EP0697474B1 - Containing apparatus for electronic parts - Google Patents
Containing apparatus for electronic parts Download PDFInfo
- Publication number
- EP0697474B1 EP0697474B1 EP19940305582 EP94305582A EP0697474B1 EP 0697474 B1 EP0697474 B1 EP 0697474B1 EP 19940305582 EP19940305582 EP 19940305582 EP 94305582 A EP94305582 A EP 94305582A EP 0697474 B1 EP0697474 B1 EP 0697474B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrically
- container
- conducting
- electronic parts
- μinches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009713 electroplating Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 description 15
- 239000003792 electrolyte Substances 0.000 description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001668 ameliorated effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
- C25D17/20—Horizontal barrels
Definitions
- the present invention relates to a containing apparatus for electronic parts, and particularly to an electronic part container used in an electroplating process, whereby bending of lead wires of an electronic part may be prevented during the electroplating operation and the deposition thickness is relatively even, and what is more the apparatus is capable of being incorporated into an automatic production line so as to enhance production efficiency and prevent hazards induced by manual operation.
- the conventional apparatus is provided with a plurality of tanks "A" and a metal piece such as tin, lead, copper, silver, and the like, serving as an anode.
- the electrically-conducting shaft is provided with a plurality of electrically-conducting rings "D'" so as to avoid collisions between electronic parts in the rolling barrel.
- the bending problem still cannot be solved effectively. This is because electronic parts are randomly disposed in the rolling barrel "C” of the apparatus.
- the space inside the barrel "C” is relatively large, the chance of collision between electronic parts during the electroplating operation is very high. As a result, close to the ends of an electronic part the lead wires will suffer from being bent, and then the bent leads must be straightened manually. Consequently, human resources are wasted.
- the conventional apparatus has the following disadvantages:
- the present invention provides a containing apparatus as defined in claim 1.
- the plurality of spikes enhance the probability of contact between the electronic parts and the cathode.
- the electronic parts have their lead wires kept from being bent so as to eliminate the necessity of straightening bent wires.
- the containers are each positioned substantially tangential to the shaft so the fluidity of electrolyte is increased and hence the uniformity of the electroplating thickness is easily achieved.
- the containers are preferably so spacious that the electronic parts therein will not crowd together, so the coating on the surface of the electronic part is complete, namely it is of better quality.
- the containing apparatus 1 of the present invention for electronic parts mainly comprises a rotating cage 4 and a plurality of electronic part containers 2.
- Each of the connecting seats 42 comprises a guiding slot 45 for guiding and receiving the respective electronic part container 2 therein and a knob 43 for fixing the container 2 in the guiding slot 45.
- the containers 2 are arranged in a tangential direction.
- the rotating cage 4 is provided with a plurality of connecting seats 42 which are substantially tangential to a rotation axis (as indicated by phantom line 41') thereof. By the provision of the connecting seats 42, the rotating cage 4 is able to receive containers 2.
- the connecting seat 42 is further provided with an electrically-conducting copper piece 44 which is capable of being in contact with electrically-conducting copper pieces on two ends of the container 2 so as to form a current path.
- the rotating cage 4 is connected to the conventional actuating rod "F" so as to move around in the tank "A".
- the container 2 takes the form of a thin rectangular box.
- the thin box 2 is provided with a plurality of baffle plates 22 which are evenly spaced so as to define a plurality of compartments 21.
- Spikes are provided on the side walls of each compartment 21 so as to form spiky walls 23 made of electrically-conducting material.
- the spiky walls 23 are connected to the electrically-conducting copper pieces 24 on the two ends of the container 2.
- the container 2 has a cap 25 which is able to keep electronic parts therein from dropping out.
- the cap 25 has a liquid-permeable screen 26 thereon and the bottom of the container 2 is also liquid-permeable. By means of the water-permeable characteristics of the container 2, the electrolyte is easily circulated.
- each electronic part 3 is perpendicular to the spiky walls such that the lead wires of each electronic part are able to contact with the spiky walls 23. Since the orientation of every electronic part 3 is the same, and no collision with another occurs, the lead wires 31 of the electronic parts 3 will be almost clear of risk of being bent. Furthermore, the probability of contact between the electronic parts and the cathode is greatly increased.
