EP0675572A2 - Kontaktelement für Randverbinder - Google Patents

Kontaktelement für Randverbinder Download PDF

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Publication number
EP0675572A2
EP0675572A2 EP95110834A EP95110834A EP0675572A2 EP 0675572 A2 EP0675572 A2 EP 0675572A2 EP 95110834 A EP95110834 A EP 95110834A EP 95110834 A EP95110834 A EP 95110834A EP 0675572 A2 EP0675572 A2 EP 0675572A2
Authority
EP
European Patent Office
Prior art keywords
shaped contact
contact
contact member
mentioned
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP95110834A
Other languages
English (en)
French (fr)
Other versions
EP0675572A3 (de
Inventor
Youichi Kashiwa
Yoshikazu Tanikawa
Jun Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of EP0675572A2 publication Critical patent/EP0675572A2/de
Publication of EP0675572A3 publication Critical patent/EP0675572A3/de
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes

Definitions

  • the present invention refers to electric contact elements for edge connectors which receives the edge of a daughter card on which is loaded, for example, a memory module, and is used to connect electrically the memory module to the circuits on a motherboard to which the connector is attached.
  • the electrical contact element which is used in the connector disclosed in Laid-Open Japanese Patent No. 60-230378 and in Laid-Open Japanese Patent No. 63-193473 features a support part between (a) the C-shaped contact member which accepts the edge of the daughter card and (b) the base part-which supports the C-shaped contact member which is short. As a result, there is the likelihood that stress will concentrate on the support part and plastic deformation will take place.
  • the elastic deformation of the electric contact element relies only on the C-shaped contact member so that (a) there are limitations on the amount of plastic deformation and (b) the electric contact element cannot handle the wide variations in thickness of the daughter card.
  • Laid-Open Japanese Patent No. 63-193473 discloses an electric contact element for a connector which is soldered onto the surface of the motherboard to which the edge connector is attached (the "surface mounting type” of connector, hereafter referred to as "SMT").
  • SMT surface mounting type of connector
  • the bottom surface of the base part of the electric contact element is soldered directly to the motherboard.
  • problems with this when there are variations in temperature. There is the possibility that temperature cracks will appear on the soldered part which is interposed between the motherboard and the base part of the electric contact part caused either by the difference in the thermal expansion coefficient of the electric element and the motherboard or due to the fact that the external force when the motherboard is mounted onto the connector is applied directly to the base part of the electric contact element thus breaking the connection.
  • an object of the present invention to take into consideration the above-mentioned problems and provide an electric contact element for edge connectors which can handle the wide variations in thickness of the daughter card by increasing the amount of resilient deformation. It is yet another object of the present invention to provide an electric contact element for edge connectors which holds in check the occurrence of soldering cracks which occur when the SMT (surface mounting type) is used.
  • the electric contact element for edge connectors in the first invention is equipped with (a) a C-shaped first contact device which comprises a first part and a second part which extend upward from both ends of the base part which is fixed to the bottom part of the cavity of the housing; (b) a C-shaped second contact device which is coupled to the front end of the elastic or resilient support part which extends from the side of the above-mentioned base part of the first contact device at a sharp angle to the above-mentioned base part and (c) a connection device which protrudes onto the bottom wall of the above-mentioned housing from the above-mentioned base part of the above-mentioned first contact device and connects to the motherboard. It uses either of the above-mentioned first and second contact devices or both as a contact with the daughter card.
  • the electric contact element for edge connectors in the second invention is equipped with (a) a C-shaped first contact device which comprises a first and a second part which extend upward respectively from both ends of the base part which is fixed to the bottom part of the cavity of a housing; (b) a C-shaped second device which is coupled to the front end of an elastic or resilient support part which extends from the above-mentioned base part of the first contact device inside the above-mentioned first contact device; and (c) a device for connecting or a fixing to a motherboard which extends from the above-mentioned first or second part of the above-mentioned first contact device to the outside of the above-mentioned housing. Either one of the above-mentioned first or second contact devices or both of them are used as a contact for the daughter card.
  • FIG. 1 gives an overview of the electric contact element and the housing of the invention.
  • Electric contact element 2 is pressed into housing 4 from the top at the position of arrow P and is forced into housing 4 and is retained on the bottom part of cavity 5 of housing 4 when convex part 2a (which is formed on the outside of both side surfaces of electric contact point 2) locks into the wall 4a of housing 4.
  • Electric contact element 2 is made up of (a) a C-shaped first connection device which comprises a second support column (second part) whose front end first extends upward from the first support column 12 (first part) which itself extends upward from one end of base part 11, then extends inside the electric contact element; (b) a resilient support part 20 which extends in a direct line from near the base part of the above-mentioned second support column 14 at a sharp angle to base part 11; and (c) a second contact device 30 which first extends to the front end of the above-mentioned second support column 14 from the front end of the part 20, then makes a U-turn, and then curves in a C-shape along the inside of the above-mentioned part 20 and the second support column 14.
