EP0718906A1 - Stripline filter - Google Patents
Stripline filter Download PDFInfo
- Publication number
- EP0718906A1 EP0718906A1 EP95118894A EP95118894A EP0718906A1 EP 0718906 A1 EP0718906 A1 EP 0718906A1 EP 95118894 A EP95118894 A EP 95118894A EP 95118894 A EP95118894 A EP 95118894A EP 0718906 A1 EP0718906 A1 EP 0718906A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- stripline
- coupling
- filter according
- resonators
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/20327—Electromagnetic interstage coupling
Definitions
- the invention relates to a stripline filter according to the preamble of claim 1.
- the stripline resonators are usually coupled capacitively by galvanically isolating a surface from the surrounding mass on the base surface of the ceramic substrate, so that this surface forms a capacitance to a conductor track separated by the dielectric and arranged on top of the ceramic substrate.
- this capacitance depends on the ⁇ of the dielectric, the thickness of the substrate and the size of the area. Slight fluctuations in the position of the surface can, if this coupling capacity z. B. is needed to inject a microwave power in a power resonator, change the frequency of the detuned by the coupling resonator.
- the object of the present invention is therefore to produce a resonance-free resonator for a stripline filter at low cost, which has low resonance frequency tolerances even when coupled with other resonators for the production of corresponding filters, and is characterized by tightly tolerated coupling capacitances.
- FIG. 1 shows a ceramic substrate 1 on which two stripline resonators 2 are arranged. Coupling metal surfaces 3 are separated from the all-round ground metallization by a galvanic separation 4. On the surface of the ceramic substrate 1, on which the stripline resonators 2 are located, metal surfaces 5 are arranged, which are contacted with the coupling metal surfaces 3 with the aid of through holes 6, which are preferably metallized on the inside.
- the stripline filter is thus coupled in that the coupling metal surfaces 3, which are galvanically separated from the surrounding mass by the separating surfaces 4, are plated through to the other side of the ceramic substrate 1 and the capacitive coupling with the stripline resonators 2 takes place on the opposite side.
- the coupling is mainly determined by the spacing of the structures and not by the substrate thickness, which preferably consists of high-dielectric microwave ceramic.
- the substrate thickness which preferably consists of high-dielectric microwave ceramic.
- Through-contacting with the aid of the through holes 6 can significantly improve the adhesive strength of the coupling structure.
- the structure on the base area can be produced mechanically or by etching with significantly larger tolerances and thus possibly less effort will.
- the coupling can also be created by etching, the position of the photomask for the coupling capacitance being less critical.
- the line structures can either be produced using thick-film technology (screen printing with thick-film silver) or using thin-film technology (copper etched).
- Another possibility is to press the structure into the ceramic body before sintering.
- the resonance frequency is not or hardly influenced.
- the distance b between the stripline resonators 2 and the metal surfaces 5 of the coupling structure determines the size of the coupling capacitance.
- the capacitive coupling accomplishes the transformation of the low-impedance stripline resonator (typically 5 to 10 ⁇ ) to the adjustment to 50 or 75 ⁇ required in most applications.
- the distance a between the metal surfaces 5 of the coupling structure determines the size of the external coupling.
- the position of the two notches of the filter characteristic can be adjusted to suit the application by adjusting the capacitance.
- the filter created in this way is characterized by low insertion loss, high blocking selection and high or complete freedom from adjustment. It is also significantly flatter than a microwave ceramic filter that has comparable properties and consists of coupled coaxial resonators.
- FIG. 2 shows the stripline filter according to FIG. 1 in a side view.
- a further development of the two-pole filter described can consist in increasing the selection properties of the filter by adding further stripline resonators.
- the filter can be readjusted through housing slots or tuning tabs inserted into the slots.
- FIG. 3 which has an additional coupling capacitor 9, which additionally capacitively couples the coupling structures.
- Through-holes holes 12 or slots 13
- stripline resonator 2 has a reduced cross section in the area of the short-circuit side 10 (metal-free surface 8) or is widened in this area (additional metallization 7). In the first case there is an inductive and in the second a capacitive effect.
- the stripline resonators 2 are arranged continuously up to the metallization-free open side 11.
- Such filters with a broad side jump in the stripline resonators 2 are characterized in that the filter characteristic has an steepening to lower frequencies. If the broadside jumps are mirrored towards the open side 11, an increase in frequency can be achieved.
- the broad side jumps with capacitive effect are particularly characterized by the fact that the coupling is very reproducible, since the line jump leads to the outside.
