EP0318955A1 - Hochfrequenz-Kleinstleistungstransformator - Google Patents

Hochfrequenz-Kleinstleistungstransformator Download PDF

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Publication number
EP0318955A1
EP0318955A1 EP88119980A EP88119980A EP0318955A1 EP 0318955 A1 EP0318955 A1 EP 0318955A1 EP 88119980 A EP88119980 A EP 88119980A EP 88119980 A EP88119980 A EP 88119980A EP 0318955 A1 EP0318955 A1 EP 0318955A1
Authority
EP
European Patent Office
Prior art keywords
transformer
core halves
windings
primary
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP88119980A
Other languages
English (en)
French (fr)
Inventor
John Alan Brunetti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluke Corp
Original Assignee
John Fluke Manufacturing Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by John Fluke Manufacturing Co Inc filed Critical John Fluke Manufacturing Co Inc
Publication of EP0318955A1 publication Critical patent/EP0318955A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/043—Fixed inductances of the signal type  with magnetic core with two, usually identical or nearly identical parts enclosing completely the coil (pot cores)

Definitions

  • the present invention relates generally to power transformers and more specifically to miniature, high frequency, printed circuit power transformers.
  • a transmission line matching transformer has primary and secondary winding turns separated by plastic sheeting and bonded to a printed circuit board.
  • the transformer which is designed to change the characteristic impedance of a transmission line, is relatively compact but is expensive as a result of customization that is characteristic of transmission line impedance matching transformers.
  • an object of the present invention to provide a miniature high frequency power transformer that is compact and inexpensive to manufacture. It is a further object of the invention to provide a miniature high frequency power transformer that exhibits good magnetic coupling and high voltage isolation. Another object of the present invention is to eliminate the requirement of winding either of or both the primary and/or secondary windings of a miniature high frequency power transformer.
  • first and second circuit boards having formed thereon the primary and secondary windings of a transformer, positioned such that sides of the boards carrying the windings face away from each other.
  • First and second halves of a bifurcated ferrite pot core extending through slotted openings formed in the circuit boards enclose the windings.
  • the windings are in contact with the core halves to avoid any high reluctance air gaps therein.
  • the windings are insulated from the core and from each other by a layer of insulating material deposited on one of the windings.
  • the first and second core halves are secured together either by bonding or by a non-metallic bolt extending through a center through-hole in the first and second core halves.
  • either the primary or secondary winding of the transformer is formed on the mother board of an electronic circuit, and the remaining winding is on a second circuit board parallel to and contacting the mother board.
  • First and second core halves extending through corresponding slotted openings formed in the mother board and the second circuit board enclose the windings.
  • the windings, on outer surfaces of the boards, are insulated from the core halves and each other [and] through the core halves by a layer of insulating material deposited on at least one of the windings, and the core halves are secured together to enclose the windings.
  • first and second ring-shaped circuit boards carrying respectively primary and secondary windings are enclosed within first and second core halves.
  • the windings, on outer surfaces of the boards, are insulated from the core halves and from each other through the core halves by a layer of insulating material deposited on at least one of the windings.
  • either the primary or secondary winding of the transformer is formed on the mother board of an electronic circuit, and the remaining winding is formed on the surface of a second ring-shaped circuit board parallel to and contacting the mother board.
  • First and second core halves enclose the windings and a layer of insulating material deposited on one of the windings insulates the windings from the core and from each other.
  • the primary and secondary windings may, as a variation, be printed on sides of the circuit boards facing each other, rather than on opposite faces as previously described.
  • a layer of insulating material is deposited on at least one of the windings between the boards.
  • Magnetic coupling between the transformer windings in the invention is maximized since there is virtually no air gap between the windings and the core in any of the embodiments. This is especially important for efficient high frequency power transformation, and enables a more compact transformer to be realized. Furthermore, forming the windings directly on the circuit boards in the various embodiments of the present invention eliminates hand or machine winding, and reduces manufacturing costs.
  • a miniature high frequency power transformer 14 in accordance with a first preferred embodiment of the invention comprises a first circuit board 20 (see FIG. 2), having a printed circuit primary winding 26 formed on one side thereof, positioned in a face-to-face relationship with a second circuit board 30 (FIG. 3) having a printed circuit secondary winding 36 formed thereon.
  • the first circuit board 20 and second circuit board 30 have identical arcuate slotted openings 24 and 34 respectively, as well as a circular center aperture 22, 32 formed therein.
  • Primary winding 26 faces a first core half 40 and secondary winding 36 faces a second core half 42; windings 26, 36 are enclosed at opposite sides by the core halves 40, 42 as shown in Figures 1a, 1b.
  • Core halves 40 and 42 are manufactured of ferrite material and are conventional. As shown in FIGs 4a and 4b, each of the identical core halves is substantially disc-shaped with a pair of arcuate peripheral lips 44 extending axially from one surface of the core and an annular spindle 48 projecting from surface 43 therebetween. A circular center through-hole 46 is formed within the spindle of each core half.
  • the spindle 48 has a diameter equal to the diameter of the disc-shaped apertures 22 and 32 formed in the circuit boards. (See FIG. 2, 3).
  • the first and second circuit boards 20, 30 are positioned such that primary winding 26 formed on first circuit board 20 and secondary winding 36 formed on second circuit board 30 face away from other.
