EP0684145B1 - Wärmeempfindliches Aufzeichnungselement - Google Patents
Wärmeempfindliches Aufzeichnungselement Download PDFInfo
- Publication number
- EP0684145B1 EP0684145B1 EP19950201166 EP95201166A EP0684145B1 EP 0684145 B1 EP0684145 B1 EP 0684145B1 EP 19950201166 EP19950201166 EP 19950201166 EP 95201166 A EP95201166 A EP 95201166A EP 0684145 B1 EP0684145 B1 EP 0684145B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- heat mode
- recording element
- recording
- roughening agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 100
- 239000003795 chemical substances by application Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000007788 roughening Methods 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- 229910052797 bismuth Inorganic materials 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 12
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 238000004377 microelectronic Methods 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- -1 silver halide Chemical class 0.000 description 14
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011230 binding agent Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000011324 bead Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 229910052714 tellurium Inorganic materials 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229940117958 vinyl acetate Drugs 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000004904 UV filter Substances 0.000 description 1
- 229920001986 Vinylidene chloride-vinyl chloride copolymer Polymers 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000002009 allergenic effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006065 biodegradation reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- FXBZWPXBAZFWIY-UHFFFAOYSA-N butyl prop-2-enoate;ethenyl acetate Chemical compound CC(=O)OC=C.CCCCOC(=O)C=C FXBZWPXBAZFWIY-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000004144 decalcomania Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000007433 macroscopic evaluation Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 238000007431 microscopic evaluation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- CMCWWLVWPDLCRM-UHFFFAOYSA-N phenidone Chemical compound N1C(=O)CCN1C1=CC=CC=C1 CMCWWLVWPDLCRM-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920013639 polyalphaolefin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 238000001454 recorded image Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 239000004289 sodium hydrogen sulphite Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000003232 water-soluble binding agent Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/42—Intermediate, backcoat, or covering layers
Definitions
- the present invention relates to an improved heat mode recording element containing a thin metal recording layer.
- Recording materials have been disclosed on which records are made thermally by the use of intense radiation like laser beams having a high energy density.
- information is recorded by creating differences in reflection and/or in transmission optical density on the recording layer.
- the recording layer has high optical density and absorbs radiation beams which impinge thereon.
- the conversion of radiation into heat brings about a local temperature rise, causing a thermal change such as evaporation or ablation to take place in the recording layer.
- the irradiated parts of the recording layer are totally or partially removed, and a difference in optical density is formed between the irradiated parts and the unirradiated parts (cf. US Pat. Nos. 4,216,501, 4,233,626, 4,188,214 and 4,291,119 and British Pat. No. 2,026,346)
- the recording layer of such heat mode recording materials is usually made of metals, dyes, or polymers. Recording materials like this are described in 'Electron, Ion and Laser Beam Technology", by M. L. Levene et al.; The Proceedings of the Eleventh Symposium (1969); “Electronics” (Mar. 18, 1968), P. 50; “The Bell System Technical Journal”, by D. Maydan, Vol. 50 (1971), P. 1761; and “Science”, by C. O. Carlson, Vol. 154 (1966), P. 1550.
- DRAW direct read after write
- Human readable records are e.g. micro-images that can be read on enlargement and projection.
- An example of a machine readable DRAW recording material is the optical disc.
- tellurium and its alloys have been used most widely to form highly reflective thin metal films wherein heating with laser beam locally reduces reflectivity by pit formation (ref. e.g. the periodical 'Physik in phy Zeit', 15. Jahrg. 1984/Nr. 5, 129-130 the article "Optische aside” by Jochen Fricke).
- Tellurium is toxic and has poor archival properties because of its sensitivity to oxygen and humidity.
- Other metals suited for use in DRAW heat-mode recording are given in US-P-4499178 and US-P-4388400.
- Other relatively low melting metals such as bismuth have been introduced in the production of a heat-mode recording layer.
- Heat mode recording materials usually do not require development and fixing processes and do not require darkroom operations because of their insensitivity to room light. Therefore they constitute a valuable alternative to conventional photosensitive materials based on silver halide emulsions, e.g. for phototype-setting or image-setting applications.
- silver halide materials have the advantage of high potential intrinsic sensitivity and excellent image quality.
- they show the drawback of requiring several wet processing steps employing chemical ingredients which are suspect from an ecological point of view. For instance the commonly used developing agent hydroquinone is allergenic and the biodegradation of disposed phenidone is too slow. As a consequence it is undesirable that depleted solutions of this kind would be discharged into the public sewerage; they have to be collected and destroyed by combustion, a cumbersome and expensive process.
