EP0154564A3 - Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions - Google Patents

Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions Download PDF

Info

Publication number
EP0154564A3
EP0154564A3 EP85301609A EP85301609A EP0154564A3 EP 0154564 A3 EP0154564 A3 EP 0154564A3 EP 85301609 A EP85301609 A EP 85301609A EP 85301609 A EP85301609 A EP 85301609A EP 0154564 A3 EP0154564 A3 EP 0154564A3
Authority
EP
European Patent Office
Prior art keywords
printed circuit
multilayer printed
plate
vacuum
rigid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP85301609A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0154564A2 (en
Inventor
Sigurd Frohlich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cirtel Inc
Original Assignee
Cirtel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cirtel Inc filed Critical Cirtel Inc
Publication of EP0154564A2 publication Critical patent/EP0154564A2/en
Publication of EP0154564A3 publication Critical patent/EP0154564A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
EP85301609A 1984-03-09 1985-03-08 Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions Ceased EP0154564A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58792884A 1984-03-09 1984-03-09
US587928 1984-03-09

Publications (2)

Publication Number Publication Date
EP0154564A2 EP0154564A2 (en) 1985-09-11
EP0154564A3 true EP0154564A3 (en) 1986-08-20

Family

ID=24351754

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85301609A Ceased EP0154564A3 (en) 1984-03-09 1985-03-08 Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions

Country Status (2)

Country Link
EP (1) EP0154564A3 (cs)
JP (1) JPS60258996A (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH673435A5 (cs) * 1987-05-27 1990-03-15 Fela Planungs Ag
JPH0661449B2 (ja) * 1988-06-30 1994-08-17 株式会社芦田製作所 オートクレーブのガス循環方法及びその装置
JP4455696B2 (ja) * 1999-08-13 2010-04-21 忠弘 大見 多層プリント配線基板の製造方法及び製造装置
CN114554725B (zh) * 2022-04-25 2022-07-05 绵阳新能智造科技有限公司 一种复合pcb板的粘贴装置及方法
CN115273664B (zh) * 2022-07-29 2023-12-26 京东方科技集团股份有限公司 一种曲面显示面板、曲面显示装置以及制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188254A (en) * 1978-07-24 1980-02-12 Seal Incorporated Vacuum press
WO1983003065A1 (en) * 1982-03-04 1983-09-15 Economics Lab A method and apparatus for manufacturing multi-layer circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188254A (en) * 1978-07-24 1980-02-12 Seal Incorporated Vacuum press
WO1983003065A1 (en) * 1982-03-04 1983-09-15 Economics Lab A method and apparatus for manufacturing multi-layer circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
COMPOSITES, vol. 23, no. 3, May/June 1983, pages 5-9, Guildford, Surrey, GB; G. KEIL "Préimprégnés thermodurcissables: les équipements nécessaires à leur mise en oeuvre" *

Also Published As

Publication number Publication date
JPS60258996A (ja) 1985-12-20
JPH0334877B2 (cs) 1991-05-24
EP0154564A2 (en) 1985-09-11

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 19880825

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18R Application refused

Effective date: 19890223

RIN1 Information on inventor provided before grant (corrected)

Inventor name: FROHLICH, SIGURD