  • Slotted openings 24 and 34 in the boards 20 and 30 are in registration with each other, and lips 44 of the first and second core halves 40, 42 extend through the slotted openings 24 and 34 to contact each other with annular spindles 48 on the core halves mating through disc-shaped apertures 22 and 32 in the boards.
  • the lips 44 of each core half are located in registration with each other with primary winding 20 and secondary winding 30 facing and enclosing core halves 40 and 42 respectively. (See FIG. 8).
  • each core half is substantially equal to the thickness of each circuit board 20, 30 so that the primary and secondary windings abut the core surfaces 43 of core halves 40, 42. This close fitting relationship between the windings and the core halves maximizes coupling of the windings to the core and minimizes leakage flux (See FIG 1b).
  • electrical insulation between primary winding 26 and secondary winding 36 is attained by the deposition of an insulating layer 13 on either or both of the two windings (the insulating layer 13 is deposited on secondary winding 36 in FIG. 1a).
  • Insulating layer 13 is formed by applying Dry Film Solder Mask manufactured by the Dynachem Company, located in Tustin, CA, onto one of the circuit boards, as shown in FIG. 7, or preferably, by using vacuum lamination; however, any other permanent insulating depositing material that exhibits high voltage thin film characteristics may be used as well.
  • first circuit board 20 and second circuit board 30 eliminates winding and reduces costs.
  • the first and second circuit boards 20 and 30 in the preferred embodiment comprise epoxy resin impregnated fiberglass; however other suitable materials can be used.
  • transformer 14 can be bonded together by any suitable bonding agent (not shown) applied to the core lips 44.
  • any suitable bonding agent (not shown) applied to the core lips 44.
  • a non-metallic bolt 12a may secure the tranformer assembly together, passing through first core half 40 and second core half 42 via through-­holes 46 and retained by a non-metallic nut 12b.
  • one winding of the transformer can be formed directly on a circuit board carrying components of a complex electronic circuit, rather than on a dedicated circuit board.
  • the transformer 90 has either its primary winding 26 or its secondary winding 36 on a mother board 92 of a piece of electronic equipment with the remaining transformer winding formed on a second circuit board 94.
  • the primary and secondary windings 64, 66 of a transformer 50 are formed on first and second ring-­shaped circuit boards 60, 62, each having a disc-shaped central aperture 68 formed therein. (FIG. 6a,6b).
  • the diameter of aperture 68 is identical to that of annular spindle 48 formed on the ferrite core halves, shown in FIG. 4a, 4b and FIG. 6a,6b.
  • Both ring-shaped circuit boards conform to the surface 43 in each of the ferrite core halves, and a layer of insulating material is deposited on one or both of the windings.
  • first ring-­shaped circuit board 60 and second ring-shaped circuit board 62 are brought together with the circuit boards oriented such that primary winding 64 and secondary winding 66 face away from each other.
  • the boards 60, 62 are located within the core halves 40, 42 as the core halves are assembled around the boards, with primary and secondary windings 64, 66 facing their respective core halves.
  • a layer of insulating material 13 is deposited on one or both windings 64, 66 (only one deposited layer is shown).
  • the entire assembly is next bonded together utilizing any appropriate bonding material (not shown), with spindles 48 and lips 44 of the respective core halves 40, 42 interfitting with each other (See FIG. 5).
  • there is no air gap between the windings and the core halves of the transformer thereby optimizing the power transfer capacity of the device.
  • either the primary winding 104 or secondary winding 106 of a transformer 100 is formed on a mother board 92 and the remaining transformer winding is formed on a second, ring-shaped circuit board 101.
  • the ring-shaped circuit board 101 is formed so as to fit entirely within first and second core halves 40, 42, and in contact with surfaces 43 of the core halves, as in the other embodiments of the invention.
  • ring-shaped circuit board 101 is located in contact with mother board 92, with primary winding 104 and secondary winding 106 of the two boards facing their respective core halves 40,42.
  • Core halves 40 and 42 are brought together with one core half enclosing ring-shaped circuit board 101, and the other core half inserted into the mother boadrd 92 in the same manner as in the embodiment of FIG. 1a.
  • the entire assembly is secured into place by bonding together or otherwise joining core halves 40, 42 by other means.
  • the primary and secondary windings are formed on sides of the circuit boards facing each other, rather than on opposite faces as previously described.
  • a layer of insulating material is deposited on at least one of the windings between the boards.
  • primary winding 26 on circuit board 20 faces secondary winding 36 on circuit board 30, insulating layer 13 is deposited on secondary winding 36.
  • a miniature high frequency power transformer comprising first and second circuit boards having formed thereon the primary and secondary windings of the transformer, positioned such that sides of the boards carrying the windings face away from each other.
  • the boards are insulated from each other by a layer of an electrically insulating material deposited on at least one of the windings.
  • Opposite halves of a bifurcated core extending through openings formed in the boards enclose the windings with virtually no air gap between the core and the windings.
  • Both boards can be dedicated to the transformer, or one board can be a mother board of an electronic circuit. Further, one or both boards can be shaped to be enclosed by one or both core halves.
  • the primary and secondary windings may be printed on sides of the circuit boards facing each other rather than on opposite faces.
  • a layer of insulating material is deposited on at least one of the windings between the boards.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
EP88119980A 1987-12-02 1988-11-30 Hochfrequenz-Kleinstleistungstransformator Withdrawn EP0318955A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US127703 1980-03-06
US12770387A 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
EP0318955A1 true EP0318955A1 (de) 1989-06-07

