EP0270448A1 - Probe for an ultrasonic apparatus with a bar composed of piezo-electric elements - Google Patents
Probe for an ultrasonic apparatus with a bar composed of piezo-electric elements Download PDFInfo
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- EP0270448A1 EP0270448A1 EP87402637A EP87402637A EP0270448A1 EP 0270448 A1 EP0270448 A1 EP 0270448A1 EP 87402637 A EP87402637 A EP 87402637A EP 87402637 A EP87402637 A EP 87402637A EP 0270448 A1 EP0270448 A1 EP 0270448A1
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- support
- blade
- metallization
- probe according
- probe
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- 239000000523 sample Substances 0.000 title claims abstract description 25
- 238000001465 metallisation Methods 0.000 claims abstract description 39
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 230000007704 transition Effects 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 description 6
- 238000002604 ultrasonography Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 3
- 238000007906 compression Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Definitions
- the present invention relates to an ultrasonic device probe with a bar of piezoelectric elements. It finds more particularly its application in the medical field where ultrasound ultrasound devices are used for diagnostic purposes to present images of internal tissue structures of human bodies studied. It can nevertheless be implemented in other fields as soon as an electrical connection problem must be resolved between a piezoelectric element and the control circuits of a probe to which it belongs.
- An ultrasound system schematically comprises an electrical signal generator and a transducer probe for applying a mechanical vibration corresponding to these signals in a medium to be studied.
- the probe can be used in a reversible manner to receive acoustic signals backscattered by the medium, and to transform these signals into electrical signals subsequently applied to reception and processing means.
- the frequency of the electrical - acoustic signal is high.
- the probe consists of a plurality of transducer elements aligned one next to the other. Each piezoelectric transducer element comprises two metallizations, located on opposite faces of this element, and which must be connected to the transmission-reception circuits of the ultrasound system. The dimensions of these elements are small and cause difficulties in producing the system for connecting the electrical signal to these elements.
- the elements are metallized on three of their contiguous surfaces, and two electrically independent metallizations, assigned to the two faces of the element, must be provided by making a saw cut in the piezoelectric crystal thus prepared. This saw cut is delicate. It has been imagined to resolve these drawbacks by adding on each side of each transducer element, a relay block metallized continuously on at least two of its adjacent faces. The relay block can then be electrically connected by one of its faces to one of the faces of the transducer element and by its other face to a connection circuit of the printed circuit type. For this printed circuit, the problems of curvature of the bar no longer arise since its connections can be made after curvature of this bar.
- FIG. 1 An example of such an embodiment is shown in FIG. 1. It was then envisaged to connect by connecting wires the corresponding faces of the relay blocks and of the elements. This micro-connection operation is however delicate to undertake.
- advantage has been taken of the fact that the piezoelectric elements are covered with a transition blade.
- This blade allows the adaptation of the acoustic signal to the environment to be studied.
- This blade has the particularity here of being metallized on its face opposite the piezoelectric element which it covers.
- This blade also extends beyond the piezoelectric element and also covers the relay block which serves for the electrical connection.
- the electrical signals are then simply routed from the im circuit. awarded, to the relay block, to the metallization of the blade, then finally to the metallization of the piezoelectric element.
- a layer of non-conductive adhesive is used to ensure mechanical-electrical continuity between the support, the element, and the blade.
- the layer of non-conductive glue does not constitute an insulating screen for the electrical connection.
- non-conductive adhesives have the distinction of being very fluid. They can therefore be used in very thin thickness.
- metallization appearance defects which give these metallizations a granulated appearance, it is possible by exerting sufficient pressure when bonding the parts by their metallized part to obtain a hardening, a molecular interpenetration between these metallization layers. In this way the connection between these layers can be considered as a dispersion of a multitude of electrical bridges between mechanical connections caused by the presence of the adhesive.
- the bonding of the metallizations, with conductive adhesive or not has the advantage on the welds of not causing any additional risk of detachment of these metallizations.
- the invention therefore relates to an ultrasonic device probe of the type with piezoelectric element strip, each element being inserted between a support and an acoustic transition plate, and being metallized on its faces opposite the support and its blade, characterized in that the blade and / or the support include a facing metallization intended to be connected to the corresponding metallization of the element.
- FIG. 1 partially represents an ultrasonic device probe with a bar of piezoelectric elements according to the invention.
