WO1997050144A1

WO1997050144A1 - Planar high temperature superconductor filters or multiplexers with backside coupling

Info

Publication number: WO1997050144A1
Application number: PCT/US1996/010951
Authority: WO
Inventors: Zhi-Yuan Shen
Original assignee: E.I. Du Pont De Nemours And Company
Priority date: 1996-06-27
Filing date: 1996-06-27
Publication date: 1997-12-31

Abstract

An improved high temperature superconducting planar filter or multiplexer wherein the coupling circuit or connecting network is located, in whole or in part, on the side of the substrate opposite the resonators and enables higher power handling capability.

Description

/50144 PC17US96/10951

_. TITL£ PLANAR HIGH TEMPERATURE SUPERCONDUCTOR FILTERS OR MULTIPLEXERS WITH BACKSIDE COUPLING FIELD OF THE INVENTION This invention relates to an improved high temperature superconducting planar filter having a coupling circuit which enables higher power handling capability, less strict manufacturing tolerance requirements and ease of design and fabrication. FUNDING

The present invention was funded in part by the National Aeronautics and Space Administration (NASA) of the United States Government, which has certain rights in the invention. BACKGROUND OF THE INVENTION

Filters made of high temperature superconductors have narrow bandwidth, extremely low in-band loss, high off-band rejection, and sharp skirts, which have many applications in telecommunication, instrumentation, radar and electronic warfare systems. However, for certain applications requiring radiofrequency high power such as in transmitters, the high temperature super¬ conductor filters must handle high power ranging from watts to kilowatts. The power handling capability of high temperature superconductor filters is limited by the maximum current density in the filter circuit, which must be below the critical current density, J_c, of the high temperature superconductor material used for fabricating the circuit. Figure 1 shows a conventional 3-pole planar high temperature superconductor filter of the prior art, as described in Applied Microwave Magazine, Fall 1991, pages 86-93. The thin film high temperature super¬ conductor material is deposited on both front and back sides of the substrate 1 as shown in Figure 1 (c) . The entire back side of 1 is coated with high temperature superconductor thin film 2 as shown in Figure 1 (b) serving as a ground plane. The front side shown in Figure 1 (a) consists of_. three square shaped high temperature superconductor thin film patterns, 3a, 3b, and 3c, serving as resonators and four thin film high temperature superconductor transmission lines, 4a, 4b, 4c, and 4d, serving as coupling apparatus, in which 4a and 4d are for coupling to the input and output, respectively, and 4b and 4c are for inter-sectional coupling. There are two places in a high temperature superconductor filter likely to have high current concentration: One is in the resonators where the resonant standing wave has current peaks and the other is in the coupling apparatus and its vicinity, where the radiofrequency power is coupled into or out of the resonators . Figure 2 shows a conventional prior art 2-pole dual mode high temperature superconductor filter with coupling on the front side of the substrate, as described in Applied Microwave Magazine, Fall 1991, pages 86-93. The substrate 10 has high temperature superconductor thin films 11 and 12 deposited on both sides as shown in the cross sectional view of Figure 2(e) . The entire back-side of substrate 10 is coated with high temperature superconductor thin film 11 serving as a ground plane as shown in Figure 2 (d) . On the front side of the substrate are high temperature superconductor thin film cut-corner squares 12 shown in Figure 2 (a) , Figure 2 (b) , and Figure 2 (c) which serve as a dual mode resonator with two modes coupled by the cut- corner 19. Three ways are known in the art for coupling on the front side of the substrate: Figure 2(a) shows direct connected coupling, in which the high temperature superconductor input and output transmission lines 13 and 13a are directly connected to the resonator 12 at connecting points 14 and 14a, respectively. Figure 2(b) shows gap coupling, in which the branch lines 15 and 15a are an extension of the input and output transmission lines 13 and 13a respectively, and are coupled to the resonator 12 by gaps 16 and 16a respectively. ^" ι - ^_

Figure 2 (c) shows parallel coupling, in which the high temperature superconductor input and output transmission lines 13 and 13a are extended to an additional length of 17 and 17a parallel to the edges of resonator 12 with gaps 18 and 18a, to provide the coupling. All of these front side couplings have power handling capability problems: (1) The high temperature superconductor microstrip transmission line 13 shown in Figure 2(a), Figure 2(b) and Figure 2(c) on a typical 0.5 mm thick LaA10₃ substrate has a narrow line width on the order of 160 micrometers, and a strip line version has an even smaller line width. The narrow high temperature super¬ conductor line has a limited power handling capability. In most filter designs, the input and output require a very strong coupling. The direct coupling shown in Figure 2 (a) can provide a strong coupling, but the radiofrequency current is strongly concentrated at the connecting points 14, 14a and their vicinity, which limits the power handling capability. In the case of gap coupling and of parallel coupling as shown in