- the broadside jump may also be designed such that one piece of the inner conductor is shifted against the other. This allows the emergency strike to be set additionally. Because this is an undercut this body can only be produced in the form described above, ie it cannot be pressed in one piece (monolithic).
- a ceramic lid is also to be installed, there is also the option of joining the lid in the pressed state with the green substrate and then sintering. This saves the work step required in the other case to demetallize the functionally necessary metallization-free surfaces or to keep them metallization-free.
- the stripline filter can be constructed asymmetrically to the extent that the ceramic substrate 1 is thicker than the ceramic cover. In this way, the unloaded quality of the resonators can be increased by up to 50%.
Abstract
Description
Die Erfindung betrifft ein Streifenleitungsfilter nach dem Oberbegriff des Patentanspruch 1.The invention relates to a stripline filter according to the preamble of claim 1.
Bei bekannten Streifenleistungsfiltern erfolgt die Ankopplung der Streifenleitungsresonatoren üblicherweise kapazitiv, indem auf der Grundfläche des Keramiksubstrats eine Fläche von der umgebenen Masse galvanisch getrennt wird, so daß diese Fläche zu einer durch das Dielektrikum getrennten oben auf dem Keramiksubstrat angeordneten Leiterbahn eine Kapazität bildet. Diese Kapazität ist nach der Plattenkondensatorformel abhängig vom ε des Dielektrikums, der Dicke des Substrates und der Größe der Flache. Geringe Schwankungen der Lage der Fläche können, wenn diese Ankopplungskapazität z. B. zur Injizierung einer Mikrowellenleistung in einem Leistungsresonator benötigt wird, die Frequenz des durch die Ankopplung verstimmten Resonators verändern.In known strip power filters, the stripline resonators are usually coupled capacitively by galvanically isolating a surface from the surrounding mass on the base surface of the ceramic substrate, so that this surface forms a capacitance to a conductor track separated by the dielectric and arranged on top of the ceramic substrate. According to the plate capacitor formula, this capacitance depends on the ε of the dielectric, the thickness of the substrate and the size of the area. Slight fluctuations in the position of the surface can, if this coupling capacity z. B. is needed to inject a microwave power in a power resonator, change the frequency of the detuned by the coupling resonator.
Zur Behebung dieser Schwierigkeiten waren bisher aufwendige Strukturierungsverfahren, Photolithograpie/Ätztechniken und hoch genaue Schlifftechniken bei der Substratherstellung erforderlich.In order to remedy these difficulties, complex structuring processes, photolithography / etching techniques and highly precise grinding techniques in the manufacture of the substrate were previously required.
Aufgabe der vorliegenden Erfindung ist es daher, einen nahezu abgleichfreien Resonator für ein Streifenleitungsfilter kostengünstig herzustellen, der auch bei Verkoppelung mit anderen Resonatoren zur Herstellung entsprechender Filter geringe Resonanzfrequenztoleranzen aufweist und sich durch engtolerierte Ankopplungskapazitäten auszeichnet.The object of the present invention is therefore to produce a resonance-free resonator for a stripline filter at low cost, which has low resonance frequency tolerances even when coupled with other resonators for the production of corresponding filters, and is characterized by tightly tolerated coupling capacitances.
Diese Aufgabe wird erfindungsgemäß mit einem Streifenleitungsfilter gelöst, das die im Patentanspruch 1 angegebenen Merkmale aufweist.This object is achieved with a stripline filter that has the features specified in claim 1.
Zweckmäßige Ausgestaltungen dieses Streifenleitungsfilters sind Gegenstand von Unteransprüchen.Appropriate configurations of this stripline filter are the subject of subclaims.
Die Erfindung wird im folgenden anhand von Ausführungsbeispielen näher erläutert.The invention is explained in more detail below on the basis of exemplary embodiments.
In der dazu gehörenden Zeichnungen zeigen
- Figur 1
- die Ansicht eines Streifenleitungsfilters,
Figur 2- eine Seitenansicht des Streifenleitungsfilters nach Figur 1 und
- Figur 3
- eine weitere Ausführungsform eines Streifenleitungsfilters in Draufsicht.
- Figure 1
- the view of a stripline filter,
- Figure 2
- a side view of the stripline filter of Figure 1 and
- Figure 3
- a further embodiment of a stripline filter in plan view.