- a heat mode recording element comprising, in order :
- the metal layer is a vacuum-deposited thin bismuth layer having a thickness preferably comprised between 0.1 and 0.6 ⁇ m.
- the average particle size of the roughening agent preferably ranges between 0.3 and 2.0 ⁇ m, most preferably around 1.0 ⁇ m.
- a preferred roughening agent is composed of polymethylmethacrylate beads.
- the layer containing the roughening agent can be the subbing layer of the support or can be an extra layer between the subbing layer and the metal layer.
- the protective element preferably comprises a cover sheet and an adhesive layer.
- the support of the heat mode element can in principle be an opaque paper base preference is given to a transparent organic resin support.
- Useful transparent organic resin supports include e.g. cellulose nitrate film, cellulose acetate film, polyvinylacetal film, polystyrene film, polyethylene terephthalate film, polycarbonate film, polyvinylchloride film or poly-Alpha-olefin films such as polyethylene or polypropylene film.
- the thickness of such organic resin film is preferably comprised between 0.07 and 0.35 mm.
- the support is a polyethylene terephthalate layer provided with a subbing layer.
- the layer containing the roughening agent can be the subbing layer itself applied to the support or can be an extra layer between the subbing layer and the metal layer.
- layer (b) can contain no binder at all but preferably it contains a binder.
- This layer (b) can be coated in principle from an organic solvent or from an aqueous medium depending on the chemical nature of the binder.
- Organic solvent-soluble binders include e.g. polymers derived from ⁇ , ⁇ -ethylenically unsaturated compounds such as e.g.
- organic solvents can be used for dissolving and coating these polymers.
- water-soluble binders coatable from an aqueous medium can be used, e.g. gelatin, polyvinyl alcohol, polyvinyl pyrrolidone, carboxymethyl cellulose, methyl cellulose, ethyl cellulose, gum arabic, casein, different kinds of water-soluble latices, etc.
- the roughening agent is incorporated in the subbing layer applied to the polyester support, in other words this subbing layer constitutes layer (b).
- This subbing layer can be applied before or after stretching of the polyester film support.
- the polyester film support is preferably biaxially stretched at an elevated temperature of e.g. 70-120°C, reducing its thickness by about 1/2 to 1/9 or more and increasing its area 2 to 9 times. The stretching may be accomplished in two stages, transversal and longitudinal in either order or simultaneously.
- the subbing layer is preferably applied by aqueous coating between the longitudinal and transversal stretch, in a thickness of 0.1 to 5 ⁇ m.
- the subbing layer preferably contains, as described in European Patent Application EP 0 464 906, a homopolymer or copolymer of a monomer comprising covalently bound chlorine.
- a homopolymer or copolymer of a monomer comprising covalently bound chlorine examples are e.g.
- polyvinyl chloride polyvinylidene chloride, a copolymer of vinylidene chloride, an acrylic ester and itaconic acid, a copolymer of vinyl chloride and vinylidene chloride, a copolymer of vinyl chloride and vinyl acetate, a copolymer of butylacrylate vinyl acetate and vinyl chloride or vinylidene chloride, a copolymer of vinyl chloride, vinylidene chloride and itaconic acid, a copolymer of vinyl chloride, vinyl acetate and vinyl alcohol etc.
- Polymers that are water dispersable are preferred since they allow aqueous coating of the subbing layer which is ecologically advantageous.
- Said homopolymer or copolymer may be prepared by various polymerization methods of the constituting monomers.
- the polymerization may be conducted in aqueous dispersion containing a catalyst and activator, e.g., sodium persulphate and meta sodium bisulphite, and an emulsifying and/or dispersing agent.
- a catalyst and activator e.g., sodium persulphate and meta sodium bisulphite
- an emulsifying and/or dispersing agent e.g., sodium persulphate and meta sodium bisulphite
- the homopolymers or copolymers used with the present invention may be prepared by polymerization of the monomeric components in the bulk without added diluent, or the monomers may be reacted in appropriate organic solvent reaction media.
- Chemical nature, concentration and particle distribution of the roughening agent must be chosen in such a way that a certain degree of unevenness can be introduced in the metal recording layer. It is shown that this unevenness can reduce the occurence of interference patterns because the reflectance gets more diffuse. It will be clear that the roughening agent must be closely packed in the layer.
- the thickness of layer (b), the average particle size and the coverage of the roughening agent must be tuned to each other in such a way that a sufficient number of the roughening particles must protrude above the interface layer (b) / metal layer in order to induce local deformation spots into this metal layer.
