EP0375225A3 - Verfahren zur Plattierung einer Palladium-Legierung - Google Patents
Verfahren zur Plattierung einer Palladium-Legierung Download PDFInfo
- Publication number
- EP0375225A3 EP0375225A3 EP19890312859 EP89312859A EP0375225A3 EP 0375225 A3 EP0375225 A3 EP 0375225A3 EP 19890312859 EP19890312859 EP 19890312859 EP 89312859 A EP89312859 A EP 89312859A EP 0375225 A3 EP0375225 A3 EP 0375225A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- palladium
- plating process
- alloy plating
- palladium alloy
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/288,337 US4911798A (en) | 1988-12-20 | 1988-12-20 | Palladium alloy plating process |
US288337 | 1988-12-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0375225A2 EP0375225A2 (de) | 1990-06-27 |
EP0375225A3 true EP0375225A3 (de) | 1991-01-02 |
Family
ID=23106674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19890312859 Withdrawn EP0375225A3 (de) | 1988-12-20 | 1989-12-08 | Verfahren zur Plattierung einer Palladium-Legierung |
Country Status (4)
Country | Link |
---|---|
US (1) | US4911798A (de) |
EP (1) | EP0375225A3 (de) |
JP (1) | JPH02221392A (de) |
CA (1) | CA2003861A1 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5140349A (en) * | 1988-09-27 | 1992-08-18 | Canon Kabushiki Kaisha | Recording apparatus |
US5136096A (en) * | 1989-08-31 | 1992-08-04 | University Of South Florida | Multifunctional synthons as used in the preparation of cascade polymers or unimolecular micelles |
US5180482A (en) * | 1991-07-22 | 1993-01-19 | At&T Bell Laboratories | Thermal annealing of palladium alloys |
US5135622A (en) * | 1991-12-02 | 1992-08-04 | At&T Bell Laboratories | Electrochemical synthesis of palladium hydroxide compounds |
US5641579A (en) * | 1993-02-05 | 1997-06-24 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating |
US5360991A (en) * | 1993-07-29 | 1994-11-01 | At&T Bell Laboratories | Integrated circuit devices with solderable lead frame |
KR0171685B1 (ko) * | 1994-02-26 | 1999-02-18 | 문성수 | 팔라듐 2원 또는 3원 합금 도금 조성물, 이를 이용한 도금방법 및 도금체 |
US5626972A (en) * | 1994-06-02 | 1997-05-06 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating simulating brass |
US5413874A (en) * | 1994-06-02 | 1995-05-09 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating simulating brass |
US5478660A (en) * | 1994-11-30 | 1995-12-26 | Baldwin Hardware Corporation | Article having a decorative and protective coating simulating brass |
US5482788A (en) * | 1994-11-30 | 1996-01-09 | Baldwin Hardware Corporation | Article having a protective coating simulating brass |
US5478659A (en) * | 1994-11-30 | 1995-12-26 | Baldwin Hardware Corporation | Article having a decorative and protective coating simulating brass |
US5484663A (en) * | 1994-11-30 | 1996-01-16 | Baldwin Hardware Corporation | Article having a coating simulating brass |
US6205999B1 (en) * | 1995-04-05 | 2001-03-27 | Aerogen, Inc. | Methods and apparatus for storing chemical compounds in a portable inhaler |
US5654108A (en) * | 1995-05-22 | 1997-08-05 | Baldwin Hardware Corporation | Article having a protective coating simulating brass |
CA2176892C (en) * | 1995-05-22 | 2002-10-29 | Stephen R. Moysan, Iii | Article having a decorative and protective coating simulating brass |
US5552233A (en) * | 1995-05-22 | 1996-09-03 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating simulating brass |
US5667904A (en) * | 1995-05-22 | 1997-09-16 | Baldwin Hardware Corporation | Article having a decorative and protective coating simulating brass |
