EP0369290A2 - Substrat de support pour un potentiomètre linéaire et procédé pour sa fabrication - Google Patents

Substrat de support pour un potentiomètre linéaire et procédé pour sa fabrication Download PDF

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Publication number
EP0369290A2
EP0369290A2 EP89120568A EP89120568A EP0369290A2 EP 0369290 A2 EP0369290 A2 EP 0369290A2 EP 89120568 A EP89120568 A EP 89120568A EP 89120568 A EP89120568 A EP 89120568A EP 0369290 A2 EP0369290 A2 EP 0369290A2
Authority
EP
European Patent Office
Prior art keywords
carrier substrate
copper strand
copper
collector
elongated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89120568A
Other languages
German (de)
English (en)
Other versions
EP0369290A3 (fr
Inventor
Ernst Halder
Peter Herlinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Horst Siedle KG
Original Assignee
Horst Siedle KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horst Siedle KG filed Critical Horst Siedle KG
Publication of EP0369290A2 publication Critical patent/EP0369290A2/fr
Publication of EP0369290A3 publication Critical patent/EP0369290A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C10/00Adjustable resistors
    • H01C10/30Adjustable resistors the contact sliding along resistive element
    • H01C10/38Adjustable resistors the contact sliding along resistive element the contact moving along a straight path

