EP0458922A1 - Verfahren zur herstellung eines oberflächenbeschichteten bauteils, insbesondere eines kontaktstücks für einen vakuumschalter, und vorrichtung zur durchführung dieses verfahrens. - Google Patents
Verfahren zur herstellung eines oberflächenbeschichteten bauteils, insbesondere eines kontaktstücks für einen vakuumschalter, und vorrichtung zur durchführung dieses verfahrens.Info
- Publication number
- EP0458922A1 EP0458922A1 EP91900146A EP91900146A EP0458922A1 EP 0458922 A1 EP0458922 A1 EP 0458922A1 EP 91900146 A EP91900146 A EP 91900146A EP 91900146 A EP91900146 A EP 91900146A EP 0458922 A1 EP0458922 A1 EP 0458922A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- local area
- melted
- additive
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/0203—Contacts characterised by the material thereof specially adapted for vacuum switches
Definitions
- Component in particular a contact piece for one
- Vacuum switch and device for performing this
- the invention is based on a method for producing a surface-coated component, in particular a contact piece for a vacuum switch, according to the preamble of claim 1.
- the invention also relates to a device for carrying out this method.
- the invention relates to a prior art, such as is described in DE-Al-3541584.
- a method specified in this patent publication serves to produce metal composite materials from a base material with at least one metal and further active components.
- a substrate made of the base material is melted locally in a targeted manner by means of energy radiation, and the active component is added to the melting volume.
- This requires beams with an extremely high beam current density, such as laser beams, and special energy transmission devices with which the active components can be accelerated to high speeds.
- the invention achieves the object of specifying a method for producing a surface-coated component, in particular a contact piece for a vacuum switch, with which large-area components can also be produced with little outlay on equipment.
- the method according to the invention enables the production of highly resilient surface-coated components with little outlay on equipment.
- Low demands are placed on the heat flow source because its beam current density can be kept low. Due to the low jet current density of the heat flow source, evaporation and spraying away of additive are largely avoided in the manufacture of the components.
- the target stoichiometry of the surface layer is therefore not impaired.
- Surface layers of up to several millimeters can be easily achieved. Such surface layers are particularly suitable as an arcing contact layer of the contact pieces of vacuum switches, particularly when they are designed as copper-chrome layers.
- Fig.l an apparatus for performing the method according to the invention
- Figure 2 is a plan view of a perpendicular to
- FIG. 3 shows a plan view of the location of the substrate 1 shown in section in FIG. 2.
- the substrate 1 is, for example, a copper disc of approximately 40 mm in diameter and approximately 8 mm in thickness, but can also any other suitable metallic body.
- the support device 3 consists, for example, of a good heat-conducting material, such as preferably copper or silver, and has a support 5 mounted on a rotating device 4 which is cooled approximately with water. 6 denotes a heat flow source.
- This heat flow source advantageously emits high-energy corpuscular beams, such as electron or ion beams, but can also be designed as a Hall generator or any other suitable device.
- This heat flow source advantageously has a beam current density of a few to a few hundred kilowatts per square centimeter.
- the heat flow source advantageously has a total output of a few hundred watts up to approx. 20 kilowatts.
- 7 denotes an additive supply device for receiving a powdery additive 8, which is trickled down onto the surface of the substrate 1 in the direction of the arrows 9 to form a powder layer 10.
- the additive preferably has lower thermal conductivity than the substrate 1 and can contain chromium or an alloy based on chromium and copper when producing a contact piece for a vacuum switch with a backing consisting predominantly of copper.
- the substrate 1 which then contains predominantly copper, the additive 8 which then contains predominantly chromium powder, and the heat flow source 6, which operates approximately on the basis of electron beams, are in a vacuum of approx. 10 ⁇ 6 mbar.
- the support device 3 rotates about an axis 11 such that an average advance of the substrate 1 relative to the heat flow source 6 of, for example, 5-10 cm / s is achieved.
- An energy flow 12 emitted by the heat flow source 6 simultaneously falls on one Part of the substrate surface. This energy flow has an expansion of, for example, 0.25 to 1 cm 2 on impact and has a current density of, for example, 20 kW / cm 2 at the point of impact.