US5675177A (en) * | 1995-06-26 | 1997-10-07 | Lucent Technologies Inc. | Ultra-thin noble metal coatings for electronic packaging |
US5693427A (en) * | 1995-12-22 | 1997-12-02 | Baldwin Hardware Corporation | Article with protective coating thereon |
US5783313A (en) * | 1995-12-22 | 1998-07-21 | Baldwin Hardware Corporation | Coated Article |
US5916696A (en) * | 1996-06-06 | 1999-06-29 | Lucent Technologies Inc. | Conformable nickel coating and process for coating an article with a conformable nickel coating |
KR100231828B1 (ko) * | 1997-02-20 | 1999-12-01 | 유무성 | 다층 도금 리드프레임 |
US5989730A (en) * | 1997-04-30 | 1999-11-23 | Masco Corporation | Article having a decorative and protective multi-layer coating |
US5948548A (en) * | 1997-04-30 | 1999-09-07 | Masco Corporation | Coated article |
US6106958A (en) * | 1997-04-30 | 2000-08-22 | Masco Corporation | Article having a coating |
US6004684A (en) * | 1997-04-30 | 1999-12-21 | Masco Corporation | Article having a protective and decorative multilayer coating |
US5952111A (en) * | 1997-04-30 | 1999-09-14 | Masco Corporation | Article having a coating thereon |
US5985468A (en) * | 1997-04-30 | 1999-11-16 | Masco Corporation | Article having a multilayer protective and decorative coating |
US6033790A (en) * | 1997-04-30 | 2000-03-07 | Masco Corporation | Article having a coating |
US5879532A (en) * | 1997-07-09 | 1999-03-09 | Masco Corporation Of Indiana | Process for applying protective and decorative coating on an article |
US6268060B1 (en) | 1997-08-01 | 2001-07-31 | Mascotech Coatings, Inc. | Chrome coating having a silicone top layer thereon |
US6534192B1 (en) | 1999-09-24 | 2003-03-18 | Lucent Technologies Inc. | Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
WO2003078670A1 (fr) | 2002-03-15 | 2003-09-25 | Mitsubishi Materials Corporation | Procede de separation d'element du groupe platine |
US6828898B2 (en) * | 2003-04-03 | 2004-12-07 | Cts Corporation | Fuel tank resistor card having improved corrosion resistance |
JP2006112838A (ja) * | 2004-10-13 | 2006-04-27 | Nuclear Fuel Ind Ltd | 高温ガス炉用燃料コンパクトの製造方法 |
EP1892320A1 (de) * | 2006-08-22 | 2008-02-27 | Enthone, Incorporated | Elektrolytzusammensetzung und Verfahren zur elektrolytischen Abscheidung von palladiumhaltigen Schichten |
JP2008081765A (ja) * | 2006-09-26 | 2008-04-10 | Tanaka Kikinzoku Kogyo Kk | パラジウム合金めっき液及びそのめっき液を用いためっき方法。 |
CN101348928B (zh) * | 2007-07-20 | 2012-07-04 | 罗门哈斯电子材料有限公司 | 镀钯及镀钯合金之高速方法 |
US20110147225A1 (en) * | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
US9217205B2 (en) | 2007-12-11 | 2015-12-22 | Enthone Inc. | Electrolytic deposition of metal-based composite coatings comprising nano-particles |
CN102234826B (zh) * | 2010-04-29 | 2014-05-28 | 比亚迪股份有限公司 | 一种电镀液及使用该电镀液的电镀方法 |
JP2014182976A (ja) * | 2013-03-21 | 2014-09-29 | Enplas Corp | 電気接触子及び電気部品用ソケット |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2939920A1 (de) * | 1979-10-02 | 1981-04-09 | W.C. Heraeus Gmbh, 6450 Hanau | Bad zum galvanischen abscheiden von palladium |
GB2094349A (en) * | 1981-02-25 | 1982-09-15 | Hooker Chemicals Plastics Corp | Metal plating compositions and processes |
US4454010A (en) * | 1982-08-30 | 1984-06-12 | At & T Bell Laboratories | Palladium plating procedure |
US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4066517A (en) * | 1976-03-11 | 1978-01-03 | Oxy Metal Industries Corporation | Electrodeposition of palladium |
US4278514A (en) * | 1980-02-12 | 1981-07-14 | Technic, Inc. | Bright palladium electrodeposition solution |
US4486274A (en) * | 1981-02-27 | 1984-12-04 | At&T Bell Laboratories | Palladium plating prodedure |