Definitions

  • the invention is based on a carrier substrate and a method for its production according to the preamble of claim 1 and claim 15.
  • a carbon fiber bundle is embedded in the longitudinal direction of the profile of the substrate, which serves in the simplest application to separate the voltage connection for the resistance path of the linear potentiometer from the opposite, So from the end remote from the common contact plug end back into the area of the contact plug, so that the user is not tongued to provide voltage connections for this on opposite sides of the possibly extremely long (for example 2 m or more) linear potentiometer.
  • the synthetic resin profile i.e. the carrier substrate, stores at least this on its surface Resistance track, preferably parallel to this and preferably on the same side still a collector track, which feeds the tapped voltage value to the third, ie the tap connection in the contact area of the linear potentiometer.
  • An embodiment of the known carrier substrate then consists in that in addition to the return carbon fiber bundle, another carbon fiber bundle is arranged on the profile surface carrying the collector path, which can be contacted along this surface and is subject to the collector path coating, so that, as it were, a constant short circuit of each collector path point to Connection or contact area results and the tapped voltage can be detected without any falsifying, if only slight, resistances in the collector area.
  • the problem with the storage of a carbon fiber bundle can be the fact that it is not sufficiently low-resistance and because of the "fibrousness" of the carbon fibers it is not ensured in all circumstances that small carbon fiber approaches do not protrude from the profile surface in the transverse direction or at an angle to it Isolation of such a linear potentiometer could lead to difficulties.
  • a basic material for potentiometer plates is known (DE-OS 23 58 004), in which an insulating plate which forms the potentiometer plate and has a corresponding resistance pattern on its surface consists of polyamide resin which is enriched with a fibrous filler.
  • This filler consists of either asbestos fibers or glass fibers. The production takes place, among other things by extrusion of the plastic provided with the filler.
  • collector track layers which are preferably arranged on the same carrier substrate, with conductive silver in order to add the lowest possible resistance value to the tap connection of the linear potentiometer to the tapped potential value - this is done essentially without current, i.e. by compensation transfer.
  • the invention has for its object to improve the above-mentioned carrier substrate for a linear potentiometer in such a way that a significantly improved voltage feedback from the opposite side of the linear potentiometer to the contact connection area is possible, so that otherwise unavoidable residual voltages are virtually eliminated to zero and further simplifications Extrusion process and the coating as well as the connection with the conductive plastic orders for collector and resistance tracks can be achieved.
  • the invention solves this problem in each case with the characterizing features of claim 1 and claim 15 and has the advantage that the filament structure of the retracted copper strand simplifies the manufacturing process due to its axial extensibility as well results in a special low resistance in the electrical field, which is based on the fact that the preferably still silver-plated copper strand forms practically an immediate short-circuit for the voltages occurring even with long and longest carrier substrates, so that it is possible with the remaining residual voltages, if any, to occur to remain within the extremely low accuracy tolerances that such high-precision linear potentiometers must have as motion detectors, as actual value transmitters for control purposes or for other applications.
  • the copper strand only takes up a space of, for example, 1 mm2 in cross section in order to work with numerical values which, as is understood, of course do not limit the invention.
  • the stranded copper strand during the extrusion process for the carrier substrate advantageously consists of an extremely high number of the finest copper threads, which are initially arranged in bundles of copper threads. These individual bundles are then connected to one another in the manner of a braiding process, that is to say intertwined or over and under brought into a longitudinal configuration that has a pronounced longitudinal flexibility due to the braided structure, but also due to the properties of the finest copper wires, and can also be brought into any cross-sectional shape.
  • the basic shape of the copper strand embedded in the carrier substrate represents a generally band-shaped structure, the rest of the individual copper filaments with their bundles also being able to be arranged in parallel, insofar as this is possible and manageable.
  • the braided copper strand structure in a silver-plated version is preferred, which is guided in parallel during the manufacture of the carrier substrate through the extrusion opening and is pressed in with a correspondingly high pressure into the substrate material, preferably remaining flush with the surface.
  • Flushness of the surface is required in any case when the silver-plated copper strand is overlaid by a collector conductive plastic application, in which case the copper strand ensures the uninfluenced, that is to say completely residual stress-free, tapping of the voltage from the collector path and its supply to the connection area.
  • the manufacturing process of such a carrier substrate proceeds in such a way that a glass fiber-reinforced synthetic resin profile is first produced for the carrier substrate itself in that lengths of glass fiber are passed into a corresponding impregnating resin and, for example, after passing through a front tool, a main tool with a shaping outlet mouth is fed, in which case the merging with the silver-plated copper braid, for example by pulling it off a supply roll and merging it with the soaked glass fiber bundle in the main tool immediately or only after passing through a front tool and soaking with the same synthetic resin, whereby the profile strand from the mouth of the main tool is sometimes considerable Forces is subtracted.
  • the drawing shows a perspective schematic representation of only a partial area of a carrier substrate, pulled out of the receiving housing of the linear potentiometer, shown as an aluminum profile, without other potentiometer components, which are also not the subject of the present invention.
  • the basic idea is to pull a (silver-plated) copper strand into the carrier substrate for linear potentiometers, preferably flush with the surface during its manufacture, and thus to obtain an electrical switching means which can be used here for a variety of tasks.