- the energy flow 12 is almost completely absorbed by the substrate 1 and therefore supplies the substrate 1 with heat.
- the heat supplied to the substrate 1 is conducted from the impingement area of the energy flow 12 through heat conduction into the entire substrate 1. In this way and due to the rotation of the substrate 1 and any oscillation of the energy flow, overheating of the impact area is avoided.
- the substrate 1 is preheated to a temperature which is considerably above room temperature but below its melting temperature. With the copper disc described above, this preheating temperature is approx. 700 - 1000 ° C.
- the output power of the heat flow source 6 is reduced during the preheating of the substrate 1. After reaching the preheating temperature, the beam 12 has a current density of only a few kW / cm 2 .
- the preheating temperature can be set at a predetermined power of the heat flow source 6 by suitable heat dissipation via the support device 3.
- the contact surface 2 can be kept at the desired temperature by appropriately enlarging or reducing the cross section of the support 5.
- a part 17 made of a single piece between the substrate 1 and the support 5 leading to cooling compared to the rest of the material of the support device 3 is comparatively poorly heat-conducting material, such as stainless steel.
- the suitable setting of the temperature can of course also be achieved by jointly using both of the measures described above.
- the support surface 2 should have a temperature of 500-600 ° C.
- the comparatively low energy conducted by the energy flow 12 into the substrate 1 is sufficient to melt the material of the substrate in a local area 15.
- the powder layer 10 is brought onto the surface of the substrate 1.
- the coating formed by loose powder is typically 25-50 mg / cm 2 .
- the local area 15 is guided to and through the powder layer 10 by rotation of the support device 3. Liquid material located in the locally melted region, for example copper, wets powder located in the powder layer 10 or soaks the powder layer 10 by predominantly effective capillary forces. This effect can be increased by further additives if necessary.
- the support device 3 or the heat flow source 6 and the additive supply device 7 By rotating the support device 3 or the heat flow source 6 and the additive supply device 7 about the vertically extended axis 11, which is guided centrally through the support table 3, and by additionally radially, preferably oscillating, movements of the heat flow source 6 and additive supply device 7 can be achieved, that almost the entire surface of the substrate 1 is successively melted and coated.
- the melting of the substrate 1 can, of course, also be carried out by a translational displacement in a horizontal xy plane, with the heat flow source 6 in the x and y directions between the Edges of the substrate 1 back and forth, and the support surface 2 is shifted approximately in the y direction.
- the additive feed device 7 should be moved according to its displacement with the substrate 1 rotating.
- an approximately 50-100 ⁇ m thick surface layer 16 can be produced in this way.
- This layer is also characterized, inter alia, in that the substrate 1 and thus also the surface layer 16 are largely gas-free due to the comparatively slow and large-area melting.
- layer thicknesses of up to several millimeters can be produced without any problems.
- Different layer thicknesses and / or predetermined surface profiles can be produced by suitably controlling the power and the current density of the energy flow 12, the heating time of the local area 15 and / or the amount of the additive 8 supplied.
- Vacuum switches equipped with contact pieces manufactured in this way have significantly improved breaking capacities compared to vacuum switches with comparable dimensions but with contact pieces manufactured according to conventional methods.
