EP0143079A2 - Herstellungsverfahren für eine Mikroklappenvorrichtung und Anwendung dieses Verfahrens zur Schaffung eines Lichtmodulators - Google Patents
Herstellungsverfahren für eine Mikroklappenvorrichtung und Anwendung dieses Verfahrens zur Schaffung eines Lichtmodulators Download PDFInfo
- Publication number
- EP0143079A2 EP0143079A2 EP84810556A EP84810556A EP0143079A2 EP 0143079 A2 EP0143079 A2 EP 0143079A2 EP 84810556 A EP84810556 A EP 84810556A EP 84810556 A EP84810556 A EP 84810556A EP 0143079 A2 EP0143079 A2 EP 0143079A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- grid
- layer
- flaps
- organic material
- fasteners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000011368 organic material Substances 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 10
- 239000002985 plastic film Substances 0.000 claims description 4
- 229920006255 plastic film Polymers 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 239000007769 metal material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract description 3
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XAGFODPZIPBFFR-BJUDXGSMSA-N Aluminum-26 Chemical compound [26Al] XAGFODPZIPBFFR-BJUDXGSMSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/37—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements
- G09F9/372—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements the positions of the elements being controlled by the application of an electric field
Definitions
- the present invention relates to a method for manufacturing a micro-flap device and more particularly relates to a method for manufacturing a device comprising a flat support to which are fixed, by elastic fasteners, miniature flaps capable of being controlled by rotation as well as the application of such a method for obtaining a light modulation device.
- an object of the invention is a method of manufacturing a microvolette device involving materials not having the drawbacks mentioned above.
- Another object of the invention is a method of manufacturing a microvolette device based on the use of relatively inexpensive materials and involving photolithography operations similar to those used in the manufacture of integrated circuits.
- Yet another object of the invention is the application of the method mentioned above for obtaining a light modulation device.
- Yet another object of the invention is the application of the method mentioned above for obtaining a display device.
- FIG. 1 One of the essential elements of the process of the invention is the support or retaining grid, an exemplary embodiment of which is shown in FIG. 1.
- the drawing in FIG. 1 shows relatively large parts 1, intended to ensure sufficient rigidity of the grid and to allow easy handling, a frame 3 which delimits the actual useful area inside which is made a fine lattice 4 which defines cells 2. It is clear that several useful areas can be performed on a single grid as well as the configuration of this or these useful zones can be adapted to the envisaged application.
- the method of the invention will be described in the context of its application to the production of a display device with microvolets, as described in the aforementioned patent application.
- the grid can be made of aluminum using known photolithographic processes or by using other more rigid materials, such as metallic compounds such as those known under the brands Dilver, Kovar, Invar or even ceramic materials.
- the essential qualities of this grid are its mechanical rigidity at low thicknesses and its compatibility with subsequent technological stages.
- the typical dimensions used in the context of the application considered are:
- the thickness of the grid can be reduced to about 100 ⁇ m without compromising its support function.
- the dimensions of the cells can be significantly increased as will be seen later in connection with the description of the stiffening grid.
- the second step of the process consists in making a flat surface on the retaining grid.
- Figure 2 shows the grid 4 coated with a polyimide film, such as that known under the trade name Kapton.
- This film 5 with a typical thickness of 25 ⁇ m, is bonded to the grid 4 using an adhesive, the property of which is to cause no distortion of the film 5.
- the adhesive sold by the firm Ciba-Geigy under the name "AZ 15 Araldite” has this property.
- Other materials than Kapton can also be used.
- organic materials for example epoxy resins
- the retaining grid thus coated constitutes a planar support for subsequent operations.
- Figures 3.a to 3.d show in detail the phase of production of a diffusing surface. This phase is necessary if you want to make a display device for which specular reflection is detrimental to aesthetics.
- Figure 3.a shows how the Kapton film 5 is covered with a photosensitive layer 6, which is exposed through a mask 7. This mask comprises a random distribution of holes which, after the conventional operations of exposure and development , is found reproduced on the photosensitive layer 6, as it appears in FIG. 3.b.
- the photosensitive layer thus prepared is then etched in a plasma, which has the effect of reproducing on the Kapton film 5 the surface condition initially created on the photosensitive layer.
- Figure 3.c shows how the outer surface of the Kapton film was changed.
- FIG. 4 shows a variant according to which the cells of the grid 4 are closed with a polymerizable material, preferably organic, and which can be eliminated by means of a plasma attack.
- this material can be an epoxy adhesive 8, which is deposited on a 'flat element 9 using a screen-printing device.