In der Figur 1 ist ein Keramiksubstrat 1 dargestellt, auf dem zwei Streifenleitungsresonatoren 2 angeordnet sind. Ankopplungsmetallflächen 3 sind durch eine galvanische Trennung 4 von der allseitigen Massemetallisierung getrennt. Auf der Oberfläche des Keramiksubstrats 1, auf der sich die Streifenleitungsresonatoren 2 befinden, sind Metallflächen 5 angeordnet, die unter Zuhilfenahme von, vorzugsweise innen metallisierten, Durchgangslöchern 6 mit den Ankopplungsmetallflächen 3 kontaktiert sind. Die Ankopplung des Streifenleitungsfilters erfolgt somit dadurch, daß die durch die Trennflächen 4 galvanisch von der umgebenden Masse getrennten Ankopplungsmetallflächen 3 zur anderen Seite des Keramiksubstrats 1 durchkontaktiert sind und die kapazitive Kopplung mit den Streifenleitungsresonatoren 2 auf der gegenüberliegenden Seite erfolgt. Auch wenn das Bauelement durch diese Maßnahme geringfügig größer wird, wird die Kopplung hauptsächlich durch den Abstand der Strukturen bestimmt und nicht durch die Substratdicke, die vorzugsweise aus hochdielektrischer Mikrowellenkeramik besteht. Durch die Durchkontaktierung mit Hilfe der Durchgangslöcher 6 kann die Haftfestigkeit der Ankopplungsstruktur deutlich verbessert werden. Die Struktur auf der Grundfläche kann mechanisch oder ätztechnisch mit deutlich größeren Toleranzen und somit ggf. geringerem Aufwand hergestellt werden. Die Kopplung kann ebenfalls ätztechnisch erstellt werden, wobei die Lage der Fotomaske für die Koppelkapazität unkritischer ist.1 shows a ceramic substrate 1 on which two
Die Leitungsstrukturen können entweder in Dickschichttechnik (Siebdruck mit Dickschichtsilber) oder in Dünnschichttechnik (Kupfer geätzt) hergestellt werden.The line structures can either be produced using thick-film technology (screen printing with thick-film silver) or using thin-film technology (copper etched).
Eine andere Möglichkeit besteht darin, vor der Sinterung die Struktur in den Keramikkörper einzupressen. Bei Entfernung der Metallisierung an der Oberseite wird die Resonanzfrequenz nicht oder kaum beeinflußt.Another possibility is to press the structure into the ceramic body before sintering. When the metallization on the top is removed, the resonance frequency is not or hardly influenced.
Der Abstand b zwischen den Streifenleitungsresonatoren 2 und den Metallflächen 5 der Ankopplungsstruktur bestimmt die Größe der Ankoppelkapazität. Die kapazitive Kopplung bewerkstelligt die Transformation des niederohmigen Streifenleitungsresonators (typischerweise 5 bis 10 Ω) auf die in den meisten Anwendungen benötigte Anpassung auf 50 oder 75 Ω.The distance b between the
Der Abstand a zwischen den Metallflächen 5 der Ankopplungsstruktur bestimmt die Größe der externen Verkopplung. Über die Einstellung der Kapazität läßt sich die Lage der beiden Notches der Filtercharakteristik anwendungsgerecht einstellen.The distance a between the
Das derart entstandene Filter zeichnet sich durch niedrige Einfügungsdämpfung, hohe Sperrselektion und durch hohe oder vollständige Abgleichfreiheit aus. Es ist zudem deutlich flacher als ein in seinen Eigenschaften vergleichbares aus gekoppelten Koaxialresonatoren bestehendes Mikrowellenkeramikfilter.The filter created in this way is characterized by low insertion loss, high blocking selection and high or complete freedom from adjustment. It is also significantly flatter than a microwave ceramic filter that has comparable properties and consists of coupled coaxial resonators.
In der Figur 2 ist das Streifenleitungsfilter nach Figur 1 in Seitenansicht dargestellt.2 shows the stripline filter according to FIG. 1 in a side view.
Eine Weiterbildung des beschriebenen Zweipolfilters kann darin bestehen, durch Hinzufügen weiterer Streifenleitungsresonatoren die Selektionseigenschaften des Filters zu erhöhen.A further development of the two-pole filter described can consist in increasing the selection properties of the filter by adding further stripline resonators.
