EP0180175A3 - Surface grinding apparatus - Google Patents

Surface grinding apparatus Download PDF

Info

Publication number
EP0180175A3
EP0180175A3 EP85113668A EP85113668A EP0180175A3 EP 0180175 A3 EP0180175 A3 EP 0180175A3 EP 85113668 A EP85113668 A EP 85113668A EP 85113668 A EP85113668 A EP 85113668A EP 0180175 A3 EP0180175 A3 EP 0180175A3
Authority
EP
European Patent Office
Prior art keywords
chuck table
grinding
workpiece
held
grinding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP85113668A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0180175A2 (en
Inventor
Toshiyuki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Publication of EP0180175A2 publication Critical patent/EP0180175A2/en
Publication of EP0180175A3 publication Critical patent/EP0180175A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP85113668A 1984-10-30 1985-10-28 Surface grinding apparatus Withdrawn EP0180175A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP226720/84 1984-10-30
JP59226720A JPS61109656A (ja) 1984-10-30 1984-10-30 表面研削装置

Publications (2)

Publication Number Publication Date
EP0180175A2 EP0180175A2 (en) 1986-05-07
EP0180175A3 true EP0180175A3 (en) 1987-10-14

Family

ID=16849567

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85113668A Withdrawn EP0180175A3 (en) 1984-10-30 1985-10-28 Surface grinding apparatus

Country Status (3)

Country Link
EP (1) EP0180175A3 (ja)
JP (1) JPS61109656A (ja)
KR (1) KR920003211B1 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0263203A3 (en) * 1986-10-06 1989-02-22 Substrate Systems Inc. Computer memory disc and method for machining same
US5035087A (en) * 1986-12-08 1991-07-30 Sumitomo Electric Industries, Ltd. Surface grinding machine
US5632667A (en) * 1995-06-29 1997-05-27 Delco Electronics Corporation No coat backside wafer grinding process
JP3231659B2 (ja) 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
KR100314267B1 (ko) * 1998-10-27 2002-10-25 주식회사 현대 디스플레이 테크놀로지 액정셀의단자부연마장치
US6705930B2 (en) 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
JP4455750B2 (ja) * 2000-12-27 2010-04-21 株式会社ディスコ 研削装置
WO2018219423A1 (de) * 2017-05-29 2018-12-06 Diskus Werke Schleiftechnik Gmbh Schleifverfahren zur bearbeitung von innenflächen von werkstücken mit mehreren innenschleifspindeln
EP3630412B1 (de) * 2017-05-29 2023-01-04 Diskus Werke Schleiftechnik GmbH Schleifverfahren zur bearbeitung von aussenflaechen von werkstuecken mit einer schleifscheibe
CN111531431A (zh) * 2020-04-14 2020-08-14 徐州尚航船舶配件有限公司 一种船用方向盘的多角度翻转自动打磨设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2145310A (en) * 1937-03-13 1939-01-31 Baird Machine Co Machine tool
US3691697A (en) * 1970-09-21 1972-09-19 Hamco Mach & Elect Co Pressure control for lapping device
GB1422908A (en) * 1973-05-02 1976-01-28 Cone Blanchard Machine Co Grinding machines
EP0039209A1 (en) * 1980-04-24 1981-11-04 Fujitsu Limited Machine for grinding thin plates such as semiconductor wafers
JPS58126051A (ja) * 1982-01-19 1983-07-27 Tokyo Seiki Kosakusho:Kk 復合回転型の平面研削盤
GB2138719A (en) * 1983-04-26 1984-10-31 Marconi Electronic Devices Grinding apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2145310A (en) * 1937-03-13 1939-01-31 Baird Machine Co Machine tool
US3691697A (en) * 1970-09-21 1972-09-19 Hamco Mach & Elect Co Pressure control for lapping device
GB1422908A (en) * 1973-05-02 1976-01-28 Cone Blanchard Machine Co Grinding machines
EP0039209A1 (en) * 1980-04-24 1981-11-04 Fujitsu Limited Machine for grinding thin plates such as semiconductor wafers
JPS58126051A (ja) * 1982-01-19 1983-07-27 Tokyo Seiki Kosakusho:Kk 復合回転型の平面研削盤
GB2138719A (en) * 1983-04-26 1984-10-31 Marconi Electronic Devices Grinding apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 7, no. 237 (M-250)[1382], 21st October 1983; & JP - A - 58 126 051 (TOUKIYOU SEIKI KOUSAKUSHIYO) 27-07-1983 *

Also Published As

Publication number Publication date
EP0180175A2 (en) 1986-05-07
KR920003211B1 (ko) 1992-04-24
JPS61109656A (ja) 1986-05-28
KR860003081A (ko) 1986-05-19

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Inventor name: MORI, TOSHIYUKI