EP0674343A3 - Méthode de stockage de plaquettes de silicium. - Google Patents

Méthode de stockage de plaquettes de silicium. Download PDF

Info

Publication number
EP0674343A3
EP0674343A3 EP95301226A EP95301226A EP0674343A3 EP 0674343 A3 EP0674343 A3 EP 0674343A3 EP 95301226 A EP95301226 A EP 95301226A EP 95301226 A EP95301226 A EP 95301226A EP 0674343 A3 EP0674343 A3 EP 0674343A3
Authority
EP
European Patent Office
Prior art keywords
silicon wafers
storing silicon
storing
wafers
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP95301226A
Other languages
German (de)
English (en)
Other versions
EP0674343A2 (fr
Inventor
Kuniyoshi Suzuki
Toshiaki Takaku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of EP0674343A2 publication Critical patent/EP0674343A2/fr
Publication of EP0674343A3 publication Critical patent/EP0674343A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/017—Clean surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/974—Substrate surface preparation
EP95301226A 1994-03-25 1995-02-27 Méthode de stockage de plaquettes de silicium. Withdrawn EP0674343A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7960194A JP2762230B2 (ja) 1994-03-25 1994-03-25 シリコンウエーハの保管方法
JP79601/94 1994-03-25

Publications (2)

Publication Number Publication Date
EP0674343A2 EP0674343A2 (fr) 1995-09-27
EP0674343A3 true EP0674343A3 (fr) 1997-07-02

Family

ID=13694539

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95301226A Withdrawn EP0674343A3 (fr) 1994-03-25 1995-02-27 Méthode de stockage de plaquettes de silicium.

Country Status (3)

Country Link
US (1) US5484748A (fr)
EP (1) EP0674343A3 (fr)
JP (1) JP2762230B2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017811A (en) * 1993-09-09 2000-01-25 The United States Of America As Represented By The Secretary Of The Navy Method of making improved electrical contact to porous silicon
JPH09260342A (ja) * 1996-03-18 1997-10-03 Mitsubishi Electric Corp 半導体装置の製造方法及び製造装置
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
CN1254440A (zh) * 1997-05-02 2000-05-24 Memc电子材料有限公司 硅晶片的腐蚀方法
US6884721B2 (en) * 1997-12-25 2005-04-26 Shin-Etsu Handotai Co., Ltd. Silicon wafer storage water and silicon wafer storage method
US6063205A (en) * 1998-01-28 2000-05-16 Cooper; Steven P. Use of H2 O2 solution as a method of post lap cleaning
US6495004B1 (en) * 1998-10-05 2002-12-17 Ebara Corporation Substrate plating apparatus
JP3693847B2 (ja) * 1999-03-26 2005-09-14 Ｎｅｃエレクトロニクス株式会社 研磨後ウェハの保管方法および装置
US20030036570A1 (en) * 2000-03-17 2003-02-20 Tatsuo Abe Water for storing silicon wafers and storing method
EP1298715B1 (fr) * 2001-03-16 2013-08-07 Shin-Etsu Handotai Co., Ltd. Procede de stockage d'une tranche de silicium
JP5122731B2 (ja) * 2005-06-01 2013-01-16 信越半導体株式会社 貼り合わせウェーハの製造方法
JP4857738B2 (ja) * 2005-11-30 2012-01-18 信越半導体株式会社 半導体ウエーハの洗浄方法および製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196738A (ja) * 1984-10-17 1986-05-15 Nec Corp シリコン基板の処理方法
JPH02178919A (ja) * 1988-12-29 1990-07-11 Matsushita Electron Corp シリコン基板への不純物拡散方法
JPH02181000A (ja) * 1989-01-06 1990-07-13 Nikko Chem Kk 二液性洗浄剤組成物
JPH03219000A (ja) * 1989-11-09 1991-09-26 Nippon Steel Corp シリコンウエハのエッチング方法および洗浄方法
JPH05291238A (ja) * 1992-04-09 1993-11-05 Nippon Steel Corp シリコンウエハのエッチング方法
JPH0641770A (ja) * 1992-07-27 1994-02-15 Daikin Ind Ltd シリコンウエハ表面の処理方法
JPH06140377A (ja) * 1992-09-09 1994-05-20 Toshiba Corp 半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383319A (en) * 1965-10-22 1968-05-14 Motorola Inc Cleaning of semiconductor devices
JPH0349224A (ja) * 1989-07-17 1991-03-04 Mitsubishi Electric Corp 基板の処理方法
JP2787788B2 (ja) * 1990-09-26 1998-08-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 残留物除去方法
US5352328A (en) * 1992-12-15 1994-10-04 At&T Bell Laboratories Control of time-dependent haze in the manufacture of integrated circuits

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196738A (ja) * 1984-10-17 1986-05-15 Nec Corp シリコン基板の処理方法
JPH02178919A (ja) * 1988-12-29 1990-07-11 Matsushita Electron Corp シリコン基板への不純物拡散方法
JPH02181000A (ja) * 1989-01-06 1990-07-13 Nikko Chem Kk 二液性洗浄剤組成物
JPH03219000A (ja) * 1989-11-09 1991-09-26 Nippon Steel Corp シリコンウエハのエッチング方法および洗浄方法
JPH05291238A (ja) * 1992-04-09 1993-11-05 Nippon Steel Corp シリコンウエハのエッチング方法
JPH0641770A (ja) * 1992-07-27 1994-02-15 Daikin Ind Ltd シリコンウエハ表面の処理方法
JPH06140377A (ja) * 1992-09-09 1994-05-20 Toshiba Corp 半導体装置の製造方法

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
MORITA M ET AL: "NATIVE OXIDE GROWTH ON SILICON SURFACE IN ULTRAPURE WATER AND HYDROGEN PEROXIDE", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 29, no. 12 PART 02, 1 December 1990 (1990-12-01), pages L2392 - L2394, XP000223085 *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 275 (E - 438) 18 September 1986 (1986-09-18) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 448 (E - 0983) 26 September 1990 (1990-09-26) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 456 (C - 0765) 2 October 1990 (1990-10-02) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 500 (C - 0895) 18 December 1991 (1991-12-18) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 077 (E - 1504) 8 February 1994 (1994-02-08) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 271 (C - 1203) 24 May 1994 (1994-05-24) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 442 (E - 1593) 17 August 1994 (1994-08-17) *

Also Published As

Publication number Publication date
JP2762230B2 (ja) 1998-06-04
US5484748A (en) 1996-01-16
EP0674343A2 (fr) 1995-09-27
JPH07263403A (ja) 1995-10-13

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