Figure 2(b) and Figure 2(c), the only way to provide strong coupling is to reduce the gap width which can result in arcing at even fairly low voltages. The typical gap width for input and output coupling is on the order of micro-meters, which again causes radio¬ frequency current concentration at the gap edges resulting in poor power handling. In addition, the extremely narrow gap requires a very strict manufacturing tolerance, which causes difficulties in design and fabrication. In summary, all the conventional front-side coupling mechanisms of the prior art have power handling problems for high temperature superconductor filters.

The present invention solves the above problems by providing an improved filter or multiplexer utilizing coupling on the back side of the substrate. It provides the additional advantages of higher power capibility, needing less strict manufacturing tolerances, easier design and fabrication and the absence of arcing when gap coupling or parallel coupling are employed.

SUMMARY OF THF. INVENTION The present invention comprises an improved high temperature superconducting planar filter of the type having a) a substrate having a front side and a back side, b) at least two resonators, each comprising a patterned high temperature superconductor film deposited on the front side of the substrate, c) a ground plane comprising an high temperature superconductor film deposited on the back side of the substrate, and d) a coupling circuit comprising an input line coupled to one resonator, an output line coupled to the second resonator, and interconnecting lines coupling between resonators, wherein the improvement comprises a coupling circuit which is positioned at least partially on the back side of the substrate.

In particular, the present invention comprises a filter wherein the coupling circuit comprises a) a first branched high temperature super¬ conductor transmission line in coplanar line form connected to the input line, b) a second branched high temperature super¬ conductor transmission line in coplanar line form connected to the output line, and c) an interconnecting high temperature superconductor transmission line in coplanar line form between every two resonators, wherein i) at least one of the said transmission lines is located on the back side of the substrate, ii) a discontinuity exists in the high temperature superconductor film of the ground plane around a perimeter of each transmission line which is located on the back side of the substrate, and iii) electromagnetic fields of said coupling circuit and said resonator overlap by positioning said discontinuity adjacent -to or overlapping with a projection onto the back side of the substrate of an outer edge of said resonator.

The present invention further comprises a multicomplexer comprising a) a substrate having a front side and a back side, b) at least two channels of resonators, each channel comprising a patterned high temperature super- conductor film deposited on the front side of the substrate, c) a ground plane comprising a high temperature superconductor film deposited on the back side of the substrate, d) an input connecting network connected between a first resonator of each channel and an input port, an output connecting network connected between a second resonator of each channel and an output port, an intrachannel network connecting between resonators in a channel, each said network comprised of transmission lines, wherein i) said channels are connected in parallel, and ii) at least one of said connecting networks is on the back side of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 shows a conventional prior art 3-pole single mode high temperature superconductor filter with front-side coupling, as described in Applied Microwave Magazine, Fall 1991, pages 86-93. Figure 1 (a) shows the front view of the high temperature superconductor filter circuit. Figure 1 (b) shows the back view of the high temperature superconductor filter circuit. Figure 1 (c) shows the cross sectional view of the circuit in a microstrip line version.

Figure 2 shows a conventional prior art 2-pole dual mode high temperature superconductor filter, as described in Applied Microwave Magazine, Fall 1991, pages 86-93, with three known front-side coupling configurations. Figure 2(a) shows a front view having direct coupling, Figure 2(b) shows a front view having gap coupling, Figure 2 (c) shows a front view having parallel coupling. Figure 2(d) shows the back view of these three circuits. Figure 2(e) shows the cross sectional view of these three circuits in a microstrip version.

Figure 3 shows a first embodiment of the present invention of a back-side coupled single mode 3-pole high temperature superconductor filter. Figure 3(a) shows the front view of the invented filter circuit with three square shaped high temperature super¬ conductor resonators. Figure 3(b) shows the back view of the invented filter circuit with back-side coupling circuits and projections (dashed lines) of the edges of the resonators on the front side. Figure 3(c) shows the cross sectional view of the circuit in a microstrip version. Figure 4 shows a second embodiment of the present invention of a back-side coupled dual mode 2-pole high temperature superconductor filter. Figure 4(a) shows the front view of the invented filter circuit with a cut-corner square shaped high temperature super- conductor resonator. Figure 4(b) shows the back view of the invented filter circuit with back-side coupling circuits and a projection (dashed line) of the edge of the resonator on the front side. Figure 4(c) shows the cross sectional view of the Gircuit in a micro- strip version.

