EP0610126B1 - Improved microstrip antenna for microwave receiver - Google Patents

Improved microstrip antenna for microwave receiver Download PDF

Info

Publication number
EP0610126B1
EP0610126B1 EP94400204A EP94400204A EP0610126B1 EP 0610126 B1 EP0610126 B1 EP 0610126B1 EP 94400204 A EP94400204 A EP 94400204A EP 94400204 A EP94400204 A EP 94400204A EP 0610126 B1 EP0610126 B1 EP 0610126B1
Authority
EP
European Patent Office
Prior art keywords
dielectric layer
relation
microstrip line
printed circuit
microstrip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP94400204A
Other languages
German (de)
French (fr)
Other versions
EP0610126A1 (en
Inventor
Joel Medard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Dassault Electronique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dassault Electronique SA filed Critical Dassault Electronique SA
Publication of EP0610126A1 publication Critical patent/EP0610126A1/en
Application granted granted Critical
Publication of EP0610126B1 publication Critical patent/EP0610126B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna

Definitions

  • the invention relates to the technical field of devices microstrip or "microstrip" antennas.
  • the geometric dimensions of the conductive pad determine the central operating frequency of the antenna device and the thickness of said dielectric layer is substantially proportional to the width of the usable frequency band.
  • the usable frequency band in the field of telecommunications antennas, requires a thickness of dielectric layer such that, if it is desired to produce 50 Ohms microstrip lines, the width of these, is important, for example 20 mm wide for a 5 mm air thickness.
  • the invention provides a satisfactory solution to this problem.
  • the thickness of the dielectric layer with respect to the microstrip line is greater than that with respect to the periphery of said line.
  • Such an adaptation of the thickness of the dielectric layer, depending on the radio zone next to said layer avoids the use of microstrip lines wide, which consequently favors the establishment of feed distributor in an antenna device comprising a network of radiant conductive pavers.
  • the paving stone is generally circular or rectangular.
  • the conductive pad and its associated microstrip line are etched in a printed circuit metallized on one side, said block and line being at contact of the dielectric layer.
  • the substrate can act as a radome of protection.
  • the substrate participates less in losses by dielectric, which allows the use of cheaper substrates, not dedicated to microwave applications.
  • the substrate of the printed circuit is a glass fabric material impregnated with resin like epoxy, very widespread in low applications frequencies.
  • the plan conductor forming the ground plane consists of a plate metallic embossed with regard to the conductive pad and the microstrip line.
  • the metal plate is a stamped sheet.
  • the dielectric layer consists of air.
  • the device comprises a network of pavers with their associated microstrip lines, installed on the same printed circuit.
  • the antenna device is associated with a converter frequency giving it a microwave receiver function satellite TV signals.
  • the antenna device microstrip conventionally comprises a dielectric layer CD, carrying on one side a shaped PC driver pad chosen, and on the other a conducting plane forming a plane of mass PM.
  • the dielectric layer CD consists for example of air.
  • the conductive pad is engraved on a simple PCB face.
  • the PC driver block is etched by microphotolithography. It is made of a material such as copper, if applicable tinned or varnished for better protection. It has a general circular or rectangular shape.
  • the substrate of the printed circuit CI is for example constituted glass-based material and epoxy-type resin.
  • circuit substrate printed CI can be used here advantageously as a protective radome.
  • the glass-resin substrate is advantageously that sold under the reference FR4.
  • the LM microstrip supply line is also engraved in the PCB printed by a process classic microphotolithography.
  • the PM ground plane is produced in a metal plate of the stamped sheet type which is embossed to allow a adaptation of the thickness of the dielectric layer in function of the radio zones facing said layer to avoid widening the width of the microstrip lines.
  • This adaptation of the thickness according to the invention is such that the thickness of the dielectric layer EP with regard to the PC driver pad is greater than that with regard to the periphery of said EHP conductive pad and to that facing the EL microstrip line, while the thickness of the layer dielectric with regard to the EL microstrip line is greater to that with regard to the periphery of the said line EHL.
  • the width of the microstrip lines is around 4 mm for a characteristic impedance of 50 Ohms with a thickness EL of the order of 1 mm of the dielectric layer with regard to the microstrip line.
  • Such a structure finds an advantageous application in an antenna device comprising a network of paving stones interconnected to a microwave converter in the case of a microwave signal receiver application satellite television.
  • FIG 4 there is shown an antenna device network comprising a printed circuit on which are engraved the radiant pavers.
  • LM microstrip transmission lines connect the different conductive blocks to a CV frequency converter.
  • the CV frequency converter is installed on the PCB printed by the CMS technology called assembly of surface.
  • WI type dividers are provided WILKINSON with decoupling resistance to allow connection of the various PC driver blocks to the converter CV frequency.
  • each divider WI type Wilkinson is installed on the printed circuit according to a CMS technology called surface mounting.
  • a coaxial type UHF connector is located at the rear PM embossed metal sheet.
  • the CV frequency converter is capable of convert frequencies in the range of 2308 to 2482 MHz at a frequency of the order of 470 to 646 MHz.
  • the Applicant has obtained a receiving device operating at a center frequency of around 2.39 GHz and with a frequency bandwidth usable on the order of 6 to 8%.
  • the width of the LM microstrip lines is of the order of 4 mm
  • the thickness EP of the dielectric layer CD with regard to the PC pad is around 5 mm
  • the thickness EL is of the order of 1 mm.
  • the diameter of the conductive blocks is of the order of 52 mm.
  • the microwave converter is housed in a recess or boss of the ground plane.
  • the thicknesses EHP and EHL are zero insofar as the stamped sheet directly supports the circuit board in places other than pavers and microstrip lines. These thicknesses may not be zero when the dielectric is not air when a support is provided to support the printed circuit.
  • the main axis of the device antenna is generally directed towards the satellite.
  • the subject of the invention is generally a antenna system with radiating elements, of which the main axis does not point the satellite permanently by construction, and in which it is planned, at microstrip line feed distributor level of said radiating elements, a phase and / or time law appropriate.
  • Such a variant makes it possible to have a reception antenna by satellite in any location, for example plated on the facade of a building or on the roof of this one.

