EP0640610A2 - Liquid indium source - Google Patents
Liquid indium source Download PDFInfo
- Publication number
- EP0640610A2 EP0640610A2 EP94303593A EP94303593A EP0640610A2 EP 0640610 A2 EP0640610 A2 EP 0640610A2 EP 94303593 A EP94303593 A EP 94303593A EP 94303593 A EP94303593 A EP 94303593A EP 0640610 A2 EP0640610 A2 EP 0640610A2
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- EP
- European Patent Office
- Prior art keywords
- trimethylindium
- bubbler
- solution
- source
- dissolved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052738 indium Inorganic materials 0.000 title description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title description 5
- 239000007788 liquid Substances 0.000 title description 5
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000012159 carrier gas Substances 0.000 claims abstract description 11
- 239000012808 vapor phase Substances 0.000 claims abstract description 3
- 239000002904 solvent Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- YMBBYINYHYQUGH-UHFFFAOYSA-N butylindium Chemical compound CCCC[In] YMBBYINYHYQUGH-UHFFFAOYSA-N 0.000 claims description 3
- PHLVLJOQVQPFAW-UHFFFAOYSA-N tris(2-methylpropyl)indigane Chemical compound CC(C)C[In](CC(C)C)CC(C)C PHLVLJOQVQPFAW-UHFFFAOYSA-N 0.000 claims description 2
- 238000004980 dosimetry Methods 0.000 abstract description 3
- 230000005587 bubbling Effects 0.000 abstract description 2
- 150000001412 amines Chemical class 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000012535 impurity Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 7
- 229930195733 hydrocarbon Natural products 0.000 description 7
- 150000002430 hydrocarbons Chemical class 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000009835 boiling Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- JMMJWXHSCXIWRF-UHFFFAOYSA-N ethyl(dimethyl)indigane Chemical compound CC[In](C)C JMMJWXHSCXIWRF-UHFFFAOYSA-N 0.000 description 3
- 125000002524 organometallic group Chemical group 0.000 description 3
- OTRPZROOJRIMKW-UHFFFAOYSA-N triethylindigane Chemical compound CC[In](CC)CC OTRPZROOJRIMKW-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 150000002472 indium compounds Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- QIVLHVRZYONPSZ-UHFFFAOYSA-N tributylindigane Chemical compound CCCC[In](CCCC)CCCC QIVLHVRZYONPSZ-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
- C23C16/4482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material by bubbling of carrier gas through liquid source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
Definitions
- the present invention is directed to a method of providing a uniform dosimetry of vapor phase trimethylindium for epitaxial growth processes, such as metalorganic chemical vapor deposition (MOCVD).
- MOCVD metalorganic chemical vapor deposition
- the most commonly used indium compound for MOCVD or other epitaxial deposition processes is trimethylindium.
- Materials produced by epitaxial growth using trimethylindium as an indium source include, for example InP, InGaAs, InGaAlP, InGaAsP, InGaAs/GaAs/AlGaAs, InAs, InSb and InAsBi.
- a well-known inherent disadvantage of trimethylindium as an indium source is the fact that it is a solid at room temperature.
- Liquid sources of organometallic vapors are preferred to solid sources because a gas stream having a substantially constant partial pressure of organometallic vapors can be produced merely by bubbling carrier gas through the liquid at a constant rate.
- the surface area is constantly changing as the organometallic source is vaporized.
- solids, such as trimethylindium tend to recondense on surfaces of the gas pathway, further increasing the difficulty of providing a uniform partial pressure of the organometallic compound.
- Trimethylindium being a solid, is an anomaly relative to other trialkylindiums, as C2-C5 alkylindiums are liquids at room temperature. This anomaly is the result of trimethylindium existing as a tetramer at room temperature, whereas other trialkylindiums are monomers.
- trimethylindium having a relatively high vapor pressure, tends to be preferred.
- trimethylindium may be dissolved in amine, its solubility is low, typically about 20%, requiring a large volume of trimethylindium source.
- Amines complex with trimethylindium advantageously breaking up the tetramer, but disadvantageously tying up trimethylindium.