- the average particle size is too low the roughening agent will not be able to introduce uneveness in the metal layer.
- the average particle size is too great too high a coverage will be required which would make layer (b) too thick. So it is clear that an optimal particle size should be chosen for the roughening agent and that this optimum will depend on the mechanical strenght of the metal layer and therefore on its thickness.
- the average particle size of the roughening agent ranges from 0.3 to 2.0 ⁇ m, and is most preferably about 1.0 ⁇ m.
- the coverage of the roughening agent ranges from 0.05 to 1.0 g/m 2 , and is most preferably about 0.6 g/m 2 .
- the degree of roughness of layer (b) is best characterized by the so-called R a value.
- This so-called average roughness value is defined as the arithmetic average value of the absolute amounts of all the measured distances of the roughness profile from the middle line within the measured interval.
- Layer (b) preferably has a R a value of at least 0.2 ⁇ m.
- the roughening agent can be chosen from a wide variety of chemical classes and commercial products provided the particles chosen show an excellent mechanical and thermal stability.
- Preferred roughening agents include following :
- a thin intermediate layer can be applied between layer (b) and the metal recording layer for reasons of protection against physical damage.
- the thin intermediate layer is coated together with layer (b) by slide hopper coating. It can contain the same kinds of binder as layer (b) at a coverage of lower than 1 g/m 2 in order not to loose the roughening effect.
- the metal recording layer is positioned immediately on top of layer (b) in order to get the full effect of the uneveness introduced by the roughening agent.
- Possible metals for the recording layers in this invention include Mg, Sc, Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Co, Ni, Ru, Rh, Pd, Ir, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Si, Ge, Sn, As, Sb, Bi, Se, Te. These metals can be used alone or as a mixture or alloy of at least two metals therof. Due to their low melting point Mg, Zn, In, Sn, Bi and Te are preferred. The most preferred metal for the practice of this invention is Bi.
- the metal recording layer may be applied on top of the layer containing the roughening agent by vapor deposition, sputtering, ion plating, chemical vapor deposition, electrolytic plating, or electroless plating.
- the recording layer is preferably provided by vapor deposition in vacuo. A method and an apparatus for such a deposition are disclosed in EP 0 384 041.
- the thickness of this Bi layer is preferably comprised between 0.1 and 0.6 ⁇ m. When this thickness is too low the recorded images do not have sufficient density. When on the other hand the thickness is too high the sensitivity tends to decrease and the minimal density, i.e. the density after laser recording on the exposed areas tends to be higher.
- this protective element comprises a transparent organic resin, acting as cover sheet, and an adhesive layer.
- a method for applying such a protective element by lamination in the same vacuum environment as wherein the deposition of the metal layer took place is disclosed in EP 0 384 041, cited above.
- the cover sheet can be chosen from the group of polymeric resins usable for the support of the heat mode element.
- the cover sheet is also polyethylene terephthalate but preferably substantially thinner than the polyethylene terephthalate of the support.
- a layer of a pressure-sensitive adhesive resin can be used for the adherence of the hard protective outermost resin layer to the heat mode recording layer.
- a layer of a pressure-sensitive adhesive resin can be used for the adherence of the hard protective outermost resin layer to the heat mode recording layer.
- a layer of a pressure-sensitive adhesive resin is described in US-P 4,033,770 for use in the production of adhesive transfers (decalcomanias) by the silver complex diffusion transfer process. in the Canadian Patent 728,607 and in the United States Patent 3,131,106.
- Pressure-sensitive adhesives are usually composed of (a) thermoplastic polymer(s) having some elasticity and tackiness at room temperature (about 20°C), which is controlled optionally with a plasticizer and/or tackifying resin.
- a thermoplastic polymer is completely plastic if there is no recovery on removal of stress and completely elastic if recovery is instantaneous and complete.
- Particularly suitable pressure-sensitive adhesives are selected from the group of polyterpene resins, low density polyethylene, a copoly(ethylene/vinyl acetate), a poly(C 1 -C 16 )alkyl acrylate, a mixture of poly(C 1 -C 16 )alkyl acrylate with polyvinyl acetate, and copoly(vinylacetate-acrylate) being tacky at 20°C.
- an intrinsically non-tacky polymer may be tackified by the adding of a tackifying substance, e.g. plasticizer or other tackifying resin.
- a tackifying substance e.g. plasticizer or other tackifying resin.
- tackifying resins examples include the terpene tackifying resins described in the periodical "Adhesives Age", Vol. 31, No. 12, November 1988, p. 28-29.
