EP0229077B1 - Verfahren zur dispersionshärtung von kupfer, silber oder gold sowie deren legierungen - Google Patents

Verfahren zur dispersionshärtung von kupfer, silber oder gold sowie deren legierungen Download PDF

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Publication number
EP0229077B1
EP0229077B1 EP86902823A EP86902823A EP0229077B1 EP 0229077 B1 EP0229077 B1 EP 0229077B1 EP 86902823 A EP86902823 A EP 86902823A EP 86902823 A EP86902823 A EP 86902823A EP 0229077 B1 EP0229077 B1 EP 0229077B1
Authority
EP
European Patent Office
Prior art keywords
boride
copper
alloys
silver
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP86902823A
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German (de)
English (en)
French (fr)
Other versions
EP0229077A1 (de
Inventor
Fehmi Nilmen
Heinrich Winter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Battelle Institut eV
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Battelle Institut eV
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Filing date
Publication date
Application filed by Battelle Institut eV filed Critical Battelle Institut eV
Priority to AT86902823T priority Critical patent/ATE40155T1/de
Publication of EP0229077A1 publication Critical patent/EP0229077A1/de
Application granted granted Critical
Publication of EP0229077B1 publication Critical patent/EP0229077B1/de
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C22C32/0073—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only borides

Definitions

  • the invention relates to a process for the dispersion hardening of copper, silver or gold and their alloys as matrix metal with metal borides as dispersoid. Furthermore, the invention relates to the use of this method for producing spot welding electrodes, in particular for welding galvanized sheets.
  • the known processes for dispersion hardening of copper, silver or gold either start from extremely fine and therefore very expensive powders of the matrix metal, which are carefully mixed with the dispersoid, mostly aluminum oxide or beryllium oxide particles, and then compacted and extruded, or they become alloys of the matrix metal with small proportions of easily oxidizable metals such as beryllium or aluminum processed into powder, which are subjected to an internal oxidation in a second complex stage, which, with correct control of the process, leads to the desired fine distribution of oxide particles with a diameter of less than 0, 1 pm in a matrix.
  • the internal oxidation process has the disadvantage that copper is also oxidized externally during the oxidation. This makes a final reduction annealing with hydrogen necessary, which in turn leads to undesired caking of the powders and thus to a reduction in its handling, in particular when producing molded parts.
  • the invention is based on the object of specifying a simple and economical production process for dispersion-hardened alloys based on copper, silver and gold which contain dispersoids which keep warm embrittlement as low as possible.
  • melts based on the matrix metals with stoichiometric additions of boron and boride-forming metals are overheated by 300 to 750 ° C. and then subjected to an extremely rapid solidification of at least 10 3 to 10 41 C per second.
  • Borides of the elements of groups IVA, VA and VIA of the periodic system, individually or in combination, are suitable as dispersoids.
  • high-melting titanium or zirconium boride is preferably formed, as is the mixed boride of titanium and zirconium with the composition Ti x Zr 1-x B 2 . It can be seen that these borides are soluble in the melt to a temperature sufficient for dispersion hardening at temperatures of the melt above approximately 1500 ° C. and, after extremely rapid solidification, for example by atomization, they form a dispersoid with a particle size of less than 0 , 1 pm in the matrix. This means that dispersion-hardened alloys can be produced in one go, directly from the melt, in an economical manner.
  • dispersion-hardened alloys based on copper, silver or gold their melts are carefully deoxidized and then stoichiometric proportions of boron, titanium and / or zirconium are added via appropriate master alloys to form 1 to 5 percent by volume of the diboride.
  • the melts are overheated by 300 to 750 ° C and then, for example by atomizing, to powder with solidification rates of more than 10 3 to 10 4 ° C / sec. processed.
  • the overheating of the melt means that a temperature of 300 to 750 ° C above the melting temperature is selected. After compacting and extrusion, a dispersion-hardened semi-finished product is then obtained in an economical manner.
  • the submicron-sized boride particles embedded in the metal matrix according to the invention do not coarsen even after annealing for several hours up to temperatures of 850 ° C. This indicates that the solubility of these boride particles in the metal matrix must be very low. This is a basic requirement for effective dispersion hardening and good electrical conductivity.
  • At one according to the invention was prepared by spraying the melt dispersion-hardened alloy based on copper with 3 vol .-% of a Ti 0, 7 Zr 0, 3 B 2 -Dispersoids an electrical conductivity of 90% of pure copper, and at 800 ° C a Warmzugfesttechnikvon 17 kp / mm 2 determined at an elongation at break of 25%. As a result, the alloy shows no warm embrittlement.
  • the extremely rapid solidification at speeds of more than 10 3 to 10 ° C. per second can be achieved by melt spinning processes. This gives dispersion-hardened strips which can be cold-formed by rolling.
  • the matrix metals or alloys with proportions of boron and boride-forming metals according to the invention are applied to surfaces in the form of powders and locally melted with a laser or electron beam. The rapid solidification takes place by dissipating the heat into the interior of the substrate.
  • the materials produced according to the invention are particularly suitable for electrical conductors which are mechanically stressed at high temperatures, such as for spot welding electrodes, commutator fins and contacts. They also show excellent thermal conductivity and wear resistance that increases sharply with increasing boride content.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
EP86902823A 1985-06-22 1986-04-18 Verfahren zur dispersionshärtung von kupfer, silber oder gold sowie deren legierungen Expired EP0229077B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT86902823T ATE40155T1 (de) 1985-06-22 1986-04-18 Verfahren zur dispersionshaertung von kupfer, silber oder gold sowie deren legierungen.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3522341 1985-06-22
DE19853522341 DE3522341A1 (de) 1985-06-22 1985-06-22 Verfahren zur dispersionshaertung von kupfer, silber oder gold sowie deren legierungen