- This probe comprises a support 1 common to a plurality of transducer elements such as 2.
- the transducer elements are separated from each other by partitions such as 3.
- Each element is covered by a blade 4 called acoustic transition blade and has on its opposite faces of the support and the blade a metallization respectively 5 and 6.
- the support and the blade also include metallizations respectively 7 and 8. These metallizations are intended to be connected to the metallizations of the elements.
- the device for the electrical connection of the elements comprises on each side of each element a parallelepipedal relay block such as 9 or 10.
- the blocks are made of insulating material, for example a ceramic.
- the various metallizations are obtained simply, for example by evaporation-spraying under vacuum, by electrolysis or others.
- the electrical signals are conducted between the electronic circuits of the probe (not shown) and the piezoelectric elements, by printed circuits such as 13 and 14, the tracks 15 or 16 of which are connected by links 17, 18 to the side faces.
- the connection of the connections is obtained for example by thermo-compression of the ends of the wires 17 and 18. This thermo-compression can not cause damage in the metallizations of the support, the element or of its blade, since these parts are only glued to each other.
- non-conductive glue By way of improvement to the invention, the presence, to conduct the electrical signals between the metallizations 6 and 8 on the one hand, and / or between the metallizations 5 and 7 on the other hand, of layers 19 and 20 respectively is noted.
- non-conductive glue The figure 2 is an enlargement of a part P of the connection between the upper face of a piezoelectric element and the lower face of the transition plate which covers it. It shows that the metallizations 6 and 8 respectively of these two parts are not perfectly smooth. On the other hand, they have microscopic roughness.
- a layer of non-conductive adhesive 19 is then spread before the assembly of these parts. Sufficient pressure is then exerted, for example of the order of 50 kgf per cm 2, and the very fluid adhesive escapes on the sides of the bonding.
- a bar of piezoelectric elements is manufactured in the following manner: on a support 1 elongated in the shape of an inverted T, and previously metallized on its upper face, a layer of non-conductive adhesive is preferably placed, a bar of piezoelectric material metallized on its two faces. Then place on the two wings 23 and 24 of the support of the strips comprising two electrically independent metallizations: there also preferably by using a layer of non-conductive adhesive interposed. Finally we glue, with a non-conductive glue, a blade, the same length as the support, that the piezoelectric bar, and that the strips, above the whole. The assembly is subjected to sufficient pressure and the adhesive is allowed to set.
- the cuts 3 are made, for example with a saw, to separate the bar into multiple independent elements.
- the cuts are not total, the support remains common to all the elements.
- the support is made of a heat-deformable material and the curvature is obtained during a heating-cooling cycle.
- the non-conductive glue eliminates any risk of short circuit between the different metallizations. These short circuits may be due, in the cited state of the art, to the use of conductive adhesives which spread everywhere. As a result, the production efficiency of the probes can be considerably increased here.
- the non-conductive adhesive is a structural adhesive, therefore with very high adhesion power, and it is in addition a so-called high temperature adhesive, that is to say very stable at low temperature or at ambient temperature. but very fluid at its (high) processing temperature. However, it is not necessary to carry out all the electrical connections of the elements of the bar with non-conductive glue.
- connections between the metallization 5 of an element and the metallization 7 of the support need not necessarily be made with a layer of non-conductive adhesive.
- parasitic reflections of acoustic vibration are less to be feared because they occur in a non-useful direction: towards the rear of the bar. They are therefore less annoying.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
La liaison électrique entre les circuits (13,14) de commande d'une sonde et les faces métallisées (5,6) des éléments (2) piéso-électriques de cette sonde est assurée par des métallisations (7,8) réalisées sur des pièces, support (1) ou lame (4) au contact de ces faces métallisées. La liaison mécanique et électrique entre ces métallisations peut être assurée par une mince couche de colle (19,20) non conductrice.The electrical connection between the circuits (13,14) for controlling a probe and the metallized faces (5,6) of the piezoelectric elements (2) of this probe is ensured by metallizations (7,8) produced on parts, support (1) or blade (4) in contact with these metallized faces. The mechanical and electrical connection between these metallizations can be ensured by a thin layer of non-conductive adhesive (19,20).