- amine solvents are used which are highly purified, particularly with respect to volatile impurities. Nevertheless, if impurities are present, they may react with the trimethylindium, producing new, more volatile impurities.
- even high boiling amines are entrained in the gas stream to some extent and may undesirably introduce nitrogen into the material which is being produced.
- U.S. Patent No. 4,720,560 approaches the problem by mixing two moles of trimethylindium with a mole of triethylindium to produce ethyldimethylindium by the reversible reaction: 2 Me3In + Et3In ⁇ 3 EtMe2In.
- the desired indium source in this approach is not trimethylindium, but ethyldimethylindium. Because the equilibrium is temperature-dependent with the equilibrium shifting to the right at lower temperatures, it is advised to maintain the mixture at a temperature below room temperature, e.g., at about 10°C. Such a lowered temperature may be disadvantageous if high vapor pressures are required for the crystal growth. Increasing the temperature may potentially cause the above equilibrium to shift to the left, and cause the ethyldimethylindium to dispreportionate.
- a liquid source of indium comprises trimethylindium dissolved in a C3-C5 trialkylindium or mixture of C3-C5 trialkylindiums. Gas, such as hydrogen or helium, bubbled through this source entrains trimethylindium in monomeric form.
- FIG. 1 is a diagrammatic illustration of apparatus used to deliver vaporized trimethylindium in the Example below.
- FIG 2 is a graph, showing grams of trimethyl indium delivered charged against hours of delivery in the Example below.
- tripropylindiums may be used as solvents, butylindiums, such, a tri n-butylindium (b.p. 85-6°C/0.1 mm Hg) and triisobutylindium (b.p. 71-2°C/0.05 mm Hg) (or mixtures of these isometric tributylindiums) are preferred because of their higher boiling point.
- the solvents are preferably highly purified, e.g., to five 9's purity.
- trialkylindiums as solvents for trimethylindium, relative to amines or hydrocarbons, are that any trace impurities, which in the case of the amine or hydrocarbon might react with trimethylindium to produce volatile impurities, would have already reacted with the higher trialkylindium to produce either a non-volatile impurity or a volatile impurity which would be removed in the purification process. Also, unlike amines which might introduce nitrogen into the material being deposited, the higher trialkylindiums introduce no element in addition to those present in trimethylindium. Like amine solvents, trialkylindium solvents break the tetrameric trimethylindium into monomeric form, which is the form that is vaporized.
- Suitable carrier gases are those which are non-reactive with the trimethylindium or with the trialkylindium solvent. Hydrogen is the preferred carrier gas, but other gases, such as helium or argon may be used.
- FIG. 1 The apparatus used in the experiment to determine the flow behavior of this solution is shown in Figure 1.
- the inlet 9 of a stainless steel (SS) bubbler (source) 10 containing Bu3In/Me3In solution was connected through line 12 to a tank 14 of semiconductor grade N2 via a mass flow controller 16.
- the outlet 17 of the bubbler 10 was connected through line 18 to the outlet 19 of another stainless steel bubbler (receiver) 20.
- the second bubbler 20 is used in reverse orientation from normal for this experiment; thus flow from outlet 17 of bubbler 10 to outlet 19 of bubbler 20.
- the receiver bubbler 20 was cooled by a coil condenser 22 maintained at -15 to -20°C.
- the inlet 24 of this receiver was connected through line 26 to a dry ice-cooled trap 28 to condense the fugitive vapors from the receiver 20.
- the trap 28 was connected through line 29 to a mineral oil bubbler 30 to maintain a by-pass of N2 gas.
- Additional features of the apparatus include a three-way valve in line 12 used to evacuate the space between the inlet valve 34a of the nitrogen bubbler 10, several valves 34a, 34b, 34c, 34d, 34e throughout the line for set-up, and a vacuum connected to line 29 to evacuate the trap 30 and the space up to the receiver valve 34e after connections are made.