Es besteht ferner auch die Möglichkeit, flache Einzelresonatoren mit nur einem Streifenleitungsresonator herzustellen, die beispielsweise als frequenzbestimmende Komponente eines Oszillators (Bandpaßbeschaltung) oder als Bandsperre geschaltet als Notchfilter zur zusätzlichen Filterung von Störfrequenzen dienen können. Hierbei können die Leiterbahnen sehr schmal ausgeführt und somit höhere charakteristische Impedanzen hergestellt werden. Ein Oszillator läßt sich dann besser ziehen (höhere Güte).There is also the possibility of producing flat individual resonators with only one stripline resonator, which can be used, for example, as a frequency-determining component of an oscillator (bandpass circuit) or as a bandstop filter as a notch filter for additional filtering of interference frequencies. Here, the conductor tracks can be made very narrow and thus higher characteristic impedances can be produced. An oscillator is then easier to pull (higher quality).
Ferner ist es möglich, das Filter durch einen über der Oberseite angeordneten Bügel oder ein Gehäuse zu schirmen, die beispielsweise mit dem Keramiksubstrat 1 verlötet bzw. verklebt sind. Hierbei kann bei besonders hohen Anforderungen an die Frequenzgenauigkeit das Filter durch Gehäuseschlitze oder in die Schlitze eingefügte Abstimmlaschen nachjustiert werden.Furthermore, it is possible to shield the filter by means of a bracket or a housing arranged above the upper side, which are soldered or glued to the ceramic substrate 1, for example. In the case of particularly high demands on the frequency accuracy, the filter can be readjusted through housing slots or tuning tabs inserted into the slots.
Zur weiteren Miniaturisierung besteht zusätzlich die Möglichkeit, anstelle eines Abschirmbleches ein bis auf die dem Filter zugewandte Fläche metallisiertes Substrat auf das Grundsubstrat 1 zu montieren (Fügen durch Löten oder Kleben möglich).For further miniaturization, there is also the possibility, instead of a shielding plate, of mounting a substrate metallized down to the surface facing the filter on the base substrate 1 (joining by soldering or gluing possible).
Bei verschiedenen Anwendungen im Bereich schnurloser Telefone und Mobilfunk ist eine besonders hohe einseitige Versteilerung der Filtercharakteristik gewünscht, um Spiegelfrequenzen - oder bei Duplexerbetrieb das Nachbarband - gezielt zu unterdrücken. Hierfür ist in der Figur 3 ein Ausführungsbeispiel dargestellt, das einen zusätzlichen Koppelkondensator 9 aufweist, der die Ankopplungsstrukturen zusätzlich kapazitiv verkoppelt. Hierbei können Durchkontaktierungen (Löcher 12 oder Schlitze 13) zusätzlich zur Einstellung der Kopplung zwischen den Einzelresonatoren 2 verwendet werden. Beim Ausführungsbeispiel der Figur 3 ist im Bereich der Ankopplungsstruktur die offene Seite (metallisierungsfrei) 11 und gegenüberliegend die Kurzschlußseite 10.In various applications in the field of cordless telephones and mobile radio, a particularly high one-sided steepening of the filter characteristic is desired in order to specifically suppress image frequencies - or the neighboring band in duplex operation. For this purpose, an exemplary embodiment is shown in FIG. 3, which has an additional coupling capacitor 9, which additionally capacitively couples the coupling structures. Through-holes (
Eine weitere Möglichkeit zur einseitigen Verbesserung der Flankensteilheit besteht darin, eine Leitungsdiskontinuität in Form eines Breitseitensprunges in der Resonatorleitung 2 zu erzeugen. Dies geschieht dadurch, daß entweder der Streifenleitungsresonator 2 im Bereich der Kurzschlußseite 10 einen verminderten Querschnitt aufweist (metallfreie Fläche 8) oder in diesem Bereich verbreitert ist (zusätzliche Metallisierung 7). Im ersten Fall resultiert eine induktive und im zweiten eine kapazitive Wirkung.Another possibility for one-sided improvement of the slope is to create a line discontinuity in the form of a broad side jump in the
Hierbei besteht die Möglichkeit, die Ankopplung entweder über die in Figur 1 dargestellte Durchkontaktierung zu erreichen, oder eine direkt kapazitive Ankopplung (ohne Durchgangslöcher 6) vorzunehmen. Bei direkt kapazitiver Ankopplung sind die Streifenleitungsresonatoren 2 durchgehend bis zur metallisierungsfreien offenen Seite 11 angeordnet.Here, there is the possibility of achieving the coupling either via the plated-through hole shown in FIG. 1, or a direct capacitive coupling (without through holes 6). With direct capacitive coupling, the
Derartige Filter mit einem Breitseitensprung in den Streifenleitungsresonatoren 2 zeichnen sich dadurch aus, daß die Filtercharakteristik eine Versteilerung zu niedrigeren Frequenzen aufweist. Werden die Breitseitensprünge zur offenen Seite 11 hingespiegelt, kann eine Versteilerung zu höheren Frequenzen realisiert werden. Die Breitseitensprünge mit kapazitiver Wirkung (Vergrößerung der Abmessungen um die Fläche 7) zeichnen sich besonders dadurch zusätzlich aus, daß die Kopplung sehr gut reproduzierbar ist, da der Leitungssprung nach außen geführt ist.Such filters with a broad side jump in the
Der Breitseitensprung kann gegebenenfalls auch so ausgeführt sein, daß ein Stück des Innenleiters gegen das andere verschoben ist. Hiermit läßt sich die Notchlage zusätzlich einstellen. Da es sich hierbei um eine Hinterschneidung handelt, kann man diesen Körper nur in der vorher beschriebenen Form herstellen, d.h. er ist nicht in einem Stück (monolithisch) zu pressen.The broadside jump may also be designed such that one piece of the inner conductor is shifted against the other. This allows the emergency strike to be set additionally. Because this is an undercut this body can only be produced in the form described above, ie it cannot be pressed in one piece (monolithic).
