CN210765485U - Pan tray for electron beam evaporation - Google Patents

Pan tray for electron beam evaporation Download PDF

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Publication number
CN210765485U
CN210765485U CN201921686788.0U CN201921686788U CN210765485U CN 210765485 U CN210765485 U CN 210765485U CN 201921686788 U CN201921686788 U CN 201921686788U CN 210765485 U CN210765485 U CN 210765485U
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CN
China
Prior art keywords
electron beam
wall portion
pan
beam evaporation
lateral wall
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201921686788.0U
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Chinese (zh)
Inventor
叶小兵
孔德兴
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Zhangjiagang Zc Opti Technology Co ltd
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Zhangjiagang Zc Opti Technology Co ltd
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Priority to CN201921686788.0U priority Critical patent/CN210765485U/en
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Publication of CN210765485U publication Critical patent/CN210765485U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a pot dish for electron beam coating by vaporization, it is including trying to get to the heart of a matter and lateral wall portion, and lateral wall portion is truncated back taper, and the external diameter that also is the top edge of lateral wall portion is greater than the external diameter of lower limb, and lateral wall portion from the top down is provided with the sunken charging chute of vertical axis that a plurality of orientations are used for the pot dish of electron beam coating by vaporization to the vertical axis direction slope that is close to the pot dish that is used for the electron beam coating by vaporization gradually on the lateral surface of lateral wall portion. The utility model discloses a pan still includes the material shielding part of being connected with the top edge of lateral wall portion, and the material shielding part includes that the material that from the bottom up set up to the vertical axis slope that is close to the pan that is used for the electron beam coating by vaporization shelters from domaticly. Utilize the utility model discloses a can effectively reduce the coating film volume that drops from the pot dish when pot dish carries out the electron beam coating by vaporization and can avoid the coating film card in the middle of pot dish and EBG and influence the pot dish and rotate, therefore guaranteed better coating by vaporization coating film effect.

