EP0519033A1 - Procede et dispositif de mesure de la temperature d'un objet, et procede de chauffage - Google Patents

Procede et dispositif de mesure de la temperature d'un objet, et procede de chauffage

Info

Publication number
EP0519033A1
EP0519033A1 EP92901693A EP92901693A EP0519033A1 EP 0519033 A1 EP0519033 A1 EP 0519033A1 EP 92901693 A EP92901693 A EP 92901693A EP 92901693 A EP92901693 A EP 92901693A EP 0519033 A1 EP0519033 A1 EP 0519033A1
Authority
EP
European Patent Office
Prior art keywords
radiation
pick
change
temperature
halogen lamps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP92901693A
Other languages
German (de)
English (en)
Inventor
Peter Michael Noel Vandenabeele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of EP0519033A1 publication Critical patent/EP0519033A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0801—Means for wavelength selection or discrimination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
    • G01J5/0804—Shutters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0896—Optical arrangements using a light source, e.g. for illuminating a surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/80—Calibration
    • G01J5/802—Calibration by correcting for emissivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0074—Radiation pyrometry, e.g. infrared or optical thermometry having separate detection of emissivity

Definitions

  • the present invention provides a method for measuring the temperature of an object that is heated by one or more radiation sources, wherein radiation generated by the object is received in at least one radiation pick-up and wherein the radiation sources are changed at least partially in intensity at a predetermined cyclic rate of change and wherein on the basis of the change in the radiation value measured by the radiation pick-up the degree of compensation
  • SUBSTITUTESHEET for the reflectivity and/or emissivity of the object is determined.
  • the present invention further provides a device for measuring the temperature of an object comprising: - one or more radiation sources for heating the ob ⁇ ject;
  • the present invention provides a method for heating an object wherein the compensation steps of the above method and device are applied.
  • fig. 1 shows a schematic view in section of a prefer ⁇ red embodiment of the present invention
  • fig. 2 shows a view over the line II-II in fig. 1
  • fig. 3 and 4 show graphs elucidating the preferred embodiment of the present invention
  • fig. 5 shows a further graph of measurements according to the present invention.
  • An object W for instance a wafer of Si material which may or may not be provided with insulating portions, is placed in a schematically designated RTP device 1 (fig. 1, 2) for heating by halogen lamps 2, 3 arranged respectively in an upper part 4 and a lower part 5.
  • a radiation pick-up 6 is provided with a lens 7 oriented through a schematically designated opening 8 between the halogen lamps 3 and towards the wafer .
  • a large aperture ⁇ is obtained so that, as indicated with broken lines in fig. 1, rays of
  • SUBSTITUTESHEET halogen lamps 3 reflected against wafer W as well as radiation from the halogen lamp 2 passing through the wafer W can be received in a sufficiently large solid angle.
  • a curve C] measured by a thermocouple indicates the temperature T as a function of time t, when the power is applied to the lamps 2 of fig. 1 as shown in fig. 3.
  • the curve C 2 shows the signal 6 received by the pyrometer 6, wherein the pyrometer is sensitive to radiation around a wavelength of 1.7 ⁇ m.
  • the reflectivity of the object W can be determined in the same way using variations in the intensity generated by the lamps 3.
  • the output signal of the radiation pick-up or pyrometer 6 can be compensated for transmissivity and reflectivity of the wafer W-using correlation techniques and a reliable temperature measurement of the wafer can be obtained irrespective of the material thereof, the roughness etc.
  • halogen lamps 2 and 3 respectively are varied or modulated with mutually differing frequencies
  • SUBSTITUTESHEET compensation can be made separately in the output signal of the pyrometer 6 for either reflectivity or emissivity with per se known correlation techniques.
  • the rear wall of the upper part 4 of the device 1 is preferably provided with a non-reflecting or black layer such as a filter or organic coating layer.
  • a window-shaped filter is pre ⁇ ferably placed in front of the pyrometer 6, whereby a more uniform distribution of the radiation intensity of the lamps 2 over the aperture ⁇ is obtained.
  • the curve C 3 measured according to the method of the present invention corresponds the temperature C 4 of the wafer as measured by a thermocouple.
  • C 5 and C 6 show the signal of a pyrometer and the emissivity resp.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Radiation Pyrometers (AREA)

Abstract

Procédé de mesure de la température d'un objet chauffé par une ou plusieurs sources de radiations, les radiations générées par l'objet étant captées par au moins un capteur de radiations, et l'intensité des sources de radiations étant modifiée au moins en partie selon un taux cyclique prédéterminé de modification. Ainsi, on peut déterminer le degré de compensation du pouvoir réfléchissant et de l'émittance de l'objet en fonction de la modification de la valeur de radiation mesurée par le capteur de radiations.
EP92901693A 1991-01-08 1992-01-08 Procede et dispositif de mesure de la temperature d'un objet, et procede de chauffage Withdrawn EP0519033A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9100018 1991-01-08
NL9100018A NL9100018A (nl) 1991-01-08 1991-01-08 Werkwijze en inrichting voor het meten van de temperatuur van een voorwerp, alsmede verwarmingswerkwijze.

Publications (1)

Publication Number Publication Date
EP0519033A1 true EP0519033A1 (fr) 1992-12-23

Family

ID=19858700

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92901693A Withdrawn EP0519033A1 (fr) 1991-01-08 1992-01-08 Procede et dispositif de mesure de la temperature d'un objet, et procede de chauffage

Country Status (5)

Country Link
EP (1) EP0519033A1 (fr)
JP (1) JPH05507356A (fr)
KR (1) KR920704108A (fr)
NL (1) NL9100018A (fr)
WO (1) WO1992012405A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9124797D0 (en) * 1991-11-22 1992-01-15 Secretary Trade Ind Brit Temperature measuring apparatus
US5444815A (en) * 1993-12-16 1995-08-22 Texas Instruments Incorporated Multi-zone lamp interference correction system
DE4414391C2 (de) * 1994-04-26 2001-02-01 Steag Rtp Systems Gmbh Verfahren für wellenvektorselektive Pyrometrie in Schnellheizsystemen
DE19534440A1 (de) * 1995-09-16 1997-03-20 Bergmann Hans Wilhelm Verfahren und Vorrichtung zur schnellen und berührungslosen Temperaturmessung an farbigen Metallen und anderen anorganischen Stoffen
JP4558411B2 (ja) * 2004-08-24 2010-10-06 富士通セミコンダクター株式会社 急速熱処理装置及び方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH537009A (de) * 1971-10-11 1973-05-15 Bbc Brown Boveri & Cie Verfahren zur berührungslosen Messung der Oberflächentemperatur an einem Objekt
FR2602590B1 (fr) * 1986-08-08 1989-11-10 Electricite De France Procede de mesure de la temperature d'un corps par detection optique et echauffement module
US4890245A (en) * 1986-09-22 1989-12-26 Nikon Corporation Method for measuring temperature of semiconductor substrate and apparatus therefor
US4956538A (en) * 1988-09-09 1990-09-11 Texas Instruments, Incorporated Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors
NL8900003A (nl) * 1989-01-02 1990-08-01 Imec Inter Uni Micro Electr Inrichting en werkwijze voor het behandelen van een of meer plakken materiaal.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9212405A1 *

Also Published As

Publication number Publication date
NL9100018A (nl) 1992-08-03
WO1992012405A1 (fr) 1992-07-23
KR920704108A (ko) 1992-12-19
JPH05507356A (ja) 1993-10-21

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