Falls zusätzlich ein Keramikdeckel montiert werden soll, besteht auch die Mögichkeit, den Deckel im gepreßten Zustand mit dem ebenfalls grünen Grundsubstrat zu fügen und anschließend zu sintern. Man erspart sich dadurch den im anderen Fall notwendigen Arbeitsschritt, die funktional notwendigen metallisierungsfreien Flächen zu entmetallisieren bzw. metallisierungsfrei zu halten.If a ceramic lid is also to be installed, there is also the option of joining the lid in the pressed state with the green substrate and then sintering. This saves the work step required in the other case to demetallize the functionally necessary metallization-free surfaces or to keep them metallization-free.
Zur Minimierung der Einfügungsdämpfung und somit zur Reduktion der Verluste kann das Streifenleitungsfilter insofern unsymmetrisch aufgebaut werden, daß das Kermiksubstrat 1 dicker als der Keramikdeckel ist. Die unbelastete Güte der Resonatoren läßt sich auf diese Weise um bis zu 50 % steigern.To minimize the insertion loss and thus to reduce the losses, the stripline filter can be constructed asymmetrically to the extent that the ceramic substrate 1 is thicker than the ceramic cover. In this way, the unloaded quality of the resonators can be increased by up to 50%.
Claims (10)
dadurch gekennzeichnet,
daß die Ankoppelstrukturen (3 bis 6) dadurch gebildet sind, daß auf der die Streifenleitungsresonatoren (2) gegenüberliegenden Oberflächenseite durch galvanische Trennung (4) von der Massemetallisierung getrennte Ankopplungsmetallflächen (3) ausgebildet sind, daß auf der die Streifenleitungsresonatoren (2) tragenden Oberflächenseite von den Streifenleitungsresonatoren (2) galvanisch getrennte Metallflächen (5) vorgesehen sind und daß die Ankopplungsmetallflächen (3) und die Metallflächen (5) durch Durchgangslöcher (6) im Keramiksubstrat (1) galvanisch miteinander verbunden sind.Stripline filter with at least one stripline resonator (2) arranged on a surface side of a ceramic substrate (1), which has capacitive coupling structures (3 to 6) for coupling or coupling in an RF signal, and in which the ceramic substrate (1) with the exception of the end face with the coupling structures (3 to 6) and the surface side with the stripline resonators (2) has a metal metallization on all sides,
characterized,
that the coupling structures (3 to 6) are formed in that coupling metal surfaces (3) are formed on the surface side opposite the stripline resonators (2) by galvanic isolation (4) from the ground metal, that on the surface side of the stripline resonators (2) carrying the stripline resonators (2) are provided with galvanically separated metal surfaces (5) and that the coupling metal surfaces (3) and the metal surfaces (5) are galvanically connected to one another through through holes (6) in the ceramic substrate (1).
dadurch gekennzeichnet,
daß die Ankoppelkapazität zwischen den Ankoppelstrukturen (3 bis 6) und den Streifenleitungsresonatoren (2) durch einen Abstand (b) zwischen Ankoppelstrukturen (3 bis 6) und Streifenleitungsresonatoren (2) festgelegt sind.Stripline filter according to claim 1,
characterized,
that the coupling capacitance between the coupling structures (3 to 6) and the stripline resonators (2) is determined by a distance (b) between coupling structures (3 to 6) and stripline resonators (2).
dadurch gekennzeichnet,
daß die Größe der externen Verkopplung durch einen Abstand (a) zwischen den Metallflächen (5) festgelegt ist.Stripline filter according to claim 1 or 2,
characterized,
that the size of the external coupling is determined by a distance (a) between the metal surfaces (5).