Family

ID=22431511

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88119980A Withdrawn EP0318955A1 (de) 1987-12-02 1988-11-30 Hochfrequenz-Kleinstleistungstransformator

Country Status (3)

Country Link
EP (1) EP0318955A1 (de)
JP (1) JPH01205509A (de)
CN (1) CN1033712A (de)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2672181A1 (fr) * 1991-01-24 1992-07-31 Burr Brown Corp Transformateur plan pour circuit integre hybride.
US5321380A (en) * 1992-11-06 1994-06-14 Power General Corporation Low profile printed circuit board
WO1995015609A1 (de) * 1993-12-01 1995-06-08 Melcher Ag Dc/dc-wandler für niedrige ausgangsspannungen
GB2285892A (en) * 1994-01-07 1995-07-26 Advanced Power Conversion Ltd Transformer structurally combined with an electrical/electronic circuit substrate
WO1996017360A1 (en) * 1994-12-01 1996-06-06 Northrop Grumman Corporation Planar pulse transformer
US5565837A (en) * 1992-11-06 1996-10-15 Nidec America Corporation Low profile printed circuit board
US5929733A (en) * 1993-07-21 1999-07-27 Nagano Japan Radio Co., Ltd. Multi-layer printed substrate
US6069548A (en) * 1996-07-10 2000-05-30 Nokia Telecommunications Oy Planar transformer
DE19915649A1 (de) * 1999-04-07 2000-10-12 Rohde & Schwarz Impedanz-Transformator für einen Gegentakt-Verstärker eines Kurz- oder Ultrakurzwellen-Senders
US6147583A (en) * 1998-05-26 2000-11-14 Artesyn Technologies Transformer assembly
WO2009131429A1 (en) * 2008-04-22 2009-10-29 Innovia, Sia Modular transformer
CN101651035B (zh) * 2009-08-07 2011-07-20 昆山恒艺电器有限公司 浸漆架改良结构
CN101699586B (zh) * 2009-10-22 2013-01-30 四川泛华航空仪表电器有限公司 高频变压器绝缘浸渍处置工艺
US20150101854A1 (en) * 2013-10-10 2015-04-16 Analog Devices, Inc. Miniature planar transformer
US9959967B2 (en) 2014-05-15 2018-05-01 Analog Devices, Inc. Magnetic devices and methods for manufacture using flex circuits