Description
La présente invention a pour objet une sonde d'appareil à ultrasons à barrette d'éléments piézo-électriques. Elle trouve plus particulièrement son application dans le domaine médical où des appareils à ultrasons échographes sont utilisés à des fins de diagnostic pour présenter des images de structures internes tissulaires de corps humains étudiés. Elle peut néanmoins être mise en oeuvre dans d'autres domaines dès qu'un problème de connexion électrique doit être réglé entre un élément piézo-électrique et les circuits de commande d'une sonde à laquelle il appartient.The present invention relates to an ultrasonic device probe with a bar of piezoelectric elements. It finds more particularly its application in the medical field where ultrasound ultrasound devices are used for diagnostic purposes to present images of internal tissue structures of human bodies studied. It can nevertheless be implemented in other fields as soon as an electrical connection problem must be resolved between a piezoelectric element and the control circuits of a probe to which it belongs.
Un échographe comporte schématiquement un générateur de signaux électriques et une sonde transductrice pour appliquer une vibration mécanique correspondant à ces signaux dans un milieu à étudier. Pendant des arrêts de l'émission, la sonde peut être utilisée d'une manière réversible pour recevoir des signaux acoustiques rétrodiffusés par le milieu, et pour transformer ces signaux en des signaux électriques ultérieurement appliqués à des moyens de réception et de traitemet. Pour diverses raisons, notamment pour des questions de résolution de l'image restituée par un échographe, la fréquence du signal électrique - acoustique est élevée. Pour ces mêmes raisons la sonde est constituée d'une pluralité d'éléments transducteurs alignés les uns à coté des autres. Chaque élément piézo-électrique transducteur comporte deux métallisations, situées sur des faces opposées de cet élément, et qui doivent être reliés aux circuits d'émission-reception de l'échographe. Les dimensions de ces éléments sont faibles et entrainent des difficultés de réalisation du système de connexion du signal éléctrique à ces éléments.An ultrasound system schematically comprises an electrical signal generator and a transducer probe for applying a mechanical vibration corresponding to these signals in a medium to be studied. During emission stops, the probe can be used in a reversible manner to receive acoustic signals backscattered by the medium, and to transform these signals into electrical signals subsequently applied to reception and processing means. For various reasons, in particular for questions of resolution of the image restored by an ultrasound system, the frequency of the electrical - acoustic signal is high. For these same reasons, the probe consists of a plurality of transducer elements aligned one next to the other. Each piezoelectric transducer element comprises two metallizations, located on opposite faces of this element, and which must be connected to the transmission-reception circuits of the ultrasound system. The dimensions of these elements are small and cause difficulties in producing the system for connecting the electrical signal to these elements.
Il est connu, notamment dans une demande de brevet Européen no 84 308 373.4, déposée le 03 DECEMBRE 1984, d'appliquer ou de prélever le signal électrique aux bornes de chaque élément transducteur en soudant des pistes de liaison électrique, supportées par un circuit imprimé souple, directement sur les métallisations des éléments. Ultérieurement, les circuits imprimés souples sont repliés vers l'arrière de la sonde et, par des dispositions diverses, la sonde est de plus courbée pour correspondre à une utilisation particulièrement recherchée d'exploration du milieu étudié : par balayage sectoriel. Cette solution présente de nombreux inconvénients. Par exemple les liaisons électriques se répartissent en points chauds d'un côté de la barrette et points froids de l'autre côté : ceci augmente les problèmes de diaphonie entre éléments dans cette barrette. En outre les éléments sont métallisés sur trois de leurs surfaces contigües, et deux métallisations électriquement indépendantes, affectées aux deux faces de l'élément, doivent être ménagées en exécutant un trait de scie dans le cristal piézo-électrique ainsi préparé. Ce trait de scie est délicat. Il a été imaginé de résoudre ces inconvénients en adjoignant de part et d'autre de chaque élément transducteur, un bloc relais métallisé continuement sur au moins deux de ses faces adjacentes. Le bloc relais peut alors être relié électriquement par une de ses faces à une des faces de l'élément transducteur et par son autre face à un circuit de connexion de type circuit imprimé. Pour ce circuit imprimé, les problèmes de courbure de la barrette n'interviennent plus puisque ses connexions peuvent être faites après courbure de cette barrette.It is known, particularly in an application for European patent No. 84 308 373.4, filed December 3, 1984, to apply or taking out the electric signal at the terminals of each transducer element by welding electrical connecting tracks, supported by a flexible printed circuit, directly on the metallizations of the elements. Subsequently, the flexible printed circuits are folded towards the rear of the probe and, by various arrangements, the probe is moreover curved to correspond to a particularly sought-after use for exploring the environment studied: by sectoral scanning. This solution has many drawbacks. For example, the electrical connections are divided into hot spots on one side of the strip and cold spots on the other side: this increases the problems of crosstalk between elements in this strip. In addition, the elements are metallized on three of their contiguous surfaces, and two electrically independent metallizations, assigned to the two faces of the element, must be provided by making a saw cut in the piezoelectric crystal thus prepared. This saw cut is delicate. It has been imagined to resolve these drawbacks by adding on each side of each transducer element, a relay block metallized continuously on at least two of its adjacent faces. The relay block can then be electrically connected by one of its faces to one of the faces of the transducer element and by its other face to a connection circuit of the printed circuit type. For this printed circuit, the problems of curvature of the bar no longer arise since its connections can be made after curvature of this bar.