dadurch gekennzeichnet,
daß durch hinzugefügte weitere Streifenleitungsresonatoren (2) die Selektionseigenschaften des Filters erhöht sind.Stripline filter according to one of Claims 1 to 3,
characterized,
that the selection properties of the filter are increased by the addition of further stripline resonators (2).
dadurch gekennzeichnet,
daß die Metallisierungsstrukturen mittels Dickschichttechnik (z. B. Siebdruck mit Dickschichtsilber) oder mittels Dünnschichttechnik (Kupfer, geätzt) hergestellt sind.Stripline filter according to one of Claims 1 to 4,
characterized,
that the metallization structures are produced by means of thick-film technology (e.g. screen printing with thick-film silver) or by means of thin-film technology (copper, etched).
dadurch gekennzeichnet,
daß die Metallisierungsstrukturen vor dem Sintervorgang in das Keramiksubstrat (1) eingepreßt sind.Stripline filter according to one of Claims 1 to 4,
characterized,
that the metallization structures are pressed into the ceramic substrate (1) before the sintering process.
dadurch gekennzeichnet,
daß die Ankopplungsstrukturen (3 bis 6) durch einen zusätzlichen Koppelkondensator (9) zusätzlich kapazitiv verkoppelt sind.Stripline filter according to one of Claims 1 to 6,
characterized,
that the coupling structures (3 to 6) are additionally capacitively coupled by an additional coupling capacitor (9).
dadurch gekennzeichnet,
daß in den Streifenleitungsresonatoren (2) eine Leitungsdiskontinuität in Form eines Breitseitensprungs (7, 8) angeordnet ist.Stripline filter according to one of Claims 1 to 7,
characterized,
that a line discontinuity in the form of a broad side jump (7, 8) is arranged in the stripline resonators (2).
dadurch gekennzeichnet,
daß über dem Keramiksubstrat (1) ein Keramikdeckel angeordnet ist.Stripline filter according to one of Claims 1 to 8,
characterized,
that a ceramic cover is arranged over the ceramic substrate (1).
dadurch gekennzeichnet,
daß das Keramiksubstrat (1) dicker als der Keramikdeckel ist.Stripline filter according to claim 9,
characterized,
that the ceramic substrate (1) is thicker than the ceramic cover.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4446103 | 1994-12-22 | ||
| DE4446103 | 1994-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0718906A1 true EP0718906A1 (en) | 1996-06-26 |
| EP0718906B1 EP0718906B1 (en) | 1999-05-12 |
Family
ID=6536790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP95118894A Expired - Lifetime EP0718906B1 (en) | 1994-12-22 | 1995-11-30 | Stripline filter |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5812037A (en) |
| EP (1) | EP0718906B1 (en) |
| AT (1) | ATE180107T1 (en) |
| DE (1) | DE59505908D1 (en) |
| DK (1) | DK0718906T3 (en) |
| ES (1) | ES2134398T3 (en) |
| GR (1) | GR3030890T3 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997050144A1 (en) * | 1996-06-27 | 1997-12-31 | E.I. Du Pont De Nemours And Company | Planar high temperature superconductor filters or multiplexers with backside coupling |
| DE19742971A1 (en) * | 1997-09-29 | 1999-04-22 | Siemens Matsushita Components | Stripline filter |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19652799C2 (en) * | 1996-12-18 | 1999-05-20 | Siemens Ag | Microwave filter |
| US6147576A (en) * | 1998-04-10 | 2000-11-14 | Ameramp Llc | Filter designs utilizing parasitic and field effects |
| JP2000252716A (en) * | 1999-03-03 | 2000-09-14 | Sony Corp | Distributed constant filter, its manufacture and distributed constant filter printed circuit board |
| US20040085165A1 (en) * | 2002-11-05 | 2004-05-06 | Yung-Rung Chung | Band-trap filter |
| DE10311041A1 (en) * | 2003-03-13 | 2004-10-07 | Kathrein-Werke Kg | High-frequency connection or high-frequency distribution network |
| US7411474B2 (en) * | 2005-10-11 | 2008-08-12 | Andrew Corporation | Printed wiring board assembly with self-compensating ground via and current diverting cutout |
| US7724109B2 (en) * | 2005-11-17 | 2010-05-25 | Cts Corporation | Ball grid array filter |
| US7940148B2 (en) * | 2006-11-02 | 2011-05-10 | Cts Corporation | Ball grid array resonator |
| WO2008063507A2 (en) * | 2006-11-17 | 2008-05-29 | Cts Corporation | Voltage controlled oscillator module with ball grid array resonator |
| US20090236134A1 (en) * | 2008-03-20 | 2009-09-24 | Knecht Thomas A | Low frequency ball grid array resonator |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4266206A (en) * | 1978-08-31 | 1981-05-05 | Motorola, Inc. | Stripline filter device |
| EP0429067A2 (en) * | 1989-11-20 | 1991-05-29 | Sanyo Electric Co., Ltd. | Band-pass filter using microstrip lines. |
| JPH0563405A (en) * | 1991-09-03 | 1993-03-12 | Tdk Corp | Dielectric substrate triplet strip line |
