EP0244214A1 - Thermal ink jet printhead - Google Patents

Thermal ink jet printhead Download PDF

Info

Publication number
EP0244214A1
EP0244214A1 EP19870303785 EP87303785A EP0244214A1 EP 0244214 A1 EP0244214 A1 EP 0244214A1 EP 19870303785 EP19870303785 EP 19870303785 EP 87303785 A EP87303785 A EP 87303785A EP 0244214 A1 EP0244214 A1 EP 0244214A1
Authority
EP
European Patent Office
Prior art keywords
nozzle
heating
printhead
supporting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19870303785
Other languages
German (de)
French (fr)
Other versions
EP0244214B1 (en
Inventor
Alfred I-Tsung Pan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
HP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US85674086A priority Critical
Priority to US856740 priority
Application filed by HP Inc filed Critical HP Inc
Publication of EP0244214A1 publication Critical patent/EP0244214A1/en
Application granted granted Critical
Publication of EP0244214B1 publication Critical patent/EP0244214B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/164Production of nozzles manufacturing processes thin film formation
    • B41J2/1642Production of nozzles manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14088Structure of heating means
    • B41J2/14112Resistive element
    • B41J2/1412Shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14088Structure of heating means
    • B41J2/14112Resistive element
    • B41J2/14129Layer structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14145Structure of the manifold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1626Production of nozzles manufacturing processes etching
    • B41J2/1629Production of nozzles manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1631Production of nozzles manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1632Production of nozzles manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1637Production of nozzles manufacturing processes molding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/164Production of nozzles manufacturing processes thin film formation
    • B41J2/1643Production of nozzles manufacturing processes thin film formation thin film formation by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/164Production of nozzles manufacturing processes thin film formation
    • B41J2/1646Production of nozzles manufacturing processes thin film formation thin film formation by sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/03Specific materials used
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/11Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics

Abstract

A thermal ink jet printer has a nozzle (17, 19), a heating element (15) within the nozzle and an ink well (11) within the thickness of a rigid substrate (10) carrying the nozzle and heating element. The latter are produced by deposition on the substrate. Thus the well (11) is directly adjacent to the nozzle (17), avoiding cavitation problems, destruction of the element (15) by ink turbulence. The method of production is described.