Un exemple d'une telle réalisation est montré sur la figure 1. Il a ensuite été envisagé de relier par des fils de liaisons les faces correspondantes des blocs relais et des éléments. Cette opération de micro-connexion est cependant délicate à entreprendre. Dans la présente invention il a été mis à profit le fait que les éléments piézo-électriques sont recouverts d'une lame de transition. Cette lame permet l'adaption du signal acoustique au milieu à étudier. Cette lame a la particularité ici d'être métallisée sur sa face en regard de l'élément piézo-électrique qu'elle couvre. Cette lame déborde par ailleurs de l'élément piézo-électrique et vient recouvrir également le bloc relais qui sert pour la liaison électrique. Les signaux électriques sont alors conduits simplement du circuit im primé, au bloc relais, à la métallisation de la lame, puis enfin à la métallisation de l'élément piézo-électrique.An example of such an embodiment is shown in FIG. 1. It was then envisaged to connect by connecting wires the corresponding faces of the relay blocks and of the elements. This micro-connection operation is however delicate to undertake. In the present invention, advantage has been taken of the fact that the piezoelectric elements are covered with a transition blade. This blade allows the adaptation of the acoustic signal to the environment to be studied. This blade has the particularity here of being metallized on its face opposite the piezoelectric element which it covers. This blade also extends beyond the piezoelectric element and also covers the relay block which serves for the electrical connection. The electrical signals are then simply routed from the im circuit. awarded, to the relay block, to the metallization of the blade, then finally to the metallization of the piezoelectric element.
Dans un perfectionnement de l'invention on utilise une couche de colle non conductrice pour assurer la continuité mécanique-électrique entre le support, l'élément, et la lame. Contrairement à ce à quoi on pouvait s'attendre, la couche de colle non conductrice ne constitue pas un écran isolant pour la liaison électrique. En effet les colles non conductrices présentent la particularité d'être très fluides. Elles peuvent donc être mises en oeuvre en très fine épaisseur. En utilisant alors des défauts d'aspect des métallisations, qui confèrent à ces métallisations un aspect granulé, on peut en exerçant une pression suffisante lors du collage des pièces par leur partie métallisée obtenir un écrouissage, une interpénétration moléculaire entre ces couches de métallisation. De cette façon la liaison entre ces couches peut être considérée comme une dispersion d'une multitude de ponts électriques entre des liaisons mécaniques provoquées par la présence de la colle. Dans tous les cas le collage des métallisations, par colle conductrice ou non, présente l'avantage sur les soudures de ne pas provoquer de risque supplémentaire de décollement de ces métallisations.In an improvement of the invention, a layer of non-conductive adhesive is used to ensure mechanical-electrical continuity between the support, the element, and the blade. Contrary to what one might expect, the layer of non-conductive glue does not constitute an insulating screen for the electrical connection. Indeed, non-conductive adhesives have the distinction of being very fluid. They can therefore be used in very thin thickness. By then using metallization appearance defects, which give these metallizations a granulated appearance, it is possible by exerting sufficient pressure when bonding the parts by their metallized part to obtain a hardening, a molecular interpenetration between these metallization layers. In this way the connection between these layers can be considered as a dispersion of a multitude of electrical bridges between mechanical connections caused by the presence of the adhesive. In all cases, the bonding of the metallizations, with conductive adhesive or not, has the advantage on the welds of not causing any additional risk of detachment of these metallizations.