  • Front end 20a of the above-mentioned part 20 faces the above-mentioned second support column 14 and forms the first contact.
  • Front end 30a of the above-mentioned second contact device 30 faces the above-mentioned first contact 20a and extends to form the second contact.
  • the inside 14a of front end of the above-mentioned second support column 14 faces the above-mentioned first contact 20a and forms a protrusion which serves as a reserve contact.
  • Daughter card 6 is inserted between the above-mentioned first contact 20a and the second contact 30a. These are connected to daughter card 6 by turning in the direction indicated by arrow Q.
  • the surfaces of the first contact 20a and the second contact 30a as well as the reserve contact 14a inside the front end of the above-mentioned second support column 14 are connected to the surface of the daughter card 6.
  • the reserve contact 14a acts as an anti-overstress device which regulates the amount of deformation so that the above-mentioned second contact device 30 is not deformed excessively especially when a daughter card with a thick sheet is inserted.
  • Part 20 extends at a sharp angle to base part 11.
  • the length of part 20 being long so that the amount of potential elastic deformation increases.
  • the electric contact element has a low profile and the connector can accordingly be of a low profile.
  • Electric contact element 2 is equipped with sliding surface 14b which is inclined toward part of the above-mentioned second support column 14 and which is opposite front end 30a of the above-mentioned second contact device 30.
  • sliding surface 14b is deformed as the above-mentioned second contact device is mounted onto daughter card 6, it makes contact with the above-mentioned outside surface 30b and functions to slide front end 30a of the second contact device 30 along surface 6a of daughter card 6.
  • Daughter card 6 is inserted between the above-mentioned first contact 20a and the second contact 30a of electric contact element 2.
  • the C-shaped second contact device 30 and part 20 deform elastically upon the daughter card being turned to the position indicating by 6'.
  • the amount of deformation and the stress involved are dispersed to the above-mentioned second contact device 30 and to the rising part 20 so that (a) the amount of resilient deformation can be increased; (b) the wide variations in sheet thickness of daughter card 6 can be handled; and (c) an electric contact point can be realized which has reliable electric contact characteristics and which makes contact with both sides of daughter card 6 with great contact pressure.
  • the above-mentioned reserve contact 14a acts as an anti-overstress device for the above-mentioned second contact device 30. It prevents plastic deformation from extreme deformation by controlling the amount of deformation of the second contact device 30.
  • the end 30b of the second contact device 30 makes contact with the sliding surface 14b and slides along surface 6a of daughter card 6. This makes it possible for daughter card 6 to be mounted smoothly even when there are scratches and other surface irregularities on surface 6a of daughter card 6 and prevents the above-mentioned second contact device 30 from excessive deforming and from plastic deformation.
  • Protrusions are located on the inside surface 12a of the first support column 12 or on plane 20b of the front end of rising part 20. These make contact with each other and are used as anti-overstress devices to prevent the above-mentioned rising part from deforming excessively.
  • Reference number 16 in Figure 1 indicates the tine part of electric element 2 which is soldered to motherboard 8. The figure also indicates tine part 17 (arrayed in zigzag fashion with tine part 16) on the electric contact element (not shown) adjacent electric contact element 2.
  • Figure 2 indicates a second embodiment. It indicates daughter card 106 which is clamped between first contact 120a and second contact 130a and which fits in last of all at position 106' which is parallel to the bottom surface of the housing. Since electric contact element 102 is configured exactly as element 2 except that the rising part 120 extends from the root part (near the base part) of the second support column 114 so that it is parallel to base part 111, we shall not go into detail about how it works since this is clear from the drawing.
  • Electric contact element 202 is made up of (a) a C-shaped first contact device 210; (b) a rising part 220; and (c) a second contact device 230. In addition to this, it is made up of (d) an elongated part 242 which extends outside from the side part of the second support column 214 of the first contact device 210; (e) a rising part 244 which extends from the elongated part 242 downward along the wall 250 of housing 204; and (f) a soldering and junction part 246 which extends from part 244 outward so that it is almost parallel to the bottom surface of the above-mentioned housing 204; and it is equipped with connection device 240 for attachment to the motherboard.
  • connection device 240 serves as a cushion so that the load is lightened and transferred to soldering coupling part 246. This prevents cracks from appearing in the solder which is interposed between soldering and junction part 246 and the substrate.
  • connection device 240 is formed by blanking so that the dimensional accuracy can be upgraded more than with a connection device which is formed by bending. Fluctuations in the position of soldering and junction part 246 can be reduced and the quality of the soldering and coupling conditions is stabilized.