Description

  • This invention concerns thermal ink jet (TIJ) printheads, and to methods for their manufacture.
  • TIJ printheads employ a liquid ink in a reservoir or well, the ink being fed via passages to a series of nozzles defined by a nozzle plate. Within each nozzle is a resistive heater which is independently energizable to evaporate the ink which emerges from the nozzle under pressure.
  • Difficulties which arise with known printheads include detachment or misalignment of the nozzle plate which has been glued in place after formation of the heater and the structure of the well and passages; restricted ink flow through the passages, thus slowing the rate of printing; and unrealiability due to destruction of the resistive heater by the flow of ink and the cavitation forces of the expelled vapour.
  • US Patent No. 4438191 proposes a new form of TIJ printhead which is an improvement on previous printheads. However, the fabrication of this device presents additional problems: formation of ink holes, removal of dry film residue from the firing chambers and other locations, proper alignment of the nozzle, and various manufacturing problems. Also, the nozzles of the monolithic printhead do not diverge. The present invention aims to reduce or avoid some or all the disadvantages mentioned above.
  • According to a first aspect of the present invention there is provided a monolithic ink jet printhead for ejecting a substance comprising a nozzle enclosing a heating chamber, means for storing the substance contiguous with the heating chamber, and a heating element for propelling the substance through the nozzle, characterised in that means is provided for flexibly supporting the heating element within the flow of the substance.
  • A monolithic printhead has the advantages of lower cost and increased precision. An advantage of placing the heating element within the flow of the substance is that the substance (e.g. ink) buffers the heating element from cavitation forces that result from collapsing bubbles. These cavitation forces could otherwise destroy the heating element. Additionally, the supporting means can flex and absorb energy from the collapsing bubbles that would otherwise be absorbed by the heating element.
  • In a preferred printhead the storing means is brought directly adjacent the nozzle, and there is then no restriction on the rate of ink flow which permits an increased printing speed. Preferably, the nozzle and heating element are formed integrally on a substrate by deposition techniques. This ensures automatic alignment of the nozzle, and means the nozzle plate cannot be detached.
  • According to a second aspect of the present invention there is provided a method of producing a monolithic ink jet printhead comprising the steps of: using integrated circuit techniques to construct in a first part of a substrate a means for supporting a heating element, using integrated circuit techniques to form in a second part of the substrate a means for storing ink that is contiguous with the supporting means, using integrated circuit techniques to form a heating element on the supporting means, and using integrated circuit techniques to form a nozzle on the substrate and over the heating element.
  • By constructing the entire printhead, including the nozzles, using integrated circuit techniques, precise nozzle alignment with the rest of the printhead is obtained. This precise alignment increases the allowable nozzle density and permits the construction of a page width array of nozzles, Also, by using integrated circuit techniques, batches of printheads can be made at one time.
  • In order that the invention shall be clearly understood, exemplary embodiments thereof will now be described with reference to the accompanying drawings, in which:
    • Figure 1 shows a prior-art thermal ink jet printhead;
    • Figure 2A shows a cross section of a prior-art nozzle on line A-A in Fig 2B;
    • Fig-ure 2B shows a top view of a prior-art nozzle, the line A-A corresponds to the cross section of Figure 2A;
    • Figure 3 shows a cross-section on line A-A in Fig.4 of a preferred embodiment of the invention with cantilever beams;
    • Figure 4 shows a top view of the preferred embodiment of the invention with the nozzle removed; the line A-A corresponds to the cross-section of Figure 3;
    • Figures 5A-5C shows steps in preparing the substrate for masking;
    • Figures 6A-6C shows the formation of the cantilever beams and the well;
    • Figure 7A shows the formation of the resistor layer and a protective layer;
    • Figure 7B shows the formation of the conducting layer for the nozzle and the donut-shaped frame for the nozzle;
    • Figures 8A, 8B and 8C show the steps taken to construct the nozzle shown in Figure 3;
    • Figure 9 shows an alternative embodiment of the invention without cantilever beams.
    • Figure 10 shows a top view of the alternative embodiment shown in Figure 9.
  • A prior-art thermal ink jet printhead 2 is shown in Figure 1. The advancement of thermal ink jet technology stumbles upon an assembly problem: detachment of the nozzle plate 1. Presently, each nozzle plate 1 is individually attached with epoxy to the resistor structure 3 as shown in Figure 2A. This costly procedure is problem-prone. For example, this procedure often misaligns the nozzle plate 1. Figure 2A, a simplified representation of the prior art, omits many of the details. The differences in thermal expansion coefficients among different components of the printhead 2 tend to debond the nozzle plate 1 during the curing process of the glue. This adhesion problem limits the number of nozzles in the printhead 2.
  • The ink refilling rate of prior-art TIJ printhead 2 presents another problem. It limits the printing speed. In prior-art TIJ printheads 2 shown in Figure 2B, ink reaches the nozzle 6 after travelling through high friction channels 7 which restrict the ink flow.
  • A monolithic thermal ink jet printhead is proposed. This monolithic structure makes page-width array thermal ink jet printheads possible. The monolithic structure can be manufactured by standard integrated circuit and printed circuit processing techniques. A nickel-plating process constructs a nozzle on top of resistors, thereby eliminating adhesion and alignment problems. A rigid substrate supports a flexible cantilever beam upon which the resistors are constructed. The cantilever beams, together with the ink itself, buffers the impact of cavitation forces during bubble collapsing and results in a better resistor reliability. The monolithic printhead allows a smoother ink supply since the ink is fed directly from the backside past the resistor from a well in the thickness of the rigid substrate. The orifice structure is constructed by a self-aligned, two-step plating process which results in compound bore shape nozzles.
  • Figure 3 shows a cross-section of the preferred embodiment of the invention, a monolithic thermal ink jet printhead with integrated nozzle 19 and ink well 11. Figure 4 shows a top view of the monolithic printhead 20. Within the thickness of the substrate 10 a well 11 resides to hold ink. The heating element, a resistor layer 15, evaporates the ink. The gaseous ink (water vapour, glycol, and ink pigment particles) migrates to the nozzle area 17. The compound bore nozzle 19 directs the gaseous ink as it is expelled from the nozzle area 17 by pressure from the accumulated gaseous ink.