Figure 5 shows a third embodiment of the present invention of a back-side coupled single mode 2-pole high temperature superconductor filter. Figure 5(a) shows the front view of the invented filter circuit with two round shaped high temperature superconductor resonators. Figure 5(b) shows the back view of the invented filter circuit with back-side coupling circuits and a projection (dashed lines) of the edges of the resonator on the . front side. ^" Figure 5(c) shows the cross sectional view of the circuit in a microstrip version.

Figure 6 shows a fourth embodiment of the present invention of a back-side coupled dual mode 2-pole high temperature superconductor filter. Figure 6(a) shows the front view of the invented filter circuit having a round shaped high temperature superconductor resonator with a notch at a 45-degree angle relative to the horizontal and vertical axes of the resonator plane.

Figure 6 (b) shows the back view of the invented filter with back-side coupling circuits and a projection (dashed lines) of the edges of the resonators on the front side. Figure 6(c) shows the cross sectional view of the circuit in a microstrip version.

Figure 7 shows the layout of a back-side coupled single mode 2-pole high temperature superconductor filter circuit of the present invention. Figure 7(a) shows the front view with two square shaped high temperature superconductor resonators. Figure 7(b) shows the back view with back side coupling circuits, a metallic layer, and metallic contact points. Figure 7 (c) shows the cross sectional view of the circuit. Figure 8 shows a metallic case for housing the back-side coupled high temperature superconductor filter of the present invention shown in Figure 7. Figure 8(a) shows the front view. Figure 8(b) shows the cross sectional view of the case. Figure 9 shows the measured performance of the invented back-side coupled high temperature super¬ conductor filter shown in Figure 7. Figure 9(a) shows a graph of the amplitude of the measured S^ (reflecting response for a first port) versus frequency, at a power level of 0.2 W. Figure 9(b) shows a graph of the amplitude of the measured S₂₂ (reflecting response for a second port) versus frequency at a power leve of 0.2 W. Figure 9(c) shows a graph of the amplitude of the measured S₂ι (transmitting response) versus frequency at a power level of 0.2 W. Figure 9(d) shows a graph of the amplitude of the measured S₂₁ (transmitting response) versus frequency at different power levels of 0.2 W, 7.3 W, 8.7 W, and 10 W for comparison.

Figure 10 shows an embodiment of a back-side coupled two-channel multiplexer of the present invention. Figure 10(a) shows the front view having two high temperature superconductor filters.

Figure 10(b) shows a back view with back side coupling and interconnecting networks. Figure 10(c) shows a cross sectional view of the multiplexer circuit. Figure 11 shows a single mode 2-pole high temperature superconductor filter of the present invention with two versions of hybrid coupling circuits. Figure 11(a) shows the front view for both versions having square shaped high temperature super¬ conductor resonators. Figure 11(b) shows the back view of one version with coupling partially on the back side. Figure 11(c) shows the back view of other version with the coupling circuit totally on the back side. Figure 11(d) shows the cross sectional view for both versions. DETAILED DESCRIPTION OF THE INVENTION

This invention comprises an improved high temperature superconductor filter with back-side coupling. This invention further comprises high temperature superconductor multiplexers utilizing back-side coupling. Coupling is defined as the electromagnetic link between separate parts of a high temperature superconductor filter circuit. The coupling in a planar high temperature superconductor filter can be divided into two categories: (1) The input/output couplings, which provide linkage between the input and output ports to the associated resonators, and (2) the intersectional or inter¬ connecting couplings, which provide linkage between two or more separate resonators . The back-side coupling of the present invention is applicable to both the input/output and the intersectional couplings . All known high temperature superconductor filter coupling apparatus utilize front-side coupling, which means that the coupling circuits, and the resonant circuits are patterned on the same side (the front side) of the substrate and the back-side is an unpatterned high temperature superconductor ground plane as shown in Figure 1 (b) and Figure 2 (d) .

The back-side coupling of the present invention places the high temperature superconductor coupling circuits totally or partially on the substrate side opposite to the high temperature superconductor resonators, i.e., the back-side of the substrate. In other words, the back-side coupled high temperature superconductor filters of the present invention have patterned high temperature superconductor circuits on both sides of the substrates.