Publications (2)

Publication Number Publication Date
EP0229077A1 EP0229077A1 (de) 1987-07-22
EP0229077B1 true EP0229077B1 (de) 1989-01-18

Family

ID=6273886

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86902823A Expired EP0229077B1 (de) 1985-06-22 1986-04-18 Verfahren zur dispersionshärtung von kupfer, silber oder gold sowie deren legierungen

Country Status (5)

Country Link
US (1) US4744947A (enrdf_load_stackoverflow)
EP (1) EP0229077B1 (enrdf_load_stackoverflow)
JP (1) JPS63500106A (enrdf_load_stackoverflow)
DE (2) DE3522341A1 (enrdf_load_stackoverflow)
WO (1) WO1986007613A1 (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2203167B (en) * 1987-03-25 1990-11-28 Matsushita Electric Works Ltd Composite conductive material and method for manufacturing same
DE3812738A1 (de) * 1988-04-16 1989-10-26 Battelle Institut E V Verfahren zur herstellung von anlauf-, oxidations- und zunderbestaendigen legierungen
US4999050A (en) * 1988-08-30 1991-03-12 Sutek Corporation Dispersion strengthened materials
DE3904494C1 (enrdf_load_stackoverflow) * 1989-02-15 1989-12-14 Battelle-Institut Ev, 6000 Frankfurt, De
US5039478A (en) * 1989-07-26 1991-08-13 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
US5017250A (en) * 1989-07-26 1991-05-21 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
US5120612A (en) * 1990-09-04 1992-06-09 Olin Corporation Incorporation of ceramic particles into a copper base matrix to form a composite material
DE10053941C2 (de) * 1999-10-27 2002-05-08 Dresden Ev Inst Festkoerper Metallband aus Silber oder einer Silberbasislegierung
CA2492925A1 (en) * 2002-07-18 2004-01-29 Honda Giken Kogyo Kabushiki Kaisha Copper alloy, copper alloy producing method, copper complex material, and copper complex material producing method
US7175687B2 (en) * 2003-05-20 2007-02-13 Exxonmobil Research And Engineering Company Advanced erosion-corrosion resistant boride cermets
US7731776B2 (en) * 2005-12-02 2010-06-08 Exxonmobil Research And Engineering Company Bimodal and multimodal dense boride cermets with superior erosion performance
US8323790B2 (en) * 2007-11-20 2012-12-04 Exxonmobil Research And Engineering Company Bimodal and multimodal dense boride cermets with low melting point binder
CN109112346B (zh) * 2018-09-29 2020-08-25 西安欧中材料科技有限公司 一种增材制造用铜合金粉末的制备方法
CN112191856A (zh) * 2020-09-29 2021-01-08 哈尔滨工业大学 一种原位自生颗粒增强钛基复合材料粉末的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419120A (en) * 1982-03-10 1983-12-06 The United States Of America As Represented By The Secretary Of Agriculture Control of prickly sida, velvetleaf, and spurred anoda with fungal pathogens

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3194656A (en) * 1961-08-10 1965-07-13 Crucible Steel Co America Method of making composite articles
US3993478A (en) * 1972-02-09 1976-11-23 Copper Range Company Process for dispersoid strengthening of copper by fusion metallurgy
US4419130A (en) * 1979-09-12 1983-12-06 United Technologies Corporation Titanium-diboride dispersion strengthened iron materials
US4540546A (en) * 1983-12-06 1985-09-10 Northeastern University Method for rapid solidification processing of multiphase alloys having large liquidus-solidus temperature intervals

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419120A (en) * 1982-03-10 1983-12-06 The United States Of America As Represented By The Secretary Of Agriculture Control of prickly sida, velvetleaf, and spurred anoda with fungal pathogens

Also Published As

Publication number Publication date
EP0229077A1 (de) 1987-07-22
US4744947A (en) 1988-05-17
DE3522341A1 (de) 1987-01-02
WO1986007613A1 (fr) 1986-12-31
DE3522341C2 (enrdf_load_stackoverflow) 1987-08-27
DE3661843D1 (en) 1989-02-23
JPS63500106A (ja) 1988-01-14

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