  • A thermal barrier, layer 21, prevents heat from flowing to nickel cantilever beams 12 which form part of the nickel deposit 40. The beams 12 are formed by apertures which communicate between wall 11 and nozzle 17. Because of layer 21 heat from the resistive layer 15 heats the ink and is not wasted on the printhead 20. A patterned conducting layer 23 shorts out the resistive layer 15 except on the cantilever beams 12. A protective layer 25 prevents electrical shorts during the nickel plating process to form the nozzle 19. The protective layer 25 also protects layers from chemical and mechanical wear. A conducting layer 27 is deposited during the manufacturing process to provide a surface upon which the nozzle 19 can be constructed.
  • Advantages of the present invention include the automatically-aligned nozzle 19, shown in Figure 3. Prior-art processes misalign the nozzle plate 1 shown in Figure 1. This misalignment causes dot spread and slanted printing. The new monolithic TIJ printhead 20 reduces resistor failure. In prior-art TIJ printheads shown in Figure 1, the collapsing bubble and refilling ink impact the resistor surface. The cavitation force eventually destroys the resistor. In the new monolithic TIJ printhead 20 shown in Figure 3, the collapsing bubble collides with the refilling ink. The ink absorbs most of the cavitation forces. The cantilever beams 12, upon which the heating element, such as a resistor, is built, absorb the remaining cavitation force. The cantilever beams, constructed from ductile nickel, lie in a reservoir of ink. The mechanical forces on resistors will be buffered by the flexibility of the cantilever beams as well as the ink itself.
  • Also, in the present invention printing speed is not limited by the ink refilling rate. The ink well 11 is directly connected to the heating elements 15 as shown in Figure 3. This direct connection reduces resistance to ink flow. Thus, printing speed is not limited by the ink refilling rate.
  • Figures 5 to 8 illustrate the process to manufacture monolithic thermal ink jet printheads 20 and involves several steps. On a substrate 10 of glass or silicon shown in Figure 5A, a conducting layer 30 approximately 1000 A is deposited using a sputter deposition technique. By conducting electricity through the conducting layer 30, a surface is formed to which nickel plating can be attached. Next, a dry film mask 32 is laminated on the conducting layer 30 as shown in Figure 5B. This mask 32, having a diameter of 2 to 3 mils, defines the location of the cantilever beams 12 in Figure 3 as well as 13 in Figure 9. Figure 5C shows the various shapes a mask 32 can have. Mask 38 corresponds to the printhead 20 shown in Figure 4. Mask 34 corresponds to printhead 60 shown in Figure 10.
  • Next, an electroplating process deposits a nickel layer 40 from 1 to 1.5 mils thick onto the exposed substrate 10. Thus, cantilever beams 12 are formed. After completion of the plating, removal of the dry film mask 38 exposes the cantilever beams 12 shown in Figure 6B. The well 11 is formed through a multi-step process. First, a sputtering process deposits a protective metal layer 42. This layer is made of gold and has a thickness of 1000 A. Next, a mask 44 defines the well 11. Then, a wet chemical etching process, such as KOH for silicon or HF for glass, forms the well 11. When the protective layer 42 and the mask layer 44 are removed, the device appears as shown in Figure 6C.
  • Next, a thermal insulating layer 21, made of LPCVD Sio2 or another dielectric, is deposited. It is deposited to a thickness of 1.5 microns on the inside of the well 11, on top of the plated nickel layer 40, and around the cantilever beams 12 as shown in Figures 3 and 7A. The thermal insulation layer 21 encourages the efficient operation of the resistor layer 15. On top of the thermal insulating layer 21, a resistive layer 15 made of a material such as tantalum-aluminium is deposited to a thickness of 1000 A to 3000 A, as shown in Figures 3 and 7A. Next, a conducting layer 23 made of gold or aluminium to a thickness of 5000 A is selectively patterned on resistive layer 15 to short out portions of the resistive layer 15. The conducting layer 23 is not present on the cantilever beam 12 so that the resistive layer 15 is operative there. On top of the conducting layer 23, a protective layer 25 made of Si Carbide (SiC) and Si3N4 or other dielectric material is deposited using an LPCVD process. This layer protects the device from chemical and mechanical wear.
  • A conducting layer 27, 1000 to 5000 A thick, is deposited on the protective layer 25. It is formed by sputtering. The conducting layer 27 provides a surface upon which the nozzle 19 can be formed with an electroplating process. Next, portions of the conducting layer 27 are etched away through a wet- etching process as shown in Figure 7B, so that the only conducting layer 27 remaining is located where the nozzle will be constructed.
  • Next, donut-shaped dry film blocks 52 are laminated onto the conducting layer 27. These blocks 52 form a frame for the construction of the nozzle 19. In the preferred embodiment of the invention, the nozzle 19 is constructed in a two-step plating process. The results of the first step are shown in Figure 8A. The base of nozzle 19 is formed by electroplating nickel onto the conducting layer 27 to a thickness of 1.5 mil to 2.0 mil, which equals the height of the nozzle 19. Next, a glass slab or any other flat dielectric material 56 is pressed on the nozzle 19 as shown in Figure 8B. This slab 56 acts as a nozzle 19 mould for the second part of the nickel plating process. Figure 8C, the electroplating process is continued to form the nozzle 19. Now that the nozzle 19 is completed, the slab 56 is removed. The resulting product is the printhead 20 shown in Figure 3.
  • Other methods can be used to form the nozzle 19. For example, the nozzle 19 could be constructed by a one- step plating process without the use of the slab 56.
  • Figures 9 and 10 show an alternative embodiment of the printhead 20. A nozzle 19 having this shape is called a compound-bore nozzle 19. It controls the stream of ink ejected from the nozzle 19. The ink stream ejected from a compound-bore nozzle has a narrow diameter and minimum spread. The cantilever beams 13 protrude inward and the heating element 15 rests on top of the cantilever beam 13. This embodiment of the printhead 20 would be formed in the same way as the printhead 20 shown in Figure 3. The primary difference in the process would be in the type of mask 32 used when layer 40 is plated onto substrate 10. Instead of mask 38 for the cantilever beams 12, a mask similar to mask 34 or 36 is used.
  • In the preferred embodiment of the invention, the printhead ejects ink. This ink contains water, glycol, and pigment particles. However, it can be used to eject other substances.
  • The present invention, a monolithic thermal ink jet printhead with integrated nozzle and ink well and a process for making it, solves the nozzle attachment and ink flow problems of prior-art printheads mentioned above. Also, the present invention reduces manufacturing costs and improves reliability. The reduced manufacturing costs are partially achieved through an automated manufacturing procedure. The increased reliability is partially achieved through longer resistor life and smoother ink flow in the printhead. With these improvements, page-width TIJ print arrays are possible.