| US5248949A (en) * | 1991-03-13 | 1993-09-28 | Matsushita Electric Industrial Co., Ltd. | Flat type dielectric filter |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS623040A (en) * | 1985-06-25 | 1987-01-09 | Nippon Electric Glass Co Ltd | Glass for coating of semiconductor |
| JPH0334305U (en) * | 1989-08-14 | 1991-04-04 | ||
| DE4031536A1 (en) * | 1990-10-05 | 1992-04-16 | Rohde & Schwarz | MICROWAVE CONTROL |
| US5105175A (en) * | 1991-03-12 | 1992-04-14 | Motorola, Inc. | Resonant circuit element having insignificant microphonic effects |
| JPH0529817A (en) * | 1991-07-18 | 1993-02-05 | Matsushita Electric Ind Co Ltd | Lambda/4 type dielectric substance resonator |
-
1995
- 1995-11-30 DK DK95118894T patent/DK0718906T3/en active
- 1995-11-30 AT AT95118894T patent/ATE180107T1/en active
- 1995-11-30 DE DE59505908T patent/DE59505908D1/en not_active Expired - Lifetime
- 1995-11-30 EP EP95118894A patent/EP0718906B1/en not_active Expired - Lifetime
- 1995-11-30 ES ES95118894T patent/ES2134398T3/en not_active Expired - Lifetime
- 1995-12-18 US US08/573,728 patent/US5812037A/en not_active Expired - Lifetime
-
1999
- 1999-07-30 GR GR990401971T patent/GR3030890T3/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4266206A (en) * | 1978-08-31 | 1981-05-05 | Motorola, Inc. | Stripline filter device |
| EP0429067A2 (en) * | 1989-11-20 | 1991-05-29 | Sanyo Electric Co., Ltd. | Band-pass filter using microstrip lines. |
| US5248949A (en) * | 1991-03-13 | 1993-09-28 | Matsushita Electric Industrial Co., Ltd. | Flat type dielectric filter |
| JPH0563405A (en) * | 1991-09-03 | 1993-03-12 | Tdk Corp | Dielectric substrate triplet strip line |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 17, no. 378 (E - 1398) 15 July 1993 (1993-07-15) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997050144A1 (en) * | 1996-06-27 | 1997-12-31 | E.I. Du Pont De Nemours And Company | Planar high temperature superconductor filters or multiplexers with backside coupling |
| DE19742971A1 (en) * | 1997-09-29 | 1999-04-22 | Siemens Matsushita Components | Stripline filter |
| DE19742971C2 (en) * | 1997-09-29 | 1999-12-09 | Siemens Matsushita Components | Stripline filter |
Also Published As
| Publication number | Publication date |
|---|---|
| DK0718906T3 (en) | 1999-11-01 |
| ATE180107T1 (en) | 1999-05-15 |
| US5812037A (en) | 1998-09-22 |
| GR3030890T3 (en) | 1999-11-30 |
| ES2134398T3 (en) | 1999-10-01 |
| DE59505908D1 (en) | 1999-06-17 |
| EP0718906B1 (en) | 1999-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4757288A (en) | Ceramic TEM bandstop filters | |
| US5396201A (en) | Dielectric filter having inter-resonator coupling including both magnetic and electric coupling | |
| DE4291076C2 (en) | Mounting socket for attaching a dielectric filter and method for attaching a dielectric filter on a support | |
| DE69736617T2 (en) | Dielectric laminated band elimination filter with electromagnetic coupling between resonators | |
| DE19923476C2 (en) | Chip-shaped piezoelectric resonator and method for adjusting its resonance frequency | |
| EP0718906B1 (en) | Stripline filter | |
| DE4030763C2 (en) | Dielectric filter | |
| DE10042229A1 (en) | Electrical component, method for its production and its use | |
| DE69729030T2 (en) | Dielectric multilayer device and associated manufacturing process | |
| DE2707176C3 (en) | Resonance circuit formed using stripline technology | |
| KR920002029B1 (en) | Dielectric filter and a method of manufacture thereof | |
| DE10015582B4 (en) | The antenna device | |
| US5278527A (en) | Dielectric filter and shield therefor | |
| EP0154703B1 (en) | Resonator | |
| DE19857062B4 (en) | Method of making a dielectric filter | |
| US4745379A (en) | Launcher-less and lumped capacitor-less ceramic comb-line filters | |
| DE3326629C2 (en) | ||
| EP0957529B1 (en) | Method for tuning the resonance frequency of a ring resonator | |
| GB2256973A (en) | Method of adjusting a frequency response in a microwave strip-line filter device. | |
| DE2714181A1 (en) | Microwave filter with resonators in interdigital structure - has additional resonators before and after input and output resonators to give additional finite frequency attenuation peak | |
| US5859575A (en) | Dielectric filter | |
| US20070146098A1 (en) | Compact printed filters with self-connected LC resonators | |
| JPH0342722Y2 (en) | ||
| EP0293678A1 (en) | High frequency coil | |
| KR100213374B1 (en) | Small dielectric filter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LI LU NL PT SE |
|
| 17P | Request for examination filed |
Effective date: 19960719 |
|
| 17Q | First examination report despatched |
Effective date: 19971127 |
|
| GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
| GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
| GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
| GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LI LU NL PT SE |
|
| REF | Corresponds to: |
Ref document number: 180107 Country of ref document: AT Date of ref document: 19990515 Kind code of ref document: T |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: SIEMENS SCHWEIZ AG Ref country code: CH Ref legal event code: EP |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: GERMAN |
|
| REF | Corresponds to: |
Ref document number: 59505908 Country of ref document: DE Date of ref document: 19990617 |
|
| ET | Fr: translation filed | ||
| GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 19990707 |
|
| ITF | It: translation for a ep patent filed |
Owner name: STUDIO JAUMANN P. & C. S.N.C. |
|
| REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2134398 Country of ref document: ES Kind code of ref document: T3 |
|
| REG | Reference to a national code |
Ref country code: DK Ref legal event code: T3 |
|
| REG | Reference to a national code |
Ref country code: PT Ref legal event code: SC4A Free format text: AVAILABILITY OF NATIONAL TRANSLATION Effective date: 19990812 |
|
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed | ||
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: E. BLUM & CO. PATENTANWAELTE |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: IF02 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: SE Payment date: 20021031 Year of fee payment: 8 Ref country code: NL Payment date: 20021031 Year of fee payment: 8 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DK Payment date: 20021101 Year of fee payment: 8 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: PT Payment date: 20021107 Year of fee payment: 8 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GR Payment date: 20021113 Year of fee payment: 8 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IE Payment date: 20021118 Year of fee payment: 8 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: LU Payment date: 20021119 Year of fee payment: 8 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20021127 Year of fee payment: 8 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 20021204 Year of fee payment: 8 Ref country code: BE Payment date: 20021204 Year of fee payment: 8 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031130 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031130 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031130 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031201 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031201 Ref country code: ES Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031201 Ref country code: DK Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031201 |
|
| BERE | Be: lapsed |
Owner name: *SIEMENS MATSUSHITA COMPONENTS G.M.B.H. & CO. K.G. Effective date: 20031130 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040531 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040601 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040603 |
|
| REG | Reference to a national code |
Ref country code: DK Ref legal event code: EBP |
|
| GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20031130 |
|
| NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 20040601 |
|
| EUG | Se: european patent has lapsed | ||
| REG | Reference to a national code |
Ref country code: PT Ref legal event code: MM4A Free format text: LAPSE DUE TO NON-PAYMENT OF FEES Effective date: 20040531 |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
| REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20031201 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20051130 |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PFA Owner name: SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG Free format text: SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG#BALANSTRASSE 73#81541 MUENCHEN (DE) -TRANSFER TO- SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG#BALANSTRASSE 73#81541 MUENCHEN (DE) |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20141120 Year of fee payment: 20 Ref country code: CH Payment date: 20141120 Year of fee payment: 20 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20141118 Year of fee payment: 20 Ref country code: AT Payment date: 20141119 Year of fee payment: 20 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R071 Ref document number: 59505908 Country of ref document: DE |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
| REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK07 Ref document number: 180107 Country of ref document: AT Kind code of ref document: T Effective date: 20151130 |