- the surface layer 16 is briefly heated to a temperature substantially above the melting temperature of the substrate 1, at least over part of its outer surface and starting from its outer surface at least over part of its depth.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacture Of Switches (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH451389 | 1989-12-15 | ||
CH4513/89 | 1989-12-15 | ||
PCT/CH1990/000285 WO1991009409A1 (de) | 1989-12-15 | 1990-12-17 | Verfahren zur herstellung eines oberflächenbeschichteten bauteils, insbesondere eines kontaktstücks für einen vakuumschalter, und vorrichtung zur durchführung dieses verfahrens |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0458922A1 true EP0458922A1 (de) | 1991-12-04 |
EP0458922B1 EP0458922B1 (de) | 1995-06-07 |
Family
ID=4277496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP91900146A Expired - Lifetime EP0458922B1 (de) | 1989-12-15 | 1990-12-17 | Verfahren zur herstellung eines oberflächenbeschichteten bauteils, insbesondere eines kontaktstücks für einen vakuumschalter, und vorrichtung zur durchführung dieses verfahrens |
Country Status (6)
Country | Link |
---|---|
US (1) | US5254185A (de) |
EP (1) | EP0458922B1 (de) |
JP (1) | JPH04503732A (de) |
AT (1) | ATE123587T1 (de) |
DE (1) | DE59009215D1 (de) |
WO (1) | WO1991009409A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997014163A1 (de) * | 1995-10-10 | 1997-04-17 | Abb Patent Gmbh | Verfahren und vorrichtung zur herstellung eines kontaktstückes |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19612143B4 (de) * | 1996-03-27 | 2005-05-04 | Abb Patent Gmbh | Verfahren zur Herstellung eines Spiralkontaktstückes für eine Vakuumkammer und Vorrichtung zur Durchführung des Verfahrens |
DE19632573A1 (de) * | 1996-08-13 | 1998-02-19 | Abb Patent Gmbh | Verfahren zur Herstellung einer Kontaktanordnung für eine Vakuumkammer und Kontaktanordnung |
DE19650752C1 (de) * | 1996-12-06 | 1998-03-05 | Louis Renner Gmbh | Kupfer-Chrom-Kontaktwerkstoff mit feinkörnig umgewandelter Oberfläche für elektrische Schaltkontakte und Verfahren zu dessen Herstellung |
US6423162B1 (en) * | 1999-07-02 | 2002-07-23 | The University Of Tennesse Research Corporation | Method for producing decorative appearing bumper surfaces |
DE102011006899A1 (de) * | 2011-04-06 | 2012-10-11 | Tyco Electronics Amp Gmbh | Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2175606A (en) * | 1939-10-10 | Method and apparatus fob alloying | ||
DE2014638A1 (de) * | 1970-03-26 | 1971-10-14 | Siemens Ag | Verfahren zur Herstellung eines Zweischichten Kontaktstuckes |
GB2047567B (en) * | 1979-03-16 | 1983-12-14 | Dodd K H | Coating with parachute material |
US4420346A (en) * | 1980-11-28 | 1983-12-13 | Belkin German S | Method of preparing contacts and electrodes of electric vacuum apparatuses |
US4750947A (en) * | 1985-02-01 | 1988-06-14 | Nippon Steel Corporation | Method for surface-alloying metal with a high-density energy beam and an alloy metal |
JPS61270335A (ja) * | 1985-05-24 | 1986-11-29 | Toyota Motor Corp | 内燃機関用肉盛バルブ |
DE3541584A1 (de) * | 1985-11-25 | 1987-05-27 | Siemens Ag | Verfahren und vorrichtung zum herstellen von metall-verbund-werkstoffen sowie damit hergestellte kontaktstuecke fuer elektrische schaltgeraete |
-
1990
- 1990-12-17 DE DE59009215T patent/DE59009215D1/de not_active Expired - Fee Related
- 1990-12-17 AT AT91900146T patent/ATE123587T1/de active
- 1990-12-17 US US07/752,600 patent/US5254185A/en not_active Expired - Fee Related
- 1990-12-17 EP EP91900146A patent/EP0458922B1/de not_active Expired - Lifetime
- 1990-12-17 JP JP3500910A patent/JPH04503732A/ja active Pending
- 1990-12-17 WO PCT/CH1990/000285 patent/WO1991009409A1/de active IP Right Grant
Non-Patent Citations (1)
Title |
---|
See references of WO9109409A1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997014163A1 (de) * | 1995-10-10 | 1997-04-17 | Abb Patent Gmbh | Verfahren und vorrichtung zur herstellung eines kontaktstückes |
Also Published As
Publication number | Publication date |
---|---|
EP0458922B1 (de) | 1995-06-07 |
ATE123587T1 (de) | 1995-06-15 |
JPH04503732A (ja) | 1992-07-02 |
US5254185A (en) | 1993-10-19 |
WO1991009409A1 (de) | 1991-06-27 |
DE59009215D1 (de) | 1995-07-13 |
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