Abstract

The microstrip antenna device comprises: a dielectric layer (CD), carrying, on one side, a conducting block (PC) of chosen form and, on the other, a conducting plane forming an earth plane (PM); and a feed circuit comprising at least one microstrip line (LM) connected to the conducting block (PC) and embedded in the dielectric layer (CD) in the same plane as the conducting block (PC). The thickness of the dielectric layer with respect to the microstrip line (EL) is greater than that with respect to the periphery of the said microstrip line (ML). <IMAGE>

Description

L'invention se rapporte au domaine technique des dispositifs d'antennes microruban ou "microstrip".The invention relates to the technical field of devices microstrip or "microstrip" antennas.

Elle trouve une application particulière dans la réception hyperfréquence de signaux de télévision par satellite.It finds a particular application in the reception microwave signals from satellite television.

De façon connue, par exemple du document "Electronics and Communications in Japan, part I, vol 73, n° 4, Avril 1990, pages 81-90, Takao Murata et al, un dispositif d'antenne microruban comporte une structure rayonnante comprenant :

  • une couche diélectrique, portant d'un côté un pavé conducteur de forme choisie, et de l'autre un plan conducteur formant plan de masse, et
  • un circuit d'alimentation définissant le mode d'alimentation de cette structure rayonnante en énergie hyperfréquence et comprenant par exemple au moins une ligne microruban connectée au pavé conducteur et implantée dans la couche diélectrique dans le même plan que le pavé conducteur.
In a known manner, for example from the document "Electronics and Communications in Japan, part I, vol 73, n ° 4, April 1990, pages 81-90, Takao Murata et al, a microstrip antenna device comprises a radiating structure comprising:
  • a dielectric layer, carrying on one side a conductive block of selected shape, and on the other a conductive plane forming a ground plane, and
  • a supply circuit defining the mode of supply of this radiating structure with microwave energy and comprising for example at least one microstrip line connected to the conductive pad and implanted in the dielectric layer in the same plane as the conductive pad.

L'homme du métier sait que, pour une constante diélectrique donnée, les dimensions géométriques du pavé conducteur déterminent la fréquence centrale de fonctionnement du dispositif d'antenne et l'épaisseur de ladite couche diélectrique est sensiblement proportionnelle à la largeur de la bande de fréquence utilisable.Those skilled in the art know that, for a dielectric constant given, the geometric dimensions of the conductive pad determine the central operating frequency of the antenna device and the thickness of said dielectric layer is substantially proportional to the width of the usable frequency band.