  • the conductive plastic layer is then placed on such a carrier substrate, in particular with the same resin base as the substrate of the carrier directly applied, sieved, sprayed, evaporated or the like.
  • the carrier substrate is designated 10; a cut-off potentiometer housing with the profile shape of the substrate in suitable guides. Since the only thing that matters here is the design of the carrier substrate as a carrier for the resistance and collector tracks, there is no need to go into those potentiometer components that are not in operative connection with the substrate occur because they are not the subject of the invention.
  • the carrier substrate 10 is a drawn plastic profile or synthetic resin profile, preferably with embedded, reinforcing glass fibers, glass fiber bundles or glass fiber rovings; the profile is pulled out of the preferably slightly conically narrowing outlet mouth of a heated main tool with considerable force, with at least one copper strand designated 12 (flush with the surface) being drawn into the profile of the carrier substrate directly in this production.
  • This copper braid which is arranged at least once in the carrier substrate, is a bundling of an extremely large number of the finest copper threads or filaments, each of which is combined into smaller bundles, these bundles then being interwoven in the usual case, thus form a kind of woven fabric.
  • the individual bundles therefore do not run in a strictly parallel straight line and in the longitudinal direction to the carrier substrate, but are interlaced with one another, they have slight bends, so that there are also short distances in the transverse direction, as is customary in a braided structure .
  • the individual copper filaments are silver-plated, so that overall there is a silver-plated copper strand which is drawn into the profile of the glass-fiber reinforced plastic, for example, during extrusion or during its manufacture.
  • a copper braid without interlacing could also be provided, in which the bundles and therefore also the individual copper filaments lie parallel to one another; here too there is a certain longitudinal elasticity due to the material properties of the copper itself.
  • the procedure according to a first embodiment can be such that the silver-plated copper strand is impregnated in a front tool with the same plastic from which the carrier substrate is made and together with the soaked glass fibers is guided through the main tool.
  • the copper strand dry to the pulling mouth of the main tool, the copper strand being pressed flat and into the cross-sectional profile shape of the carrier substrate by the pull-out force in the mouth region, so that in any case a completely flat surface of the carrier substrate results, whereby at In certain places, the synthetic resin surface is replaced by the copper wire embedded flush with the surface.
  • At least one of the copper strands can also be arranged inside the carrier substrate, namely when the copper strand is used to return the voltage at the opposite end of the resistance track. It is then only necessary to ensure that the silver-plated copper strand in the contact area comes out and is available.
  • collector layer and the resistance layer are arranged in parallel next to one another on the carrier substrate, one side of the silver-plated copper strands being drawn in to contact each collector station point then being located on this side below the collector layer, while the other copper strand, which is the opposite, preferably also runs flush on the back or underside of the carrier substrate Contacted end of the resistance track and leads back to the common terminal contact area.
  • the copper strand (s) is (are) drawn into the carrier substrate during their manufacture in such a way that they are flush with the surface. If, for example, it has a bundle shape that is approximately round in cross section, the copper strand is flattened in the surface area by the molding tool and then continues in a band-like manner in the transition without a step and without dislocation, smoothly extending the surface and the profile shape of the longitudinal substrate of the carrier.
  • the copper wire can thus also be contacted directly with regard to its electrical properties. The focus is exclusively on the electrical properties of the copper strand, while a new product with particularly reliable functional properties is achieved at the same time.
  • a copper braid as an electrical transmission and conduction element is also particularly cost-effective - a conductive silver underlayer is considerably more expensive and above all also higher impedance than the silver-plated copper wire.
  • the carrier substrate 10 of the drawing has two longitudinal regions 14 and 15 which serve to arrange the collector path and, parallel to it, the resistance path.
  • a preferred exemplary embodiment of the present invention therefore comprises the substrate 10, as shown in the drawing, on the upper side of which, in the lower half in the drawing, the conductive plastic layer of the resistance track is cross-hatched and designated by 14a. No copper braid is underlaid on this resistive conductive plastic layer 14a.
  • the conductive plastic layer for the collector track is then applied to the upper half of the upper side of the substrate, i.e. in the longitudinal region 15, which is not shown for reasons of clarity - this conductive plastic layer of the collector track is underlaid with the silver-plated copper strand 12, as explained earlier.
  • the illustration of the drawing also shows the second copper strand 12a arranged on the back or underside of the substrate 10, which serves to connect the averted resistance path potentiometer connection to the voltage to be supplied.
  • the potentiometer in any case in the area of the substrate connections, to be designed to be line-free or cable-free.
  • low-resistance contact surfaces can also be provided at the end areas, for example conductive silver applications.
  • the procedure can be such that conductive silver layers are applied or underlaid in the corresponding areas, and the electrical contact connection is then made by a U-shaped, resilient bracket which points to the end area of the substrate is plugged in that it touches the respective contact surfaces on both sides and is manufactured without cables or wires.
  • the bracket then embraces the end region of the substrate in a U-shape in the manner of a bridge and thus connects the contact surfaces arranged on the top and bottom.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
EP89120568A 1988-11-15 1989-11-07 Substrat de support pour un potentiomètre linéaire et procédé pour sa fabrication Withdrawn EP0369290A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3838662 1988-11-15
DE19883838662 DE3838662A1 (de) 1988-11-15 1988-11-15 Traegersubstrat fuer linearpotentiometer und verfahren zu seiner herstellung