Claims (13)

1. A monolithic ink jet printhead for ejecting a substance comprising a nozzle (17,19) enclosing a heating chamber, means (11) for storing the substance contiguous with the heating chamber, and a heating element (15) for propelling the substance through the nozzle, characterised in that means (12) is provided for flexibly supporting the heating element within the flow of the substance.
2. A printhead according to claim 1, wherein the supporting means comprises a cantilever beam (12).
3. A printhead according to claim 1 or 2, wherein the storing means comprises a well (11) which is constructed at least partly into the same substrate as the supporting means (12).
4. A printhead according to any preceding claim wherein the nozzle has a compound bore shape.
5. A printhead according to any preceding claim, wherein the nozzle (17,19), the heating element (15), the storing means (11), and the supporting means (12) form a monolithic structure formed by integrated circuit techniques.
6. A printhead according to any preceding claim, wherein the surface of the heating element (15) is located perpendicular to the direction of flow of the substance into the nozzle (17,19).
7. A method of producing a monolithic ink jet printhead comprising the steps of: using integrated circuit techniques to construct in a first part of a substrate a means (12) for supporting a heating element, using integrated circuit techniques to form in a second part of the substrate a means (11) for storing ink that is contiquous with the supporting means, using integrated circuit techniques to form a heating element (15) on the supporting means, and using integrated circuit techniques to form a nozzle (17,19) on the substrate and over the heating element.
8. A method according to claim 7, wherein a first side of the substrate is masked, and the masked substrate is plated to form the supporting means (12), the supporting means comprising a cantilever beam.
9. A method according to claim 8, wherein the second side of the substrate is masked, and the masked substrate is etched to form the storing means (11), the storing means comprising a well.
10. A method according to claim 7, wherein the heating element (15) is formed by depositing a resistive layer on the supporting means.
11. A method according to claim 10, wherein the nozzle (17,19) is formed by depositing an insulating layer (25) over the resistive layer (15), depositing a conducting layer (27) over the insulating layer (25), constructing a frame (52) for the nozzle over the conducting layer, and plating the conducting layer to form the nozzle.
12. A method according to Claim 11, wherein plating the conducting layer (27) comprises the steps of plating the conducting layer (27) to the height of the nozzle, placing a slab (56) over the plating, continuing to plate with the slab in place to form a compound nozzle, and removing the slab.
13. A thermal ink jet printer produced by a method as according to any of claims 7 to 12.
EP19870303785 1986-04-28 1987-04-28 Thermal ink jet printhead Expired - Lifetime EP0244214B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US85674086A true 1986-04-28 1986-04-28
US856740 1986-04-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP89123606.9 Division-Into 1989-12-21

Publications (2)

Publication Number Publication Date
EP0244214A1 true EP0244214A1 (en) 1987-11-04
EP0244214B1 EP0244214B1 (en) 1991-07-10

Family

ID=25324393

Family Applications (2)

Application Number Title Priority Date Filing Date
EP19870303785 Expired - Lifetime EP0244214B1 (en) 1986-04-28 1987-04-28 Thermal ink jet printhead
EP19890123606 Withdrawn EP0367303A1 (en) 1986-04-28 1987-04-28 Thermal ink jet printhead

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP19890123606 Withdrawn EP0367303A1 (en) 1986-04-28 1987-04-28 Thermal ink jet printhead

Country Status (3)

Country Link
EP (2) EP0244214B1 (en)
JP (2) JP2635043B2 (en)
DE (1) DE3771269D1 (en)