Ainsi, pour conserver une largeur de bande de fréquence utilisable prédéterminée, il convient de déterminer une épaisseur de couche diélectrique correspondante.So to keep a frequency bandwidth usable predetermined, it is necessary to determine a corresponding thickness of dielectric layer.

La bande de fréquence utilisable, dans le domaine des antennes de télécommunication, nécessite une épaisseur de couche diélectrique telle que, si l'on désire réaliser des lignes microruban d'impédance 50 Ohms, la largeur de celles-ci, est importante, par exemple 20 mm de largeur pour une épaisseur de 5 mm d'air.The usable frequency band, in the field of telecommunications antennas, requires a thickness of dielectric layer such that, if it is desired to produce 50 Ohms microstrip lines, the width of these, is important, for example 20 mm wide for a 5 mm air thickness.

L'usage d'une telle largeur de ligne engendre des inconvénients, notamment pour l'implantation du distributeur d'alimentation lorsque le dispositif d'antenne comprend un réseau de pavés conducteurs ainsi que pour la réalisation des coupleurs résistifs des lignes microruban d'alimentation. Elle engendre également un rayonnement parasite plus important.The use of such a line width generates drawbacks, especially for the location of the distributor power when the antenna device includes a network of conductive pavers as well as for the realization of resistive couplers of the microstrip supply lines. It also generates more stray radiation.

Une solution consiste à travailler alors avec une impédance de ligne de valeur supérieure à 50 Ohms, par exemple 70 Ohms, mais elle a l'inconvénient d'impliquer des tronçons d'adaptation encombrants et difficiles à mettre en oeuvre.One solution is to work with an impedance lines with a value greater than 50 Ohms, for example 70 Ohms, but it has the disadvantage of involving adaptation sections bulky and difficult to implement.

L'invention apporte une solution satisfaisante à ce problème.The invention provides a satisfactory solution to this problem.

Elle porte sur un dispositif d'antenne microruban selon la revendication 1.It relates to a microstrip antenna device according to claim 1.

Selon une définition générale de l'invention, l'épaisseur de la couche diélectrique au regard de la ligne microruban est supérieure à celle au regard de la périphérie de ladite ligne.According to a general definition of the invention, the thickness of the dielectric layer with respect to the microstrip line is greater than that with respect to the periphery of said line.

Une telle adaptation de l'épaisseur de la couche diélectrique, en fonction de la zone radioélectrique en regard de ladite couche, permet d'éviter l'usage de lignes microruban larges, ce qui favorise en conséquence l'implantation de distributeur d'alimentation dans un dispositif d'antenne comprenant un réseau de pavés conducteurs rayonnants.Such an adaptation of the thickness of the dielectric layer, depending on the radio zone next to said layer avoids the use of microstrip lines wide, which consequently favors the establishment of feed distributor in an antenna device comprising a network of radiant conductive pavers.

En pratique, le pavé est de forme générale circulaire ou rectangulaire.In practice, the paving stone is generally circular or rectangular.

Selon un aspect de l'invention, le pavé conducteur et sa ligne microruban associée sont gravés dans un circuit imprimé métallisé sur une seule face, lesdits pavé et ligne étant au contact de la couche diélectrique.According to one aspect of the invention, the conductive pad and its associated microstrip line are etched in a printed circuit metallized on one side, said block and line being at contact of the dielectric layer.

Une telle réalisation a pour conséquence de mettre le substrat du circuit imprimé au-dessus du pavé et de sa ligne par rapport au plan de masse, ce qui confère deux avantages.The consequence of such an achievement is to put the substrate of the printed circuit above the block and its line compared to the ground plane, which gives two advantages.

Tout d'abord, le substrat peut assurer le rôle de radôme de protection.First, the substrate can act as a radome of protection.

Enfin, le substrat participe moins aux pertes par diélectrique, ce qui permet d'utiliser des substrats moins chers, non dédiés aux applications hyperfréquences.Finally, the substrate participates less in losses by dielectric, which allows the use of cheaper substrates, not dedicated to microwave applications.

Avantageusement, le substrat du circuit imprimé est un matériau à base de tissu de verre imprégné de résine genre époxy, très largement répandu dans les applications basses fréquences.Advantageously, the substrate of the printed circuit is a glass fabric material impregnated with resin like epoxy, very widespread in low applications frequencies.

Selon un mode de réalisation préféré de l'invention, le plan conducteur formant plan de masse est constitué d'une plaque métallique embossée au regard du pavé conducteur et de la ligne microruban.According to a preferred embodiment of the invention, the plan conductor forming the ground plane consists of a plate metallic embossed with regard to the conductive pad and the microstrip line.