- the grid 4 is then pressed against the glued surface of the element 9 so that the glue 8 is pushed into the cells of the grid.
- the planar element 9 can be in Kapton. If it is desired to produce a diffusing surface, the face of the element 9, in contact with the epoxy adhesive 8, may have been previously treated as described above so as to present surface irregularities which will be reproduced on the external face of the glue 8.
- a polymerization of the glue is then carried out, then the Kapton is attacked selectively and a grid is obtained having on one side a flat surface, possibly structured, the cells of which are partially filled with polymerized glue.
- a stiffening grid is produced.
- An aluminum layer with a thickness of the order of 1 ⁇ m is then deposited over the entire surface of the film 5. This layer is then selectively etched at the locations of the flaps.
- the aluminum layer will be eliminated in the areas which will be occupied by shutters with the exception of ribs 21 disposed on the shutters, as indicated in FIG. 6.b.
- Figure 5 shows, in section, the aluminum layer 20 and the ribs 2i.
- This aluminum layer 20 has fairly stiff stop flanks 25 which can be softened by immersing the assembly in an aluminum etching bath for a relatively short time. This last operation is known by the Anglo-Saxon name of "dip".
- Aluminum deposition and selective attack operations are classic operations of integrated circuit technology and their description can be found in the book "Handbook of thin film technology" by Maissel and Glang published by Editions McGraw-Hill Inc.
- the ribs 21 have the same thickness as the aluminum layer 20 surrounding the flaps. It can however be envisaged that the thicknesses of the ribs 21 and of the layer 20 are different, in which case the layer 20, for example, can be produced by two successive deposits, the last deposit having the desired thickness for the ribs. Furthermore, it is understood that this stiffening grid 20 provides rigidity such that it makes it possible to envisage the use of a retaining grid 4 having cells 2 of large dimensions. In the extreme and for small display devices, the retaining grid 4 may have only one cell 2, the rigidity of the assembly then being ensured by the stiffening grid 20.
- Figure 6.a shows how the stiffening grid 20 is then covered, by evaporation, with a thin layer of aluminum 26 with a thickness of about 50 nm.
- the flaps 23 ( Figures 6.b and 6.c) and their fasteners 24 ( Figure 6.b) are then etched in the layer 26 using standard methods.
- FIG. 6.c shows the flaps 23 resulting from the etching operation
- FIG. 6.b shows, seen from above, the respective arrangements of the first grid 4, of the second grid 20, of the thin layer 26, of the flaps 23 and their fasteners 24.
- Figure 6.b also shows the arrangement of the ribs 21 on the flaps 23. These ribs have the effect of stiffening the surface of the flaps without significantly increasing their mass or their thickness.
- the ul-time phase of the process consists in releasing the flaps from their support, that is to say removing the film 5 under the flaps 23 inside the cells of the grid 4.
- the Kapton film 5 is attacked by a plasma in the gas phase (oxygen plasma) until the flaps are completely released, which are therefore only attached to the support 20 by their fasteners 24 (FIG. 6.b).
- FIG. 7 shows the flaps released and how the film 5 has been eliminated in the cells defined by the grid 4.
- a preferred application of the method described above is for producing light modulation devices like that described in the aforementioned patent application.
- the grid 4 is fixed, by gluing, on a base carrying electrodes so that these electrodes are arranged opposite each flap, if each flap is individually addressable, or each group of flaps, if several flaps are simultaneously addressable.
- the bottom may also include an electronic control circuit. If the light modulation device is intended to operate in transmission, the background, provided with electrodes, must necessarily be transparent. On the other hand, if it is intended to operate in reflection, the bottom must have a face made of light absorbing material on the side of the shutters.
- the light modulation device is then closed using a transparent plate kept at a suitable distance from the shutters by spacers.
- the transparent plate as well as the bottom can be made of glass or any other similar material.