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0498293A2 (en) * 1991-01-30 1992-08-12 Canon Information Systems Research Australia Pty Ltd. Bubblejet image reproducing apparatus
EP0498291A1 (en) * 1991-01-30 1992-08-12 Canon Information Systems Research Australia Pty Ltd. Nozzle structures for bubblejet print devices
EP0507134A2 (en) * 1991-04-02 1992-10-07 Hewlett-Packard Company An ink jet print head having two cured photo-imaged barrier layers
EP0638424A2 (en) * 1993-08-09 1995-02-15 Hewlett-Packard Company Thermal ink jet printhead and method of manufacture
AU657930B2 (en) * 1991-01-30 1995-03-30 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
WO1996032284A1 (en) * 1995-04-12 1996-10-17 Eastman Kodak Company Monolithic printing heads and manufacturing processes therefor
WO1996032267A1 (en) * 1995-04-12 1996-10-17 Eastman Kodak Company Constructions and manufacturing processes for thermally activated print heads
WO1996032274A1 (en) * 1995-04-12 1996-10-17 Eastman Kodak Company Heather structure and fabrication process for monolithic print heads
EP0771658A3 (en) * 1995-10-30 1997-11-05 Eastman Kodak Company Construction and manufacturing process for drop on demand print heads with nozzle heaters
US5815173A (en) * 1991-01-30 1998-09-29 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
EP0895866A2 (en) * 1997-08-08 1999-02-10 Hewlett-Packard Company Forming refill slot for monolithic ink jet printhead
GB2330557A (en) * 1997-10-22 1999-04-28 Hewlett Packard Co Monolithic inkjet printhead formed on a silicon die using single-side fabrication processes
US5905517A (en) * 1995-04-12 1999-05-18 Eastman Kodak Company Heater structure and fabrication process for monolithic print heads
US6019457A (en) * 1991-01-30 2000-02-01 Canon Information Systems Research Australia Pty Ltd. Ink jet print device and print head or print apparatus using the same
EP0940257A3 (en) * 1998-03-02 2000-04-05 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
US6086187A (en) * 1989-05-30 2000-07-11 Canon Kabushiki Kaisha Ink jet head having a silicon intermediate layer
US6305790B1 (en) 1996-02-07 2001-10-23 Hewlett-Packard Company Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
US6336714B1 (en) 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6364466B1 (en) 2000-11-30 2002-04-02 Hewlett-Packard Company Particle tolerant ink-feed channel structure for fully integrated inkjet printhead
EP1213146A1 (en) * 2000-12-05 2002-06-12 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead
US6419346B1 (en) 2001-01-25 2002-07-16 Hewlett-Packard Company Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6482574B1 (en) 2000-04-20 2002-11-19 Hewlett-Packard Co. Droplet plate architecture in ink-jet printheads
US6499832B2 (en) 2000-04-26 2002-12-31 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead capable of preventing a backflow of ink
US6517735B2 (en) 2001-03-15 2003-02-11 Hewlett-Packard Company Ink feed trench etch technique for a fully integrated thermal inkjet printhead
US6520627B2 (en) 2000-06-26 2003-02-18 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
US6533399B2 (en) 2000-07-18 2003-03-18 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead and manufacturing method thereof
US6543884B1 (en) 1996-02-07 2003-04-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having etched back PSG layer
US6627467B2 (en) 2001-10-31 2003-09-30 Hewlett-Packard Development Company, Lp. Fluid ejection device fabrication
US6698868B2 (en) 2001-10-31 2004-03-02 Hewlett-Packard Development Company, L.P. Thermal drop generator for ultra-small droplets
GB2406309A (en) * 2001-09-29 2005-03-30 Hewlett Packard Co Fluid ejection device with drive circuitry proximate to heating element
DE10217990B4 (en) * 2002-03-09 2006-06-01 Rheinmetall Landsysteme Gmbh Load lifting gear for armored vehicle has load-lifting unit with crane jib fastened to suitable flange surface on vehicle and with linear or rotational drives to enable load lifting to be carried out on all reachable points of vehicle
GB2396334B (en) * 2002-10-31 2006-08-09 Hewlett Packard Development Co Slotted substrates and methods and systems for forming same
US7125731B2 (en) 2001-10-31 2006-10-24 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
KR100650075B1 (en) 2003-12-26 2006-11-27 캐논 가부시끼가이샤 Ink-jet recording head and method for manufacturing ink-jet recording head
KR100788065B1 (en) 2003-11-28 2007-12-21 캐논 가부시끼가이샤 Method of manufacturing ink jet recording head, ink jet recording head, and ink jet cartridge

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991017891A1 (en) * 1990-05-21 1991-11-28 Mannesmann Ag Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it
DE4214554C2 (en) * 1992-04-28 1995-07-06 Eastman Kodak Co Multi-layer electrothermal ink printhead
EP0594310A3 (en) * 1992-10-23 1994-08-17 Hewlett Packard Co Ink jet printhead and method of manufacture thereof
US6243117B1 (en) * 1995-05-12 2001-06-05 Lexmark International, Inc. Print head cartridge and method of making a print head cartridge by one-shot injection molding
US6733116B1 (en) 1998-10-16 2004-05-11 Silverbrook Research Pty Ltd Ink jet printer with print roll and printhead assemblies
US6508546B2 (en) 1998-10-16 2003-01-21 Silverbrook Research Pty Ltd Ink supply arrangement for a portable ink jet printer
FR2811588B1 (en) * 2000-07-13 2002-10-11 Centre Nat Rech Scient Thermal injection and dosing head, manufacturing method thereof, and functionalization or addressing system comprising the same
US7431427B2 (en) 2002-06-13 2008-10-07 Silverbrook Research Pty Ltd Ink supply arrangement with improved ink flows
US6672710B1 (en) * 2002-11-23 2004-01-06 Silverbrook Research Pty Ltd Thermal ink jet printhead with symmetric bubble formation
US6824246B2 (en) 2002-11-23 2004-11-30 Kia Silverbrook Thermal ink jet with thin nozzle plate
US7328978B2 (en) 2002-11-23 2008-02-12 Silverbrook Research Pty Ltd Printhead heaters with short pulse time
US6755509B2 (en) 2002-11-23 2004-06-29 Silverbrook Research Pty Ltd Thermal ink jet printhead with suspended beam heater
US6736489B1 (en) 2002-11-23 2004-05-18 Silverbrook Research Pty Ltd Thermal ink jet printhead with low heater mass
US6672709B1 (en) 2002-11-23 2004-01-06 Silverbrook Research Pty Ltd Self-cooling thermal ink jet printhead
US6669334B1 (en) * 2002-11-23 2003-12-30 Silverbrook Research Pty Ltd Thermal ink jet printhead with cavitation gap
US7152958B2 (en) 2002-11-23 2006-12-26 Silverbrook Research Pty Ltd Thermal ink jet with chemical vapor deposited nozzle plate
US7669980B2 (en) 2002-11-23 2010-03-02 Silverbrook Research Pty Ltd Printhead having low energy heater elements
US7581822B2 (en) 2002-11-23 2009-09-01 Silverbrook Research Pty Ltd Inkjet printhead with low voltage ink vaporizing heaters
KR100641359B1 (en) 2004-10-26 2006-11-01 삼성전자주식회사 Ink-jet print head with high efficiency heater and the fabricating method for the same
KR100773983B1 (en) * 2006-06-26 2007-11-08 삼성전기주식회사 Inkjet head and manufacturing method thereof
JP2013500880A (en) * 2009-07-31 2013-01-10 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. Inkjet printhead and method using a central ink supply path

