EP0164006B1 - Enveloped heat-insulating member - Google Patents

Enveloped heat-insulating member Download PDF

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Publication number
EP0164006B1
EP0164006B1 EP19850106109 EP85106109A EP0164006B1 EP 0164006 B1 EP0164006 B1 EP 0164006B1 EP 19850106109 EP19850106109 EP 19850106109 EP 85106109 A EP85106109 A EP 85106109A EP 0164006 B1 EP0164006 B1 EP 0164006B1
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EP
European Patent Office
Prior art keywords
thermal insulation
heat
microporous
molded
insulating
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EP19850106109
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German (de)
French (fr)
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EP0164006A1 (en
Inventor
Günter Dr. Dipl.-Chem. Kratel
Günter Dr. Dipl.-Chem. Stohr
Franz Dipl.-Ing. Schreiner (Fh)
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Wacker Chemie AG
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Wacker Chemie AG
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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62—Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62—Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
    • E04B1/78—Heat insulating elements
    • E04B1/80—Heat insulating elements slab-shaped
    • E04B1/806—Heat insulating elements slab-shaped with air or gas pockets included in the slab
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/231—Filled with gas other than air; or under vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro
    • Y10T428/24998—Composite has more than two layers

Definitions

  • the invention relates to thermal insulation boards based on compressed, microporous thermal insulation material with a covering.
  • Molded heat-insulating bodies based on compressed, microporous heat-insulating material are known, for example, according to DE-A-3033515 (EP-A-00 47 494). It is also known to partially or completely moldings of this type with envelopes, e.g. with glass fiber fabrics, aluminum foil or other lamination material.
  • Such thermal insulation molded articles are distinguished, in particular in the range of higher temperatures, in particular in the temperature range from approximately 200 ° C. to 1,000 ° C., by excellent insulating properties. In the temperature range between about -50 ° C to 200 ° C, however, their insulating properties are similar to other insulating materials that are less efficient or unsuitable in the higher temperature range.
  • microporous insulation material are required if an insulation is to be designed in such a way that, in the case of insulation against high temperatures, the cold side of the insulation layer only has temperatures in the range from approximately -10 ° C. to 40 ° C.
  • the object of the invention was to improve the insulating effect of molded thermal bodies based on pressed, microporous thermal insulation material in the temperature range from about -50 ° C to 200 ° C.
  • the insulating effect of moldings based on compressed, microporous material can be improved by evacuating the moldings.
  • these moldings can be filled with gases such as krypton, xenon, sulfur hexafluoride or carbon dioxide.
  • gases such as krypton, xenon, sulfur hexafluoride or carbon dioxide.
  • the invention relates to thermal insulation boards made of a coating, provided, pressed, microporous thermal insulation material based on finely divided metal oxides, which are characterized in that the casing is gas-tight and the partial pressure of air within the coated thermal insulation boards is less than 20 mbar.
  • the thermal insulation boards according to the invention can, if desired, have a content of krypton, xenon, sulfur hexafluoride or carbon dioxide.
  • the partial pressure on the gases mentioned can be 0-1000 mbar, in particular 0-400 mbar.
  • the proportion of binder is preferably 0.3 to 1.5% by weight.
  • finely divided metal oxide examples include pyrogenic silicas, including arcing silicas, low-alkali precipitated silicas, aluminum oxide, titanium dioxide and zirconium dioxide produced analogously.
  • the finely divided metal oxides have specific surfaces of 50-700 square meters / g, preferably 70-400 square meters / g.
  • Ilmenite, titanium dioxide, silicon carbide, iron-II-iron-III mixed oxide, chromium dioxide, zirconium oxide, manganese dioxide and iron oxide are suitable as opacifiers.