Since the back-side also serves as the ground plane of the high temperature superconductor filter, the transmission line used to form the back-side coupling is in the coplanar line configuration. The coplanar line configuration provides several advantages for the coupling circuit: First, the center line and the ground plane of the coplanar line are on the same surface, which is ideal for back-side coupling. Second, the center line width of the coplanar line can be increased to handle higher power, while at the same time maintaining a given characteristic impedance such as 50-ohm. Use of a wider width results in a requirement for less strict manufacturing tolerances and easier design and fabrication. Also back side coupling eliminates arcing across the gap when gap or parallel line coupling are used because no gap exists on the other side of the substrate. The gap is the thickness of the substrate, since the coupling lines are on the opposite side of the substrate than the resonators.

The main concept of back-side coupling is to couple the resonators from their back-sides through openings in the ground plane on the back side of the substrate and to use coplanar lines to transmit the radiofrequency power to the vicinity of the resonator. The coupling mechanism is the overlapping of the electromagnetic fields associated with the resonators and with the coupling circuits. In order to increase power handling capability, it is preferable to arrange the overlapping electromagnetic field in a large region. To do so, the coupling circuit may have a different size and shape, such as branched coplanar lines with different lengths and angles, with respect to the main coplanar line, and a gradually changing center line width.

The back-side coupling spreads the overlapping electromagnetic fields in a large region, which not only reduces the radiofrequency current density in the high temperature superconductor circuits resulting in a higher power handling capability, but also makes the coupling strength less dependent upon the variation of the circuit dimensions. This results in a much less strict manufacturing tolerance requirement for placement of the filter components (at least an order of magnitude compared to the front-side coupling) , which greatly eases the required tolerances for the coupling circuits. This invention further comprises combinations of front-side and back-side coupling in a high temperature superconductor filter, in which part of the coupling circuit is on the front-side, and the other part is on the back-side. The back-side coupling concept and circuits of the present invention can also be used for forming high temperature superconductor filter banks and multiplexers. In those cases, coplanar lines on the back-side are used for providing an ^"input connecting network, an output connecting network and intrachannel network coupling between the filters in the multiplexer. In addition, the individual filters within a multiplexer can employ back side coupling.

Because the interconnection network transmission lines handle the sum of the power of all individual filters, the high power handling capability of coplanar line with broader line width is more important for filter banks and multiplexers than for a single filter.

The high temperature superconductor thin film materials useful in the practice of this invention can include any superconductor with a T_c greater than 77°K. Preferably the material is selected from YBa₂Cu₃0₇, Tl₂Ba₂CaCu₂0₈, TlBa₂Ca₂Cu₃0₉, (TIPb) Sr₂CaCu₂0₇ and

(TIPb) Sr₂Ca₂Cu₃0c,. The substrate materials can be any dielectric material with close lattice match to the high temperature superconductor thin film deposited thereon and having a loss tangent of less than 0.0001. The substrate materials are commonly selected from LaA103, MgO, LiNb03, sapphire or quartz.

In the present invention the separate filter elements such as the resonators, and the input and output ports of a high temperature superconductor filter are coupled from the back-side, which is the ground plane of the filter circuit. The basic transmission line form for the back-side coupling is the coplanar line, in which the center line width can be chosen to satisfy the power handling requirement and at the same time to provide the required characteristic impedance. The coplanar line shares the ground plane with the resonator of the filter. As long as the above mentioned principles are followed, the configuration, shape, and the dimensions of a particular coupling circuit or its components, such as transmission lines or discontinuities around transmission lines, may vary. Some examples are given below. Figure 3 shows one^' embodiment of the present invention as a single mode 3-pole square shaped high temperature superconductor filter. Figure 3(a) shows the three square resonators, 32a, 32b, and 32c, located on the front-side of the substrate 30 having a discrete distance between them. Figure 3(c) shows the cross section of the circuit. The back-side of substrate 30 is coated with high temperature super¬ conductor film 31. The back-side coupling circuits are shown in Figure 3 (b) . The coupling circuit comprises two branched high temperature superconductor transmission lines in coplanar line form and inter¬ connecting transmission lines between the resonators in coplanar line form. Center transmission lines 34 and 34a along with the spacing 33 and 33a, each a discontinuity in the film of the ground plane around the perimeter of the transmission line, form the input and output coplanar lines. One end (at the edge of the substrate) of each of center line 34 and 34a is connected to the input or output port (not shown) . The other end of each of 34 and 34a is extended to form a T-shaped branch comprising branched transmission lines 35 and 35a. The purpose of the said T-shape branches is to spread the electromagnetic fields along a projection of the vertical side of resonators 32a and 32c shown by the dashed lines in Figure 3 (b) . The dashed lines are a projection of the outline or outer edge of the resonators and represent their electromagnetic fields since the resonators are located on the front-side of the substrate as shown in Figure 3 (a) . The back-side intersectional coupling is also achieved by coplanar lines formed by the center lines 37 and 37a and discontinuities 36 and 36a in the film of the ground plane. The coupling strength can be adjusted by varying the dimensions and the locations of 33, 33a, 34, 34a, 35, 35a, 36, 36a, 37, and 37a. To maximize coupling strength the discontinuities 33, 33a, 36 and 36a are adjacent to or overlap the projection Of the resonator edges to provide overlap of the electromagnetic fields of the coupling circuit and the resonators. In this particular case, the square high temperature superconductor resonators, 32a, 32b, and 32c are single mode with the radiofrequency current along the horizontal direction in Figure 3(a) . The other mode with the radiofrequency current along the vertical direction is not used. However, any parasitic coupling can couple to the vertical mode, which causes interference. To avoid such interference, the high temperature superconductor resonator can be designed in a rectangular shape to shift the resonant frequency of the vertical mode off the passing band (the desired bandwidth) .