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2104453A (en) * 1981-07-09 1983-03-09 Canon Kk Liquid jet recording head
GB2106039A (en) * 1981-08-14 1983-04-07 Hewlett Packard Co Thermal ink jet printer
US4438191A (en) * 1982-11-23 1984-03-20 Hewlett-Packard Company Monolithic ink jet print head
EP0120160A2 (en) * 1983-03-28 1984-10-03 Hewlett-Packard Company Method for reducing erosion due to cavitation in ink jet printers
US4580149A (en) * 1985-02-19 1986-04-01 Xerox Corporation Cavitational liquid impact printer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS636358B2 (en) * 1978-10-31 1988-02-09 Canon Kk
JPS565979A (en) * 1979-06-27 1981-01-22 Ricoh Co Ltd Manufacture of nozzle plate for liquid jetting
US4535343A (en) * 1983-10-31 1985-08-13 Hewlett-Packard Company Thermal ink jet printhead with self-passivating elements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2104453A (en) * 1981-07-09 1983-03-09 Canon Kk Liquid jet recording head
GB2106039A (en) * 1981-08-14 1983-04-07 Hewlett Packard Co Thermal ink jet printer
US4438191A (en) * 1982-11-23 1984-03-20 Hewlett-Packard Company Monolithic ink jet print head
EP0120160A2 (en) * 1983-03-28 1984-10-03 Hewlett-Packard Company Method for reducing erosion due to cavitation in ink jet printers
US4580149A (en) * 1985-02-19 1986-04-01 Xerox Corporation Cavitational liquid impact printer