  • the above-mentioned housing 204 is equipped with protecting wall 252 which is formed so that elongated part 242 and dropping part 244 from the above-mentioned connection device 240 are protected on both sides. the elongated part 242 and dropping part 244 are prevented from making contact with each other inadvertently and deforming when the connector 201 is being assembled or transported.
  • a bumper 254 is also located on both sides of housing 204 in at least the lengthwise direction and is prevented from touching the soldering coupling part 246 inadvertently when the connector 201 is being assembled or transported.
  • connection device extends outward from the second support column 214 of the first contact device 210.
  • connection device may be extended to the outside from the side part of the first support column 212 if necessary.
  • the electric contact elements are arrayed vis-a-vis each other, (a) the array pitch of soldering and junction part 246 becomes double that of the array pitch of the electric contact element, (b) the soldering and coupling pad area of motherboard 208 can be increased, (c) the reliability of the soldering and coupling can be upgraded and (d) the soldering and coupling condition can be easily inspected.
  • Figure 4 indicates another SMT (surface mounting type) embodiment.
  • protrusion 360 extends downward from the bottom surface of housing 304 and locks into hole 309 which is located on motherboard 308. This is basically the same as the embodiment in Figure 3 for the surface mounting type. Therefore, we shall not give a detailed explanation of it.
  • FIGS 4 through 7 all indicate embodiment of the mounting type in which the daughter card is clamped between the first contact and the second contact and is perpendicular.
  • connection device 440 which is made up of (a) elongated part 442 which curves from near the center of the side surface of the second support column 412; (b) dropping part 444 which extends downward from the front end of elongated part 442 and (c) solder junction part 446 which extends outward from dropping part 444.
  • Reference number 470 indicates a connection device for electric contact element (not shown) which is adjacent electric contact element 402. The advantages of arraying these two types of electric contact elements with one another have been discussed previously.
  • electric contact element 502 is equipped with protrusion 509 which is located in housing 504 and is soldered and joined to the soldering surface of motherboard 508.
  • soldering and joining is carried out in the above-mentioned protrusion 580 so that the load on connection device 540 can be reduced even though a load is applied when connector 501 is used.
  • the area of the bottom of the above-mentioned protrusion 580 is rather small compared to the area of the bottom of electric contact element 502 and so there is no danger of soldering cracks forming between protrusion 580 and motherboard 508.
  • Protrusion 582 is equipped with an electric contact element (not shown) which is adjacent electric contact element 502. The advantages of arraying these electric contact elements with one another have been discussed previously.
  • connection device 650 extends from the first support column 612 as in the previous example. It [electric contact element 602] is equipped with fixed device 690 which first extends outside from the side surface of the second support column 614 and then extends downward. The bottom surface 692 of the fixed 690 is soldered and joined to the soldering surface of motherboard 608. Since the fixed device 690 does not itself have any springiness, it receives most of the load applied to connector 601 and acts to reduce the load on connection device 640. The surface of the bottom 692 of fixed device 690 is comparatively small and there is little danger of soldering cracks forming.
  • the connection device can extend from the second support column and the fixed device as well can extend from the first support column. Needless to say, this electric contact element and the above-mentioned electric contact element 602 can be arrayed with one another.
  • the protrusion and the fixed device indicated in Figure 6 and Figure 7 can be used respectively for the embodiment of the SMT indicated in Figure 3 and Figure 4 and can be placed there if need be.
  • the bumpers indicated in Figure 3 and Figure 4 may also be placed in each of the SMT embodiments indicated in Figure 5 through Figure 7.
  • the first electric contact element for edge connectors in the present invention has the following characteristics.
  • the elastic support part extends from near the base part of the first contact device at a sharp angle to the base part so that (a) the resilient support part is sufficiently long even in a low profile configuration and so that (b) the amount of potential elastic deformation can be increased. Therefore, the resilient support part is also subject to elastic deformation along with the C-shaped part of the second C-shaped contact device which makes contact with the daughter card, the amount of deformation and the stress involved are dispersed and the plastic deformation occurring is kept to a minimum. There is a large amount of potential resilient deformation so that it can handle the wide variations in sheet thickness of the daughter card inserted.
  • the second embodiment in the present invention has the following characteristics. It is equipped on the side part with a springy connection device. The external force applied when the connector is used is reduced by the connection device. It is effective in holding in check cracks which appear during soldering. It is easy to visually check from the outside to see whether the connection device and the motherboard are connected and it is highly reliable. Since the area on the bottom surface of the soldering and junction part of the front end of the connection part is small, the soldering cracks which cause variations in the thermal expansion coefficient between the motherboard and the soldering and junction part can be effectively held in check.