SU1006549A1 (ru) * | 1981-03-09 | 1983-03-23 | Предприятие П/Я В-2672 | Электролит блест щего палладировани |
-
1988
- 1988-12-20 US US07/288,337 patent/US4911798A/en not_active Expired - Lifetime
-
1989
- 1989-11-24 CA CA002003861A patent/CA2003861A1/en not_active Abandoned
- 1989-12-08 EP EP19890312859 patent/EP0375225A3/de not_active Withdrawn
- 1989-12-19 JP JP1327474A patent/JPH02221392A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2939920A1 (de) * | 1979-10-02 | 1981-04-09 | W.C. Heraeus Gmbh, 6450 Hanau | Bad zum galvanischen abscheiden von palladium |
GB2094349A (en) * | 1981-02-25 | 1982-09-15 | Hooker Chemicals Plastics Corp | Metal plating compositions and processes |
US4454010A (en) * | 1982-08-30 | 1984-06-12 | At & T Bell Laboratories | Palladium plating procedure |
US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
Non-Patent Citations (2)
Title |
---|
CHEMICAL ABSTRACTS, vol. 95, no. 5, September 1981, page 476, abstract no. 88152w, Columbus, Ohio, US; S.I. KHOTYANOVICH: "Some new processes for the electrodeposition of corrosion-resistant palladium and rhodium coatings", & RAZRAB. MER ZASHCH. MET. KORROZ., MEZHDUNAR. NAUCHNO-TEKH. KONF. PROBL. SEV- 3RD 1980, 4, 143-6 * |
GALVANOTECHNIK, vol. 75, no. 9, September 1984, page 1183, Saulgau, DE; J. BERNHARD: "Neue ausländische Patente", & SU-A-1 006 549 * |
Also Published As
Publication number | Publication date |
---|---|
EP0375225A2 (de) | 1990-06-27 |
CA2003861A1 (en) | 1990-06-20 |
JPH02221392A (ja) | 1990-09-04 |
US4911798A (en) | 1990-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0375225A3 (de) | Verfahren zur Plattierung einer Palladium-Legierung | |
AU568895B2 (en) | Forgeable nickel base super alloys | |
AU1523588A (en) | Alloy powder mixture for treating alloys | |
GB2187204B (en) | Electroplating solution for deposition of palladium or alloys thereof | |
DE3471697D1 (en) | An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath | |
AU4360489A (en) | Corrosion resistant nickel-base alloy | |
IE41858L (en) | Electrodeposition of noble metal alloys | |
AU554827B2 (en) | Preparation of zn-fe alloy electroplated onto steel | |
AU3402993A (en) | Palladium-nickel alloy plating solution | |
GB8820807D0 (en) | Reduction of corrosion of metals | |
GB2171721B (en) | Palladium and palladium alloy plating | |
JPS57123992A (en) | Electrodeposition of palladium and alloy thereof | |
AU5717880A (en) | Silver and gold/silver alloy plating bath and method | |
GB2112018B (en) | Palladium and palladium alloys electroplating procedure | |
EP0250163A3 (en) | A method for the preparation of an alloy of nickel and titanium | |
GB2194961B (en) | A copper-based metal alloy of improved type, particularly for the construction of electronic components | |
AU602155B2 (en) | Method of inhibiting the corrosion of copper and copper alloys | |
AU537532B2 (en) | Electrolytic bath for palladium nickel alloy | |
AU535304B2 (en) | Palladium-nickel alloy electrodeposition bath | |
TW241312B (de) | ||
EP0257425A3 (de) | Gussstück | |
AU535263B2 (en) | Palladium-nickel alloy electrodeposition bath | |
Tolkmit | MP 4 Plating: Mechanical Plating in the Acids Range | |
AU1252788A (en) | Electroplating bath and process for maintaining plating alloy composition stable | |
GB2047749B (en) | Electrodeposition of a pink gold alloy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB |
|
17P | Request for examination filed |
Effective date: 19910619 |
|
17Q | First examination report despatched |
Effective date: 19920218 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 19920630 |