Figure 4 shows another embodiment of the back¬ side coupled high temperature superconductor filter of the present invention. It is a dual mode 2-pole filter. Figure 4(a) shows the front side, in which the high temperature superconductor cut-corner square resonator 42 having a cut-corner 43 is deposited on the front side of substrate 40. As shown in Figure 4(c), a cross sectional view of the filter, the back side of substrate 40 is coated with high temperature superconductor film 41, which serves as the ground plane of the resonator. The back-side coupling circuits are shown in Figure 4 (b) and comprise two branched high temperature superconductor transmission lines. The coupling circuits include: input and output center lines 45 and 45a; discontinuities 44 and 44a in the film of the ground plane, and extended branch center lines 46 and 46a. All coupling circuits are in the coplanar line configuration. There are two modes in the dual mode resonator 42: one with horizontal radiofrequency current, the other with vertical current. The inter¬ sectional coupling in this particular case is provided by the cut-corner 43. The location of a projection of the outer edge of resonator 42 and the cut-corner 43 are indicated by the dashed lines in Figure 4 (b) . Again, the coupling strength of the back-side coupling can be adjusted by varying the location, the shape, and the dimensions of the coupling circuit elements, 44, 44a, 45, 45a, 46 and 46a. To maximize coupling strength the discontinuities 44 and 44a are adjacent to or overlap with the projection of the resonator edges to provide overlap of the electromagnetic fields of the coupling circuit and the resonator.

Figure 5 shows yet another embodiment of the back-side coupled high temperature superconductor filter of the present invention. In this particular case, it is a single mode round shaped 2-pole high temperature superconductor filter with two resonators 52a and 52b, deposited on the front side of the substrate 50 as shown in Figure 5 (a) . As shown in Figure 5 (b) , the back-side of substrate 50 is coated with high temperature superconductor film 51, which serves as the ground plane of the filter and has the patterned coupling circuits. The input and output coupling circuits are branched transmission lines in the coplanar configuration including the following parts: the center lines 54 and 54a; the discontinuities (in the film of the ground plane) 53 and 53a; and the extended branch center lines 55 and 55a. Note that, in this particular case, the branched lines 55 and 55a, are not straight lines but instead they are in a V-shape which is closer to the projection of the outer edges of the round shaped resonators 52a and 52b. Overlap of the electro¬ magnetic fields of the resonators and coupling circuit provide a stronger coupling. The interconnecting coupling is also in the coplanar line configuration including the center line 57 and the discontinuity 56 in the film of the ground plane. The projection of the resonators shape or outer edges is indicated by the dashed lines in Figure 5(b) . Figure 5(c) shows the cross-sectional view of the high temperature superconductor filter circuit showing high temperature superconductor film 51 coating the back side of substrate 50. At certain frequencies, the round shaped resonators also support dual modes similar to those in the square resonator. The single mode filter such as shown in Figure 5 utilizes only the mode with horizontal current because the possible parasitic coupling to the mode with vertical current also causes undesired interference. Such interference can be avoided by using elliptical shaped resonators to replace the round shaped ones to shift the resonant frequency of the interference mode off the passing band.

