EP0343559B1 - Use of 2-substituted ethane sulfone compounds as galvanic auxiliary agents - Google Patents

Use of 2-substituted ethane sulfone compounds as galvanic auxiliary agents Download PDF

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Publication number
EP0343559B1
EP0343559B1 EP89109164A EP89109164A EP0343559B1 EP 0343559 B1 EP0343559 B1 EP 0343559B1 EP 89109164 A EP89109164 A EP 89109164A EP 89109164 A EP89109164 A EP 89109164A EP 0343559 B1 EP0343559 B1 EP 0343559B1
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Prior art keywords
compounds
galvanic
residue
auxiliary agents
substituted ethane
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Expired - Lifetime
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EP89109164A
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German (de)
French (fr)
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EP0343559B2 (en
EP0343559A1 (en
Inventor
Wolfgang Clauss
Werner Kurze
Ferdinand Leifeld
Willy Wasserberg
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Raschig AG
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Raschig AG
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Definitions

  • propane sulfone compounds with a pyridinium substituent or a quinoline substituent in the 3-position are known as electroplating agents and brighteners in acidic nickel baths (cf. DE-PS 1 004 011).
  • the 2-substituted ethanesulfone compounds used according to the invention with an alkyl chain branching at the C2 show good gloss formation and leveling, in particular of nickel and copper coatings, although the steric hindrance leads to poor results. In this way, numerous substance variants allow adaptation and optimization to different galvanic requirements.
  • the pyridine and quinoline derivatives of the 2-substituted ethanesulfone betaines in particular are particularly good brighteners and levelers in acidic nickel baths, while the mercapto derivatives are suitable as brighteners in acidic copper baths.
  • a galvanic nickel bath was set up as follows: distilled water to 1 liter, pH 4.0 adjusted with sulfuric acid.
  • the sheets After the nickel plating, the sheets showed a uniform surface, good gloss and leveling.
  • the storage stability of the prepared additional solution at 60 ° C was good.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Pyridine Compounds (AREA)

Description

Die Erfindung betrifft die Verwendung von 2-substituierten Ethansulfonverbindungen der allgemeinen Formel I

Figure imgb0001
und deren Alkali- oder Ammoniumsalze, wobei R3 einen C1-C4-Niederalkylrest darstellt und A

  • 1.) ein Pyridinium-Rest
    Figure imgb0002
    ist, dessen Substituenten R1 und R2 Wasserstoff oder einen C1-C3-Niederalkylrest bedeuten, oder R1 und R2 zusammen mit dem Pyridiniumrest einen kondensierten 6-gliedrigen aromatischen Ring bilden oder
  • 2.) ein Mercaptorest -S-R4 ist, in dem R4 Wasserstoff oder die Gruppe
    Figure imgb0003
    ist,

als galvanotechnische Hilfsstoffe.The invention relates to the use of 2-substituted ethanesulfone compounds of the general formula I.
Figure imgb0001
and their alkali or ammonium salts, where R 3 represents a C1-C4 lower alkyl radical and A
  • 1.) a pyridinium residue
    Figure imgb0002
    is whose substituents R 1 and R 2 are hydrogen or a C1-C3 lower alkyl radical, or R 1 and R 2 together with the pyridinium radical form a condensed 6-membered aromatic ring or
  • 2.) is a mercapto residue -SR 4 , in which R 4 is hydrogen or the group
    Figure imgb0003
    is

as galvanotechnical auxiliaries.

Einige dieser Verbindungen, nämlich solche der Formel I mit A-Pyridinium und R3 = CH3 (Can. J. Chem. 1984, 62 (19), Seiten 1977-95) und R3 = n - C4 Hg) (J. Am. Chem. Soc. 76, (1954) Seite 3945) sind zwar bekannt, aber nicht für galvanotechnische Zwecke.Some of these compounds, namely those of the formula I with A-pyridinium and R 3 = CH 3 (Can. J. Chem. 1984, 62 (19), pages 1977-95) and R 3 = n - C 4 Hg) (J Chem. Soc. 76, (1954) page 3945) are known, but not for electroplating purposes.

Andererseits sind Propansulfonverbindungen mit einem Pyridiniumsubstituenten bzw. einem Chinolinsubstituenten in 3-Stellung für galvanotechnische Zwecke als Glanzbildner und Einebner in sauren Nickelbädern bekannt (vgl. DE-PS 1 004 011). Überraschenderweise zeigen erfindungsgemäß verwendete 2- substituierte Ethansulfonverbindungen mit einer Alkylkettenverzweigung am C2 gute Glanzbildung und Einebnung insbesondere von Nickel- und Kupferüberzügen, obwohl die sterische Hinderung schlechte Ergebnisse erwarten läßt. Auf diese Weise ist durch zahlreiche Substanzvarianten Anpassung und Optimierung an verschiedene galvanische Forderungen möglich.On the other hand, propane sulfone compounds with a pyridinium substituent or a quinoline substituent in the 3-position are known as electroplating agents and brighteners in acidic nickel baths (cf. DE-PS 1 004 011). Surprisingly, the 2-substituted ethanesulfone compounds used according to the invention with an alkyl chain branching at the C2 show good gloss formation and leveling, in particular of nickel and copper coatings, although the steric hindrance leads to poor results. In this way, numerous substance variants allow adaptation and optimization to different galvanic requirements.