L'invention concerne donc une sonde d'appareil à ultrasons du type à barrette d'éléments piézo-électriques, chaque élément étant inséré entre un support et une lame de transition acoustique, et étant métallisé sur ses faces en regard du support et de sa lame, caractérisée en ce que la lame et/ou le support comportent une métallisation en regard destiné à être connectée à la métallisation correspondante de l'élément.The invention therefore relates to an ultrasonic device probe of the type with piezoelectric element strip, each element being inserted between a support and an acoustic transition plate, and being metallized on its faces opposite the support and its blade, characterized in that the blade and / or the support include a facing metallization intended to be connected to the corresponding metallization of the element.
L'invention sera mieux comprise à la lecture de la description qui suit et à l'examen des figures qui l'accompagnent. Elles ne sont données qu'à titre indicatif et nullement limitatif de l'invention. Les figures montrent :
- - figure 1 : une vue en perspective d'une sonde d'appareil à ultrasons conforme à l'invention;
- - figure 2 : une coupe d'un détail d'une partie de la figure 1 montrant schématiquement la continuité électrique.
- - Figure 1: a perspective view of an ultrasonic device probe according to the invention;
- - Figure 2: a section of a detail of a part of Figure 1 schematically showing the electrical continuity.
La figure 1 représente en partie une sonde d'appareil à ultrasons à barrette d'éléments piézo-électriques conforme à l'invention. Cette sonde comporte un support 1 commun à une pluralité d'éléments transducteurs tels que 2. Les éléments transducteurs sont séparés les uns des autres par des séparations telles que 3. Chaque élément est recouvert par une lame 4 dite de transition acoustique et possède sur ses faces en regard du support et de la lame une métallisation respectivement 5 et 6. Dans l'invention le support et la lame comportent également des métallisations respectivement 7 et 8. Ces métallisations sont destinées à être connectées aux métallisations des éléments. Dans un exemple préféré de réalisation, le dispositif de liaison électrique des éléments comporte de part et d'autre de chaque élément un bloc relais parallélépipèdique tel que 9 ou 10. Les blocs sont réalisés en matériau isolant, par exemple en une céramique. Ils sont métallisés sur leur surface par deux métallisations électriquement indépendantes respectivement 11 et 12 à chaque fois. Les diverses métallisations sont obtenues simplement, par exemple par évaporation-projection sous vide, par électrolyse ou autres. Les signaux électriques sont conduits entre les circuits électroniques de la sonde (non représentés) et les éléments piézo-électriques, par des circuits imprimés tels que 13 et 14, dont les pistes 15 ou 16 sont reliées par des liaisons 17, 18 aux faces latérales métallisées électriquement indépendantes des blocs 9 et 10. La connexion des liaisons est obtenues par exemple par thermo-compression des extrémités des fils 17 et 18. Cette thermo-compression ne peut pas provoquer de dégat dans les métallisations du support, de l'élément ou de sa lame, puisque ces pièces ne sont que collées les unes aux autres.FIG. 1 partially represents an ultrasonic device probe with a bar of piezoelectric elements according to the invention. This probe comprises a
A titre de perfectionnement à l'invention on note la présence, pour conduire les signaux éléctriques entre les métallisations 6 et 8 d'une part, et/ou entre les métallisations 5 et 7 d'autre part, de couches respectivement 19 et 20 de colle non conductrice. La figure 2 est un agrandissement d'une partie P de la liaison entre la face supérieure d'un élément piézo-électrique et la face inférieure de la lame de transition qui le recouvre. Elle montre que les métallisations 6 et 8 respectivement de ces deux pièces ne sont pas parfaitement lisses. Elles présentent par contre des aspérités microscopiques. On répand alors une couche de colle non conductrice 19 avant l'assemblage de ces pièces. On exerce ensuite une pression suffisante, par exemple de l'ordre de 50 kgf par cm2, et la colle très fluide s'échappe sur les cotés du collage. Elle ne laisse en place que des minuscules liaisons mécaniques 21 parmis lesquelles est dispersé une multitude de ponts éléctriques 22. Dans ces conditions la liaison électrique est bonne entre la métallisation 8 et entre la métallisation 6 et le couplage acoustique entre l'élément 2 et sa lame 4 est direct. On peut opérer de même pour le support.By way of improvement to the invention, the presence, to conduct the electrical signals between the