Figure 6 shows yet another embodiment of the back-side coupled high temperature superconductor filter of the present invention. In this particular case, it is a dual mode round shaped 2-pole high temperature superconductor filter. Figure 6(a) shows the front view of the filter circuit, in which a round shaped high temperature superconductor resonator 62 having a stub 63 located at a 45-degree angle relative to the vertical and the horizontal axes of the resonator plane is deposited on the surface of the substrate 60. The back-side of substrate 60 is coated with high temperature superconductor thin film 61 serving as the ground plane of the filter as shown in the cross-sectional view of the filter in Figure 6(c) . The back-side coupling circuits are shown in

Figure 6 (b) . The back-side coupling circuits are branched transmission lines in the coplanar configuration including the following parts: the center lines 65 and 65a; the discontinuities 64 and 64a in the film of the ground plane; and the extended branch center lines 66 and 66a. The projection of the outer edges of the resonator 62 with stub 63 is indicated by the dashed lines in Figure 6(b). In this particular case, the branched lines 66 and 66a, are in a curved shape which is closer to the projected edges of the round resonator, 62, to provide a stronger coupling. Again, the coupling strength can be adjusted by varying the location, shape, and the dimensions of the coupling circuit elements 65, 65a, 64, 64a, 66 and 66a.

Figure 7 shows the layout of an L-band single mode 2-pole high temperature superconductor filter of the present invention with back-side coupling circuits. Figure 7(a) shows the front view, in which two high temperature superconductor square resonators 73 and 73a are deposited on the front-side of the substrate 70. The back-side of substrate 70 is coated with high temperature superconductor film 71 and a metallic thin film 72 as shown in the cross-sectional view in Figure 7(c). Figure 7(b) shows the back view of the filter, in which the back-side coupling circuit comprising two branched transmission lines and an interconnecting transmission line are shown. The input and output coupling circuits include the following parts: center lines 74 and 74a; discontinuities 78 and 78a in the film of the ground plane; and extended branch lines 75 and 75a. The intersectional coupling circuit includes the center line 76 and the discontinuity 79 in the film of the ground plane. A metallic thin film 72, such as gold or silver, is deposited on top of a portion of the high temperature superconductor ground plane 71. The metallic film 72 has openings through which the elements of the coupling circuit are exposed, including elements 74, 74a, 75, 75a, 76, 78, 78a and 79. Metallic contacts 77 and 77a are deposited on the transmission lines 74 and 74a for bonding to the input and output connectors (not shown) . The purpose of the metallic film 72 on top of the high temperature superconductor film 71 is for soldering the filter to an outer enclosure case (not shown) . Figure 8 shows a metallic outer enclosure case for housing the filter shown in Figure 7. Figure 8(a) shows the front view of the case, in which 101 is the case body with three cut-through openings, 103, 103a and 103b. These cut-through openings are aligned to accomodate exposure of the back-side coupling circuit shown in Figure 7 (b) . The openings have a similar shape and slightly larger dimensions than the corresponding discontinuities in the ground plane of the filter circuit. Figure 8(b) shows the cross sectional view of the case. Holes 102 and 102a are for the input and output connectors, which are not shown in the figure. Openings 103, 103a and 103b are shown in cross section. Figure 9 depicts graphs showing the measured performance of the high temperature superconductor filter shown in Figure 7. Figure 9(a), Figure 9(b), and Figure 9(c) each show a graph of the amplitude of the measured S_llf S₂₂, and S₂₁, respectively, as functions of frequency at a low power level of 0.2 W. S_X1 is the reflecting response for a first port. S₂₂ is the reflecting response for a second port. S₂₁ is the transmitting response. Figure 9(d) shows a graph of the amplitude of the measured S₂₁ versus frequency at different power levels of 0.2 W, 7.3 W, 8.7 W and 10 W. The measured data show that the performance of the high temperature superconductor filter virtually does not change up to 10 watts, which indicates a significant power handling capability for such a compact planar high temperature superconductor filter. In fact, the 10 watts power level is limited by the enclosure case's thermal efficiency at the input interface and the power limit of the testing setup. The real power handling capability is believed to be even higher. Additional test data shows that this filter handles 22 watts at 77 K.

The back-side coupling circuits of the present invention can also be used for high temperature superconductor filter banks and multiplexers. A filter bank or a multiplexer comprises a series of filters in parallel with connecting network lines to link them. The back-side coupling circuits of the present invention not only can be used in high temperature superconductor filters but also can be used for interconnection among these filters.