Par exemple, la plaque métallique est une tôle emboutie.For example, the metal plate is a stamped sheet.

Selon une caractéristique importante de l'invention, la couche diélectrique est constituée d'air.According to an important characteristic of the invention, the dielectric layer consists of air.

Selon une application de l'invention, le dispositif comprend un réseau de pavés avec leurs lignes microruban associées, implantés sur le même circuit imprimé.According to an application of the invention, the device comprises a network of pavers with their associated microstrip lines, installed on the same printed circuit.

Avantageusement, dans l'application récepteur hyperfréquence, le dispositif d'antenne est associé à un convertisseur de fréquence lui conférant une fonction de récepteur hyperfréquence de signaux de télévision par satellite. Advantageously, in the microwave receiver application, the antenna device is associated with a converter frequency giving it a microwave receiver function satellite TV signals.

D'autres caractéristiques et avantages de l'invention apparaítront à la lumière de la description détaillée ci-après et des dessins dans lesquels :

  • la figure 1 est une vue en coupe partielle selon la coupe B-B' d'un pavé conducteur selon l'invention ;
  • la figure 2 est une vue en coupe partielle selon la coupe A-A' d'une ligne microruban selon l'invention ;
  • la figure 3 est une vue en coupe partielle selon la coupe C-C' d'un pavé conducteur et d'une ligne microruban selon l'invention ; et
  • la figure 4 est une vue de dessus de dix pavés conducteurs interconnectés à un convertisseur de fréquence selon l'invention.
Other characteristics and advantages of the invention will become apparent in the light of the detailed description below and of the drawings in which:
  • Figure 1 is a partial sectional view along section BB 'of a conductive pad according to the invention;
  • Figure 2 is a partial sectional view along section AA 'of a microstrip line according to the invention;
  • Figure 3 is a partial sectional view along section CC 'of a conductive pad and a microstrip line according to the invention; and
  • Figure 4 is a top view of ten conductive blocks interconnected to a frequency converter according to the invention.

En référence aux figures 1 à 3, le dispositif d'antenne microruban comprend d'une façon classique une couche diélectrique CD, portant d'un côté un pavé conducteur PC de forme choisie, et de l'autre un plan conducteur formant plan de masse PM.Referring to Figures 1 to 3, the antenna device microstrip conventionally comprises a dielectric layer CD, carrying on one side a shaped PC driver pad chosen, and on the other a conducting plane forming a plane of mass PM.

La couche diélectrique CD est constituée par exemple d'air.The dielectric layer CD consists for example of air.

Le pavé conducteur est gravé sur un circuit imprimé CI simple face.The conductive pad is engraved on a simple PCB face.

Par exemple, le pavé conducteur PC est gravé par microphotolithographie. Il est constitué d'un matériau tel que du cuivre, le cas échéant étamé ou verni pour une meilleure protection. Il a une forme générale circulaire ou rectangulaire.For example, the PC driver block is etched by microphotolithography. It is made of a material such as copper, if applicable tinned or varnished for better protection. It has a general circular or rectangular shape.

Le substrat du circuit imprimé CI est par exemple constitué d'un matériau à base de verre et de résine genre époxy. The substrate of the printed circuit CI is for example constituted glass-based material and epoxy-type resin.

L'homme du métier comprendra que le substrat du circuit imprimé CI peut servir ici avantageusement de radôme protecteur.Those skilled in the art will understand that the circuit substrate printed CI can be used here advantageously as a protective radome.

Pour des raisons de coût, le substrat verre-résine est avantageusement celui vendu sous la référence FR4.For cost reasons, the glass-resin substrate is advantageously that sold under the reference FR4.

De préférence, la ligne microruban d'alimentation LM est elle aussi gravée dans le circuit imprimé CI par un procédé classique de microphotolithogravure.Preferably, the LM microstrip supply line is also engraved in the PCB printed by a process classic microphotolithography.

Le plan de masse PM est réalisé dans une plaque métallique du type tôle emboutie qui est embossée pour permettre une adaptation de l'épaisseur de la couche diélectrique en fonction des zones radioélectriques en regard de ladite couche afin d'éviter d'élargir la largeur des lignes microruban.The PM ground plane is produced in a metal plate of the stamped sheet type which is embossed to allow a adaptation of the thickness of the dielectric layer in function of the radio zones facing said layer to avoid widening the width of the microstrip lines.