Une barrette d'éléments piézo-électriques est fabriquée de la manière suivante : sur un support 1 alongé en forme de T inversé, et préalablement métallisé sur sa face supérieure, on place, d'une manière préférée avec une couche de colle non conductrice, un barreau d'un matériau piézo-électrique métallisé sur ses deux faces. Puis on place sur les deux ailes 23 et 24 du support des réglettes comportant deux métallisations électriquement indépendantes : là aussi de préférence en utilisant une couche de colle non conductrice interposée. Enfin on colle, avec une colle non conductrice, une lame, d'une même longueur que le support, que le barreau piézo-électrique, et que les réglettes, au dessus du tout. On soumet l'ensemble à une pression suffisante et on laisse prendre la colle. Lorsque la prise est terminée on exécute les découpes 3, par exemple à la scie, pour séparer la barrette en de multiples éléments indépendants. Les découpes ne sont pas totales, le support reste commun à tous les éléments. Pour constituer une barrette courbe il suffit ensuite de courber le support 1 dans la forme voulue. D'une manière préférée le support est en un matériau thermo-déformable et la courbure est obtenue au cours d'un cycle d'échauffement-refroidissement.A bar of piezoelectric elements is manufactured in the following manner: on a
L'invention apporte de plus un avantage inattendu. L'usage de colle non conductrice permet d'éliminer tout risque de court-circuit entre les différentes métallisations. Ces court-circuits peuvent être dûs, dans l'état de la technique citée, à l'usage de colles conductrices qui se répandent partout. Il en résulte que le rendement de fabrication des sondes peut être ici considérablement augmenté. D'une manière préférée la colle non conductrice est une colle structurale, donc à très haut pouvoir d'adhésion, et elle est en plus une colle dite haute température, c'est-à-dire très stable à basse température ou à température ambiante mais très fluide à sa (haute) température de mise en oeuvre. Il n'est cependant pas nécessaire d'exécuter toutes les liaisons électriques des éléments de la barrette avec de la colle non conductrice. En particulier les liaisons entre la métallisation 5 d'un élément et la métallisation 7 du support ne doit pas nécessairement être réalisée avec une couche de colle non conductrice. A cet endroit, en effet, des réflexions parasites de vibration acoustiques sont moins à craindre car elles se produisent dans une direction non utile : vers l'arrière de la barrette. Elles sont donc moins génantes.The invention also provides an unexpected advantage. The use of non-conductive glue eliminates any risk of short circuit between the different metallizations. These short circuits may be due, in the cited state of the art, to the use of conductive adhesives which spread everywhere. As a result, the production efficiency of the probes can be considerably increased here. Preferably, the non-conductive adhesive is a structural adhesive, therefore with very high adhesion power, and it is in addition a so-called high temperature adhesive, that is to say very stable at low temperature or at ambient temperature. but very fluid at its (high) processing temperature. However, it is not necessary to carry out all the electrical connections of the elements of the bar with non-conductive glue. In particular, the connections between the metallization 5 of an element and the
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FR8616663A FR2607593B1 (en) | 1986-11-28 | 1986-11-28 | PROBE OF ULTRASONIC APPARATUS WITH PIEZOELECTRIC ELEMENT BAR |
FR8616663 | 1986-11-28 |
Publications (1)
Publication Number | Publication Date |
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EP0270448A1 true EP0270448A1 (en) | 1988-06-08 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87402637A Withdrawn EP0270448A1 (en) | 1986-11-28 | 1987-11-24 | Probe for an ultrasonic apparatus with a bar composed of piezo-electric elements |