Publications (2)

Publication Number Publication Date
EP0369290A2 true EP0369290A2 (fr) 1990-05-23
EP0369290A3 EP0369290A3 (fr) 1990-08-29

Family

ID=6367204

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89120568A Withdrawn EP0369290A3 (fr) 1988-11-15 1989-11-07 Substrat de support pour un potentiomètre linéaire et procédé pour sa fabrication

Country Status (3)

Country Link
EP (1) EP0369290A3 (fr)
JP (1) JPH02222841A (fr)
DE (1) DE3838662A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4191616A1 (fr) * 2021-12-06 2023-06-07 KNORR-BREMSE Systeme für Nutzfahrzeuge GmbH Support de résistance pour un potentiomètre, potentiomètre et procédé de fabrication du support de résistance

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19710600A1 (de) 1997-03-14 1998-09-17 Meto International Gmbh Verfahren und Vorrichtung zur Herstellung eines Sicherungselementes sowie ein entsprechendes Sicherungselement
DE29709206U1 (de) * 1997-05-26 1997-07-24 Horst Siedle GmbH & Co. KG, 78120 Furtwangen Vorrichtung zur ortsfesten Befestigung eines Wegaufnehmers
DE10045260C1 (de) 2000-09-13 2002-01-24 Deutsches Krebsforsch Potentiometer zur Wegerfassung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3036284A (en) 1960-05-20 1962-05-22 Gen Precision Inc Translatory precision potentiometer
DE1515625A1 (de) 1965-09-16 1969-08-14 Dinter Dr Ing Konrad Einstellwiderstand und Einstellpotentiometer in besonders einfacher fuer die automatische Fertigung geeigneter Weise
DE2358004A1 (de) 1973-11-21 1975-05-22 Licentia Gmbh Grundmaterial fuer potentiometerplatten
DD211421A1 (de) 1982-11-08 1984-07-11 Spezialwiderstaende Veb Elektrisch leitendes widerstandsmaterial
DE3406366A1 (de) 1984-02-22 1985-08-22 Novotechnik Kg Offterdinger Gmbh & Co, 7302 Ostfildern Traegerlaengssubstrat fuer linearpotentiometer und verfahren zu dessen herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2759080A (en) * 1953-09-14 1956-08-14 Marlan E Bourns Linear motion resistor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3036284A (en) 1960-05-20 1962-05-22 Gen Precision Inc Translatory precision potentiometer
DE1515625A1 (de) 1965-09-16 1969-08-14 Dinter Dr Ing Konrad Einstellwiderstand und Einstellpotentiometer in besonders einfacher fuer die automatische Fertigung geeigneter Weise
DE2358004A1 (de) 1973-11-21 1975-05-22 Licentia Gmbh Grundmaterial fuer potentiometerplatten
DD211421A1 (de) 1982-11-08 1984-07-11 Spezialwiderstaende Veb Elektrisch leitendes widerstandsmaterial
DE3406366A1 (de) 1984-02-22 1985-08-22 Novotechnik Kg Offterdinger Gmbh & Co, 7302 Ostfildern Traegerlaengssubstrat fuer linearpotentiometer und verfahren zu dessen herstellung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4191616A1 (fr) * 2021-12-06 2023-06-07 KNORR-BREMSE Systeme für Nutzfahrzeuge GmbH Support de résistance pour un potentiomètre, potentiomètre et procédé de fabrication du support de résistance

Also Published As

Publication number Publication date
EP0369290A3 (fr) 1990-08-29
JPH02222841A (ja) 1990-09-05
DE3838662A1 (de) 1990-05-17

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