- the source bubbler 10 was maintained at about 20°C while the carrier gas was passed through it at a rate of 500 SCCM. Such a high flow rate was chosen to deplete the contents of the bubbler 10 in a relatively less amount of time. It was observed that the saturation of the carrier gas with TMIn was approximately 40%. This is perhaps due to the high flow rate and somewhat lower source temperature. The saturation of the carrier gas can easily be increased to >80% by lowering the flow rate and increasing the source temperature to 30-40°C.
- the amount of trimethylindium carried was monitored by the weight loss in the source bubbler. NMR spectra were obtained periodically to identify the material in the source bubbler and receiver bubbler. The data indicated that trimethylindium alone was carried through until toward the end. This has been confirmed by the gradual reduction of methyl peaks in the source bubbler.
- the receiver contained a white solid-trimethylindium-as evidenced by its NMR.
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- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
- The present invention is directed to a method of providing a uniform dosimetry of vapor phase trimethylindium for epitaxial growth processes, such as metalorganic chemical vapor deposition (MOCVD).
- The most commonly used indium compound for MOCVD or other epitaxial deposition processes is trimethylindium. Materials produced by epitaxial growth using trimethylindium as an indium source include, for example InP, InGaAs, InGaAlP, InGaAsP, InGaAs/GaAs/AlGaAs, InAs, InSb and InAsBi.
- A well-known inherent disadvantage of trimethylindium as an indium source is the fact that it is a solid at room temperature. Liquid sources of organometallic vapors are preferred to solid sources because a gas stream having a substantially constant partial pressure of organometallic vapors can be produced merely by bubbling carrier gas through the liquid at a constant rate. With solids, on the other hand, the surface area is constantly changing as the organometallic source is vaporized. Furthermore, solids, such as trimethylindium, tend to recondense on surfaces of the gas pathway, further increasing the difficulty of providing a uniform partial pressure of the organometallic compound.
- Trimethylindium, being a solid, is an anomaly relative to other trialkylindiums, as C₂-C₅ alkylindiums are liquids at room temperature. This anomaly is the result of trimethylindium existing as a tetramer at room temperature, whereas other trialkylindiums are monomers. However, from the standpoint of providing a sufficiently high vapor pressure for epitaxial growth applications, trimethylindium, having a relatively high vapor pressure, tends to be preferred.
- Several approaches have been taken to eliminate complications due to uneven mass flow when using trimethylindium. Some of these include reverse flow of carrier gas through the bubbler; packing the trimethylindium in inert material, such as Teflon beads, in the bubbler; use of two or more trimethylindium bubblers in series; and "solution trimethylindium" where the trimethylindium is dissolved and/or suspended in a high boiling amine or high boiling hydrocarbon.
- Those approaches in which the trimethylindium remains in solid phase, reduce, but do not eliminate, uneven mass flow.
- While trimethylindium may be dissolved in amine, its solubility is low, typically about 20%, requiring a large volume of trimethylindium source. Amines complex with trimethylindium, advantageously breaking up the tetramer, but disadvantageously tying up trimethylindium. Because epitaxial growth applications require a source with very minimal high vapor pressure impurities, amine solvents are used which are highly purified, particularly with respect to volatile impurities. Nevertheless, if impurities are present, they may react with the trimethylindium, producing new, more volatile impurities. Also, even high boiling amines are entrained in the gas stream to some extent and may undesirably introduce nitrogen into the material which is being produced.
- High boiling hydrocarbons avoid the problem of nitrogen. However, trimethylindium is even less soluble in hydrocarbons than amines, and the trimethylindium is more dispersed than dissolved in hydrocarbon media. Because hydrocarbons do not break up the tetramer, problems with deposition of trimethylindium in the gas pathway remain. Also, as with amines, there is the possibility that impurities will react with trimethylindium to produce volatile impurities.