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  • Coupling Device And Connection With Printed Circuit (AREA)
EP95110834A 1989-10-06 1990-10-05 Kontaktelement für Randverbinder. Ceased EP0675572A3 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1259976A JP2704300B2 (ja) 1989-10-06 1989-10-06 エッジコネクタ用コンタクト
JP259976/89 1989-10-06
EP90119186A EP0421474B1 (de) 1989-10-06 1990-10-05 Kontaktelement für Randverbinder

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP90119186.6 Division 1990-10-05

Publications (2)

Publication Number Publication Date
EP0675572A2 true EP0675572A2 (de) 1995-10-04
EP0675572A3 EP0675572A3 (de) 1996-03-27

Family

ID=17341547

Family Applications (2)

Application Number Title Priority Date Filing Date
EP90119186A Expired - Lifetime EP0421474B1 (de) 1989-10-06 1990-10-05 Kontaktelement für Randverbinder
EP95110834A Ceased EP0675572A3 (de) 1989-10-06 1990-10-05 Kontaktelement für Randverbinder.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP90119186A Expired - Lifetime EP0421474B1 (de) 1989-10-06 1990-10-05 Kontaktelement für Randverbinder

Country Status (5)

Country Link
EP (2) EP0421474B1 (de)
JP (1) JP2704300B2 (de)
KR (1) KR960001069B1 (de)
DE (1) DE69027500T2 (de)
MY (1) MY107147A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2814446B2 (ja) * 1994-01-11 1998-10-22 ヒロセ電機株式会社 回路基板用電気コネクタ
JP2007220542A (ja) * 2006-02-17 2007-08-30 Iriso Denshi Kogyo Kk コネクタ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60230378A (ja) 1984-04-06 1985-11-15 モレツクス　インコーポレーテツド 低挿入力の電気コネクタ
US4737120A (en) 1986-11-12 1988-04-12 Amp Incorporated Electrical connector with low insertion force and overstress protection
JPS63193473A (ja) 1987-01-30 1988-08-10 モレックス　インコーポレーテッド コネクタ構成体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3732531A (en) * 1971-06-16 1973-05-08 Bunker Ramo Electric contacts
US3848952A (en) * 1973-07-27 1974-11-19 Amp Inc Zero insertion force edge card connector
MY105824A (en) * 1989-07-10 1995-01-30 Whitaker Corp Printed circuit board edge connector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60230378A (ja) 1984-04-06 1985-11-15 モレツクス　インコーポレーテツド 低挿入力の電気コネクタ
US4737120A (en) 1986-11-12 1988-04-12 Amp Incorporated Electrical connector with low insertion force and overstress protection
JPS63193473A (ja) 1987-01-30 1988-08-10 モレックス　インコーポレーテッド コネクタ構成体

Also Published As

Publication number Publication date
EP0421474A1 (de) 1991-04-10
KR960001069B1 (ko) 1996-01-18
EP0421474B1 (de) 1996-06-19
MY107147A (en) 1995-09-30
DE69027500T2 (de) 1996-10-31
KR910008894A (ko) 1991-05-31
JP2704300B2 (ja) 1998-01-26
DE69027500D1 (de) 1996-07-25
EP0675572A3 (de) 1996-03-27
JPH03122981A (ja) 1991-05-24

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