Figure 10 shows an example of a back-side coupled high temperature superconductor multiplexer of the present invention. In this particular case, it is a

2-channel multiplexer or a diplexer having two channels of filters. Figure 10(a) shows the front view of the diplexer, _.wfadch includes two 4-pole single mode high temperature superconductor filters with two sets or channels of square high temperature superconductors resonators 92a and 92b on substrate 90. Figure 10(c) shows a cross sectional view of the diplexer having high temperature superconductor ground plane 91 deposited on substrate 90 on the side opposite to the resonators. Figure 10(b) shows the back view of the diplexer, in which high temperature superconductor thin film 91 serves as the ground plane with the multiplexer coupling circuits comprising an input connecting network, an output connecting network and an intrachannel network. The input connecting newtork connects between an input port (not shown) and a first resonator in each channel and includes the following parts: center line 93; branch interconnection center transmission lines 94a and 94b; branch coupling transmission lines 95a and 95b; and discontinuity 97 in the film of the ground plane around the perimeter of the transmission lines making up the input connecting network. The output connecting network is the same configuration as the input connecting network and includes corresponding parts 93d, 94e, 94f, 95e, 95f, and 97d. It connects between an output port (not shown) and a second resonator in each channel. The intrachannel network connects filters within a channel and includes the following parts: the center transmission lines 96a, and the discontinuities 98a in the film of the ground plane for the upper channel; the center transmission lines 96b, and the discontinuities 98b in the film of the ground plane for the lower channel. In this particular example, the input connecting network circuit is in a simple T-shape split configuration formed by parts 93, 94a, 94b, 95a, 95b and 97 at the input and the output connecting network circuit is in a T-shape configuration formed by parts 93d, 94e, 94f, 95e, 95f, and 97d at the output. The input matching or output matching is achieved by appropriately adjusting the locations and dimensions of these respective parts. The dashed lines represent a projection of the edges of the resonators deposited on the front side.

The invention is not restricted to this particular form. Figure 10(c) shows all of the input connecting network, output connecting network or intrachannel network located on the ground plane on the back side of the substrate. Alternatively one or more, but not all, of these networks can be located on the front side of the substrate. The invention further includes multiplexers comprised of a plurality of filters, each having back side coupling in whole or in part, aligned in parallel channels with the input connecting network, output connecting network, and intrachannel network each on the front side of the substrate. In this case the back side coupling is within the individual filter instead of within the networks of the multiplexer. The invention also includes high temperature superconductor filter banks or multiplexers of any configuration having filter coupling circuits or multiplexer networks, a portion of which is on the back-side of the substrate.

This invention also includes filters, filter banks, and multiplexers having a hybrid form of simultaneous back-side and front-side couplings, in which part of the coupling circuit or network is located on the front side, i.e., the same side of the substrate as the resonators, and the other part of the coupling circuit or network is located on the back-side, i.e., the side opposite of the resonator. Figure 11 shows two examples. Figure 11(a) shows the front view of a single mode 2-pole high temperature superconductor filter with 2 square high temperature superconductor resonators 82 and 82a, deposited on the front-side of the substrate 80. The back-side of substrate 80 is coated with high temperature superconductor film 81 as the ground plane as shown in the cross sectional view Figure 11 (d) . The filter has back-side T-shaped coplanar transmission lines 83 and 83a, for the input, and the output, respectively as shown in Figure 11 (b) .

But the interconnecting coupling between resonators has two possible versions: The first version is a front-side coupling as shown in Figure 11 (a) in which the interconnecting transmission line 84 is on the front-side of the substrate. No interconnecting transmission line is on the back-side. See Figure 11 (b) . In this version, the hybrid coupling means a combination of the back-side branched transmission lines for coupling to the input and output and a front side interconnecting transmission line for coupling between resonators. The second version is a hybrid coupling in which the interconnecting transmission line for coupling between resonators has both a front side element 84 as shown in Figure 11 (a) , and back-side elements center line 84a and discontinuity 85 as shown in Figure 11(c) . In this version, the hybrid coupling means a combination of back-side and front-side interconnecting transmission lines for coupling between resonators. The hybrid coupling circuits of the present invention include any planar high temperature superconductor filters, filter banks, or multiplexers containing a combination of back-side and front side coupling circuits and/or connecting networks in the coplanar line configuration.

The filters and multiplexers of the present invention are useful in microwave communication satellites, and in electronic systems for selecting and channeling radiofrequency signals, in particular in telecommunications systems.