Die Herstellung solcher erfindungsgemäß verwendeter Verbindungen erfolgt durch gleichzeitiges Umsetzen von Verbindungen AH oder A mit einem Olefin R3-CH = CH2 mit Schwefeltrioxid in einem inerten Lösungsmittel bzw. Lösungsmittelgemisch oder durch Sulfonieren des Olefins im Gemisch mit Dioxan in einem Fallfilmreaktor und Umsetzen des erhaltenen 1,2-Sulfons mit der Verbindung AH oder A.Such compounds used according to the invention are prepared by simultaneously reacting compounds AH or A with an olefin R 3 -CH = CH 2 with sulfur trioxide in an inert solvent or solvent mixture or by sulfonating the olefin in a mixture with dioxane in a falling film reactor and reacting the resultant 1,2-sulfones with the compound AH or A.

Beide Verfahrensweisen sind Gegenstand älterer nicht vorveröffentlichter Schutzrechte.Both procedures are the subject of older, unpublished property rights.

Wie gefunden wurde, sind insbesondere die Pyridin- und Chinolinderivate der 2-substituierten Ethansulfonbetaine besonders gute Glanzbildner und Einebner in sauren Nickelbädern, während die Mercaptoderivate als Glanzbildner in sauren Kupferbädern geeignet sind.As was found, the pyridine and quinoline derivatives of the 2-substituted ethanesulfone betaines in particular are particularly good brighteners and levelers in acidic nickel baths, while the mercapto derivatives are suitable as brighteners in acidic copper baths.

Die Erfindung wird durch folgende Beispiele erläutert:The invention is illustrated by the following examples:

Beispiel 1example 1

Es wurde ein galvanisches Nickelbad wie folgt angesetzt:

Figure imgb0004
destilliertes Wasser auf 1 Liter, pH-Wert 4,0 mit Schwefelsäure eingestellt.A galvanic nickel bath was set up as follows:
Figure imgb0004
distilled water to 1 liter, pH 4.0 adjusted with sulfuric acid.

Es wurde jeweils 10 min. bei 2 A/dm2 und 60°C ein Messingblech in einer Hull-Zelle vernickelt. Das Blech war vorher in alkalischer Lösung und nach dem Waschen mit Wasser bei 2,5 A 2 min. kathodisch entfettet worden. Anschließend wurden die Bleche mit Wasser gespült und 30 sec. in einen Beizentfetter getaucht und danach mit Zellstoff abgerieben und nochmals mit Wasser gespült. Die Bewegung des Bades geschah durch Lufteinperlen.It was 10 min each. at 2 A / dm 2 and 60 ° C nickel-plated brass sheet in a Hull cell. The sheet was previously in alkaline solution and after washing with water at 2.5 A for 2 min. have been degreased cathodically. The sheets were then rinsed with water and immersed in a pickling degreaser for 30 seconds and then rubbed with cellulose and rinsed again with water. The movement of the bath was done by bubbling in air.

Es wurden als Versuchsverbindungen zum Beispiel

  • a.) 1-(2-Sulfopropyl)-pyridiniumbetain und
  • b.) 1-(2-Sulfopentyl)-pyridiniumbetain

eingesetzt.There were test compounds for example
  • a.) 1- (2-Sulfopropyl) pyridinium betaine and
  • b.) 1- (2-Sulfopentyl) pyridinium betaine

used.

Die Bleche zeigten nach der Vernickelung eine einheitliche Fläche, guten Glanz und Einebnung. Die Lagerstabilität der angesetzten Zusatzlösung bei 60 ° C war gut.After the nickel plating, the sheets showed a uniform surface, good gloss and leveling. The storage stability of the prepared additional solution at 60 ° C was good.

Beispiel 2Example 2

Es wurde ein Bad aus

Figure imgb0005

verwendet.It became a bath
Figure imgb0005

used.

Hierzu wurden steigende Konzentrationen von Natrium-2-mercapto-propan-1-sulfonat eingesetzt. Es wurde eine Prüf-Zelle von 1,5 I Badinhalt verwendet. Die Versuchskupferbleche waren matt und gewinkelt. Sie wurden mit 0,8 m/min senkrecht zur Anode bewegt (3 cm Hub). Es wurde mit einer kathodischen Stromdichte von 3 A/dm2 30 min bei 25 ° C galvanisch verkupfert. Die Kathode bestand aus gewinkeltem Kupferblech.Rising concentrations of sodium 2-mercapto-propane-1-sulfonate were used for this. A test cell with a bath content of 1.5 l was used. The test copper sheets were matt and angled. They were moved perpendicular to the anode at 0.8 m / min (3 cm stroke). It was galvanically copper-plated with a cathodic current density of 3 A / dm 2 for 30 min at 25 ° C. The cathode was made of angled copper sheet.