Cited By (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086187A (en) * 1989-05-30 2000-07-11 Canon Kabushiki Kaisha Ink jet head having a silicon intermediate layer
US5815173A (en) * 1991-01-30 1998-09-29 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
EP0498291A1 (en) * 1991-01-30 1992-08-12 Canon Information Systems Research Australia Pty Ltd. Nozzle structures for bubblejet print devices
EP0498293A2 (en) * 1991-01-30 1992-08-12 Canon Information Systems Research Australia Pty Ltd. Bubblejet image reproducing apparatus
US5841452A (en) * 1991-01-30 1998-11-24 Canon Information Systems Research Australia Pty Ltd Method of fabricating bubblejet print devices using semiconductor fabrication techniques
EP0498293B1 (en) * 1991-01-30 1996-10-30 Canon Information Systems Research Australia Pty Ltd. Bubblejet image reproducing apparatus
US6019457A (en) * 1991-01-30 2000-02-01 Canon Information Systems Research Australia Pty Ltd. Ink jet print device and print head or print apparatus using the same
AU657930B2 (en) * 1991-01-30 1995-03-30 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
EP0507134A2 (en) * 1991-04-02 1992-10-07 Hewlett-Packard Company An ink jet print head having two cured photo-imaged barrier layers
EP0507134A3 (en) * 1991-04-02 1992-11-19 Hewlett-Packard Company An ink jet print head having two cured photoimaged barrier layers
EP0638424A3 (en) * 1993-08-09 1996-07-31 Hewlett Packard Co Thermal ink jet printhead and method of manufacture.
EP0638424A2 (en) * 1993-08-09 1995-02-15 Hewlett-Packard Company Thermal ink jet printhead and method of manufacture
WO1996032284A1 (en) * 1995-04-12 1996-10-17 Eastman Kodak Company Monolithic printing heads and manufacturing processes therefor
WO1996032274A1 (en) * 1995-04-12 1996-10-17 Eastman Kodak Company Heather structure and fabrication process for monolithic print heads
US5905517A (en) * 1995-04-12 1999-05-18 Eastman Kodak Company Heater structure and fabrication process for monolithic print heads
WO1996032267A1 (en) * 1995-04-12 1996-10-17 Eastman Kodak Company Constructions and manufacturing processes for thermally activated print heads
US5871656A (en) * 1995-10-30 1999-02-16 Eastman Kodak Company Construction and manufacturing process for drop on demand print heads with nozzle heaters
EP0771658A3 (en) * 1995-10-30 1997-11-05 Eastman Kodak Company Construction and manufacturing process for drop on demand print heads with nozzle heaters
US6336714B1 (en) 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6305790B1 (en) 1996-02-07 2001-10-23 Hewlett-Packard Company Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
US6543884B1 (en) 1996-02-07 2003-04-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having etched back PSG layer
EP0895866A2 (en) * 1997-08-08 1999-02-10 Hewlett-Packard Company Forming refill slot for monolithic ink jet printhead
EP0895866A3 (en) * 1997-08-08 2000-03-01 Hewlett-Packard Company Forming refill slot for monolithic ink jet printhead
US6158846A (en) * 1997-08-08 2000-12-12 Hewlett-Packard Co. Forming refill for monolithic inkjet printhead
DE19836357B8 (en) * 1997-10-22 2010-06-10 Hewlett-Packard Development Co., L.P., Houston One-sided manufacturing method for forming a monolithic ink jet printing element array on a substrate
GB2330557B (en) * 1997-10-22 2001-08-01 Hewlett Packard Co Single-side fabrication process for forming inkjet monolithic printing element array on a substrate
DE19836357B4 (en) * 1997-10-22 2010-01-07 Hewlett-Packard Development Co., L.P., Houston One-sided manufacturing method for forming a monolithic ink jet printing element array on a substrate
US6322201B1 (en) 1997-10-22 2001-11-27 Hewlett-Packard Company Printhead with a fluid channel therethrough
GB2330557A (en) * 1997-10-22 1999-04-28 Hewlett Packard Co Monolithic inkjet printhead formed on a silicon die using single-side fabrication processes
US6365058B1 (en) 1997-10-22 2002-04-02 Hewlett-Packard Company Method of manufacturing a fluid ejection device with a fluid channel therethrough
US6137443A (en) * 1997-10-22 2000-10-24 Hewlett-Packard Company Single-side fabrication process for forming inkjet monolithic printing element array on a substrate
EP1595703A2 (en) * 1998-03-02 2005-11-16 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
US6162589A (en) * 1998-03-02 2000-12-19 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
EP0940257A3 (en) * 1998-03-02 2000-04-05 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
US6902259B2 (en) 1998-03-02 2005-06-07 Hewlett-Packard Development Company, L.P. Direct imaging polymer fluid jet orifice
EP1595703A3 (en) * 1998-03-02 2006-06-07 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
US6447102B1 (en) 1998-03-02 2002-09-10 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
SG88770A1 (en) * 1999-08-27 2002-05-21 Hewlett Packard Co Fully integrated thermal inkjet printhead having thin layer shelf
US6482574B1 (en) 2000-04-20 2002-11-19 Hewlett-Packard Co. Droplet plate architecture in ink-jet printheads
US6682874B2 (en) 2000-04-20 2004-01-27 Hewlett-Packard Development Company L.P. Droplet plate architecture
US6837572B2 (en) 2000-04-20 2005-01-04 Hewlett-Packard Development Company, L.P. Droplet plate architecture
US6499832B2 (en) 2000-04-26 2002-12-31 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead capable of preventing a backflow of ink
US6685846B2 (en) 2000-04-26 2004-02-03 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead, manufacturing method thereof, and ink ejection method
US6520627B2 (en) 2000-06-26 2003-02-18 Hewlett-Packard Company Direct imaging polymer fluid jet orifice
US6749762B2 (en) 2000-07-18 2004-06-15 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead and manufacturing method thereof
US6533399B2 (en) 2000-07-18 2003-03-18 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead and manufacturing method thereof
US6364466B1 (en) 2000-11-30 2002-04-02 Hewlett-Packard Company Particle tolerant ink-feed channel structure for fully integrated inkjet printhead
EP1211076A3 (en) * 2000-11-30 2003-09-10 Hewlett-Packard Company Ink-feed channel structure for fully integrated ink-jet printhead
EP1213146A1 (en) * 2000-12-05 2002-06-12 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead
US6598961B2 (en) 2000-12-05 2003-07-29 Samsung Electronics Co., Ltd. Bubble-jet type ink-jet printhead
US6419346B1 (en) 2001-01-25 2002-07-16 Hewlett-Packard Company Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6718632B2 (en) 2001-01-29 2004-04-13 Hewlett-Packard Development Company, L.P. Method of making a fluid-jet ejection device
US6517735B2 (en) 2001-03-15 2003-02-11 Hewlett-Packard Company Ink feed trench etch technique for a fully integrated thermal inkjet printhead
GB2406309A (en) * 2001-09-29 2005-03-30 Hewlett Packard Co Fluid ejection device with drive circuitry proximate to heating element
GB2406309B (en) * 2001-09-29 2006-02-08 Hewlett Packard Co Fluid ejection device with drive circuitry proximate to heating element
US7490924B2 (en) 2001-10-31 2009-02-17 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
US6698868B2 (en) 2001-10-31 2004-03-02 Hewlett-Packard Development Company, L.P. Thermal drop generator for ultra-small droplets
US7125731B2 (en) 2001-10-31 2006-10-24 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
US6627467B2 (en) 2001-10-31 2003-09-30 Hewlett-Packard Development Company, Lp. Fluid ejection device fabrication
DE10217990B4 (en) * 2002-03-09 2006-06-01 Rheinmetall Landsysteme Gmbh Load lifting gear for armored vehicle has load-lifting unit with crane jib fastened to suitable flange surface on vehicle and with linear or rotational drives to enable load lifting to be carried out on all reachable points of vehicle
GB2396334B (en) * 2002-10-31 2006-08-09 Hewlett Packard Development Co Slotted substrates and methods and systems for forming same
KR100788065B1 (en) 2003-11-28 2007-12-21 캐논 가부시끼가이샤 Method of manufacturing ink jet recording head, ink jet recording head, and ink jet cartridge
US7753502B2 (en) 2003-11-28 2010-07-13 Canon Kabushiki Kaisha Method of manufacturing ink jet recording head, ink jet recording head, and ink jet cartridge
KR100650075B1 (en) 2003-12-26 2006-11-27 캐논 가부시끼가이샤 Ink-jet recording head and method for manufacturing ink-jet recording head