  • the opacifiers advantageously have an absorption maximum in the infrared range between 1.5 and 10 1 tm.
  • fiber material examples include glass wool, rock wool, slag wool, ceramic fibers such as those obtained from melts of aluminum oxide and / or silicon oxide, asbestos fibers and others.
  • the inorganic binders used are, for example, the borides of aluminum, titanium, zirconium, calcium, silicides such as calcium silicide and calcium aluminum silicide, in particular by boron carbide.
  • silicides such as calcium silicide and calcium aluminum silicide, in particular by boron carbide.
  • further constituents are basic oxides, in particular magnesium oxide, calcium oxide or barium oxide.
  • thermal insulation boards according to the invention mostly have a flat shape. In special cases, however, they can also take the form of circular segments and the like.
  • Beveled edges, folds and the like may be mentioned as further shaping elements.
  • the thermal insulation boards based on microporous material are provided with gastight coverings. Relatively low demands are to be made of the compressive strength of these envelopes, since they are in direct contact with the molded body and are thus supported in such a way that the pressure of the surrounding atmosphere is absorbed.
  • wrapping material examples include composite films with a layer sequence of thermoplastic material / metal foil / thermoplastic material.
  • a composite film consists of a layer sequence of polypropylene / aluminum film / polyester.
  • Other examples are composite films with a layer sequence of polyfluorocarbon / polyimide, which may also have a layer of aluminum foil can.
  • the covering preferably consists of two separate layers, a first layer which consists of a thermoplastic material, such as polyethylene, and a second layer which can consist of one of the aforementioned composite films.
  • Glass plates serve as a covering, which are connected by gas-tight sealing compounds.
  • sealing compounds are polymers and copolymers of hexafluoropropylene, vinylidene fluoride and the like.
  • the gases enclosed in the bed should be able to escape during pre-compression or compression. Therefore, the compression and compression is preferably carried out with the application of negative pressure. Degassing can also take place before compression or compression.
  • the prefabricated molded body is then provided with a covering and finally evacuated until the partial pressure in air no longer exceeds 20 mbar. Typically, evacuation is carried out until the partial pressure in air is 20 mbar to 10- 4 mbar Krypton, xenon, sulfur hexafluoride, carbon dioxide or mixtures thereof can be filled. Finally, the covering is sealed airtight. Such a sealing is carried out, for example, by welding off the composite films described above.
  • the thermal insulation boards according to the invention are used in particular for insulation in the temperature range from -50 ° C. to 200 ° C. They serve, for example, as insulation in cold store facilities. Another application opens up as an additional element for thermal insulation in storage furnaces and the like, where they are preferably used in conjunction with non-evacuated high-temperature insulation based on microporous thermal insulation material. It is provided here that the non-evacuated thermal insulation layer is designed such that a heat gradient to a temperature of approximately 100 ° C. to 200 ° C. arises and, in combination, the evacuated thermal insulation board according to the invention is a W a rmegef a overall to a temperature in the area of the ambient temperature.
  • thermal insulation boards according to the invention By using the thermal insulation boards according to the invention, high-performance insulation arrangements are available, the layer thicknesses of which are significantly reduced compared to conventional insulation arrangements with a comparable insulating effect.
  • the thermal insulation panels according to the invention are assembled in the same way as the assembly of conventional thermal insulation panels.
  • the plate was coated with a 100 ⁇ m thick composite film (polypropylene / aluminum / polyester) and evacuated to a residual pressure of 20 mbar.
  • the thermal conductivity number 1 of the plate was 100 ° C