Claims

WHAT IS CLAIMED IS:

1. An improved high temperature superconducting planar filter of the type having a) a substrate having a front side and a back side, b) at least two resonators, each comprising a patterned high temperature superconductor film deposited on the front side of the substrate, c) a ground plane comprising an high temperature superconductor film deposited on the back side of the substrate, and d) a coupling circuit comprising an input line coupled to one resonator, an output line coupled to the second resonator, and interconnecting lines coupling between resonators, wherein the improvement comprises a coupling circuit which is positioned at least partially on the back side of the substrate.

2. The filter of Claim 1 wherein the coupling circuit comprises a) a first branched high temperature superconductor transmission line in coplanar line form connected to the input line, b) a second branched high temperature superconductor transmission line in coplanar line form connected to the output line, and c) an interconnecting high temperature superconductor transmission line in coplanar line form between every two resonators, wherein i) at least one of the said transmission lines is located on the back side of the substrate, ii) a discontinuity exists in the high temperature superconductor film of the ground plane around a perimeter of each transmission line which is located on the back side of the substrate, and iii) electromagnetic fields of said coupling circuit and said resonator overlap by positioning said discontinuity adjacent to or overlapping with a projection onto the back side of the substrate of an outer edge of said resonator.

3. A filter of Claim 2 wherein all of said transmission lines are located on the back side of the substrate.

4. The filter of Claim 1 wherein the high temperature superconductor film is a superconductor having a T_c greater than about 77°K.

5. The filter of Claim 4 wherein the high temperature superconductor film is selected from the group consisting of YBa₂Cu₃0₇, Tl₂Ba₂CaCu₂0₈, TlBa₂Ca₂Cu₃0₉, (TlPb)Sr₂CaCu₂0₇ and (TIPb)Sr₂Ca₂Cu₃0₉.

6. The filter of Claim 1 wherein the substrate is a dielectric material lattice matched to the high temperature superconductor film deposited thereon and has a loss tangent of less than 0.0001.

7. The filter of Claim 6 wherein the substrate is selected from the group consisting of LaA10₃, MgO, LiNb0₃, sapphire or quartz.

8. The filter of Claim 2 wherein coupling strength can be varied by varying the dimension of the branched high temperature superconductor transmission line, the interconnecting transmission line, or the discontinuity around a transmission line.

9. The filter of Claim 2 wherein said branched transmission lines are configured to conform to the shape of a portion of the outer edge of the resonator to which it is coupled.

10. The filter of Claim 2 further comprising a) a metal film deposited on the ground plane, said film having openings through which each said branched high temperature superconductor transmission line and each said interconnecting transmission line are exposed, and b) a metal contact point deposited on each branched transmission line.

11. A multiplexer comprising a plurality of filters of Claim 1 aligned in parallel.

12. A multicomplexer comprising a) a substrate having a front side and a back side, b) at least two channels of resonators, each channel comprising a patterned high temperature superconductor film deposited on the front side of the substrate, c) a ground plane comprising a high temperature superconductor film deposited on the back side of the substrate, d) an input connecting network connected between a first resonator of each channel and an input port, an output connecting network connected between a second resonator of each channel and an output port, an intrachannel network connecting between resonators in a channel, each said network comprised of transmission lines, wherein i) said channels are connected in parallel, and ii) at least one of said connecting networks is on the back side of the substrate.

13. A multiplexer of Claim 12 wherein both the input connecting network and the output connecting network are on the back side of the substrate.

14. A multiplexer of Claim 12 wherein all networks are on the back side of the substrate.

15. The multiplexer of Claim 12 wherein the high temperature superconductor film is a superconductor having a T_c greater than about 77°K.

16. The multiplexer of Claim 15 wherein the high temperature superconductor film is selected from the group consisting of YBa₂Cu₃0₇, Tl₂Ba₂CaCu₂08, TlBa₂Ca₂Cu₃0₉, (TIPb) Sr₂CaCu₂0₇ and (TIPb)Sr₂Ca₂Cu₃0₉.

17. The multiplexer of Claim 12 wherein the substrate is a dielectric material which is lattice matched to the high temperature superconductor film deposited thereon and has a loss tangent of less than 0.0001.

18. The multiplexer of Claim 17 wherein the substrate is selected from the group consisting of LaA10₃, MgO, LiNb0₃, sapphire, or quartz.

19. A multiplexer of Claim 12 further comprising a) a metal film deposited on the ground plane, said film having openings through which each network is exposed and b) a metal contact point deposited on the input connecting network and the output connecting network.

20. A case for enclosing a filter or multiplexer comprising a case body of metal having openings aligned with back side circuit coupling elements of the filter or with back side network circuit coupling elements of the multiplexer.