- the electrodes for addressing the flaps are arranged on the transparent plate.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Integrated Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH6199/83A CH654686A5 (fr) | 1983-11-18 | 1983-11-18 | Procede de fabrication d'un dispositif a volets miniatures et application d'un tel procede pour l'obtention d'un dispositif de modulation de lumiere. |
| CH6199/83 | 1983-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0143079A2 true EP0143079A2 (de) | 1985-05-29 |
| EP0143079A3 EP0143079A3 (de) | 1986-07-30 |
Family
ID=4305834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP84810556A Withdrawn EP0143079A3 (de) | 1983-11-18 | 1984-11-15 | Herstellungsverfahren für eine Mikroklappenvorrichtung und Anwendung dieses Verfahrens zur Schaffung eines Lichtmodulators |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4584056A (de) |
| EP (1) | EP0143079A3 (de) |
| JP (1) | JPS60120389A (de) |
| CA (1) | CA1256683A (de) |
| CH (1) | CH654686A5 (de) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0230081A1 (de) * | 1986-01-09 | 1987-07-29 | Koninklijke Philips Electronics N.V. | Anzeigevorrichtung und Herstellungsverfahren |
| EP0290093A1 (de) * | 1987-05-07 | 1988-11-09 | Koninklijke Philips Electronics N.V. | Mit einer Flüssigkeit gefüllte elektroskopische Anzeigevorrichtung und Herstellungsverfahren |
| EP0372302A3 (de) * | 1988-12-09 | 1991-05-22 | Firma Carl Zeiss | Koordinatenmessgerät mit einem oder mehreren Führungselementen aus Aluminium |
| EP0453400A1 (de) * | 1990-04-20 | 1991-10-23 | Centre Suisse D'electronique Et De Microtechnique S.A. | Matrixadressierte Lichtmodulationsvorrichtung |
| WO1994010669A1 (de) * | 1992-11-05 | 1994-05-11 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Hochauflösendes display |
| EP0643378A1 (de) * | 1993-09-13 | 1995-03-15 | CSEM, Centre Suisse d'Electronique et de Microtechnique S.A. | Lichtmikronetzverschluss |
| CN115019651A (zh) * | 2022-06-20 | 2022-09-06 | 昆山国显光电有限公司 | 一种卷曲显示模组及其生产工艺 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8402201A (nl) * | 1984-07-12 | 1986-02-03 | Philips Nv | Passieve weergeefinrichting. |
| US4960486A (en) * | 1988-06-06 | 1990-10-02 | Brigham Young University | Method of manufacturing radiation detector window structure |
| US5463200A (en) * | 1993-02-11 | 1995-10-31 | Lumonics Inc. | Marking of a workpiece by light energy |
| WO1999010775A1 (en) * | 1997-08-28 | 1999-03-04 | Mems Optical Inc. | System for controlling light including a micromachined foucault shutter array and a method of manufacturing the same |
| US6201633B1 (en) | 1999-06-07 | 2001-03-13 | Xerox Corporation | Micro-electromechanical based bistable color display sheets |
| US6268908B1 (en) * | 1999-08-30 | 2001-07-31 | International Business Machines Corporation | Micro adjustable illumination aperture |
| US6325554B1 (en) | 2000-03-15 | 2001-12-04 | Eastman Kodak Company | Camera with electrostatic light valve that functions as image reflecting mirror for viewfinder |
| US6443637B1 (en) | 2000-03-15 | 2002-09-03 | Eastman Kodak Company | Camera with electrostatic light valve that functions as diaphragm |
| US20110121179A1 (en) * | 2007-06-01 | 2011-05-26 | Liddiard Steven D | X-ray window with beryllium support structure |
| US7737424B2 (en) * | 2007-06-01 | 2010-06-15 | Moxtek, Inc. | X-ray window with grid structure |
| KR20100037615A (ko) * | 2007-07-09 | 2010-04-09 | 브라이엄 영 유니버시티 | 대전된 분자 조작을 위한 방법 및 이를 위한 장치 |
| US8498381B2 (en) | 2010-10-07 | 2013-07-30 | Moxtek, Inc. | Polymer layer on X-ray window |
| US20100285271A1 (en) * | 2007-09-28 | 2010-11-11 | Davis Robert C | Carbon nanotube assembly |
| US9305735B2 (en) | 2007-09-28 | 2016-04-05 | Brigham Young University | Reinforced polymer x-ray window |
| US20100239828A1 (en) * | 2009-03-19 | 2010-09-23 | Cornaby Sterling W | Resistively heated small planar filament |
| US8247971B1 (en) | 2009-03-19 | 2012-08-21 | Moxtek, Inc. | Resistively heated small planar filament |