Cette adaptation de l'épaisseur selon l'invention est telle que l'épaisseur de la couche diélectrique EP au regard du pavé conducteur PC est supérieure à celle au regard de la périphérie dudit pavé conducteur EHP et à celle au regard de la ligne microruban EL, tandis que l'épaisseur de la couche diélectrique au regard de la ligne microruban EL est supérieure à celle au regard de la périphérie de ladite ligne EHL.This adaptation of the thickness according to the invention is such that the thickness of the dielectric layer EP with regard to the PC driver pad is greater than that with regard to the periphery of said EHP conductive pad and to that facing the EL microstrip line, while the thickness of the layer dielectric with regard to the EL microstrip line is greater to that with regard to the periphery of the said line EHL.

Une telle structure permet de simplifier notablement le dispositif d'antenne et ainsi d'affaiblir le coût de réalisation.Such a structure makes it possible to considerably simplify the antenna device and thus weaken the cost of realization.

Par exemple, la largeur des lignes microruban est de l'ordre de 4 mm pour une impédance caractéristique de 50 Ohms avec une épaisseur EL de l'ordre de 1 mm de la couche diélectrique au regard de la ligne microruban.For example, the width of the microstrip lines is around 4 mm for a characteristic impedance of 50 Ohms with a thickness EL of the order of 1 mm of the dielectric layer with regard to the microstrip line.

Une telle structure trouve une application avantageuse dans un dispositif d'antenne comprenant un réseau de pavés interconnectés à un convertisseur hyperfréquence dans le cas d'une application récepteur hyperfréquence de signaux de télévision par satellite.Such a structure finds an advantageous application in an antenna device comprising a network of paving stones interconnected to a microwave converter in the case of a microwave signal receiver application satellite television.

Sur la figure 4, il est représenté un dispositif d'antenne réseau comprenant un circuit imprimé sur lequel sont gravés les pavés rayonnants.In Figure 4, there is shown an antenna device network comprising a printed circuit on which are engraved the radiant pavers.

Dans l'application visée, dix pavés circulaires PC individualisées en PC1 à PC10 sont gravés sur le circuit imprimé.In the targeted application, ten individual PC circular tiles in PC1 to PC10 are engraved on the printed circuit.

Des lignes de transmission microruban LM relient les différents pavés conducteurs à un convertisseur de fréquence CV.LM microstrip transmission lines connect the different conductive blocks to a CV frequency converter.

Par exemple, le convertisseur de fréquence CV est implanté sur le circuit imprimé CI par la technologie CMS dite montage de surface.For example, the CV frequency converter is installed on the PCB printed by the CMS technology called assembly of surface.

De façon classique, il est prévu des diviseurs WI type WILKINSON avec résistance de découplage pour permettre la liaison des différents pavés conducteurs PC au convertisseur de fréquence CV.Conventionally, WI type dividers are provided WILKINSON with decoupling resistance to allow connection of the various PC driver blocks to the converter CV frequency.

De préférence, la résistance de découplage de chaque diviseur WI de type Wilkinson est implanté sur le circuit imprimé selon une technologie CMS dite montage de surface.Preferably, the decoupling resistance of each divider WI type Wilkinson is installed on the printed circuit according to a CMS technology called surface mounting.

Enfin, un connecteur UHF du type coaxial est situé à l'arrière de la tôle métallique embossée PM.Finally, a coaxial type UHF connector is located at the rear PM embossed metal sheet.

Par exemple, le convertisseur de fréquence CV est capable de convertir les fréquences d'une plage de l'ordre de 2308 à 2482 MHz à une fréquence de l'ordre de 470 à 646 MHz.For example, the CV frequency converter is capable of convert frequencies in the range of 2308 to 2482 MHz at a frequency of the order of 470 to 646 MHz.

Avec une telle structure, la Demanderesse a obtenu un dispositif récepteur fonctionnant à une fréquence centrale de l'ordre de 2,39 GHz et avec une largeur de bande de fréquence utilisable de l'ordre de 6 à 8%. With such a structure, the Applicant has obtained a receiving device operating at a center frequency of around 2.39 GHz and with a frequency bandwidth usable on the order of 6 to 8%.