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Acoustics & Sound (AREA)
  • Electromagnetism (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Thermal Insulation (AREA)
  • Laminated Bodies (AREA)

Abstract

A molded thermal insulation body having a microporous thermal insulation material encased in a sheathing. The molded body is partially evacuated to a partial air pressure of 20 mbar or less. Following the evacuation of air, the molded body may be filled with krypton, xenon, sulfur hexafluoride, carbon dioxide or a combination thereof. A process for the manufacture of the molded thermal insulation body is also provided.

Description

Die Erfindung betrifft Wärmedämmplatten auf Basis von verpresstem, mikroporösem Wärmedämmstoff mit Umhüllung.The invention relates to thermal insulation boards based on compressed, microporous thermal insulation material with a covering.

Wärmedämmformkörper auf Basis von verpresstem, mikroporösem Wärmedämmstoff sind beispielsweise gemäss DE-A-3033515 (EP-A-00 47 494) bekannt. Es ist weiterhin bekannt, derartige Formkörper teilweise oder vollständig mit Umhüllungen, z.B. mit Glasfasergeweben, Alufolien oder anderem Kaschierungsmaterial, zu versehen. Derartige Wärmedämmformkörper zeichnen sich vor allem im Bereich höherer Temperaturen, insbesondere im Temperaturbereich von etwa 200°C bis 1.000°C durch ausgezeichnete Isoliereigenschaften aus. Im Temperaturbereich zwischen etwa -50°C bis 200°C gleichen sich ihre Isoliereigenschaften allerdings anderen, im Bereich höherer Temperaturen weniger leistungsfähigen oder ungeeigneten Isolierstoffen an.Molded heat-insulating bodies based on compressed, microporous heat-insulating material are known, for example, according to DE-A-3033515 (EP-A-00 47 494). It is also known to partially or completely moldings of this type with envelopes, e.g. with glass fiber fabrics, aluminum foil or other lamination material. Such thermal insulation molded articles are distinguished, in particular in the range of higher temperatures, in particular in the temperature range from approximately 200 ° C. to 1,000 ° C., by excellent insulating properties. In the temperature range between about -50 ° C to 200 ° C, however, their insulating properties are similar to other insulating materials that are less efficient or unsuitable in the higher temperature range.

Entsprechend werden grosse Schichtdicken an mikroporösem Isoliermaterial erforderlich, wenn eine Isolierung so ausgelegt werden soll, dass bei Isolierung gegen hohe Temperaturen die kalte Seite der Isolierschicht nur noch Temperaturen im Bereich von etwa -10°C bis 40°C aufweist.Accordingly, large layer thicknesses of microporous insulation material are required if an insulation is to be designed in such a way that, in the case of insulation against high temperatures, the cold side of the insulation layer only has temperatures in the range from approximately -10 ° C. to 40 ° C.

Nun sind bereits Messungen bekannt geworden, nach denen die Isolierwirkung von evakuierten Schüttungen mikroporösen Materials oder die Isolierwirkung von Schüttungen mikroporösen Materials, die beispielsweise mit Xenon erfüllt sind, eine gegenüber mit Luft erfüllten Schüttungen verbesserte Isolierwirkung aufweisen.Measurements have now become known according to which the insulating effect of evacuated beds of microporous material or the insulating effect of beds of microporous material, which are filled with xenon, for example, have an improved insulating action compared to beds filled with air.

Aufgabe der Erfindung war es, die Isolierwirkung von Wärmedämmformkörpern auf Basis von verpresstem, mikroporösem Wärmedämmaterial im Temperaturbereich von etwa -50°C bis 200 °C zu verbessern.The object of the invention was to improve the insulating effect of molded thermal bodies based on pressed, microporous thermal insulation material in the temperature range from about -50 ° C to 200 ° C.

Es wurde nun gefunden, dass die Isolierwirkung von Formkörpern auf Basis von verpresstem, mikroporösem Material dadurch verbessert werden kann, dass die Formkörper evakuiert werden. Alternativ dazu können diese Formkörper anstatt mit Luft mit Gasen wie Krypton, Xenon, Schwefelhexafluorid oder Kohlendioxid erfüllt sein. Überraschenderweise ist der Verbesserungseffekt bezüglich der Isolierwirkung, der durch Evakuieren dieser Formkörper erzielt wird, immer noch so gross, dass er den erhöhten konstruktiven Aufwand lohnt, obwohl der Luftgehalt von verpressten Formkörpern gegenüber Schüttungen naturgemäss bereits durch den Pressvorgang stark reduziert wurde.It has now been found that the insulating effect of moldings based on compressed, microporous material can be improved by evacuating the moldings. Alternatively, instead of air, these moldings can be filled with gases such as krypton, xenon, sulfur hexafluoride or carbon dioxide. Surprisingly, the improvement effect with regard to the insulating effect, which is achieved by evacuating these moldings, is still so great that it pays off the increased design effort, even though the air content of compressed moldings compared to fillings has naturally already been greatly reduced by the pressing process.

Gegenstand der Erfindung sind Wärmedämmplatten aus mit einer Umhüllung,versehenem, verpresstem, mikroporösem Wärmedämmstoff auf Basis von feinteiligen Metalloxiden die dadurch gekennzeichnet sind, dass die Umhüllung gasdicht ist und der Partialdruck von Luft innerhalb der umhüllten Wärmedämmplatten weniger als 20 mbar beträgt.The invention relates to thermal insulation boards made of a coating, provided, pressed, microporous thermal insulation material based on finely divided metal oxides, which are characterized in that the casing is gas-tight and the partial pressure of air within the coated thermal insulation boards is less than 20 mbar.