- U.S. Patent No. 4,720,560 approaches the problem by mixing two moles of trimethylindium with a mole of triethylindium to produce ethyldimethylindium by the reversible reaction:
2 Me₃In + Et₃In → 3 EtMe₂In.
The desired indium source in this approach is not trimethylindium, but ethyldimethylindium. Because the equilibrium is temperature-dependent with the equilibrium shifting to the right at lower temperatures, it is advised to maintain the mixture at a temperature below room temperature, e.g., at about 10°C. Such a lowered temperature may be disadvantageous if high vapor pressures are required for the crystal growth. Increasing the temperature may potentially cause the above equilibrium to shift to the left, and cause the ethyldimethylindium to dispreportionate. - In accordance with the invention, a liquid source of indium comprises trimethylindium dissolved in a C₃-C₅ trialkylindium or mixture of C₃-C₅ trialkylindiums. Gas, such as hydrogen or helium, bubbled through this source entrains trimethylindium in monomeric form.
- FIG. 1 is a diagrammatic illustration of apparatus used to deliver vaporized trimethylindium in the Example below.
- FIG 2 is a graph, showing grams of trimethyl indium delivered charged against hours of delivery in the Example below.
- Trimethylindium is highly soluble in high-boiling trialkylindiums, such as C₃-C₅ trialkylindiums. As is the case with the trimethylindium/triethylindium system, it is believed that a reversible reaction occurs when trimethylindium is introduced into a higher trialkylindium:
Me₃In + (C₃-C₅alkyl)₃In → Mex(C₃-C₅alkyl)(3-x)In; where x = 1 or 2. Thus, up to two moles of trimethylindium can be dissolved into 1 mole of C₃-C₅ trialkylindium. For example, 320 grams of trimethylindium may be dissolved into 286 grams of tributylindium. - Although tripropylindiums may be used as solvents, butylindiums, such, a tri n-butylindium (b.p. 85-6°C/0.1 mm Hg) and triisobutylindium (b.p. 71-2°C/0.05 mm Hg) (or mixtures of these isometric tributylindiums) are preferred because of their higher boiling point. The solvents are preferably highly purified, e.g., to five 9's purity. An advantage of trialkylindiums as solvents for trimethylindium, relative to amines or hydrocarbons, are that any trace impurities, which in the case of the amine or hydrocarbon might react with trimethylindium to produce volatile impurities, would have already reacted with the higher trialkylindium to produce either a non-volatile impurity or a volatile impurity which would be removed in the purification process. Also, unlike amines which might introduce nitrogen into the material being deposited, the higher trialkylindiums introduce no element in addition to those present in trimethylindium. Like amine solvents, trialkylindium solvents break the tetrameric trimethylindium into monomeric form, which is the form that is vaporized.
- Unlike the trimethylindium/triethylindium system described in U.S. Patent No. 4,720,560, essentially the only volatile species is trimethylindium. Also, at higher temperatures, where a higher vapor pressure of trimethylindium is achieved, the equilibrium shifts to the left, enhancing the amount of trimethylindium available for entrainment by the carrier gas. As a result, the bubbler may be maintained at higher temperatures, 17-40°C being a typical temperature for the bubbler. As a consequence of there being a single volatile species which is constantly replenished by the equilibrium of the reaction, the amount of trimethylindium entrained by a carrier gas tends to be very constant over time, until trimethylindium is substantially depleted, whereupon a rather sharp drop-off may occur. By depositing in the trimethylindium concentration range where the mass flow of trimethylindium is constant, more uniform epitaxial growth may be achieved.
- To provide the most constant mass flow of trimethylindium, it is advantageous to initially provide a saturated or nearly saturated solution of trimethyl indium.
- Suitable carrier gases are those which are non-reactive with the trimethylindium or with the trialkylindium solvent. Hydrogen is the preferred carrier gas, but other gases, such as helium or argon may be used.
- To illustrate the invention, the following experiment was conducted. Inside a nitrogen filled glove box, 18 grams of trimethylindium (0.11 mol) was dissolved in 15 grams of tri n-butylindium (0.05 mol) in a stainless steel bubbler. A clear colorless solution resulted which by NMR showed the formulation of BuMe₂In. Further dissolution of trimethylindium (TMI) was not possible as it started to settle down. The density of this solution was approximately 2 g/mL at room temperature.