Pour un tel résultat, la largeur des lignes microruban LM est de l'ordre de 4 mm, l'épaisseur EP de la couche diélectrique CD au regard du pavé PC est de l'ordre de 5 mm et l'épaisseur EL est de l'ordre de 1 mm. Le diamètre des pavés conducteurs est de l'ordre de 52 mm.For such a result, the width of the LM microstrip lines is of the order of 4 mm, the thickness EP of the dielectric layer CD with regard to the PC pad is around 5 mm and the thickness EL is of the order of 1 mm. The diameter of the conductive blocks is of the order of 52 mm.

En variante, le convertisseur hyperfréquence est logé dans un évidement ou bossage du plan de masse.Alternatively, the microwave converter is housed in a recess or boss of the ground plane.

Dans cette structure, les épaisseurs EHP et EHL sont nulles dans la mesure où la tôle emboutie soutient directement le circuit imprimé aux endroits autres que les pavés et les lignes microruban. Ces épaisseurs peuvent ne pas être nulles lorsque le diélectrique n'est pas de l'air lorsqu'un support est prévu pour supporter le circuit imprimé.In this structure, the thicknesses EHP and EHL are zero insofar as the stamped sheet directly supports the circuit board in places other than pavers and microstrip lines. These thicknesses may not be zero when the dielectric is not air when a support is provided to support the printed circuit.

L'homme du métier comprendra que la réalisation d'un tel dispositif d'antenne est susceptible d'être réalisé à faible coût, ce qui permet une application grand public, notamment pour les dispositifs d'antenne pour la réception hyperfréquence de signaux de télévision par satellite.Those skilled in the art will understand that the realization of such a antenna device is likely to be realized at low cost, which allows a general public application, in particular for antenna devices for microwave reception satellite TV signals.

Dans l'application réception hyperfréquence de signaux de télévision par satellite, l'axe principal du dispositif d'antenne est généralement dirigé vers le satellite.In the microwave signal reception application satellite TV, the main axis of the device antenna is generally directed towards the satellite.

En variante, l'invention a généralement pour objet un dispositif d'antenne à réseau d'éléments rayonnants, dont l'axe principal ne pointe pas le satellite de façon permanente par construction, et dans lequel il est prévu, au niveau du distributeur d'alimentation en lignes microruban desdits éléments rayonnants, une loi de phase et/ou de temps appropriée.As a variant, the subject of the invention is generally a antenna system with radiating elements, of which the main axis does not point the satellite permanently by construction, and in which it is planned, at microstrip line feed distributor level of said radiating elements, a phase and / or time law appropriate.

Une telle variante permet de disposer une antenne de réception par satellite dans un endroit quelconque, par exemple plaquée sur la façade d'un immeuble ou sur le toit de celui-ci.Such a variant makes it possible to have a reception antenna by satellite in any location, for example plated on the facade of a building or on the roof of this one.

Claims (9)

  1. Microstrip antenna device comprising:
    a dielectric layer (DC) carrying a conductive pad (PC) of chosen shape on one side, and a conductive plane forming an earth plane (PM) on the other side; and
    a feed circuit comprising at least one microstrip line (LM) connected to the conductive pad (PC) and implanted in the dielectric layer (CD) in the same plane as the conductive pad (PC),
    the thickness of the dielectric layer in relation to the conductive pad (EP) being greater than the thickness of the said layer in relation to the periphery of the said pad (EHP), and
    the conductive pad (PC) and the microstrip line (LM) being etched on a first face of a single-sided printed circuit (CI),
    characterized in that the thickness of the dielectric layer in relation to the microstrip line (EL) is greater than the thickness of the said layer in relation to the periphery of the said line (EHL), and in that the said first face is in direct contact with the dielectric layer (CD) while the second face of the printed circuit acts as a radome.
  2. Device according to Claim 1, characterized in that the substrate of the printed circuit (CI) consists of a material based on glass and resin, of the epoxy kind.
  3. Device according to one of Claims 1 and 2, characterized in that the conductive plane forming the earth plane (PM) consists of a metal plate embossed in relation to the conductive pad and the microstrip line.
  4. Device according to Claim 3, characterized in that the metal plate is a stamped sheet.
  5. Device according to Claim 1, characterized in that the dielectric layer (CD) consists solely of air.
  6. Device according to Claim 1, characterized in that the thicknesses of the dielectric layer respectively in relation to the periphery of the pad (EHP) and in relation to the periphery of the microstrip line (EHL) are substantially zero, the stamped sheet supporting the printed circuit.
  7. Device according to one of Claims 1 to 6, characterized in that it comprises an array of pads implanted with their associated microstrip lines, and implanted on the same printed circuit.
  8. Device according to Claim 7, characterized in that it is associated with a frequency converter (CV) conferring thereon a function of microwave receiver of satellite television signals.
  9. Device according to Claim 7 or 8, characterized in that the pointing of the beam of the antenna is continuously altered by construction by devising, with regard to the microstrip line feed distributor of the array of pads, an appropriate phase and/or time law.
EP94400204A 1993-02-04 1994-01-31 Improved microstrip antenna for microwave receiver Expired - Lifetime EP0610126B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9301248 1993-02-04
FR9301248A FR2701168B1 (en) 1993-02-04 1993-02-04 Microstrip antenna device improved in particular for microwave receiver.