Die erfindungsgemässen Wärmedämmplatten können, falls erwünscht, einen Gehalt an Krypton, Xenon, Schwefelhexafluorid oder Kohlendioxid aufweisen. Der Partialdruck an den genannten Gasen kann 0 - 1000 mbar, insbesondere 0 - bis 400 mbar betragen.The thermal insulation boards according to the invention can, if desired, have a content of krypton, xenon, sulfur hexafluoride or carbon dioxide. The partial pressure on the gases mentioned can be 0-1000 mbar, in particular 0-400 mbar.

Als mikroporöser Wärmedämmstoff werden feinteilige Metalloxide eingesetzt Folgende typische Zusammensetzungen für Wärmedämmaterial haben sich bewährt

  • 30-100 Gew.% feinteiliges Metalloxid
  • 0- 30 Gew.% Trübungsmittel
  • 0- 20 Gew.% Fasermaterial
  • 0- 15 Gew.% anorganisches Bindemittel.
Finely divided metal oxides are used as the microporous thermal insulation material. The following typical compositions for thermal insulation material have proven themselves
  • 30-100% by weight of finely divided metal oxide
  • 0- 30% by weight opacifier
  • 0- 20% by weight fiber material
  • 0- 15% by weight of inorganic binder.

Vorzugsweise beträgt der Bindemittelanteil 0,3 bis 1,5 Gew.%.The proportion of binder is preferably 0.3 to 1.5% by weight.

Beispiele für feinteiliges Metalloxid sind pyrogen erzeugte Kieselsäuren, einschliesslich Lichtbogenkieselsäuren, alkaliarme Fällungskieselsäuren, analog hergestelltes Aluminiumoxid, Titandioxid und Zirkondioxid. Die feinteiligen Metalloxide weisen spezifische Oberflächen von 50-700 qm/g, vorzugsweise 70-400 qm/g auf.Examples of finely divided metal oxide are pyrogenic silicas, including arcing silicas, low-alkali precipitated silicas, aluminum oxide, titanium dioxide and zirconium dioxide produced analogously. The finely divided metal oxides have specific surfaces of 50-700 square meters / g, preferably 70-400 square meters / g.

Als Trübungsmittel kommen Ilmenit, Titandioxid, Siliciumcarbid, Eisen-II-Eisen-III-Mischoxid, Chromdioxid, Zirkonoxid, Mangandioxid, sowie Eisenoxid in Betracht Die Trübungsmittel weisen vorteilhafterweise ein Absorptionsmaximum im Infrarotbereich zwischen 1,5 und 101tm auf.Ilmenite, titanium dioxide, silicon carbide, iron-II-iron-III mixed oxide, chromium dioxide, zirconium oxide, manganese dioxide and iron oxide are suitable as opacifiers. The opacifiers advantageously have an absorption maximum in the infrared range between 1.5 and 10 1 tm.

Beispiele für Fasermaterial sind Glaswolle, Steinwolle, Schlackenwolle, keramische Fasern, wie sie aus Schmelzen von Aluminiumoxid und/ oder Siliciumoxid gewonnen werden, Asbestfasern und andere.Examples of fiber material are glass wool, rock wool, slag wool, ceramic fibers such as those obtained from melts of aluminum oxide and / or silicon oxide, asbestos fibers and others.

Als anorganisches Bindemittel werden beispielsweise die Boride des Aluminiums, des Titans, des Zircons, des Calciums, Silicide wie Calciumsilicid und Calcium-Aluminium-Silicid, insbesondere durch Borcarbid eingesetzt. Beispiele für weitere Bestandteile sind basische Oxide, insbesondere Magnesiumoxid, Calciumoxid oder-Bariumoxid.The inorganic binders used are, for example, the borides of aluminum, titanium, zirconium, calcium, silicides such as calcium silicide and calcium aluminum silicide, in particular by boron carbide. Examples of further constituents are basic oxides, in particular magnesium oxide, calcium oxide or barium oxide.

Die erfindungsgemässen Wärmedämmplatten weisen zumeist eine ebene Form auf. In speziellen Fällen können sie jedoch auch die Form von Kreissegmenten und dergleichen annehmen.The thermal insulation boards according to the invention mostly have a flat shape. In special cases, however, they can also take the form of circular segments and the like.

Als weitere Formgebungselemente seien abgeschrägte Kanten, Falze und dergleichen genannt.Beveled edges, folds and the like may be mentioned as further shaping elements.