Description

Pan tray for electron beam evaporation
Technical Field
The utility model relates to a coating device technical field, concretely relates to pot dish for electron beam coating by vaporization.
Background
Electron Beam Evaporation (Electron Beam Evaporation) is a physical vapor deposition film forming method in which a film material to be evaporated is bombarded by high-energy electrons to be melted and evaporated so as to be deposited on the surface of an object. The film material after electron beam evaporation has higher precision and purity. SiO 22As a low refractive index material which is most commonly used in the coating industry, the material has the advantages of low price, simple processing technology and stable performance, thereby SiO2The coating is applied to evaporation coating materials of various products.
Currently, SiO is commonly used2Particle and quartz ring for SiO2Coating film of the film layer by evaporation, in the process of using SiO2When performing electron beam evaporation coating, firstly, SiO is2The raw materials are placed in a pot plate, and an electron evaporation gun (EBG) is used for carrying out SiO treatment in the rotating process of the pot plate2Bombardment is performed. To ensure SiO2The deposition effect of (2) is usually required to be as small as possible, preferably not more than 2mm, from the electron beam deposition gun (EBG) to the pan. However, SiO is very likely to occur during the evaporation process2The steel wire rope is bounced out of the pot plate and falls off, and is clamped between the EBG and the pot plate, so that the pot is very easy to clamp, and the film coating effect is greatly influenced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects, the utility model aims to provide a pot plate which is not easy to clamp the pot and is used for electron beam evaporation.
The utility model discloses a pot dish for electron beam coating by vaporization is including trying to get to the heart of a matter and lateral wall portion, the internal diameter of the upper edge of lateral wall portion is greater than the internal diameter of lower limb, lateral wall portion from the top down is gradually to being close to the vertical axis direction slope of a pot dish for electron beam coating by vaporization be provided with the orientation on the lateral surface of lateral wall portion the sunken blanking groove of vertical axis of a pot dish for electron beam coating by vaporization, the middle part of trying to get to the heart of a matter is provided with the bellied boss that makes progress the boss with be provided with the material holding tank that is used for placing the filmforming material in the. The utility model discloses an external diameter dimension of the lower limb of the lateral wall portion of pot dish for electron beam coating by vaporization is less than the external diameter dimension of upper limb and lateral wall portion from the top down slope to the vertical axis direction of pot dish gradually, therefore, also can drop fast along the lateral wall of lateral wall portion after the card goes into the membrane material between lateral wall portion and EBG, through the utility model discloses a set up the blanking groove on the lateral wall portion of pot dish for electron beam coating by vaporization for jump out the coating by vaporization membrane material that drops in the pot dish and get into the blanking groove, and rotate and in time drop along with the pot dish, can not block in the middle of pot dish and EBG and obstruct the rotation of pot dish.
Furthermore, the number of the charging chutes is at least one, the charging chutes are sequentially arranged on the outer surface of the side wall part along the circumferential direction of the outer surface, the distance between the chute wall and the chute bottom of the charging chute close to the upper edge of the side wall part is larger than the distance between the chute wall and the chute bottom of the charging chute close to the lower edge of the side wall part, and the chute wall of the charging chute inclines from top to bottom towards the longitudinal central axis close to the pan tray for electron beam evaporation. Therefore, the depth of the groove body of the charging chute is gradually reduced from top to bottom, so that more falling film materials can be accommodated at the position close to the upper edge of the side wall part at the upper end of the charging chute, and the film materials can smoothly fall off when the pan rotates.
Further, a lower edge of at least one of the charging chutes is disposed along a lower edge of an outer side wall of the side wall portion. Therefore, for the film material with larger particles, the film material can gradually fall from top to bottom in the charging chute in the rotation process of the pan, and the pan and the EBG cannot be clamped.
Further, the charging chute is at least one spiral groove formed in the outer surface of the side wall portion, an upper notch of the charging chute is located at the upper edge of the pan for electron beam evaporation, and a lower notch of the charging chute is located at the lower edge of the pan for electron beam evaporation. The feeding groove is arranged to be spiral, so that the membrane material is easier to drop in the rotating process of the pan and is not clamped.
Further, the upper surface of the boss does not exceed the height of the upper edge of the side wall portion.
Further, still include with the material shielding part that the top edge of lateral wall portion is connected, material shielding part includes from the bottom up and is close to the material that is used for the slope of the slope setting of the vertical axis of the pot dish of electron beam coating by vaporization. Therefore, the amount of the membrane material falling out of the pan can be effectively reduced by intercepting the material shielding slope.
Furthermore, the material shielding part further comprises a material rolling part arranged along the upper edge of the material shielding slope, and the material rolling part is obliquely arranged from top to bottom far away from the longitudinal central axis of the pan for electron beam evaporation. The material rolls the guide effect that the portion can play the material of jumping out the pot dish for the membrane material can drop under the effect that the material rolled the portion and roll the top edge department that falls to the lateral wall portion of pot dish and then drop to the charging chute on the material shelters from domaticly and from it on the material.
Furthermore, a plurality of material rolling grooves extending to the upper edge of the side wall part are formed in the material shielding slope surface. Therefore, the material rolling groove can prevent the film materials falling on the material shielding slope from splashing around and rolling down orderly along the material rolling groove.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of the present invention;
fig. 2 is a schematic structural view of a material shielding portion according to a first embodiment of the present invention;
fig. 3 is a schematic perspective view of a second embodiment of the present invention.
In the figure:
1-plate bottom, 11-boss, 2-side wall part, 3-charging chute, 4-material holding tank, 5-material shielding part, 51-material shielding slope, 52-material rolling part and 53-material rolling chute.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
The first embodiment is as follows:
referring to fig. 1, the pan for electron beam evaporation according to the present embodiment includes a pan bottom 1 and a side wall portion 2, the side wall portion 2 is a truncated inverted cone as a whole, that is, the outer diameter of the upper edge of the side wall portion 2 is greater than the outer diameter of the lower edge, the side wall portion 2 is inclined from top to bottom toward the longitudinal central axis of the pan for electron beam evaporation, a plurality of material receiving grooves 3 recessed toward the longitudinal central axis of the pan for electron beam evaporation are sequentially disposed on the outer side surface of the side wall portion, a boss 11 protruding upward is disposed in the middle of the pan bottom 1, a material receiving groove 4 for receiving a film material is disposed between the boss 11 and the side wall portion 2, the upper surface of the boss 11 does not exceed the height of the upper edge of the side wall portion 2, and thus the film material can be.
The distance of the cell wall and the tank bottom of the charging chute that is close to the upper edge of lateral wall portion of charging chute 3 is greater than the distance of the cell wall and the tank bottom of the charging chute that are close to the lower edge of lateral wall portion, and the cell wall from the top down of charging chute 3 is close to the vertical axis slope that is used for the pan of electron beam coating by vaporization, therefore the membrane material that drops in the pan from can drop fast through charging chute 3 and can not block in the middle of pan and EBG, can not influence the pan rotation.
The lower edge of at least one of the charging chutes 3 in this embodiment is disposed along the lower edge of the outer side wall of the side wall part 2, so that the film material with larger particles can rapidly fall therefrom, while the film material with a smaller volume can fall along with the rotation of the pan at the other charging chute 3. The opening direction of each charging chute 3 in this embodiment is set in a direction perpendicular to the tray bottom 1, and it may also be set in a direction having a certain inclination angle with the tray bottom 1. The opening widths of the charging chutes 3 can be the same or different according to requirements.
A material barrier 5 is also provided along the upper edge of the side wall portion 2, thereby further reducing the amount of film material that falls from the pan. Referring to fig. 2, the material blocking portion 5 includes a material blocking slope 51 and a material falling portion 52. The material shelters from domatic 51 from the bottom up and is close to the utility model discloses a vertical axis slope setting of coating by vaporization pot dish, therefore, the material shelters from domatic 51 can effectively block the membrane material of jumping out from lateral wall portion 2 top edge, restricts the membrane material in material holding tank 4. The material rolls the top edge setting that the portion 52 sheltered from domatic 51 along the material, the material rolls the portion 52 from the top down and sets up to keeping away from the vertical axis slope that is used for the pot dish of electron beam evaporation plating, the lower limb of material roll the portion 52 is located the top that the material sheltered from domatic 51, the material rolls the portion 52 and the material shelters from domatic 51 junction is the convex arc of upwards salient, therefore, the material that jumps out in following the pot dish rolls down along the upper surface that the material sheltered from domatic 51 and drops through silo 3 through material roll the portion 52.
As a preferred embodiment of the present invention, a plurality of material rolling grooves 53 are provided on the material shielding slope 51, the material rolling grooves 53 extend toward the edge of the side wall portion 2 and can communicate with the upper notch of the charging chute 3 on the side wall portion 2, so that the film material jumping out of the pan can be orderly rolled and discharged through the charging chute 3 under the guidance of the material rolling grooves 53 without being stuck between the pan and the EBG.
Example two:
referring to fig. 3, the pan for electron beam evaporation in the present embodiment is different from the first embodiment in that the charging chute 3 is a plurality of spiral grooves formed on the outer surface of the sidewall portion 2, the upper notch of the charging chute 3 is opened at the upper edge of the pan, and the lower notch of the charging chute 3 is opened at the lower edge of the pan, so that the material falling through the material falling portion 52 can slowly fall along the charging chute 3 during the rotation of the pan without being clamped between the pan and the EBG.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims (8)