Publications (2)

Publication Number Publication Date
EP0610126A1 EP0610126A1 (en) 1994-08-10
EP0610126B1 true EP0610126B1 (en) 1998-08-12

Family

ID=9443733

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94400204A Expired - Lifetime EP0610126B1 (en) 1993-02-04 1994-01-31 Improved microstrip antenna for microwave receiver

Country Status (9)

Country Link
US (1) US5477231A (en)
EP (1) EP0610126B1 (en)
JP (1) JPH06260830A (en)
AT (1) ATE169777T1 (en)
DE (1) DE69412296T2 (en)
DK (1) DK0610126T3 (en)
ES (1) ES2122180T3 (en)
FR (1) FR2701168B1 (en)
GR (1) GR3027646T3 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2312791A (en) * 1996-05-02 1997-11-05 Northern Telecom Ltd Antenna array assembly
SE9702490D0 (en) * 1997-06-27 1997-06-27 Ericsson Telefon Ab L M Microstrip structure
US5990835A (en) * 1997-07-17 1999-11-23 Northern Telecom Limited Antenna assembly
DE19809819A1 (en) * 1998-02-27 1999-09-02 Siemens Ag Power transmission system with sensor and allocated antenna
US6011522A (en) * 1998-03-17 2000-01-04 Northrop Grumman Corporation Conformal log-periodic antenna assembly
US6018323A (en) * 1998-04-08 2000-01-25 Northrop Grumman Corporation Bidirectional broadband log-periodic antenna assembly
US6140965A (en) * 1998-05-06 2000-10-31 Northrop Grumman Corporation Broad band patch antenna
US6181279B1 (en) 1998-05-08 2001-01-30 Northrop Grumman Corporation Patch antenna with an electrically small ground plate using peripheral parasitic stubs
US6879290B1 (en) * 2000-12-26 2005-04-12 France Telecom Compact printed “patch” antenna
FI113589B (en) * 2001-01-25 2004-05-14 Pj Microwave Oy Mikrovågsantennarrangemang
US7180440B2 (en) * 2001-02-03 2007-02-20 Robert Bosch Gmbh Integrated circuit for a radar device in a hermetically sealed housing comprising a patch antenna formed from a bent component from sheet metal
TWI260821B (en) * 2005-08-12 2006-08-21 Tatung Co Dual operational frequency antenna
JP2010114645A (en) * 2008-11-06 2010-05-20 Japan Radio Co Ltd Antenna device, and array antenna device provided with the same
GB2535216B (en) * 2015-02-13 2019-04-24 Cambium Networks Ltd Antenna array assembly using a dielectric film and a ground plate with a contoured surface

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0521377A2 (en) * 1991-07-03 1993-01-07 Ball Corporation Microstrip patch antenna structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221007A (en) * 1983-05-31 1984-12-12 Nippon Telegr & Teleph Corp <Ntt> Microstrip antenna
CA1250046A (en) * 1984-07-13 1989-02-14 Masayuki Matsuo Microwave plane antenna for receiving circularly polarized waves
JPS62118609A (en) * 1985-11-18 1987-05-30 Matsushita Electric Works Ltd Manufacture of plane antenna
DE3738513A1 (en) * 1987-11-13 1989-06-01 Dornier System Gmbh MICROSTRIP LADDER AERIAL
JPH0262703A (en) * 1988-08-29 1990-03-02 Matsushita Electric Ind Co Ltd Digital signal recording and reproducing device
JPH02141007A (en) * 1988-11-21 1990-05-30 Mitsubishi Electric Corp Micro-strip antenna
GB8904302D0 (en) * 1989-02-24 1989-04-12 Marconi Co Ltd Microwave antenna array
JPH03151702A (en) * 1989-11-08 1991-06-27 Sony Corp Plane array antenna