Die Wärmedämmplatten auf Basis von mikroporösem Material sind erfindungsgemäss mit gasdichten Umhüllungen versehen. An die Druckfestigkeit dieser Umhüllungen sind relativ geringe Ansprüche zu stellen, da sie in unmittelbarem Kontakt mit dem Formkörper stehen und damit derart abgestützt sind, dass der Druck der umgebenden Atmosphäre abgefangen wird.According to the invention, the thermal insulation boards based on microporous material are provided with gastight coverings. Relatively low demands are to be made of the compressive strength of these envelopes, since they are in direct contact with the molded body and are thus supported in such a way that the pressure of the surrounding atmosphere is absorbed.

Beispiele für Umhüllungsmaterial sind Verbundfolien mit einer Schichtfolge aus thermoplastischem Material/Metallfolie/thermoplastischem Material. Im speziellen Fall besteht eine solche Verbundfolie aus einer schichtfolge von Polypropylen/Aluminiumfolie/Polyester. Andere Beispiele sind Verbundfolien mit einer Schichtfolge aus Polyfluorkohlenwasserstoff/Polyimid, die noch ggf. eine Schicht aus Aluminiumfolie aufweisen können. Vorzugsweise besteht die Umhüllung aus Gründen der günstigen Fertigung der erfindungsgemässen Wärmedämmplatten aus zwei getrennten Schichten, einer ersten Schicht, die aus einem thermoplastischen Material, wie beispielsweise Polyethylen, besteht, und einer zweiten Schicht, die aus einer der vorstehend genannten Verbundfolien bestehen kann.Examples of wrapping material are composite films with a layer sequence of thermoplastic material / metal foil / thermoplastic material. In a special case, such a composite film consists of a layer sequence of polypropylene / aluminum film / polyester. Other examples are composite films with a layer sequence of polyfluorocarbon / polyimide, which may also have a layer of aluminum foil can. For reasons of the inexpensive manufacture of the thermal insulation boards according to the invention, the covering preferably consists of two separate layers, a first layer which consists of a thermoplastic material, such as polyethylene, and a second layer which can consist of one of the aforementioned composite films.

Es können jedoch auch z.B. Glasplatten als Umhüllung dienen, die durch gasdichte Dichtungsmassen verbunden sind. Beispiele für derartige Dichtungsmassen sind Polymerisate und Copolymerisate von Hexafluoropropylen, Vinylidenfluorid und dergleichen.However, e.g. Glass plates serve as a covering, which are connected by gas-tight sealing compounds. Examples of such sealing compounds are polymers and copolymers of hexafluoropropylene, vinylidene fluoride and the like.

Zur Herstellung der erfindungsgemässen Wärmedämmplatten werden zunächst die Formkörper nach an sich bekannten Methoden vorgefertigt Vorzugsweise umfasst die Fertigung folgende Verfahrensschritte:

  • a) Vorverdichten der Wärmedämmischung auf Basis von mikroporösem Wärmedämmaterial bei Drücken von 1-5 bar, insbesondere etwa 2 bar;
  • b) Verpressen des vorverdichteten Materials in die Endform bei Enddrücken von 10-15 bar, wobei gegenüber dem Schüttgewicht des mikroporösem Materials eine etwa 5- bis 10-fache Verdichtung erfolgt.
  • c) gegebenenfalls Erhitzen des verpessten Formkörpers bei Temperaturen von 500 °C bis 800 °C.
To produce the thermal insulation boards according to the invention, the moldings are first prefabricated using methods known per se. The production preferably comprises the following process steps:
  • a) pre-compressing the thermal insulation mixture based on microporous thermal insulation material at pressures of 1-5 bar, in particular about 2 bar;
  • b) pressing the precompressed material into the final shape at final pressures of 10-15 bar, about 5 to 10 times the compression compared to the bulk density of the microporous material.
  • c) if necessary, heating the peppered shaped body at temperatures of 500 ° C to 800 ° C.

Beim Vorverdichten bzw. Verpressen sollen die in der Schüttung eingeschlossenen Gase entweichen können. Daher erfolgt das Verdichten und Verpressen vorzugsweise unter Anlegen von Unterdruck. Das Entgasen kann auch schon vor dem Verdichten bzw. Verpressen erfolgen.The gases enclosed in the bed should be able to escape during pre-compression or compression. Therefore, the compression and compression is preferably carried out with the application of negative pressure. Degassing can also take place before compression or compression.