| US7983394B2 (en) * | 2009-12-17 | 2011-07-19 | Moxtek, Inc. | Multiple wavelength X-ray source |
| US8804910B1 (en) | 2011-01-24 | 2014-08-12 | Moxtek, Inc. | Reduced power consumption X-ray source |
| US8750458B1 (en) | 2011-02-17 | 2014-06-10 | Moxtek, Inc. | Cold electron number amplifier |
| US8929515B2 (en) | 2011-02-23 | 2015-01-06 | Moxtek, Inc. | Multiple-size support for X-ray window |
| US8989354B2 (en) | 2011-05-16 | 2015-03-24 | Brigham Young University | Carbon composite support structure |
| US9076628B2 (en) | 2011-05-16 | 2015-07-07 | Brigham Young University | Variable radius taper x-ray window support structure |
| US9174412B2 (en) | 2011-05-16 | 2015-11-03 | Brigham Young University | High strength carbon fiber composite wafers for microfabrication |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3574012A (en) * | 1969-01-06 | 1971-04-06 | Aerojet General Co | Trimetallic masks and method |
| FR2094458A5 (de) * | 1970-06-22 | 1972-02-04 | Usine Metal Doloise | |
| DE2512086C3 (de) * | 1975-03-19 | 1978-11-30 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung freitragender, dünner Metallstrukturen |
| NL7510103A (nl) * | 1975-08-27 | 1977-03-01 | Philips Nv | Elektrostatisch bestuurde beeldweergeefinrichting. |
| US4170512A (en) * | 1977-05-26 | 1979-10-09 | Massachusetts Institute Of Technology | Method of manufacture of a soft-X-ray mask |
| CH633902A5 (fr) * | 1980-03-11 | 1982-12-31 | Centre Electron Horloger | Dispositif de modulation de lumiere. |
| JPS5844644A (ja) * | 1981-09-10 | 1983-03-15 | Toshiba Corp | カラ−受像管用マスクの製作法 |
-
1983
- 1983-11-18 CH CH6199/83A patent/CH654686A5/fr not_active IP Right Cessation
-
1984
- 1984-11-13 US US06/670,929 patent/US4584056A/en not_active Expired - Lifetime
- 1984-11-15 JP JP59239617A patent/JPS60120389A/ja active Pending
- 1984-11-15 EP EP84810556A patent/EP0143079A3/de not_active Withdrawn
- 1984-11-15 CA CA000467912A patent/CA1256683A/fr not_active Expired
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0230081A1 (de) * | 1986-01-09 | 1987-07-29 | Koninklijke Philips Electronics N.V. | Anzeigevorrichtung und Herstellungsverfahren |
| EP0290093A1 (de) * | 1987-05-07 | 1988-11-09 | Koninklijke Philips Electronics N.V. | Mit einer Flüssigkeit gefüllte elektroskopische Anzeigevorrichtung und Herstellungsverfahren |
| EP0372302A3 (de) * | 1988-12-09 | 1991-05-22 | Firma Carl Zeiss | Koordinatenmessgerät mit einem oder mehreren Führungselementen aus Aluminium |
| EP0453400A1 (de) * | 1990-04-20 | 1991-10-23 | Centre Suisse D'electronique Et De Microtechnique S.A. | Matrixadressierte Lichtmodulationsvorrichtung |
| US5078479A (en) * | 1990-04-20 | 1992-01-07 | Centre Suisse D'electronique Et De Microtechnique Sa | Light modulation device with matrix addressing |
| CH682523A5 (fr) * | 1990-04-20 | 1993-09-30 | Suisse Electronique Microtech | Dispositif de modulation de lumière à adressage matriciel. |
| WO1994010669A1 (de) * | 1992-11-05 | 1994-05-11 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Hochauflösendes display |
| EP0643378A1 (de) * | 1993-09-13 | 1995-03-15 | CSEM, Centre Suisse d'Electronique et de Microtechnique S.A. | Lichtmikronetzverschluss |
| FR2710161A1 (fr) * | 1993-09-13 | 1995-03-24 | Suisse Electronique Microtech | Réseau miniature d'obturateurs de lumière. |
| US5579149A (en) * | 1993-09-13 | 1996-11-26 | Csem Centre Suisse D'electronique Et De Microtechnique Sa | Miniature network of light obturators |
| CN115019651A (zh) * | 2022-06-20 | 2022-09-06 | 昆山国显光电有限公司 | 一种卷曲显示模组及其生产工艺 |
| CN115019651B (zh) * | 2022-06-20 | 2023-05-23 | 昆山国显光电有限公司 | 一种卷曲显示模组及其生产工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1256683A (fr) | 1989-07-04 |
| US4584056A (en) | 1986-04-22 |
| CH654686A5 (fr) | 1986-02-28 |
| EP0143079A3 (de) | 1986-07-30 |
| JPS60120389A (ja) | 1985-06-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Designated state(s): DE FR GB IT NL |
|
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