- the protective element is laminated or adhered to the heat-mode recording layer by means of a heat-sensitive also called heat-activatable adhesive layer or thermoadhesive layer, examples of which are described also in US-P 4,033,770.
- a heat-sensitive also called heat-activatable adhesive layer or thermoadhesive layer
- the laminating material consisting of adhesive layer and abrasion resistant protective layer and/or the recording web material to be protected by lamination are heated in their contacting area to a temperature beyond the softening point of the adhesive. Heat may be supplied by electrical energy to at least one of the rollers between which the laminate is formed or it may be supplied by means of infra-red radiation.
- the laminating may proceed likewise by heat generated by high-frequency micro-waves as described e.g. in published EP-A 0 278 818 directed to a method for applying a plastic covering layer to documents.
- the adhesive layer may be heat-curable or ultra-violet radiation curable.
- heat-curable organic resins and curing agents therefore reference is made e.g. to the above mentioned “Handbook of Adhesive Raw Materials", and for UV curable resin layers reference is made e.g. to "UV Curing: Science and Technology” - Technology Marketing Corporation, 642 Westover Road - Stanford - Connecticut - USA - 06902 (1979).
- UV curable resin layers reference is made e.g. to "UV Curing: Science and Technology” - Technology Marketing Corporation, 642 Westover Road - Stanford - Connecticut - USA - 06902 (1979).
- heat mode recording with a meltable metal layer preference is given to an easily deformable adhesive layer so that it does not form a hindrance for the formation of small metal globules in the areas of the recording layer struck by high intensity radiation energy laser energy.
- the easy deformability of the adhesive interlayer is in favour of recording sensitivity.
- a heat mode DRAW material such as the one of the present invention the dimensional stability is of utmost importance.
- Fields of application where the requirements for dimensional stability are very stringent are e.g. those where the heat moded image serves as an intermediate for the exposure of a lithographic printing plate, or as a master mask for the production of microelectronic integrated circuits or printed circuit boards (PCB).
- PCB printed circuit boards
- one or more barrier layers can be applied onto the heat mode recording element retarding the uptake of water vapour as disclosed in European Patent Application Appl. No. 93201366, filed 12 May, 1993.
- this barrier layer is a vapour-deposited glass layer substantially composed of SiO x , x ranging from 1.2.to 1.8.
- Such a barrier layer can be applied to one of or to both outermost sides of the complete finished heat mode element of the present invention, or to one of or to both sides of the support of the recording element before the element is further produced.
- any laser can be used which provides enough energy needed for the production of sufficient heat for this particular process of image formation.
- a powerful infra-red laser is used.
- a Nd-YLF laser is used emitting at 1053 nm.
- a bismuth layer of 0.3 ⁇ m thickness was applied by vacuum-deposition (vacuum of 10 -2 Pa) in a Leybold apparatus, after a weak corona discharge of 0.05 Ampère.
- a protective element consisting of a 8 ⁇ m thick adhesive layer containing copoly(butylacrylate-vinylacetate), and of a cover sheet being a 12 ⁇ m thick polyethylene terephthalate foil.
- the four recording elements were exposed by means of a high-power internal drum laser recorder with following characteristics :
- the elements were exposed through the protective laminate side. Full areas and separate scan lines (1 on / 10 off) were exposed at different laser powers ranging between 480 mW and 1330 mW.
- the obtained image quality was evaluated as follows.
- the macroscopic homogeneity was defined as the minimal laser power at which the full areas and lines showed no interference patterns or interference fringes any more. These values are summarized in table 2 : element homogeneity full areas lines R-1 > 1330 > 1330 R-2 > 1330 > 1330 I-1 1200-1260 > 1330 I-2 1110-1200 1110-1200
Landscapes
- Thermal Transfer Or Thermal Recording In General (AREA)
Claims (11)
- Wärmeempfindliches Aufzeichnungselement, das folgendes enthält :a) einen Träger,b) eine Schicht mit einem Ra-wert von wenigstens 0,2 µm, die in einem Verhältnis zwischen 0,05 und 1,0 g/m2 ein Aufrauhmittel mit einer durchschnittlichen Teilchengröße zwischen 0,3 und 2,0 µm enthält,c) eine Metallaufzeichnungsschicht, undd) ein Schutzelement.
- Wärmeempfindliches Aufzeichnungselement nach Anspruch 1, dadurch gekennzeichnet, daß das Aufrauhmittel Polymethyl-Methacrylat ist.
- Wärmeempfindliches Aufzeichnungselement nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Metallaufzeichnungs-Schicht eine Wismutschicht ist.