EP87907783A Withdrawn EP0333738A1 (en) | 1986-11-28 | 1987-11-24 | Probe with bar of piezoelectric elements for ultrasound apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87907783A Withdrawn EP0333738A1 (en) | 1986-11-28 | 1987-11-24 | Probe with bar of piezoelectric elements for ultrasound apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US5044370A (en) |
EP (2) | EP0270448A1 (en) |
JP (1) | JPH02501611A (en) |
CA (1) | CA1298395C (en) |
FR (1) | FR2607593B1 (en) |
WO (1) | WO1988004092A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5156844A (en) * | 1987-11-17 | 1992-10-20 | Brown University Research Foundation | Neurological therapy system |
US5106627A (en) * | 1987-11-17 | 1992-04-21 | Brown University Research Foundation | Neurological therapy devices |
JP3487981B2 (en) * | 1994-10-20 | 2004-01-19 | オリンパス株式会社 | Ultrasonic probe |
FR2815723B1 (en) * | 2000-10-24 | 2004-04-30 | Thomson Csf | SYSTEM METHOD AND PROBE FOR OBTAINING IMAGES VIA A BROADCAST EMITTED BY AN ANTENNA AFTER REFLECTION OF THESE WAVES AT A TARGET ASSEMBLY |
US6490228B2 (en) * | 2001-02-16 | 2002-12-03 | Koninklijke Philips Electronics N.V. | Apparatus and method of forming electrical connections to an acoustic transducer |
JP5024989B2 (en) * | 2007-01-23 | 2012-09-12 | 株式会社東芝 | Two-dimensional array ultrasonic probe and ultrasonic diagnostic system |
US8450910B2 (en) | 2011-01-14 | 2013-05-28 | General Electric Company | Ultrasound transducer element and method for providing an ultrasound transducer element |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0005265A2 (en) * | 1978-05-10 | 1979-11-14 | Siemens Aktiengesellschaft | Method for making contact on the adhesive side of the electrode of an electrical device |
US4276491A (en) * | 1979-10-02 | 1981-06-30 | Ausonics Pty. Limited | Focusing piezoelectric ultrasonic medical diagnostic system |
JPS57181299A (en) * | 1981-04-30 | 1982-11-08 | Yokogawa Hokushin Electric Corp | Conformal array transducer and its manufacture |
EP0140363A2 (en) * | 1983-10-31 | 1985-05-08 | Advanced Technology Laboratories, Inc. | Phased array transducer construction |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217684A (en) * | 1979-04-16 | 1980-08-19 | General Electric Company | Fabrication of front surface matched ultrasonic transducer array |
US4684971A (en) * | 1981-03-13 | 1987-08-04 | American Telephone And Telegraph Company, At&T Bell Laboratories | Ion implanted CMOS devices |
JPS60140153A (en) * | 1983-12-28 | 1985-07-25 | Toshiba Corp | Preparation of ultrasonic probe |
JPS6197859A (en) * | 1984-10-18 | 1986-05-16 | Matsushita Electronics Corp | Manufacture of cmos ic |
JPS63207300A (en) * | 1987-02-24 | 1988-08-26 | Toshiba Corp | Ultrasonic probe |
-
1986
- 1986-11-28 FR FR8616663A patent/FR2607593B1/en not_active Expired
-
1987
- 1987-11-24 EP EP87402637A patent/EP0270448A1/en not_active Withdrawn
- 1987-11-24 US US07/368,364 patent/US5044370A/en not_active Expired - Fee Related
- 1987-11-24 WO PCT/FR1987/000465 patent/WO1988004092A1/en not_active Application Discontinuation
- 1987-11-24 JP JP63500069A patent/JPH02501611A/en active Pending
- 1987-11-24 EP EP87907783A patent/EP0333738A1/en not_active Withdrawn
- 1987-11-25 CA CA000552751A patent/CA1298395C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0005265A2 (en) * | 1978-05-10 | 1979-11-14 | Siemens Aktiengesellschaft | Method for making contact on the adhesive side of the electrode of an electrical device |
US4276491A (en) * | 1979-10-02 | 1981-06-30 | Ausonics Pty. Limited | Focusing piezoelectric ultrasonic medical diagnostic system |
JPS57181299A (en) * | 1981-04-30 | 1982-11-08 | Yokogawa Hokushin Electric Corp | Conformal array transducer and its manufacture |
EP0140363A2 (en) * | 1983-10-31 | 1985-05-08 | Advanced Technology Laboratories, Inc. | Phased array transducer construction |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN, vol. 7, no. 27 (E-156)[1172], 3 février 1983; & JP-A-57 181 299 (YOKOGAWA DENKI SEISAKUSHO K.K.) 08-11-1982 * |
Also Published As
Publication number | Publication date |
---|---|
EP0333738A1 (en) | 1989-09-27 |
FR2607593B1 (en) | 1989-07-21 |
JPH02501611A (en) | 1990-05-31 |
US5044370A (en) | 1991-09-03 |
FR2607593A1 (en) | 1988-06-03 |
CA1298395C (en) | 1992-03-31 |
WO1988004092A1 (en) | 1988-06-02 |
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18D | Application deemed to be withdrawn |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: GELLY, JEAN-FRANCOIS Inventor name: DUBUT, PATRICK |