Also Published As

Publication number Publication date
JPH08230192A (en) 1996-09-10
EP0244214B1 (en) 1991-07-10
JP2716418B2 (en) 1998-02-18
JP2635043B2 (en) 1997-07-30
EP0367303A1 (en) 1990-05-09
DE3771269D1 (en) 1991-08-14
JPS62259864A (en) 1987-11-12

Similar Documents

Publication Publication Date Title
US8075111B2 (en) Printhead with ink distribution through aligned apertures
US8287099B2 (en) Printhead having annular shaped nozzle heaters
US5940099A (en) Ink jet print head with ink supply through porous medium
EP1567351B1 (en) Thermal ink jet printhead with symmetric bubble formation
JP3297136B2 (en) Method of manufacturing inkjet printer and inkjet printhead
EP0423324B1 (en) Bubble jet print cartridge
EP0705695B1 (en) Ink delivery system
US7416284B2 (en) Inkjet unit cell with dual heater elements
EP0436889B1 (en) Integral ink jet print head
JP4355777B2 (en) Fabrication method of scalable wide array inkjet printhead
US6890063B2 (en) Ink-jet printhead and method of manufacturing the ink-jet printhead
US6322201B1 (en) Printhead with a fluid channel therethrough
EP0322228B1 (en) Large array thermal ink jet printhead
US4680859A (en) Thermal ink jet print head method of manufacture
US6582064B2 (en) Fluid ejection device having an integrated filter and method of manufacture
US5648805A (en) Inkjet printhead architecture for high speed and high resolution printing
US5160577A (en) Method of fabricating an aperture plate for a roof-shooter type printhead
DE60222323T2 (en) Printhead with high nozzle packing density
US6938340B2 (en) Method of forming a printhead using a silicon on insulator substrate
US5604519A (en) Inkjet printhead architecture for high frequency operation
US4438191A (en) Monolithic ink jet print head
KR100244830B1 (en) Apparatus using ink printer and manufacturing method of nozzle member for ink printer
DE60208088T2 (en) Two-step etching of a trench for a fully integrated inkjet printhead
US7980664B2 (en) Inkjet printhead incorporating multiple heater elements for weighted ink drop ejection
US6135586A (en) Large area inkjet printhead

Legal Events

Date Code Title Description
AK Designated contracting states:

Kind code of ref document: A1

Designated state(s): DE FR GB

17P Request for examination filed

Effective date: 19880504

17Q First examination report

Effective date: 19890825

AK Designated contracting states:

Kind code of ref document: B1

Designated state(s): DE FR GB

REF Corresponds to:

Ref document number: 3771269

Country of ref document: DE

Date of ref document: 19910814

Format of ref document f/p: P

ET Fr: translation filed
26N No opposition filed
PGFP Postgrant: annual fees paid to national office

Ref country code: FR

Payment date: 19950313

Year of fee payment: 09

PGFP Postgrant: annual fees paid to national office

Ref country code: DE

Payment date: 19950324

Year of fee payment: 09

PGFP Postgrant: annual fees paid to national office

Ref country code: GB

Payment date: 19950327

Year of fee payment: 09

PG25 Lapsed in a contracting state announced via postgrant inform. from nat. office to epo

Ref country code: GB

Effective date: 19960428

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19960428

PG25 Lapsed in a contracting state announced via postgrant inform. from nat. office to epo

Ref country code: FR

Effective date: 19961227

PG25 Lapsed in a contracting state announced via postgrant inform. from nat. office to epo

Ref country code: DE

Effective date: 19970101

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST