EP0143079A2 - Herstellungsverfahren für eine Mikroklappenvorrichtung und Anwendung dieses Verfahrens zur Schaffung eines Lichtmodulators - Google Patents

Herstellungsverfahren für eine Mikroklappenvorrichtung und Anwendung dieses Verfahrens zur Schaffung eines Lichtmodulators Download PDF

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Publication number
EP0143079A2
EP0143079A2 EP84810556A EP84810556A EP0143079A2 EP 0143079 A2 EP0143079 A2 EP 0143079A2 EP 84810556 A EP84810556 A EP 84810556A EP 84810556 A EP84810556 A EP 84810556A EP 0143079 A2 EP0143079 A2 EP 0143079A2
Authority
EP
European Patent Office
Prior art keywords
grid
layer
flaps
organic material
fasteners
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP84810556A
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English (en)
French (fr)
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EP0143079A3 (de
Inventor
André Perret
Raymond Vuilleumier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre Electronique Horloger SA
Original Assignee
Centre Electronique Horloger SA
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Filing date
Publication date
Application filed by Centre Electronique Horloger SA filed Critical Centre Electronique Horloger SA
Publication of EP0143079A2 publication Critical patent/EP0143079A2/de
Publication of EP0143079A3 publication Critical patent/EP0143079A3/de
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/37—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements
    • G09F9/372—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements the positions of the elements being controlled by the application of an electric field

Definitions

  • the present invention relates to a method for manufacturing a micro-flap device and more particularly relates to a method for manufacturing a device comprising a flat support to which are fixed, by elastic fasteners, miniature flaps capable of being controlled by rotation as well as the application of such a method for obtaining a light modulation device.
  • an object of the invention is a method of manufacturing a microvolette device involving materials not having the drawbacks mentioned above.
  • Another object of the invention is a method of manufacturing a microvolette device based on the use of relatively inexpensive materials and involving photolithography operations similar to those used in the manufacture of integrated circuits.
  • Yet another object of the invention is the application of the method mentioned above for obtaining a light modulation device.
  • Yet another object of the invention is the application of the method mentioned above for obtaining a display device.
  • FIG. 1 One of the essential elements of the process of the invention is the support or retaining grid, an exemplary embodiment of which is shown in FIG. 1.
  • the drawing in FIG. 1 shows relatively large parts 1, intended to ensure sufficient rigidity of the grid and to allow easy handling, a frame 3 which delimits the actual useful area inside which is made a fine lattice 4 which defines cells 2. It is clear that several useful areas can be performed on a single grid as well as the configuration of this or these useful zones can be adapted to the envisaged application.
  • the method of the invention will be described in the context of its application to the production of a display device with microvolets, as described in the aforementioned patent application.
  • the grid can be made of aluminum using known photolithographic processes or by using other more rigid materials, such as metallic compounds such as those known under the brands Dilver, Kovar, Invar or even ceramic materials.
  • the essential qualities of this grid are its mechanical rigidity at low thicknesses and its compatibility with subsequent technological stages.
  • the typical dimensions used in the context of the application considered are:
  • the thickness of the grid can be reduced to about 100 ⁇ m without compromising its support function.
  • the dimensions of the cells can be significantly increased as will be seen later in connection with the description of the stiffening grid.
  • the second step of the process consists in making a flat surface on the retaining grid.
  • Figure 2 shows the grid 4 coated with a polyimide film, such as that known under the trade name Kapton.
  • This film 5 with a typical thickness of 25 ⁇ m, is bonded to the grid 4 using an adhesive, the property of which is to cause no distortion of the film 5.
  • the adhesive sold by the firm Ciba-Geigy under the name "AZ 15 Araldite” has this property.
  • Other materials than Kapton can also be used.
  • organic materials for example epoxy resins
  • the retaining grid thus coated constitutes a planar support for subsequent operations.
  • Figures 3.a to 3.d show in detail the phase of production of a diffusing surface. This phase is necessary if you want to make a display device for which specular reflection is detrimental to aesthetics.
  • Figure 3.a shows how the Kapton film 5 is covered with a photosensitive layer 6, which is exposed through a mask 7. This mask comprises a random distribution of holes which, after the conventional operations of exposure and development , is found reproduced on the photosensitive layer 6, as it appears in FIG. 3.b.
  • the photosensitive layer thus prepared is then etched in a plasma, which has the effect of reproducing on the Kapton film 5 the surface condition initially created on the photosensitive layer.
  • Figure 3.c shows how the outer surface of the Kapton film was changed.
  • FIG. 4 shows a variant according to which the cells of the grid 4 are closed with a polymerizable material, preferably organic, and which can be eliminated by means of a plasma attack.
  • this material can be an epoxy adhesive 8, which is deposited on a 'flat element 9 using a screen-printing device.
  • the grid 4 is then pressed against the glued surface of the element 9 so that the glue 8 is pushed into the cells of the grid.
  • the planar element 9 can be in Kapton. If it is desired to produce a diffusing surface, the face of the element 9, in contact with the epoxy adhesive 8, may have been previously treated as described above so as to present surface irregularities which will be reproduced on the external face of the glue 8.
  • a polymerization of the glue is then carried out, then the Kapton is attacked selectively and a grid is obtained having on one side a flat surface, possibly structured, the cells of which are partially filled with polymerized glue.
  • a stiffening grid is produced.
  • An aluminum layer with a thickness of the order of 1 ⁇ m is then deposited over the entire surface of the film 5. This layer is then selectively etched at the locations of the flaps.
  • the aluminum layer will be eliminated in the areas which will be occupied by shutters with the exception of ribs 21 disposed on the shutters, as indicated in FIG. 6.b.
  • Figure 5 shows, in section, the aluminum layer 20 and the ribs 2i.
  • This aluminum layer 20 has fairly stiff stop flanks 25 which can be softened by immersing the assembly in an aluminum etching bath for a relatively short time. This last operation is known by the Anglo-Saxon name of "dip".
  • Aluminum deposition and selective attack operations are classic operations of integrated circuit technology and their description can be found in the book "Handbook of thin film technology" by Maissel and Glang published by Editions McGraw-Hill Inc.
  • the ribs 21 have the same thickness as the aluminum layer 20 surrounding the flaps. It can however be envisaged that the thicknesses of the ribs 21 and of the layer 20 are different, in which case the layer 20, for example, can be produced by two successive deposits, the last deposit having the desired thickness for the ribs. Furthermore, it is understood that this stiffening grid 20 provides rigidity such that it makes it possible to envisage the use of a retaining grid 4 having cells 2 of large dimensions. In the extreme and for small display devices, the retaining grid 4 may have only one cell 2, the rigidity of the assembly then being ensured by the stiffening grid 20.
  • Figure 6.a shows how the stiffening grid 20 is then covered, by evaporation, with a thin layer of aluminum 26 with a thickness of about 50 nm.
  • the flaps 23 ( Figures 6.b and 6.c) and their fasteners 24 ( Figure 6.b) are then etched in the layer 26 using standard methods.
  • FIG. 6.c shows the flaps 23 resulting from the etching operation
  • FIG. 6.b shows, seen from above, the respective arrangements of the first grid 4, of the second grid 20, of the thin layer 26, of the flaps 23 and their fasteners 24.
  • Figure 6.b also shows the arrangement of the ribs 21 on the flaps 23. These ribs have the effect of stiffening the surface of the flaps without significantly increasing their mass or their thickness.
  • the ul-time phase of the process consists in releasing the flaps from their support, that is to say removing the film 5 under the flaps 23 inside the cells of the grid 4.
  • the Kapton film 5 is attacked by a plasma in the gas phase (oxygen plasma) until the flaps are completely released, which are therefore only attached to the support 20 by their fasteners 24 (FIG. 6.b).
  • FIG. 7 shows the flaps released and how the film 5 has been eliminated in the cells defined by the grid 4.
  • a preferred application of the method described above is for producing light modulation devices like that described in the aforementioned patent application.
  • the grid 4 is fixed, by gluing, on a base carrying electrodes so that these electrodes are arranged opposite each flap, if each flap is individually addressable, or each group of flaps, if several flaps are simultaneously addressable.
  • the bottom may also include an electronic control circuit. If the light modulation device is intended to operate in transmission, the background, provided with electrodes, must necessarily be transparent. On the other hand, if it is intended to operate in reflection, the bottom must have a face made of light absorbing material on the side of the shutters.
  • the light modulation device is then closed using a transparent plate kept at a suitable distance from the shutters by spacers.
  • the transparent plate as well as the bottom can be made of glass or any other similar material.
  • the electrodes for addressing the flaps are arranged on the transparent plate.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optical Integrated Circuits (AREA)
EP84810556A 1983-11-18 1984-11-15 Herstellungsverfahren für eine Mikroklappenvorrichtung und Anwendung dieses Verfahrens zur Schaffung eines Lichtmodulators Withdrawn EP0143079A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH6199/83 1983-11-18
CH6199/83A CH654686A5 (fr) 1983-11-18 1983-11-18 Procede de fabrication d'un dispositif a volets miniatures et application d'un tel procede pour l'obtention d'un dispositif de modulation de lumiere.

Publications (2)

Publication Number Publication Date
EP0143079A2 true EP0143079A2 (de) 1985-05-29
EP0143079A3 EP0143079A3 (de) 1986-07-30

Family

ID=4305834

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84810556A Withdrawn EP0143079A3 (de) 1983-11-18 1984-11-15 Herstellungsverfahren für eine Mikroklappenvorrichtung und Anwendung dieses Verfahrens zur Schaffung eines Lichtmodulators

Country Status (5)

Country Link
US (1) US4584056A (de)
EP (1) EP0143079A3 (de)
JP (1) JPS60120389A (de)
CA (1) CA1256683A (de)
CH (1) CH654686A5 (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0230081A1 (de) * 1986-01-09 1987-07-29 Koninklijke Philips Electronics N.V. Anzeigevorrichtung und Herstellungsverfahren
EP0290093A1 (de) * 1987-05-07 1988-11-09 Koninklijke Philips Electronics N.V. Mit einer Flüssigkeit gefüllte elektroskopische Anzeigevorrichtung und Herstellungsverfahren
EP0372302A2 (de) * 1988-12-09 1990-06-13 Firma Carl Zeiss Koordinatenmessgerät mit einem oder mehreren Führungselementen aus Aluminium
EP0453400A1 (de) * 1990-04-20 1991-10-23 Centre Suisse D'electronique Et De Microtechnique S.A. Matrixadressierte Lichtmodulationsvorrichtung
WO1994010669A1 (de) * 1992-11-05 1994-05-11 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Hochauflösendes display
EP0643378A1 (de) * 1993-09-13 1995-03-15 CSEM, Centre Suisse d'Electronique et de Microtechnique S.A. Lichtmikronetzverschluss
CN115019651A (zh) * 2022-06-20 2022-09-06 昆山国显光电有限公司 一种卷曲显示模组及其生产工艺

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8402201A (nl) * 1984-07-12 1986-02-03 Philips Nv Passieve weergeefinrichting.
US4960486A (en) * 1988-06-06 1990-10-02 Brigham Young University Method of manufacturing radiation detector window structure
US5463200A (en) * 1993-02-11 1995-10-31 Lumonics Inc. Marking of a workpiece by light energy
US6214633B1 (en) * 1997-08-28 2001-04-10 Mems Optical Inc. System for controlling light including a micromachined foucault shutter array and a method of manufacturing the same
US6201633B1 (en) 1999-06-07 2001-03-13 Xerox Corporation Micro-electromechanical based bistable color display sheets
US6268908B1 (en) * 1999-08-30 2001-07-31 International Business Machines Corporation Micro adjustable illumination aperture
US6443637B1 (en) 2000-03-15 2002-09-03 Eastman Kodak Company Camera with electrostatic light valve that functions as diaphragm
US6325554B1 (en) 2000-03-15 2001-12-04 Eastman Kodak Company Camera with electrostatic light valve that functions as image reflecting mirror for viewfinder
US20110121179A1 (en) * 2007-06-01 2011-05-26 Liddiard Steven D X-ray window with beryllium support structure
US7737424B2 (en) * 2007-06-01 2010-06-15 Moxtek, Inc. X-ray window with grid structure
JP2010532997A (ja) * 2007-07-09 2010-10-21 ブリガム・ヤング・ユニバーシティ 荷電分子の操作のための方法および装置
US9305735B2 (en) 2007-09-28 2016-04-05 Brigham Young University Reinforced polymer x-ray window
WO2009045915A2 (en) * 2007-09-28 2009-04-09 Brigham Young University Carbon nanotube assembly
US8498381B2 (en) 2010-10-07 2013-07-30 Moxtek, Inc. Polymer layer on X-ray window
US8247971B1 (en) 2009-03-19 2012-08-21 Moxtek, Inc. Resistively heated small planar filament
US20100239828A1 (en) * 2009-03-19 2010-09-23 Cornaby Sterling W Resistively heated small planar filament
US7983394B2 (en) * 2009-12-17 2011-07-19 Moxtek, Inc. Multiple wavelength X-ray source
US8804910B1 (en) 2011-01-24 2014-08-12 Moxtek, Inc. Reduced power consumption X-ray source
US8750458B1 (en) 2011-02-17 2014-06-10 Moxtek, Inc. Cold electron number amplifier
US8929515B2 (en) 2011-02-23 2015-01-06 Moxtek, Inc. Multiple-size support for X-ray window
US8989354B2 (en) 2011-05-16 2015-03-24 Brigham Young University Carbon composite support structure
US9076628B2 (en) 2011-05-16 2015-07-07 Brigham Young University Variable radius taper x-ray window support structure
US9174412B2 (en) 2011-05-16 2015-11-03 Brigham Young University High strength carbon fiber composite wafers for microfabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2322416A1 (fr) * 1975-08-27 1977-03-25 Philips Nv Dispositif de reproduction d'images commande par voie electrostatique
GB2071896A (en) * 1980-03-11 1981-09-23 Centre Electron Horloger Miniature display device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3574012A (en) * 1969-01-06 1971-04-06 Aerojet General Co Trimetallic masks and method
FR2094458A5 (de) * 1970-06-22 1972-02-04 Usine Metal Doloise
DE2512086C3 (de) * 1975-03-19 1978-11-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung freitragender, dünner Metallstrukturen
US4170512A (en) * 1977-05-26 1979-10-09 Massachusetts Institute Of Technology Method of manufacture of a soft-X-ray mask
JPS5844644A (ja) * 1981-09-10 1983-03-15 Toshiba Corp カラ−受像管用マスクの製作法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2322416A1 (fr) * 1975-08-27 1977-03-25 Philips Nv Dispositif de reproduction d'images commande par voie electrostatique
GB2071896A (en) * 1980-03-11 1981-09-23 Centre Electron Horloger Miniature display device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ELECTRONICS INTERNATIONAL, vol. 56, no. 14, juillet 1983, pages 81-82, New York, US; R.T. GALLAGHER: "Microshutters flip to form characters in dot-matrix display" *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0230081A1 (de) * 1986-01-09 1987-07-29 Koninklijke Philips Electronics N.V. Anzeigevorrichtung und Herstellungsverfahren
EP0290093A1 (de) * 1987-05-07 1988-11-09 Koninklijke Philips Electronics N.V. Mit einer Flüssigkeit gefüllte elektroskopische Anzeigevorrichtung und Herstellungsverfahren
EP0372302A2 (de) * 1988-12-09 1990-06-13 Firma Carl Zeiss Koordinatenmessgerät mit einem oder mehreren Führungselementen aus Aluminium
EP0372302A3 (de) * 1988-12-09 1991-05-22 Firma Carl Zeiss Koordinatenmessgerät mit einem oder mehreren Führungselementen aus Aluminium
EP0453400A1 (de) * 1990-04-20 1991-10-23 Centre Suisse D'electronique Et De Microtechnique S.A. Matrixadressierte Lichtmodulationsvorrichtung
US5078479A (en) * 1990-04-20 1992-01-07 Centre Suisse D'electronique Et De Microtechnique Sa Light modulation device with matrix addressing
CH682523A5 (fr) * 1990-04-20 1993-09-30 Suisse Electronique Microtech Dispositif de modulation de lumière à adressage matriciel.
WO1994010669A1 (de) * 1992-11-05 1994-05-11 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Hochauflösendes display
EP0643378A1 (de) * 1993-09-13 1995-03-15 CSEM, Centre Suisse d'Electronique et de Microtechnique S.A. Lichtmikronetzverschluss
FR2710161A1 (fr) * 1993-09-13 1995-03-24 Suisse Electronique Microtech Réseau miniature d'obturateurs de lumière.
US5579149A (en) * 1993-09-13 1996-11-26 Csem Centre Suisse D'electronique Et De Microtechnique Sa Miniature network of light obturators
CN115019651A (zh) * 2022-06-20 2022-09-06 昆山国显光电有限公司 一种卷曲显示模组及其生产工艺
CN115019651B (zh) * 2022-06-20 2023-05-23 昆山国显光电有限公司 一种卷曲显示模组及其生产工艺

Also Published As

Publication number Publication date
EP0143079A3 (de) 1986-07-30
JPS60120389A (ja) 1985-06-27
CH654686A5 (fr) 1986-02-28
CA1256683A (fr) 1989-07-04
US4584056A (en) 1986-04-22

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