1. The utility model provides a pot dish for electron beam coating by vaporization, includes a dish bottom and lateral wall portion, its characterized in that, the external diameter of the upper limb of lateral wall portion is greater than the external diameter of lower limb, lateral wall portion from the top down is gradually to being close to the vertical axis direction slope of pot dish for electron beam coating by vaporization be provided with the orientation on the lateral surface of lateral wall portion the sunken blanking groove of vertical axis of pot dish for electron beam coating by vaporization, the middle part of dish bottom is provided with the bellied boss that makes progress the boss with be provided with the material holding tank that is used for placing the coating film material in the middle of the boss with the lateral wall portion.
2. The pan for electron beam evaporation according to claim 1, wherein the number of the charging troughs is at least one and is arranged in this order on the outer surface of the side wall portion in the circumferential direction thereof, the distance between the trough wall and the trough bottom of the charging trough near the upper edge of the side wall portion is larger than the distance between the trough wall and the trough bottom of the charging trough near the lower edge of the side wall portion, and the trough wall of the charging trough is inclined from top to bottom toward the longitudinal central axis of the pan for electron beam evaporation.
3. The pan tray for electron beam evaporation according to claim 2, wherein a lower edge of at least one of the charging chutes is provided along a lower edge of an outer side wall of the side wall portion.
4. The pan for electron beam evaporation as claimed in claim 1, wherein the charging chute is at least one spiral groove provided on an outer surface of the side wall portion, an upper notch of the charging chute is located at an upper edge of the pan for electron beam evaporation, and a lower notch of the charging chute is located at a lower edge of the pan for electron beam evaporation.
5. The pan tray for electron beam evaporation according to claim 1, wherein an upper surface of the boss does not exceed a height of an upper edge of the side wall portion.
6. The pan for electron beam evaporation according to any one of claims 1 to 5, further comprising a material shielding portion connected to an upper edge of the side wall portion, wherein the material shielding portion comprises a material shielding slope surface inclined from bottom to top toward a longitudinal central axis of the pan for electron beam evaporation.
7. The pan for electron beam evaporation according to claim 6, wherein the material shielding portion further comprises a material falling portion disposed along an upper edge of the material shielding slope, and the material falling portion is disposed in an inclined manner from top to bottom away from a longitudinal central axis of the pan for electron beam evaporation.
8. The pan for electron beam evaporation according to claim 7, wherein a plurality of material falling grooves extending toward an upper edge of the sidewall portion are formed on the material shielding slope.
CN201921686788.0U 2019-10-10 2019-10-10 Pan tray for electron beam evaporation Expired - Fee Related CN210765485U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921686788.0U CN210765485U (en) 2019-10-10 2019-10-10 Pan tray for electron beam evaporation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921686788.0U CN210765485U (en) 2019-10-10 2019-10-10 Pan tray for electron beam evaporation

Publications (1)

Publication Number Publication Date
CN210765485U true CN210765485U (en) 2020-06-16

Family

ID=71064313

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921686788.0U Expired - Fee Related CN210765485U (en) 2019-10-10 2019-10-10 Pan tray for electron beam evaporation

Country Status (1)

Country Link
CN (1) CN210765485U (en)

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20200616