner name: STUDIO JAUMANN P. & C. S.N.C.

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2134398

Country of ref document: ES

Kind code of ref document: T3

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

REG Reference to a national code

Ref country code: PT

Ref legal event code: SC4A

Free format text: AVAILABILITY OF NATIONAL TRANSLATION

Effective date: 19990812

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: E. BLUM & CO. PATENTANWAELTE

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20021031

Year of fee payment: 8

Ref country code: NL

Payment date: 20021031

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20021101

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PT

Payment date: 20021107

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GR

Payment date: 20021113

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IE

Payment date: 20021118

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: LU

Payment date: 20021119

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20021127

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20021204

Year of fee payment: 8

Ref country code: BE

Payment date: 20021204

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031130

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031130

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031201

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031201

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031201

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031201

BERE Be: lapsed

Owner name: *SIEMENS MATSUSHITA COMPONENTS G.M.B.H. & CO. K.G.

Effective date: 20031130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040601

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040603

REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20031130

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 20040601

EUG Se: european patent has lapsed
REG Reference to a national code

Ref country code: PT

Ref legal event code: MM4A

Free format text: LAPSE DUE TO NON-PAYMENT OF FEES

Effective date: 20040531

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20031201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051130

REG Reference to a national code

Ref country code: CH

Ref legal event code: PFA

Owner name: SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG

Free format text: SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG#BALANSTRASSE 73#81541 MUENCHEN (DE) -TRANSFER TO- SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG#BALANSTRASSE 73#81541 MUENCHEN (DE)

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20141120

Year of fee payment: 20

Ref country code: CH

Payment date: 20141120

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20141118

Year of fee payment: 20

Ref country code: AT

Payment date: 20141119

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 59505908

Country of ref document: DE

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK07

Ref document number: 180107

Country of ref document: AT

Kind code of ref document: T

Effective date: 20151130