Bei einer Konzentration von 0,2 bis 0,4 mg/I ergab die Verbindung einen sehr guten Glanz.At a concentration of 0.2 to 0.4 mg / l, the compound gave a very good gloss.

Claims (3)

1. Use of 2-substituted ethane sulphone compounds of the general formula I.
Figure imgb0009
or the alkali or ammonium salts thereof wherein R3 is a C1 -C4 lower alkyl residue and A is
1.) a pyridinium residue
Figure imgb0010
in which the substuents R1 and R2 mean hydrogen or a C1-C3 lower alkyl residue or R1 and R2 together with the pyridinium residue form a condensed 6-membered aromatic ring or
2.) a mercapto residue S-R4 wherein R4 is hydrogen or the group
Figure imgb0011
as galvanotechnical adjuvants.
2. Use of the compounds of formula I wherein A = (1) as brighteners and levelling agents in acid nickel electroplating baths.
3. Use of the compounds of formula I. with A = (2) as brighteners in acid copper electroplating baths.
EP89109164A 1988-05-25 1989-05-22 Use of 2-substituted ethane sulfone compounds as galvanic auxiliary agents Expired - Lifetime EP0343559B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3817722A DE3817722A1 (en) 1988-05-25 1988-05-25 USE OF 2-SUBSTITUTED ETHANESULPHONE COMPOUNDS AS GALVANOTECHNICAL AUXILIARIES
DE3817722 1988-05-25

Publications (3)

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EP0343559A1 EP0343559A1 (en) 1989-11-29
EP0343559B1 true EP0343559B1 (en) 1993-03-31
EP0343559B2 EP0343559B2 (en) 1996-07-10

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EP89109164A Expired - Lifetime EP0343559B2 (en) 1988-05-25 1989-05-22 Use of 2-substituted ethane sulfone compounds as galvanic auxiliary agents

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US (1) US5024736A (en)
EP (1) EP0343559B2 (en)
JP (1) JP2505281B2 (en)
DE (2) DE3817722A1 (en)
ES (1) ES2053865T5 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
DE4013349A1 (en) * 1990-04-23 1991-10-24 Schering Ag 1- (2-SULFOAETHYL) PYRIDINIUMBETAIN, METHOD FOR THE PRODUCTION THEREOF AND ACID NICKEL BATH CONTAINING THIS COMPOUND
US5523861A (en) 1991-05-15 1996-06-04 Canon Kabushiki Kaisha Image reader capable of setting density and illumination
US6605204B1 (en) * 1999-10-14 2003-08-12 Atofina Chemicals, Inc. Electroplating of copper from alkanesulfonate electrolytes
US6776893B1 (en) * 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
DE102014207778B3 (en) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Use of a mixture for use in a plating bath or plating bath to produce a bright nickel plating, and to a method of making an article having a bright nickel plating
KR20210094558A (en) 2018-11-07 2021-07-29 코벤트야 인크. Satin Copper Bath and Satin Copper Layer Deposition Method
DE102020212830B4 (en) 2020-10-12 2022-08-18 Sms Group Gmbh Adjustment system for adjusting the guide play of a slide for moving parts of a press and method for adjusting the position of at least one sliding block of a slide on a press

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
DE1075398B (en) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bath for the galvanic production of metal coatings
BE545564A (en) * 1955-03-16
DE1092744B (en) * 1958-12-17 1960-11-10 Dehydag Gmbh Acid galvanic nickel bath
DE1238032B (en) * 1962-07-21 1967-04-06 Dehydag Gmbh Process for the preparation of sulfobetaines containing oxy groups
DE1205973B (en) * 1963-02-02 1965-12-02 Dehydag Gmbh Process for the preparation of thiosulfobetaines containing oxy groups
DE1191652B (en) * 1963-05-15 1965-04-22 Dehydag Gmbh Acid galvanic nickel bath
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2803493A1 (en) * 1978-01-27 1979-08-02 Agfa Gevaert Ag PROCESS FOR THE MANUFACTURING OF SULFOALKYL QUARTER SALTS
FI70304C (en) * 1980-02-27 1986-09-15 Kee Klamps Ltd ROERANSLUTNING
US4526968A (en) * 1981-08-24 1985-07-02 M&T Chemicals Inc. Quaternary aminehydroxypropane sulfobetaines
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
DE3541098A1 (en) * 1985-11-21 1987-05-27 Agfa Gevaert Ag SULFOALKYLATION PROCESS

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JP2505281B2 (en) 1996-06-05
ES2053865T5 (en) 1996-11-16
US5024736A (en) 1991-06-18
JPH0273990A (en) 1990-03-13
DE3817722A1 (en) 1989-12-14
EP0343559B2 (en) 1996-07-10
DE58903912D1 (en) 1993-05-06
EP0343559A1 (en) 1989-11-29
ES2053865T3 (en) 1994-08-01

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