- the electroplating apparatus of the present invention is able to achieve the following advantages:
- the present invention makes the thickness of the zone L.C.D. and that of the H.C.D. zone almost equal. Therefore, the quality of the electronic part can be improved.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Packaging Frangible Articles (AREA)
Description
Thickness | Alloy proportion (percentage of tin in a tin-lead alloy) | |
H.C.D. | Average: 14.03 µm (552.5 µinches) | 83.5% |
STD. DEV (statistical error value: 4.87 µm (191.9 µinches) | 0.9 | |
MAX. Value: 21.41µm (882.6 µinches) | 85.1% | |
MIN. Value: 7.77 µm (305.9 µinches) | 82.3% | |
Range: 14.65 µm (576.7 µinches) | 2.8 | |
STD.DEV=standard deviation |
Thickness | Alloy proportion (percentage of tin in a tin-lead alloy) | |
L.C.D. | Average: 6.66 µm (262.2 µinches) | 86.6% |
STD.DEV: 3.43 µm (135.0 µinches) | 3.4 | |
MAX. Value: 13.18 µm (518.9 µinches) | 94.3% | |
MIN. Value: 0.82 µm (32.6 µinches) | 82.8% | |
Range: 12.35 µm (486.3 µinches) | 11.5 | |
STD.DEV=standard deviation |
Thickness | Alloy proportion (percentage of tin in a tin-lead alloy) | |
M.C.D. | Average: 10.41 µm (410.0 µinches) | 82.3% |
STD.DEV: 7.67 µm (119.0 µinches) | 1.0 | |
MAX. Value: 14.71µm (579.2 µinches) | 83.5% | |
MIN. Value: 6.56 µm (258.2 µinches) | 88.9% | |
Range: 8.15 µm (321.0 µinches) | 2.6 | |
STD.DEV=standard deviation |
Thickness | Alloy proportion (percentage of tin in a tin-lead alloy) | |
H.C.D. | Average: 11.43 µm (450.5 µinches) | 88.6% |
STD. DEV (statistical error value: 6.99 µm (275 µinches) | 3.3 | |
MAX. Value: 30.48 µm (1200 µinches) | 93.8% | |
MIN. Value: 5.08 µm (200 µinches) | 80.9% | |
Range: 24.9 µm (980 µinches) | 12.9 | |
STD.DEV=standard deviation |
Thickness | Alloy proportion (percentage of tin in a tin-lead alloy) | |
M.C.D. | Average: 12.14 µm (478 µinches) | 84.2% |
STD.DEV: 4.32 µm (170 µinches) | 1.1 | |
MAX. Value: 23.37 µm (920 µinches) | 86.4% | |
MIN. Value: 5.72 µm (225 µinches) | 82.2% | |
Range: 17.78 µm (700 µinches) | 4.2 | |
STD.DEV=standard deviation |
Thickness | Alloy proportion (percentage of tin in a tin-lead alloy) | |
L.C.D. | Average: 10.29 µm (405 µinches) | 86.4% |
STD.DEV: 3.81 µm (150 µinches) | 1.5 | |
MAX. Value: 18.8 µm (740 µinches) | 90.01% | |
MIN. Value: 3.81µm (150 µinches) | 83.2% | |
Range: 15.24 µm (600 µinches) | 6.8 | |
STD.DEV=standard deviation |
Claims (3)
- A containing apparatus for electronic parts (3) used in an electroplating process which is disposed in a tank (A) comprising:-a rotating cage (4) capable of moving around in the tank and having a plurality of connecting seats (42), each of said connecting seats having thereon an electrically-conducting piece (44) and being tangent to a central axis (41') of said rotating cage; anda plurality of containers (2) each having a respective electrically-conducting piece (24) provided on the two ends of said container to contact said electrically-conducting piece (44) of said rotating cage (4) when each of said containers (2) is received in a respective said connecting seat (42), each said container having a thin box having each end provided with an electrically-conducting copper piece and a screen provided thereon as a cap, and being received in said rotating cage, the bottom of said box including a bottom screen (26);
said thin box has a plurality of baffle plates (22) which are so placed that a plurality of compartments (21) are formed therein, and in that each of said compartments has two side walls which are provided with a plurality of electrically-conducting spikes (23) so as to form an electrically-conducting spiky wall on each of said ends, each of said spiky walls being respectively in contact with each of said electrically-conducting copper pieces (24) of said box. - A container as claimed in claim 1, wherein said rotating cage has a plurality of guiding slots (45), each capable of receiving a said container and provided with a said electrically-conducting piece (44)of copper, and wherein a knob is provided at the open end of said guiding slots.
- A container as claimed in claim 1 or 2, wherein each spike (23) of said spiky walls is in the shape of a pyramid, and said spikes are not in contact with one another.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES94305582T ES2114661T3 (en) | 1994-07-28 | 1994-07-28 | CONTAINER DEVICE FOR ELECTRONIC PARTS. |
DE1994608312 DE69408312T2 (en) | 1994-07-28 | 1994-07-28 | Receptacle for electronic parts |
EP19940305582 EP0697474B1 (en) | 1994-07-28 | 1994-07-28 | Containing apparatus for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19940305582 EP0697474B1 (en) | 1994-07-28 | 1994-07-28 | Containing apparatus for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0697474A1 EP0697474A1 (en) | 1996-02-21 |
EP0697474B1 true EP0697474B1 (en) | 1998-01-28 |
Family
ID=8217786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19940305582 Expired - Lifetime EP0697474B1 (en) | 1994-07-28 | 1994-07-28 | Containing apparatus for electronic parts |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0697474B1 (en) |
DE (1) | DE69408312T2 (en) |
ES (1) | ES2114661T3 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1367567A (en) * | 1917-03-03 | 1921-02-08 | Harry A Sedgwick | Electroplating-machine |
US1335177A (en) * | 1918-09-18 | 1920-03-30 | Copper Products Company | Electrolytic method and apparatus |
FR2038654A5 (en) * | 1969-03-21 | 1971-01-08 | Savy Sife | Current connector for the drum of an - electrolysis vat |
-
1994
- 1994-07-28 EP EP19940305582 patent/EP0697474B1/en not_active Expired - Lifetime
- 1994-07-28 DE DE1994608312 patent/DE69408312T2/en not_active Expired - Fee Related
- 1994-07-28 ES ES94305582T patent/ES2114661T3/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ES2114661T3 (en) | 1998-06-01 |
DE69408312T2 (en) | 1998-08-20 |
DE69408312D1 (en) | 1998-03-05 |
EP0697474A1 (en) | 1996-02-21 |
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