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0521377A2 (en) * 1991-07-03 1993-01-07 Ball Corporation Microstrip patch antenna structure

Also Published As

Publication number Publication date
JPH06260830A (en) 1994-09-16
EP0610126A1 (en) 1994-08-10
GR3027646T3 (en) 1998-11-30
DK0610126T3 (en) 1998-12-14
ATE169777T1 (en) 1998-08-15
US5477231A (en) 1995-12-19
ES2122180T3 (en) 1998-12-16
FR2701168A1 (en) 1994-08-05
FR2701168B1 (en) 1995-04-07
DE69412296T2 (en) 1999-04-22
DE69412296D1 (en) 1998-09-17

Similar Documents

Publication Publication Date Title
EP0610126B1 (en) Improved microstrip antenna for microwave receiver
EP0889541B1 (en) Helix antenna with variable length
EP0089084B1 (en) Flat microwave antenna structure
EP0899814B1 (en) Radiating structure
EP1038333B1 (en) Patch antenna
EP1723693B1 (en) Antenna with variable misalignment comprising at least one phase-changing element
EP0123350A1 (en) Plane microwave antenna with a totally suspended microstrip array
EP0307338B1 (en) Microwave plate antenna, especially for a Doppler radar
FR2683952A1 (en) IMPROVED MICRO-TAPE ANTENNA DEVICE, PARTICULARLY FOR TELEPHONE TRANSMISSIONS BY SATELLITE.
EP2710676B1 (en) Radiating element for an active array antenna consisting of elementary tiles
FR2952240A1 (en) DIELECTRIC RESONATOR ANTENNA WITH DOUBLE POLARIZATION
EP1399986B1 (en) Antenna window with high frequency component
FR2926929A1 (en) PRINTED ANTENNA HAVING A BI-BEAM DIAGRAM
EP0999608B1 (en) Multifunctional printed antenna
CA2282679A1 (en) Antenna for transmitting and/or receiving signals with rectilinear polarisation
EP2174381A1 (en) Antenna module including integrated radome
JP2846609B2 (en) Dual-polarized antenna
EP2432072B1 (en) Wideband balun on a multilayer circuit for a network antenna
FR2662026A1 (en) PLANE ORIENTABLE ANTENNA, OPERATING IN MICROWAVE.
EP0586010B1 (en) High frequency circuit device and method for making the same
CA2808511A1 (en) Flat antenna for a terminal operating in dual circular polarisation, airborne terminal and satellite telecommunication system featuring at least one antenna
FR2784236A1 (en) FREQUENCY SWITCHED ANTENNA
US20050174288A1 (en) Antenna
EP0983616B1 (en) Method and device for connecting two millimetric elements
FR2911998A1 (en) Omnidirectional broadband aerial for use in e.g. portable computer, has primary sections connected to extremities of preceding and following sections through secondary sections and by extremities without connecting to two sections

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE

17P Request for examination filed

Effective date: 19940924

17Q First examination report despatched

Effective date: 19961011

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19980812

REF Corresponds to:

Ref document number: 169777

Country of ref document: AT

Date of ref document: 19980815

Kind code of ref document: T

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19980813

REF Corresponds to:

Ref document number: 69412296

Country of ref document: DE

Date of ref document: 19980917

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: FRENCH

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: PATENTANWAELTE SCHAAD, BALASS, MENZL & PARTNER AG

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2122180

Country of ref document: ES

Kind code of ref document: T3

REG Reference to a national code

Ref country code: PT

Ref legal event code: SC4A

Free format text: AVAILABILITY OF NATIONAL TRANSLATION

Effective date: 19981022

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990131

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990131

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990131

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990731

26N No opposition filed
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20000731

REG Reference to a national code

Ref country code: PT

Ref legal event code: MM4A

Free format text: LAPSE DUE TO NON-PAYMENT OF FEES

Effective date: 20000731

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20011220

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20011228

Year of fee payment: 9

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20020102

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20020107

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20020108

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IE

Payment date: 20020117

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20020121

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20020128

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20020129

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 20020318

Year of fee payment: 9

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030131

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030131

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030131

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030131

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030201

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030801

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030801

GBPC Gb: european patent ceased through non-payment of renewal fee
REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

EUG Se: european patent has lapsed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030930

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 20030801

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20030201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20050131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990131