Der vorgefertigte Formkörper wird anschliessend mit einer Umhüllung versehen und schliesslich evakuiert, bis der Partialdruck an Luft 20 mbar nicht mehr übersteigt Typischerweise wird evakuiert, bis der Partialdruck an Luft 20 mbar bis 10-4 mbar beträgt Falls erwünscht kann das evakuierte System anschliessend mit Gasen wie Krypton, Xenon, Schwefelhexafluorid, Kohlendioxid oder deren Gemischen gefüllt werden. Abschliessend wird die Umhüllung luftdicht versiegelt Eine derartige Versiegelung erfolgt beispielsweise durch Abschweissen der vorstehend beschriebenen Verbundfolien.The prefabricated molded body is then provided with a covering and finally evacuated until the partial pressure in air no longer exceeds 20 mbar. Typically, evacuation is carried out until the partial pressure in air is 20 mbar to 10- 4 mbar Krypton, xenon, sulfur hexafluoride, carbon dioxide or mixtures thereof can be filled. Finally, the covering is sealed airtight. Such a sealing is carried out, for example, by welding off the composite films described above.

Die erfindungsgemässen Wärmedämmplatten finden insbesondere Verwendung zur Isolierung im Temperaturbereich von -50°C bis 200°C. Sie dienen beispielsweise als Isolierungen in Kühlhauseinrichtungen. Eine weitere Anwendung eröffnet sich als Zusatzelement für Wärmeisolierungen in Speicheröfen und dergleichen, wobei sie vorzugsweise im Verbund mit nicht evakuierten Hochtemperatur Isolierungen auf Basis von mikroporösem Wärmedämmstoff eingesetzt werden. Hierbei ist vorgesehen, dass die nicht evakuierte Wärmedämmschicht so ausgelegt ist, dass ein Wärmegefälle auf eine Temperatur von etwa 100 °C bis 200 °C entsteht und im Verbund dazu die erfindungsgemässe, evakuierte Wärmedämmplatte ein Warmegefalle insgesamt auf eine Temperatur, die im Bereich der Umgebungstemperatur liegt, sichert.The thermal insulation boards according to the invention are used in particular for insulation in the temperature range from -50 ° C. to 200 ° C. They serve, for example, as insulation in cold store facilities. Another application opens up as an additional element for thermal insulation in storage furnaces and the like, where they are preferably used in conjunction with non-evacuated high-temperature insulation based on microporous thermal insulation material. It is provided here that the non-evacuated thermal insulation layer is designed such that a heat gradient to a temperature of approximately 100 ° C. to 200 ° C. arises and, in combination, the evacuated thermal insulation board according to the invention is a W a rmegef a overall to a temperature in the area of the ambient temperature.

Durch Einsatz der erfindungsgemässen Wärmedämmplatten stehen hochleistungsfähige Isolieranordnungen zur Verfügung, deren Schichtdicken gegenüber herkömmlichen Isolieranordnungen mit vergleichbarer lsolierwirkung entscheidend reduziert sind. Die Montage der erfindungsgemässen Wärmedämmplatten erfolgt in gleicher Weise wie die Montage herkömmlicher Wärmedämmplatten.By using the thermal insulation boards according to the invention, high-performance insulation arrangements are available, the layer thicknesses of which are significantly reduced compared to conventional insulation arrangements with a comparable insulating effect. The thermal insulation panels according to the invention are assembled in the same way as the assembly of conventional thermal insulation panels.

Beispielexample

Es wurde eine 20 mm dicke Platte (Fläche 300 x 300 mm) durch Verpressen einer Wärmedämmischung aus

  • 60 Gew.% hochdisperser Kieselsäure
  • 34,5Gew.% Ilmenit
  • 5 Gew.% Aluminiumsilikat-Faser
  • 0,5 Gew. % Borcarbid
  • bei 10 kp/Cm2 verpresst.
A 20 mm thick plate (area 300 x 300 mm) was pressed out by pressing a thermal insulation mixture
  • 60% by weight of highly disperse silica
  • 34.5% by weight ilmenite
  • 5% by weight aluminum silicate fiber
  • 0.5% by weight boron carbide
  • pressed at 10 kp / cm 2 .