- The apparatus used in the experiment to determine the flow behavior of this solution is shown in Figure 1. The
inlet 9 of a stainless steel (SS) bubbler (source) 10 containing Bu₃In/Me₃In solution was connected throughline 12 to atank 14 of semiconductor grade N₂ via amass flow controller 16. Theoutlet 17 of thebubbler 10 was connected throughline 18 to theoutlet 19 of another stainless steel bubbler (receiver) 20. (Thesecond bubbler 20 is used in reverse orientation from normal for this experiment; thus flow fromoutlet 17 ofbubbler 10 tooutlet 19 ofbubbler 20.) Thereceiver bubbler 20 was cooled by acoil condenser 22 maintained at -15 to -20°C. Theinlet 24 of this receiver was connected throughline 26 to a dry ice-cooledtrap 28 to condense the fugitive vapors from thereceiver 20. Thetrap 28 was connected throughline 29 to amineral oil bubbler 30 to maintain a by-pass of N₂ gas. - Additional features of the apparatus include a three-way valve in
line 12 used to evacuate the space between the inlet valve 34a of thenitrogen bubbler 10,several valves trap 30 and the space up to thereceiver valve 34e after connections are made. - The
source bubbler 10 was maintained at about 20°C while the carrier gas was passed through it at a rate of 500 SCCM. Such a high flow rate was chosen to deplete the contents of thebubbler 10 in a relatively less amount of time. It was observed that the saturation of the carrier gas with TMIn was approximately 40%. This is perhaps due to the high flow rate and somewhat lower source temperature. The saturation of the carrier gas can easily be increased to >80% by lowering the flow rate and increasing the source temperature to 30-40°C. - The amount of trimethylindium carried was monitored by the weight loss in the source bubbler. NMR spectra were obtained periodically to identify the material in the source bubbler and receiver bubbler. The data indicated that trimethylindium alone was carried through until toward the end. This has been confirmed by the gradual reduction of methyl peaks in the source bubbler. The receiver contained a white solid-trimethylindium-as evidenced by its NMR.
- The dosimetry of trimethylindium is shown in figure 2. A linear relationship exists up to 110 hours with a gradual slow down in the delivery of TMIn toward the end. In this experiment, approximately 13 grams of the total 15 grams of TMIn (3.0 grams was consumed for NMR samples) was transported in a very uniform manner corresponding to 85% of the initial amount of TMIn. The delivery of TMIn did not drop off even at this stage and showed no erratic delivery behavior. The NMR spectrum indicated a n-Bu₃In rich solution with >80% less TMIn than the initial mixture. These data confirm that TMIn could be consistently delivered for an extended period of time with a uniform rate. Furthermore, it is believed that this uniform delivery can be further enhanced by suspending additional TMIn in this solution.
Claims (5)
- A method of providing vapor phase trimethylindium comprising dissolving trimethylindium in a C₃-C₅ trialkylindium solvent to produce a solution and entraining trimethylindium from said solution with a carrier gas.
- A method according to claim 1 wherein said solvent comprises tri n-butylindium, triisobutylindium or a mixture thereof.
- A method according to claim 1 or claim 2 wherein said trimethylindium is dissolved at a molar ratio relative to said solvent of at least 0.05:1.
- A solution comprising a C₃-C₅trialkylindium solvent and trimethylindium dissolved therein.