- Wärmeempfindliches Aufzeichnungselement nach Anspruch 3, dadurch gekennzeichnet, daß die Stärke der Wismutschicht zwischen 0,1 µm und 0,6 µm liegt.
- Wärmeempfindliches Aufzeichnungselement nach irgendeinem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß der Träger mit einer Haftschicht versehen ist und die ein Aufrauhmittel enthaltende Schicht (b) die Haftschicht ist.
- Wärmeempfindliches Aufzeichnungselement nach irgendeinem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß das Schutzelement einen polymeren Deckbogen oder eine polymere Deckschicht, das (die) ein transparentes polymeres Harz ist, und eine Klebeschicht enthält.
- Verfahren zur Bildung eines thermischen Bilds, das die intensive informationsmäßige Laserstrahlenbelichtung eines wärmeempfindlichen Aufzeichnungselements nach irgendeinem der vorstehenden Ansprüche umfaßt.
- Verfahren nach Anspruch 7, dadurch gekennzeichnet, daß die intensive Laserstrahlung durch einen Infrarotlaser geliefert wird.
- Verfahren nach Anspruch 8, dadurch gekennzeichnet, daß der Infrarotlaser ein bei 1.053 emittierender Nd-YLF-Laser ist.
- Verwendung des gemäß dem Verfahren der Ansprüche 7, 8 oder 9 erhaltenen thermischen Bilds als Druckwerkzeug bei der Herstellung von gedruckten Leiterplatten oder mikroelektronischen integrierten Schaltungen.
- Verwendung des gemäß dem Verfahren der Ansprüche 7, 8 oder 9 erhaltenen thermischen Bilds als Druckwerkzeug für die Belichtung einer Druckplatte.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19950201166 EP0684145B1 (de) | 1994-05-25 | 1995-05-08 | Wärmeempfindliches Aufzeichnungselement |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP94201472 | 1994-05-25 | ||
| EP94201472 | 1994-05-25 | ||
| EP19950201166 EP0684145B1 (de) | 1994-05-25 | 1995-05-08 | Wärmeempfindliches Aufzeichnungselement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0684145A1 EP0684145A1 (de) | 1995-11-29 |
| EP0684145B1 true EP0684145B1 (de) | 1998-08-12 |
Family
ID=26136284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19950201166 Expired - Lifetime EP0684145B1 (de) | 1994-05-25 | 1995-05-08 | Wärmeempfindliches Aufzeichnungselement |
Country Status (1)
| Country | Link |
|---|---|
| EP (1) | EP0684145B1 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19642040C1 (de) * | 1996-10-11 | 1998-01-15 | Schreiner Etiketten | Mit einem Laserstrahl beschriftbare Folie |
| US5989777A (en) * | 1997-06-18 | 1999-11-23 | Agfa-Gevaert, N. V. | Heat mode recording element based on a thin metallic recording layer |
| EP0886268B1 (de) * | 1997-06-18 | 2003-04-09 | Agfa-Gevaert | Wärmeempfindliches Aufzeichnungselement mit metallischer Dünnfilmaufzeichnungsschicht |
| EP0982718B1 (de) * | 1998-08-28 | 2004-02-11 | Agfa-Gevaert | Wärmeempfindliches Aufzeichnungselement mit antistatischen Schichten |
| JP2000158833A (ja) * | 1998-11-26 | 2000-06-13 | Konica Corp | 光熱変換型ヒートモード記録材料 |
| US6692895B2 (en) | 2001-05-25 | 2004-02-17 | 3M Innovative Properties Company | Imageable article and method of imaging |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049435B2 (ja) * | 1980-07-30 | 1985-11-01 | 本州製紙株式会社 | 放電記録媒体 |
| DE3885937T2 (de) * | 1987-05-30 | 1994-06-01 | Kuraray Co | Medium für optische Aufzeichnung und das Medium verwendendes Aufzeichnungsverfahren. |
| JPH03297698A (ja) * | 1990-04-16 | 1991-12-27 | Toppan Printing Co Ltd | カードおよびその製造方法 |
| JP2616131B2 (ja) * | 1990-04-16 | 1997-06-04 | 凸版印刷株式会社 | 感熱記録カード |
| EP0573092A1 (de) * | 1992-06-05 | 1993-12-08 | Agfa-Gevaert N.V. | Verfahren zur Herstellung eines Bildes unter Verwendung von einem Aufzeichnungsmaterial nach dem Wärmeverfahren |
-
1995
- 1995-05-08 EP EP19950201166 patent/EP0684145B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0684145A1 (de) | 1995-11-29 |
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