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069119U (ja) * 1992-06-30 1994-02-04 ミツミ電機株式会社 トランス
JPH0736556U (ja) * 1993-12-13 1995-07-04 株式会社ユー・アール・ディー 無結線電力授受装置
JP2003125588A (ja) * 2001-10-12 2003-04-25 Mitsubishi Electric Corp 電力変換装置
CN101373658B (zh) * 2007-08-21 2011-06-29 台达电子工业股份有限公司 导电绕组结构及使用该导电绕组结构的变压器
JP2013131719A (ja) * 2011-12-22 2013-07-04 Toyota Industries Corp 誘導素子および誘導装置
JP2014204032A (ja) * 2013-04-08 2014-10-27 三菱電機株式会社 コイル装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180923A (en) * 1966-02-21 1970-02-11 Plessey Co Ltd Improvements relating to Electric Coil Assemblies.
GB2087656A (en) * 1980-11-14 1982-05-26 Analog Devices Inc Miniaturized transformer construction
EP0126169A1 (de) * 1983-05-19 1984-11-28 ANT Nachrichtentechnik GmbH Verteiler für Hochfrequenzenergie

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180923A (en) * 1966-02-21 1970-02-11 Plessey Co Ltd Improvements relating to Electric Coil Assemblies.
GB2087656A (en) * 1980-11-14 1982-05-26 Analog Devices Inc Miniaturized transformer construction
EP0126169A1 (de) * 1983-05-19 1984-11-28 ANT Nachrichtentechnik GmbH Verteiler für Hochfrequenzenergie

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353001A (en) * 1991-01-24 1994-10-04 Burr-Brown Corporation Hybrid integrated circuit planar transformer
GB2252208B (en) * 1991-01-24 1995-05-03 Burr Brown Corp Hybrid integrated circuit planar transformer
FR2672181A1 (fr) * 1991-01-24 1992-07-31 Burr Brown Corp Transformateur plan pour circuit integre hybride.
US5321380A (en) * 1992-11-06 1994-06-14 Power General Corporation Low profile printed circuit board
US5565837A (en) * 1992-11-06 1996-10-15 Nidec America Corporation Low profile printed circuit board
US5929733A (en) * 1993-07-21 1999-07-27 Nagano Japan Radio Co., Ltd. Multi-layer printed substrate
US5673183A (en) * 1993-12-01 1997-09-30 Melcher, Ag DC/DC converter for low output voltages
WO1995015609A1 (de) * 1993-12-01 1995-06-08 Melcher Ag Dc/dc-wandler für niedrige ausgangsspannungen
GB2285892A (en) * 1994-01-07 1995-07-26 Advanced Power Conversion Ltd Transformer structurally combined with an electrical/electronic circuit substrate
GB2285892B (en) * 1994-01-07 1997-05-14 Advanced Power Conversion Ltd A transformer assembly
WO1996017360A1 (en) * 1994-12-01 1996-06-06 Northrop Grumman Corporation Planar pulse transformer
US6069548A (en) * 1996-07-10 2000-05-30 Nokia Telecommunications Oy Planar transformer
US6147583A (en) * 1998-05-26 2000-11-14 Artesyn Technologies Transformer assembly
DE19915649A1 (de) * 1999-04-07 2000-10-12 Rohde & Schwarz Impedanz-Transformator für einen Gegentakt-Verstärker eines Kurz- oder Ultrakurzwellen-Senders
DE19915649B4 (de) * 1999-04-07 2009-10-22 Rohde & Schwarz Gmbh & Co. Kg Transformatoranordnung für den Gegentakt-Verstärker einer Kurzwellen- oder Ultrakurzwellen-Senderendstufe
WO2009131429A1 (en) * 2008-04-22 2009-10-29 Innovia, Sia Modular transformer
CN101651035B (zh) * 2009-08-07 2011-07-20 昆山恒艺电器有限公司 浸漆架改良结构
CN101699586B (zh) * 2009-10-22 2013-01-30 四川泛华航空仪表电器有限公司 高频变压器绝缘浸渍处置工艺
US20150101854A1 (en) * 2013-10-10 2015-04-16 Analog Devices, Inc. Miniature planar transformer
US10141107B2 (en) * 2013-10-10 2018-11-27 Analog Devices, Inc. Miniature planar transformer
US9959967B2 (en) 2014-05-15 2018-05-01 Analog Devices, Inc. Magnetic devices and methods for manufacture using flex circuits

Also Published As

Publication number Publication date
CN1033712A (zh) 1989-07-05
JPH01205509A (ja) 1989-08-17

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