- A solution according to claim 4 wherein said trimethylindium is dissolved at a molar ratio relative to said solvent of at least 0.05:1.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US97821 | 1993-07-27 | ||
US08/097,821 US5502227A (en) | 1993-07-27 | 1993-07-27 | Liquid indium source |
Publications (3)
Publication Number | Publication Date |
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EP0640610A2 true EP0640610A2 (en) | 1995-03-01 |
EP0640610A3 EP0640610A3 (en) | 1995-04-12 |
EP0640610B1 EP0640610B1 (en) | 2000-04-19 |
Family
ID=22265288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94303593A Expired - Lifetime EP0640610B1 (en) | 1993-07-27 | 1994-05-19 | Liquid indium source |
Country Status (7)
Country | Link |
---|---|
US (1) | US5502227A (en) |
EP (1) | EP0640610B1 (en) |
JP (1) | JP2596713B2 (en) |
KR (1) | KR0144640B1 (en) |
CA (1) | CA2124052C (en) |
DE (1) | DE69424007T2 (en) |
TW (1) | TW253888B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5783716A (en) * | 1996-06-28 | 1998-07-21 | Advanced Technology Materials, Inc. | Platinum source compositions for chemical vapor deposition of platinum |
JP2003252878A (en) * | 2002-01-17 | 2003-09-10 | Shipley Co Llc | Organic indium compound |
JP4954448B2 (en) | 2003-04-05 | 2012-06-13 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Organometallic compounds |
JP4689969B2 (en) * | 2003-04-05 | 2011-06-01 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Preparation of Group IVA and Group VIA compounds |
JP4714422B2 (en) | 2003-04-05 | 2011-06-29 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Method for depositing germanium-containing film and vapor delivery device |
PL1747302T3 (en) * | 2004-05-20 | 2013-05-31 | Akzo Nobel Chemicals Int Bv | Bubbler for constant vapor delivery of a solid chemical |
US20060121192A1 (en) * | 2004-12-02 | 2006-06-08 | Jurcik Benjamin J | Liquid precursor refill system |
EP3173507A1 (en) * | 2015-11-25 | 2017-05-31 | Umicore AG & Co. KG | Method for the organometallic gas phase deposition under use of solutions of indiumalkyl compounds in hydrocarbons |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0181706A1 (en) * | 1984-10-25 | 1986-05-21 | Morton Thiokol, Inc. | Hybrid organometallic compounds of In and ba and process for metal organic chemical vapour deposition |
US4847399A (en) * | 1987-01-23 | 1989-07-11 | Morton Thiokol, Inc. | Process for preparing or purifying Group III-A organometallic compounds |
WO1993003196A1 (en) * | 1991-07-30 | 1993-02-18 | Shell Internationale Research Maatschappij B.V. | Method for deposition of a metal |
-
1993
- 1993-07-27 US US08/097,821 patent/US5502227A/en not_active Expired - Fee Related
-
1994
- 1994-05-16 TW TW083104412A patent/TW253888B/zh active
- 1994-05-19 EP EP94303593A patent/EP0640610B1/en not_active Expired - Lifetime
- 1994-05-19 DE DE69424007T patent/DE69424007T2/en not_active Expired - Fee Related
- 1994-05-20 CA CA002124052A patent/CA2124052C/en not_active Expired - Fee Related
- 1994-06-10 KR KR1019940013089A patent/KR0144640B1/en not_active IP Right Cessation
- 1994-06-22 JP JP6139979A patent/JP2596713B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0181706A1 (en) * | 1984-10-25 | 1986-05-21 | Morton Thiokol, Inc. | Hybrid organometallic compounds of In and ba and process for metal organic chemical vapour deposition |
US4847399A (en) * | 1987-01-23 | 1989-07-11 | Morton Thiokol, Inc. | Process for preparing or purifying Group III-A organometallic compounds |
WO1993003196A1 (en) * | 1991-07-30 | 1993-02-18 | Shell Internationale Research Maatschappij B.V. | Method for deposition of a metal |
Also Published As
Publication number | Publication date |
---|---|
KR0144640B1 (en) | 1998-07-15 |
KR950003196A (en) | 1995-02-16 |
JP2596713B2 (en) | 1997-04-02 |
DE69424007T2 (en) | 2000-09-14 |
JPH07150357A (en) | 1995-06-13 |
CA2124052A1 (en) | 1995-01-28 |
CA2124052C (en) | 1996-11-26 |
EP0640610A3 (en) | 1995-04-12 |
EP0640610B1 (en) | 2000-04-19 |
TW253888B (en) | 1995-08-11 |
DE69424007D1 (en) | 2000-05-25 |
US5502227A (en) | 1996-03-26 |
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