Die Platte wurde mit einer 100 µm dicken Verbundfolie (Polypropylen/Aluminium/Polyester) umhüllt und auf einen Restdruck von 20 mbar evakuiert.The plate was coated with a 100 µm thick composite film (polypropylene / aluminum / polyester) and evacuated to a residual pressure of 20 mbar.

Die Wärmeleitzahl 1 der Platte betrug bei 100 °C

Figure imgb0001
The thermal conductivity number 1 of the plate was 100 ° C
Figure imgb0001

Zum Vergleich wurde für die nicht evakuierte Platte eine Wärmeleitzahl von

Figure imgb0002
gemessen.For comparison, a coefficient of thermal conductivity of
Figure imgb0002
 measured.

Entsprechend ergibt sich eine um 46% erhöhte Wärmedämmeffizienz bei der erfindungsgemässen Platte.Accordingly, there is a 46% increase in thermal insulation efficiency in the panel according to the invention.

Claims (3)

1. Heat-insulating board composed of compression-moulded, microporous heat-insulating material, equipped with an envelope and based on finely divided metal oxides, characterized in that the envelope is gas-tight and the partial pressure of the air within the enveloped heat-insulating board is less than 20 mbar.
2. Heat-insulating board according to claim 1, characterized in that in contains krypton, xenon, sulphur hexafluoride, carbon dioxide or mixtures thereof.
3. Heat-insulating board according to an least one of claims 1 and 2, characterized in that the envelope used is composite sheeting composed of at least one metallic layer and a layer of thermoplastic polymer material.
EP19850106109 1984-05-18 1985-05-17 Enveloped heat-insulating member Expired EP0164006B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT85106109T ATE39523T1 (en) 1984-05-18 1985-05-17 HEAT INSULATION MOLDED BODY WITH COVER.

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Application Number Priority Date Filing Date Title
DE19843418637 DE3418637A1 (en) 1984-05-18 1984-05-18 THERMAL INSULATION BODY WITH COVER
DE3418637 1984-05-18

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EP0164006B1 true EP0164006B1 (en) 1988-12-28

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JP (1) JPS60260796A (en)
AT (1) ATE39523T1 (en)
DE (2) DE3418637A1 (en)

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EP0396961A1 (en) * 1989-05-10 1990-11-14 Degussa Aktiengesellschaft Formed body for thermal insulation
EP0403943A1 (en) * 1989-06-21 1990-12-27 Isolfeu Ag Zurich Thermal insulation for pipe-line compensators
EP0446486A2 (en) * 1990-03-16 1991-09-18 Degussa Aktiengesellschaft Thermal insulation element
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EP0254993A2 (en) * 1986-07-31 1988-02-03 General Electric Company Insulation formed of precipitated silica and fly ash
EP0254993A3 (en) * 1986-07-31 1988-10-05 General Electric Company Insulation formed of precipitated silica and fly ash insulation formed of precipitated silica and fly ash
EP0396961A1 (en) * 1989-05-10 1990-11-14 Degussa Aktiengesellschaft Formed body for thermal insulation
EP0403943A1 (en) * 1989-06-21 1990-12-27 Isolfeu Ag Zurich Thermal insulation for pipe-line compensators
EP0446486A2 (en) * 1990-03-16 1991-09-18 Degussa Aktiengesellschaft Thermal insulation element
EP0446486A3 (en) * 1990-03-16 1992-03-18 Degussa Aktiengesellschaft Thermal insulation element
DE4018970A1 (en) * 1990-06-13 1991-12-19 Schatz Oskar VACUUM HEAT INSULATION SUITABLE FOR THE TRANSFER OF PRESSURE FORCE, ESPECIALLY FOR HEAT STORAGE OF CRAC VEHICLES
TR25085A (en) * 1991-03-04 1992-11-01 Degussa Ag Dallare Ind Limited CONSTRUCTION OF HIGH CRYSTALIZATION RANGE FOR HIGH CRYSTALIZATION SPEED FOR GLASSING ELEMENTS OF HORIZONTAL AND VERTICAL ACTION AND WINDOW BULBS.
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JPH0355719B2 (en) 1991-08-26
DE3418637A1 (en) 1985-11-21
US4636416A (en) 1987-01-13
JPS60260796A (en) 1985-12-23
EP0164006A1 (en) 1985-12-11
ATE39523T1 (en) 1989-01-15
DE3567048D1 (en) 1989-02-02

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